esp32-solo-1 datasheet en - Espressif Systems
7 juil. 2022 — through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast ... ESP32 Technical Reference Manual.
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ESP32-SOLO-1 — это одноядерный модуль на базе чипа ESP32 со встроенным WiFi и Bluetooth | CNXSoft - Новости Андроид приставок и встраиваемых систем
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Document DEVICE REPORTesp32-solo-1 datasheet en ?ct=t(EMAIL CAMPAIGN 7 5 2018 19 28)&mc cid=fc92b600a8&mc eid=9b573361a7ESP32SOLO1 Datasheet NOTFROERCONMEWM(ENDNREDSNEIDGD)NS Version v2.0 Espressif Systems Copyright © 2022 www.espressif.com Contents 1 Overview 4 2 Pin Definitions 6 2.1 Pin Layout 6 2.2 Pin Description 6 2.3 Strapping Pins 8 3 Functional Description 10 3.1 CPU and Internal Memory 10 3.2 External Flash and SRAM 10 3.3 Crystal Oscillators 10 3.4 RTC and Low-Power Management 11 4 Peripherals and Sensors 12 5 Electrical Characteristics 13 5.1 Absolute Maximum Ratings 13 5.2 Recommended Operating Conditions 13 5.3 DC Characteristics (3.3 V, 25 °C) 13 5.4 Wi-Fi Radio 14 5.5 Bluetooth LE Radio 15 5.5.1 Receiver 15 5.5.2 Transmitter 15 6 Schematics 16 7 Peripheral Schematics 17 8 Physical Dimensions 18 9 Recommended PCB Land Pattern 19 10 Product Handling 20 10.1 Storage Conditions 20 10.2 Electrostatic Discharge (ESD) 20 10.3 Reflow Profile 20 10.4 Ultrasonic Vibration 21 11 Related Documentation and Resources 22 Revision History 23 List of Tables 1 ESP32-SOLO-1 Ordering Information 4 2 ESP32-SOLO-1 Specifications 4 3 Pin Definitions 6 4 Strapping Pins 8 5 Description of ESP32 Power-up and Reset Timing Parameters 9 6 Absolute Maximum Ratings 13 7 Recommended Operating Conditions 13 8 DC Characteristics (3.3 V, 25 °C) 13 9 Wi-Fi Radio Characteristics 14 10 Receiver Characteristics Bluetooth LE 15 11 Transmitter Characteristics Bluetooth LE 15 Not Recommended For New Designs (NRND) List of Figures 1 ESP32-SOLO-1 Pin Layout (Top View) 6 2 ESP32 Power-up and Reset Timing 9 3 ESP32-SOLO-1 Schematics 16 4 ESP32-SOLO-1 Peripheral Schematics 17 5 Physical Dimensions of ESP32-SOLO-1 18 6 Recommended PCB Land Pattern of ESP32-SOLO-1 19 7 Reflow Profile 20 Not Recommended For New Designs (NRND) 1 Overview 1 Overview ESP32-SOLO-1 is a powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU module that targets a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming and MP3 decoding. Two different temperature variants of ESP32-SOLO-1 are available. Details are listed as follows: Table 1: ESP32SOLO1 Ordering Information Module ESP32-SOLO-1 (Default Version) ESP32-SOLO-1 (High Temp Version) Chip embedded ESP32-S0WD ESP32-S0WD Recommended operating ambient temperature 40 °C ~ +85 °C 40 °C ~ +105 °C Flash 4 MB 4 MB Dimensions (mm) 18 × 25.5 × 3.1 18 × 25.5 × 3.1 For detailed ordering information, please see ESP Product Selector. The information in this datasheet is applicable to both modules. At the core of this module is the ESP32-S0WD chip. ESP32-S0WD is a member of the ESP32 family of chips, which features a single core and contains all the peripherals of its dual-core counterparts. Available in a 5×5 mm QFN, ESP32-S0WD offers great value for money, with its sustained performance when powering complex IoT applications. Note: * For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet. The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted, and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps, and 