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Document DEVICE REPORT002-28997 CYW20719B2 CYW20721B2 Enhanced Low Power Bluetooth 5.0 BLE 2 Mbps LE EDR Integrated SOC
Document #: 002-28997

Rev. *A

Issue Date: 3/9/2020 _______________________________________________________________________________________________________________________

Cypress Semiconductor Reliability Qualification Report
QTP# 190301, 192004 Version *A

CYW20719B2 / CYW20721B2
CYW20719B2 / CYW20721B2, Enhanced Low Power, Bluetooth 5.0/BLE/2 Mbps LE/EDR/Integrated SOC

FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE

Prepared By:
Bak Lee Chan Reliability Engineer

Approved By: David Hoffman Reliability Director

Reviewed By:
Yusaku Ohta Reliability Manager

A printed copy of this document is considered uncontrolled. Refer to online copy for latest version. Page 1 of 9

Document #: 002-28997

Rev. *A

Issue Date: 3/9/2020 _______________________________________________________________________________________________________________________

I.A. Product and Package Information
_______________________________________________________________________________________________________________________

Product Description: CYW20719B2KWB9GT

Cypress Division: IoT Division

Enhanced Low Power, Bluetooth 5.0/BLE/2 Mbps LE/EDR/Integrated SOC

_______________________________________________________________________________________________________________________

Package: WLCSP

QTP: 190301

Description: (3.31 x 3.22 x 0.33mm) 134 Ball, Wafer Level Chip Scale Package (WLCSP)

Flammability: O2 Index:

Assembly: ASE Taiwan

Molding Compound: N/A

UL-V0

>28

Electrical Test: ASE Taiwan

Substrate/Leadframe: N/A

Die Attachment: N/A

Lead Finish: 98.2Sn / 1.8Ag

Comments: _______________________________________________________________________________________________________________________

Est. Field Temperature: Est. DC Field Current: Est. Field Voltage:

55 °C 20 mA 1.2 V

Life Test Temperature: Life Test Dynamic Current:
Life Test Voltage:

125 °C 20 mA 1.38 V

Est. Field Power Dissipation: 24 mWatts

Est. Stress Power Dissipation: 27.6 mWatts

_______________________________________________________________________________________________________________________

Die: Process: Type:

20719YPB2DA 40NM LP Bluetooth

Die Size: Fab:
Density:

3.35 x 3.26 mm TSMC N/A

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Document #: 002-28997

Rev. *A

Issue Date: 3/9/2020 _______________________________________________________________________________________________________________________

I.B. Product and Package Information
_______________________________________________________________________________________________________________________

Product Description:

CYW20721B2KUMLG

Cypress Division: IoT Division

Enhanced Low Power, Bluetooth 5.0/BLE/2 Mbps LE/EDR/Integrated SOC

_______________________________________________________________________________________________________________________

Package: QFN

QTP: 190301a

Description: (5 x 5 x 0.6mm) 40 Pin, Quad Flat No Lead Package (QFN)

Flammability: O2 Index:

Assembly: SPIL-TAIWAN

Molding Compound: HITACHI_CEL-9240-HF

UL-V0

>28

Electrical Test: ASE Singapore

Substrate/Leadframe: Copper Leadframe

Die Attachment: Hitachi EN-4900GC

Lead Finish: 100% Matte Sn Plating

Comments: _______________________________________________________________________________________________________________________

Est. Field Temperature: Est. DC Field Current: Est. Field Voltage:

55 °C 20 mA 1.2 V

Life Test Temperature: Life Test Dynamic Current:
Life Test Voltage:

125 °C 20 mA 1.38 V

Est. Field Power Dissipation: 24 mWatts

Est. Stress Power Dissipation: 27.6 mWatts

_______________________________________________________________________________________________________________________

Die: Process: Type:

20721PB2DA 40NM LP QFN

Die Size: Fab:
Density:

3.35 x TSMC N/A

3.26 mm

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Document #: 002-28997

Rev. *A

Issue Date: 3/9/2020 _______________________________________________________________________________________________________________________

I.C. Product and Package Information
_______________________________________________________________________________________________________________________

Product Description: CYW20721B2KWB9GT

Cypress Division: IoT Division

Enhanced Low Power, Bluetooth 5.0/BLE/2 Mbps LE/EDR/Integrated SOC

_______________________________________________________________________________________________________________________

Package: WLCSP

QTP: 190301b

Description: (3.31 x 3.22 x 0.33mm) 134 Ball, Wafer Level Chip Scale Package (WLCSP)

