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Antenna Report

Shenzhen Zhangle Tong Technology Co., LTD A7 hearing earphone 2BGP9-A7 2BGP9A7 a7

Dongguan Yanwei Electronic Technology Co., Ltd YW05 2BGU9-YW05 2BGU9YW05 yw05

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Document DEVICE REPORTGetApplicationAttachment.html?id=7412963
Shenzhen Shuer Zhichuang Technology Co., LTD 4 F, Building AB, Danli Industrial Park, No.16 Kangzheng Road, Nanwan Street, Longgang District, Shenzhen

Application:
WLAN, 802.11b/g, Bluetooth, WLAN, etc...

Features
SMD, high reliability, ultra Impact, Omni-directional...

Part number Information

RANT 2012 F 245

C

07

(A) (B) (C) (D)

(E) (F)

(A)Product Type

Chip Antenna

(B) Size Code

2.0x1.2mm(+-0.2mm)

(C) Material

High K material

(D) Frequency

2.4 ~ 2.5GHz

(E) Feeding mode (F) Antenna type

PIFA & Single Feeding SMD

Electrical Specification

Working Frequency Range

2400 ~2484 MHz

Bandwidth

84 (Min.)

Peak Gain

1.7 dBi (Typ.)

Impedance

50 Ohm

Return loss

10 dB ( Min)

Polarization

Linear

Azimuth Beamwidth

Omni-directional

Operation Temperature()

-40 ~85

Resistance to Soldering Heats

10sec. ( @ 280)

Termination

Ni / Au (Leadless)

The specification is defined on EVB.

Dimension and Terminal Configuration

Dimension (mm)

L

2.05+-0.10

W 1.20+-0.10

T

0.65+-0.10

No. Terminal Name

1

Feeding/GNG

2

GND



: 13530576606

RAIN International Technology Co., Ltd.

2.4GHz 2012 Chip Antenna: RANT2012F245C07

Evaluation Board Reference
PCB Dimension

Antenna Layout Reference Unit :mm

Electrical Characteristics
Return Loss

Return Loss & Radiation

1
Radiation

Frequency(MHz) 2400 2450 2484

S11 (dB) -10.77 -24.81 -10.243

Z

Y

X

Efficiency

2400MHz 70.56%

2450MHz 2500MHz 75.25% 71.01%

2.4GHz 2012 Chip Antenna: RANT2012F245C07

Taping Specifications
Reel Specification

Reel and Taping Specification

TYPE 2012

SIZE 7" 5K/Reel

A 9.0±0.5

B 60±2

C 13.5±0.5

D 178±2

Tapping Specification

Packaging Type Paper Type 2012

A

B

W

E

F

G

H

T

D

P

1.50±0.20 2.30±0.20 8.0±0.20 1.75±0.10 3.5±0.05 4.0±0.10 2.0±0.05 0.75±0.10 1.57±0.10 4.0±0.1

2.4GHz 2012 Chip Antenna: RANT2012F245C07

Reliability Table

Test Item Electrical Characterization Thermal Shock
Temperature Cycling
High Temperature Exposure
Low Temperature Storage
Solderability (SMD Bottom Side)
Soldering Heat Resistance (RSH)
Vibration
Mechanical Shock

Procedure
1. Preconditioning: 50 ± 10 / 1 hr , then keep for 24 ± 1 hrs at room temp.
2. Initial measure: Spec: refer Initial spec. 3. Rapid change of temperature test:
-30 to +85; 100 cycles; 15 minutes at Lower category temperature; 15 minutes at Upper category temperature.
1. Initial measure: Spec: refer Initial spec. 2. 100 Cycles (-30 to +85), Soak Mode=1(2 Cycle/hours). 3. Measurement at 24 ± 2Hours after test condition.
1. Initial measure: Spec: refer Initial spec. 2. Unpowered; 500hours @ T=+85. 3. Measurement at 24 ± 2 hours after test.
1. Initial measure: Spec: refer Initial spec. 2. Unpowered: 500hours @ T= -30. 3. Measurement at 24 ± 2 hours after test.
Dipping method: a. Temperature: 235 ± 5°C b. Dipping time: 3 ± 0.5s
Preheating temperature: 150 ± 10°C. Preheating time: 1~2 min. Solder temperature: 260 ± 5°C. Dipping time: 5 ± 0.5s
5g's for 20 min., 12 cycles each of 3 orientations Note: Use 8"X5" PCB .031" thick 7 secure points on, one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz.
Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks) Peak value: 1,500g's Duration: 0.5ms Velocity change: 15.4 ft/s Waveform: Half-sine

Requirements Ceramic Type Fulfill the electrical specification No Visible Damage. Fulfill the electrical specification.
No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. The solder should cover over 95% of the critical area of bottom side. No Visible Damage.
No Visible Damage.
No Visible Damage.

Remark (Reference) User Spec. MIL-STD-202 107
JESD22 JA104
MIL-STD-202 108
MIL-STD-202 108
IEC 60384-21/22 4.10
IEC 60384-21/22 4.10
MIL-STD-202 Method 204
MIL-STD-202 Method 213

Humidity Bias

1. Humidity: 85% R.H., Temperature: 85 ± 2°C. 2. Time: 500 ± 24 hours. 3. Measurement at 24 ± 2hrs after testcondition.

No Visible Damage. Fulfill the electrical specification.

MIL-STD-202 Method 106

2.4GHz 2012 Chip Antenna: RANT2012F245C07

2.4GHz 2012 Chip Antenna: RANT2012F245C07

Board Flex (SMD)

1. Mounting method: IR-Reflow. PCB Size (L:100 × W:40 × T:1.6mm)
2. Apply the load in direction of the arrow until bending reaches 2 mm.

No Visible Damage.

_
AEC-Q200 005

Adhesion

Force of 1.8Kg for 60 seconds.

No Visible Damage Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body terminals and body/terminal junction.

AEC-Q200 006

Physical Dimension

Any applicable method using x10 magnification, micrometers, calipers, gauges, contour projectors, or other measuring equipment, capable of determining the actual specimen dimensions.

In accordance with specification.

JESD22 JB100

Revision History

Revision 1

Date 2020/10/15

Content New Datasheet

2.4GHz 2012 Chip Antenna: RANT2012F245C07



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