20 dBm output power at the antenna to ensure the widest physical range. Several peripherals facilitate integration with other electronic devices. As such the chip does offer industry-leading specifications and ultra-high performance for electronic integration, range, power consumption, and connectivity. The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that developers can upgrade their products even after their release at minimum cost and effort. Table 2 provides the specifications of ESP32-SOLO-1. Table 2: ESP32SOLO1 Specifications Categories Certification Items RF certification Wi-Fi certification Green certification Specifications See certificates for ESP32-SOLO-1 Wi-Fi Alliance RoHS/REACH Espressif Systems Not Recommended For New Designs (NRND) 4 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 1 Overview Categories Test Wi-Fi Bluetooth Hardware Items Reliablity Protocols Center frequency range of operating channel Protocols Radio Audio Module interfaces On-chip sensor Integrated crystal Integrated SPI flash Operating voltage/Power supply Minimum current delivered by power supply Operating ambient temperature range Package size Moisture sensitivity level (MSL) Specifications HTOL/HTSL/uHAST/TCT/ESD 802.11 b/g/n (802.11n up to 150 Mbps) A-MPDU and A-MSDU aggregation and 0.4 µs guard interval support 2412 ~ 2484 MHz Bluetooth v4.2 BR/EDR and Bluetooth LE specification NZIF receiver with 97 dBm sensitivity Class-1, class-2 and class-3 transmitter AFH CVSD and SBC SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, Two-Wire Automotive Interface (TWAI®), compatible with ISO11898-1 (CAN Specification 2.0) Hall sensor 40 MHz crystal 4 MB 3.0 V ~ 3.6 V 500 mA 40 °C ~ +85 °C or 40 °C ~ +105 °C (18.00±0.10) mm × (25.50±0.10) mm × (3.10±0.10) mm Level 3 Espressif Systems Not Recommended For New Designs (NRND) 5 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 2 Pin Definitions 2 Pin Definitions 2.1 Pin Layout Keepout Zone 1 GND 2 3V3 3 EN 4 SENSOR_VP 5 SENSOR_VN 6 IO34 7 IO35 8 IO32 9 IO33 10 IO25 11 IO26 12 IO27 13 IO14 14 IO12 39 GND GND 38 IO23 37 IO22 36 TXD0 35 RXD0 34 IO21 33 NC 32 IO19 31 IO18 30 IO5 29 IO17 28 IO16 27 IO4 26 IO0 25 IO2 24 IO15 23 SD1 22 SD0 21 CLK 20 CMD 19 SD3 18 SD2 17 IO13 16 GND 15 Figure 1: ESP32SOLO1 Pin Layout (Top View) 2.2 Pin Description ESP32-SOLO-1 has 38 pins. See pin definitions in Table 3. Table 3: Pin Definitions Name No. GND 1 3V3 2 EN 3 SENSOR_VP 4 SENSOR_VN 5 IO34 6 Espressif Systems Type P P I I I I Function Ground Power supply Module-enable signal. Active high. GPIO36, ADC1_CH0, RTC_GPIO0 GPIO39, ADC1_CH3, RTC_GPIO3 GPIO34, ADC1_CH6, RTC_GPIO4 Not Recommended For New Designs (NRND) 6 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 2 Pin Definitions Name No. IO35 7 IO32 8 IO33 9 IO25 10 IO26 11 IO27 12 IO14 13 IO12 14 GND 15 IO13 16 SHD/SD2* 17 SWP/SD3* 18 SCS/CMD* 19 SCK/CLK* 20 SDO/SD0* 21 SDI/SD1* 22 IO15 23 IO2 24 IO0 25 IO4 26 IO16 27 IO17 28 IO5 29 IO18 30 IO19 31 NC 32 IO21 33 RXD0 34 TXD0 35 IO22 36 IO23 37 GND 38 Type I I/O I/O I/O I/O I/O I/O I/O P I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O P Function GPIO35, ADC1_CH7, RTC_GPIO5 GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 Ground GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK GPIO18, VSPICLK, HS1_DATA7 GPIO19, VSPIQ, U0CTS, EMAC_TXD0 