Flammability: O2 Index:

Assembly: ASE Taiwan

Molding Compound: N/A

UL-V0

>28

Electrical Test: ASE Taiwan

Substrate/Leadframe: N/A

Die Attachment: N/A

Lead Finish: 98.2Sn / 1.8Ag

Comments: _______________________________________________________________________________________________________________________

Est. Field Temperature: Est. DC Field Current: Est. Field Voltage:

55 °C 20 mA 1.2 V

Life Test Temperature: Life Test Dynamic Current:
Life Test Voltage:

125 °C 20 mA 1.38 V

Est. Field Power Dissipation: 24 mWatts

Est. Stress Power Dissipation: 27.6 mWatts

_______________________________________________________________________________________________________________________

Die: Process: Type:

20721YPB2DA 40NM LP Bluetooth

Die Size: Fab:
Density:

3.35 x 3.26 mm TSMC N/A

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Document #: 002-28997

Rev. *A

Issue Date: 3/9/2020 _______________________________________________________________________________________________________________________

I.D. Product and Package Information
_______________________________________________________________________________________________________________________

Product Description:

CYW20719B2KUMLG

Cypress Division: IoT Division

Enhanced Low Power, Bluetooth 5.0/BLE/2 Mbps LE/EDR/Integrated SOC

_______________________________________________________________________________________________________________________

Package: QFN

QTP: 190301c

Description: (5 x 5 x 0.6mm) 40 Pin, Quad Flat No Lead Package (QFN)

Flammability: O2 Index:

Assembly: SPIL-TAIWAN

Molding Compound: HITACHI_CEL-9240-HF

UL-V0

>28

Electrical Test: ASE Singapore

Substrate/Leadframe: Copper Leadframe

Die Attachment: Hitachi EN-4900GC

Lead Finish: 100% Matte Sn Plating

Comments: _______________________________________________________________________________________________________________________

Est. Field Temperature: Est. DC Field Current: Est. Field Voltage:

55 °C 20 mA 1.2 V

Life Test Temperature: Life Test Dynamic Current:
Life Test Voltage:

125 °C 20 mA 1.38 V

Est. Field Power Dissipation: 24 mWatts

Est. Stress Power Dissipation: 27.6 mWatts

_______________________________________________________________________________________________________________________

Die: Process: Type:

20719B2DA 40NM LP QFN

Die Size: Fab:
Density:

3.35 x TSMC N/A

3.26 mm

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Document #: 002-28997

Rev. *A

Issue Date: 3/9/2020 _______________________________________________________________________________________________________________________

I.E. Product and Package Information
_______________________________________________________________________________________________________________________

Product Description:

CYW20721B2KUMLG

Cypress Division: IoT Division

Enhanced Low Power, Bluetooth 5.0/BLE/2 Mbps LE/EDR/Integrated SOC

_______________________________________________________________________________________________________________________

Package: QFN

QTP: 192004

Description: (5 x 5 x 0.6mm) 40 Lead, Quad Flat No Lead Package (QFN)

Flammability: O2 Index:

Assembly: ASE Taiwan

Molding Compound: Sumitomo EME G700LA

UL-V0

>28

Electrical Test: ASE Taiwan

Substrate/Leadframe: Copper Leadframe

Die Attachment: Hitachi EN-4900F

Lead Finish: 100% Matte Sn Plating

Comments: _______________________________________________________________________________________________________________________

Est. Field Temperature: Est. DC Field Current: Est. Field Voltage:

55 °C 20 mA 1.2 V

Life Test Temperature: Life Test Dynamic Current:
Life Test Voltage:

125 °C 20 mA 1.38 V

Est. Field Power Dissipation: 24 mWatts

Est. Stress Power Dissipation: 27.6 mWatts

_______________________________________________________________________________________________________________________

Die: Process: Type:

20721PB2DA 40NM LP QFN

Die Size: Fab:
Density:

3.35 x TSMC N/A

3.26 mm

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Document #: 002-28997

Rev. *A

Issue Date: 3/9/2020 _______________________________________________________________________________________________________________________

II. 40nm GLL/LP/RF Life Test Failure Rate Calculation
_______________________________________________________________________________________________________________________

HTOL Stress Temperature - 125 °C

Failure Mechanism
PLASTIC Sample Size
Zero fails, Process ave. Ea

Read Points / Test Results

24 168 500 1000

hrs hrs hrs

hrs

2716 2519 1559

0* 0

0

1559 0

Modeling Parameters @ 55 °C

Avg. Failure Rate FITS @ 55 °C, 60% Conf.

Ea eV TAF VAF OAF MTTF (yrs)

PPM

FIT

0.66 71 1 71

Totals

0

0

0

0

* - Contributes to early life FITS

14269

0

8

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Document #: 002-28997

Rev. *A

Issue Date: 3/9/2020 _______________________________________________________________________________________________________________________

III. Summary of Stress Test Results
_______________________________________________________________________________________________________________________

Package Sample Num. of Num. of Failure

Stress Test Stress Condition

Type

Size

Lots Fails Rate % Comments

_______________________________________________________________________________________________________________________

Data From Qualification 190301, 190301a, 192004:

High Temp Bake (175°C)

QFN 3

45

1

0

0.00 500 Hours

ESD CDM N/A N/A N/A

WLCSP 1

3

QFN 2

3

QFN 3

3

1

0

0.00 Passed 500V

1

0

0.00 Passed 500V

1

0

0.00 Passed 1.0kV

ESD HBM N/A N/A

WLCSP 1

3

QFN 2

3

1

0

0.00 Passed 2.0kV

1

0

0.00 Passed 2.0kV

Latch Up (125°C, +/- 200mA) (125°C, +/- 200mA)

WLCSP 1

3

QFN 2

3

1

0

0.00 Passed

1

0

0.00 Passed

Preconditioning (PC2/260°C, +0°C/-5°C)

QFN 3

383

3

Passed

Precon+Temp Cycle (PC2/260°C, -65°C/150°C)

QFN 3

231

3

0

0.00 500 Cycles

Precon+HAST (PC2/260°C, Biased, 130°C/85% RH)

QFN 3

75

3

0

0.00 96 Hours

Precon+uHAST (PC2/260°C, Unbiased, 130°C/85% RH)

QFN 3

77

1

0

0.00 96 hours

Solderability N/A

QFN 3

9

1

Passed

_______________________________________________________________________________________________________________________
Notes / Justification: 1) Results from Qual 190301, CYW20719B2KWB9GT, 40NM LP Bluetooth in 134 Ball WLCSP (3.31 x 3.22 x 0.33mm) 2) Results from Qual 190301a, CYW20721B2KUMLG, 40NM LP QFN in 40 Pin QFN (5 x 5 x 0.6mm) 3) Results from Qual 192004, CYW20721B2KUMLG, 40NM LP QFN in 40 Lead QFN (5 x 5 x 0.6mm)
Preconditioning Flows: PC2 (JEDEC L3): Bake 125°C, 24hr => Soak @ 30°C/60%RH, 192hr => 3x Reflow

Reliability Tests Performed per Specification Requirements

Stress

Condition

ESD CDM

N/A

ESD HBM

N/A

High Temp Bake

(175°C)

Latch Up

(125°C, +/- 200mA)

Precon+HAST

(PC2/260°C, Biased, 130°C/85% RH)

Precon+Temp Cycle

(PC2/260°C, -65°C/150°C)

Precon+uHAST

(PC2/260°C, Unbiased, 130°C/85% RH)

Preconditioning

(PC2/260°C, +0°C/-5°C)

Solderability

N/A

Specification Reference JS002 / AEC-Q100-011 JS001 / AEC-Q100-002 JESD22-A103 JESD78 / AEC Q100-004 JESD22-A110 JESD22-A104 JESD22-A118 J-STD-020 J-STD-002

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Document #: 002-28997

Rev. *A

Issue Date: 3/9/2020 _______________________________________________________________________________________________________________________

IV. Revision History
_______________________________________________________________________________________________________________________

Document Number: Document Title:

002-28997
CYW20719B2 / CYW20721B2, Enhanced Low Power, Bluetooth 5.0/BLE/2 Mbps LE/EDR/Integrated SOC

Rev. Issue Date ** 11/18/2019

ECN# Originator

6733035

BAKC Initial Release.

Description

*A

3/9/2020

6825712

BAKC Added QFN Package Data

Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Cypress product under development by Cypress. Cypress reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Cypress assumes no liability for any damages of any kind arising out of the use of the information in this document.
Copyright © 2019- 2020 Cypress Inc. All rights reserved.

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