GPIO21, VSPIHD, EMAC_TX_EN GPIO3, U0RXD, CLK_OUT2 GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 GPIO22, VSPIWP, U0RTS, EMAC_TXD1 GPIO23, VSPID, HS1_STROBE Ground Espressif Systems Not Recommended For New Designs (NRND) 7 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 2 Pin Definitions Notice: * Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected to the integrated SPI flash integrated on the module and are not recommended for other uses. 2.3 Strapping Pins ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics: · MTDI · GPIO0 · GPIO2 · MTDO · GPIO5 Software can read the values of these five bits from register "GPIO_STRAPPING". During the chip's system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of the strapping pins sample the voltage level as strapping bits of "0" or "1", and hold these bits until the chip is powered down or shut down. The strapping bits configure the device's boot mode, the operating voltage of VDD_SDIO and other initial system settings. Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCU's GPIOs to control the voltage level of these pins when powering on ESP32. After reset release, the strapping pins work as normal-function pins. Refer to Table 4 for a detailed boot-mode configuration by strapping pins. Table 4: Strapping Pins Voltage of Internal LDO (VDD_SDIO) Pin Default 3.3 V 1.8 V MTDI Pull-down 0 1 Booting Mode Pin Default SPI Boot Download Boot GPIO0 Pull-up 1 0 GPIO2 Pull-down Don't-care 0 Enabling/Disabling Debugging Log Print over U0TXD During Booting Pin Default U0TXD Active U0TXD Silent MTDO Pull-up 1 0 Timing of SDIO Slave FE Sampling FE Sampling RE Sampling RE Sampling Pin Default FE Output RE Output FE Output RE Output MTDO Pull-up 0 0 1 1 GPIO5 Pull-up 0 1 0 1 Espressif Systems Not Recommended For New Designs (NRND) 8 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 2 Pin Definitions Note: · FE: falling-edge, RE: rising-edge. · Firmware can configure register bits to change the settings of "Voltage of Internal LDO (VDD_SDIO)" and "Timing of SDIO Slave" after booting. The illustration below shows the ESP32 power-up and reset timing. Details about the parameters are listed in Table 5. t0 t1 VDD3P3_RTC Min VDD CHIP_PU VIL_nRST Figure 2: ESP32 Powerup and Reset Timing Table 5: Description of ESP32 Powerup and Reset Timing Parameters Parameters Description Min. Unit Time between the 3.3 V rails being brought up and CHIP_PU being t0 activated 50 µs t1 Duration of CHIP_PU signal level < VIL_nRST (refer to its value in 50 µs Table 8 DC Characteristics) to reset the chip Espressif Systems Not Recommended For New Designs (NRND) 9 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 3 Functional Description 3 Functional Description This chapter describes the modules and functions integrated in ESP32-SOLO-1. 3.1 CPU and Internal Memory ESP32-S0WD contains one low-power Xtensa® 32-bit LX6 microprocessor. The internal memory includes: · 448 KB of ROM for booting and core functions. · 520 KB of on-chip SRAM for data and instructions. · 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode. · 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during the Deep-sleep mode. · 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including flash-encryption and chip-ID. 3.2 External Flash and SRAM ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to protect developers' programs and data in flash. ESP32 can access the external QSPI flash and SRAM through high-speed caches. · The external flash can be mapped into CPU instruction memory space and read-only memory space simultaneously. When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be reduced due to speculative reads by the CPU. When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads are supported. · External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads and writes are supported. ESP32-SOLO-1 integrates a 4 MB SPI flash, which is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as regular GPIOs. 3.3 Crystal Oscillators The module uses a 40-MHz crystal oscillator. Espressif Systems Not Recommended For New Designs (NRND) 10 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 3 Functional Description 3.4 RTC and LowPower Management With the use of advanced power-management technologies, ESP32 can switch between different power modes. For details on ESP32's power consumption in different power modes, please refer to section "RTC and Low-Power Management" in ESP32 Datasheet. Espressif Systems Not Recommended For New Designs (NRND) 11 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 4 Peripherals and Sensors 4 Peripherals and Sensors Please refer to Section Peripherals and Sensors in ESP32 Datasheet. Note: External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to the module's integrated SPI flash. For details, please see Section 6 Schematics. Espressif Systems Not Recommended For New Designs (NRND) 12 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 5 Electrical Characteristics 5 Electrical Characteristics 5.1 Absolute Maximum Ratings Stresses beyond the absolute maximum ratings listed in Table 6 below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions. Table 6: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage 0.3 3.6 V Ioutput1 Cumulative IO output current - 1,100 mA Tstore Storage temperature 40 105 °C 1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains (VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 2. Please see Appendix IO_MUX of ESP32 Datasheet for IO's power domain. 5.2 Recommended Operating Conditions Table 7: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V IV DD Current delivered by external power supply 0.5 - - A T Operating ambient temperature 85 or 105, 40 - °C depending on model 5.3 DC Characteristics (3.3 V, 25 °C) Table 8: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit CIN Pin capacitance -2 - pF VIH High-level input voltage 0.75×VDD1 - VDD1+0.3 V VIL Low-level input voltage 0.3 - 0.25×VDD1 V IIH High-level input current -- 50 nA IIL Low-level input current -- 50 nA VOH High-level output voltage 0.8×VDD1 - -V VOL Low-level output voltage - - 0.1×VDD1 V VDD3P3_CPU High-level source current (VDD1 = 3.3 V, power domain 1, 2 VDD3P3_RTC IOH VOH >= 2.64 V, power domain 1, 2 output drive strength set - 40 - 40 - mA - mA to the maximum) Espressif Systems Not Recommended For New Designs (NRND) 13 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 5 Electrical Characteristics Symbol IOL RP U RP D VI L_nRS T Parameter VDD_SDIO power domain 1, 3 Low-level sink current (VDD1 = 3.3 V, VOL = 0.495 V, output drive strength set to the maximum) Resistance of internal pull-up resistor Resistance of internal pull-down resistor Low-level input voltage of CHIP_PU to power off the chip Min Typ - 20 Max Unit - mA - 28 - 45 - 45 -- - mA - k - k 0.6 V Notes: 1. Please see Appendix IO_MUX of ESP32 Datasheet for IO's power domain. VDD is the I/O voltage for a particular power domain of pins. 2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases. 3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 5.4 WiFi Radio Table 9: WiFi Radio Characteristics Parameter Center frequency range of operating channel note1 Output impedance note2 TX power note3 Sensitivity Adjacent channel rejection Condition - 11n, MCS7 11b mode 11b, 1 Mbps 11b, 11 Mbps 11g, 6 Mbps 11g, 54 Mbps 11n, HT20, MCS0 11n, HT20, MCS7 11n, HT40, MCS0 11n, HT40, MCS7 11g, 6 Mbps 11g, 54 Mbps 11n, HT20, MCS0 11n, HT20, MCS7 Min Typical Max Unit 2412 - 2484 MHz - note 2 12 13 17.5 18.5 - 98 - 89 - 92 - 74 - 91 - 71 - 89 - 69 - 31 - 14 - 31 - 13 - 14 dBm 20 dBm - dBm - dBm - dBm - dBm - dBm - dBm - dBm - dBm - dB - dB - dB - dB 1. Device should operate in the center frequency range of operating channel allocated by regional regulatory authorities. Target center frequency range of operating channel is configurable by software. 2. For the modules that use external antennas, the output impedance is 50 . For other modules without external antennas, users do not need to concern about the output impedance. 3. Target TX power is configurable based on device or certification requirements. Espressif Systems Not Recommended For New Designs (NRND) 14 Submit Documentation Feedback ESP32-SOLO-1 Datasheet v2.0 5 Electrical Characteristics 5.5 Bluetooth LE Radio 5.5.1 Receiver Table 10: Receiver Characteristics Bluetooth LE Parameter Sensitivity @30.8% PER Maximum received signal @30.8% PER Co-channel C/I Adjacent channel selectivity C/I Out-of-band blocking performance Intermodulation Conditions Min Typ Max Unit - - 97 - dBm - 0 - - dBm - - +10 - dB F = F0 + 1 MHz - 5 - dB F = F0 1 MHz - 5 - dB F = F0 + 2 MHz - 25 - dB F = F0 2 MHz - 35 - dB F = F0 + 3 MHz - 25 - dB F = F0 3 MHz - 45 - dB 30 MHz ~ 2000 MHz 10 - - dBm 2000 MHz ~ 2400 MHz 27 - - dBm 2500 MHz ~ 3000 MHz 27 - - dBm 3000 MHz ~ 12.5 GHz 10 - - dBm - 36 - - dBm 5.5.2 Transmitter Table 11: Transmitter Characteristics Bluetooth LE Parameter RF transmit power Gain control step RF power control range Adjacent channel transmit power f 1avg f 2max f 2avg/ f 1avg ICFT Drift rate Drift Conditions F = F0 ± 2 MHz F = F0 ± 3 MHz F = F0 ± > 3 MHz - Min Typ Max Unit - 0 - dBm - 3 - dB 12 - +9 dBm - 52 - dBm - 58 - dBm - 60 - dBm - - 265 kHz 247 - - kHz - 0.92 -- - 10 - kHz - 0.7 - kHz/50 µs - 2 - kHz Espressif Systems Not Recommended For New Designs (NRND) 15 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 6 Schematics Espressif Systems 6 Schematics This is the reference design of the module. 16 Submit Documentation Feedback The values of C1 and C2 vary with the selection of the crystal. The value of R2 varies with the actual PCB board. GND 3 4 GND U1 GND GND XOUT XIN GND VDD33 C1 22pF/6.3V(10%) VDD33 VDD33 C11 1uF C3 C20 100pF 1uF GND GND GND C5 10nF/6.3V(10%) R1 C6 20K(5%) C9 0.1uF GND L5 2.0nH GND 3.3nF/6.3V(10%) 49 GND C12 C13 C10 C21 NC 10uF 0.1uF NC ANT1 GND 1 2 GND GND C14 TBD GND PCB ANT C15 TBD C16 L4 NC TBD C17 NC GND GND GND The values of C15, C14 and L4 vary with the actual PCB board. GND 1 2 3 4 SENSOR_VP 5 6 7 SENSOR_VN8 CHIP_PU 9 GPIO34 10 GPIO35 11 GPIO32 12 GPIO33 13 GPIO25 14 VDDA LNA_IN VDD3P3 VDD3P3 SENSOR_VP SENSOR_CAPP SENSOR_CAPN SENSOR_VN CHIP_PU VDET_1 VDET_2 32K_XP 32K_XN GPIO25 U2 15 16 GPIO26 17 GPIO27 18 MTMS 19 MTDI 20 VDD3P3_RTC 21 MTCK 22 MTDO 23 GPIO2 24 GPIO0 GPIO4 48 CAP1 47 CAP2 46 VDDA 45 XTAL_P 44 R2 XTAL_N 43 VDDA 42 GPIO21 41 U0TXD 40 U0RXD 39 GPIO22 100R 1 C2 22pF/6.3V(10%) 2 GND 40MHz+/-10ppm R3 499R GPIO21 U0TXD U0RXD GPIO22 GND C4 0.1uF VDD33 VDD_SDIO 38 GPIO19 37 VDD3P3_CPU 36 GPIO23 35 GPIO18 34 GPIO5 33 SD_DATA_1 32 SD_DATA_0 31 SD_CLK 30 SD_CMD 29 SD_DATA_3 28 SD_DATA_2 27 GPIO17 26 VDD_SDIO 25 GPIO16 ESP32-S0WD GPIO19 GPIO23 GPIO18 GPIO5 SDI/SD1 SDO/SD0 SCK/CLK SCS/CMD SWP/SD3 SHD/SD2 GPIO17 GPIO16 SCS/CMD SCK/CLK SHD/SD2 U3 1 /CS 6 CLK 7 /HOLD FLASH GND VCC 5 DI 2 DO 3 /WP 4 GND 8 VDD_SDIO C18 1uF GND VDD33 SDI/SD1 SDO/SD0 SWP/SD3 GPIO26 GPIO27 GPIO14 GPIO12 GPIO13 GPIO15 GPIO2 GPIO0 GPIO4 C19 0.1uF GND Pin.1 GND Pin.2 3V3 Pin.15 GND GND D1 Pin.16 LESD8D3.3CAT5G IO13 VDD33 GND GPIO13 Pin.3 CHIP_PU/EN CHIP_PU Pin.17 SD2 SHD/SD2 Pin.4 SENSOR_VP SENSOR_VP Pin.18 SD3 SWP/SD3 Pin.5 SENSOR_VN SENSOR_VN Pin.19 CMD SCS/CMD Pin.6 IO34 GPIO34 Pin.20 CLK SCK/CLK Pin.7 IO35 GPIO35 Pin.21 SD0 SDO/SD0 Pin.8 IO32 GPIO32 Pin.22 SD1 SDI/SD1 Pin.9 IO33 GPIO33 Pin.23 IO15 GPIO15 Pin.10 IO25 GPIO25 Pin.24 IO2 GPIO2 Pin.11 IO26 GPIO26 Pin.12 IO27 GPIO27 Pin.13 IO14 GPIO14 Pin.14 IO12 GPIO12 Pin.39 GND GND Pin.38 GND Pin.37 IO23 GND GPIO23 Pin.36 IO22 GPIO22 Pin.35 U0TXD U0TXD Pin.34 U0RXD U0RXD Pin.33 IO21 GPIO21 Pin.32 NC Pin.31 IO19 GPIO19 Pin.30 IO18 GPIO18 Pin.29 IO5 GPIO5 Pin.28 IO17 GPIO17 Pin.27 IO16 GPIO16 Pin.26 IO4 GPIO4 Pin.25 IO0 GPIO0 Figure 3: ESP32SOLO1 Schematics Not Recommended For New Designs (NRND) ESP32-SOLO-1 Datasheet v2.0 7 Peripheral Schematics 5 4 3 2 7 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). VDD33 VDD33 C1 10uF C2 0.1uF GND R1 TBD GND C3 TBD EN GND U1 1 2 3 SENSOR_VP 4 SENSOR_VN 5 IO34 6 IO35 7 IO32 8 IO33 9 IO25 10 IO26 11 IO27 12 13 14 GND1 3V3 EN SENSOR_VP SENSOR_VN IO34 IO35 IO32 IO33 IO25 IO26 IO27 IO14 IO12 39 P_GND 38 GND3 37 IO23 36 IO22 35 TXD0 34 RXD0 33 IO21 32 NC 31 IO19 30 IO18 29 IO5 28 IO17 27 IO16 26 IO4 25 IO0 GND IO23 IO22 TXD RXD IO21 IO19 IO18 IO5 IO17 IO16 IO4 IO0 3 2 1 UART DOWNLOAD J1 GND GND 2 1 15 16 GND2 17 IO13 18 SD2 19 SD3 20 CMD 21 CLK 22 SD0 23 SD1 24 IO15 IO2 J2 BOOT OPTION SD2 SD3 CMD CLK SD0 SD1 IO2 U2 1 MTMS 2 MTDI 3 MTCK 4 MTDO JTAG R2 100R R3 100R R4 100R R5 100R MTMS MTDI MTCK MTDO GND MTDI should be kept at a low electric level when powering up the module. Figure 4: ESP32SOLO1 Peripheral Schematics Note: Espressif Systems Title Application of ESP32-WROOM-32 · Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users Size Document Number do want to solder it, they need to ensure that the correct quantity of soldering paste is applied. A4 <Doc> Date: Wednesday, August 07, 2019 She 5 · To ensure the power suppl4y to the ESP32 chip during power-up,3it is advised to add an RC delay circui2t at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 k and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32's power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32 Datasheet. Espressif Systems Not Recommended For New Designs (NRND) 17 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 3.60 6.19 10.29 8 Physical Dimensions 8 Physical Dimensions Unit: mm 25.50±0.15 16.51 1.50 1.27 0.90 1.05 0.45 15.80 Ø0.50 8.89 11.43 18.00±0.15 Top View 17.60 6.19 3.10±0.15 0.80 0.85 3.60 0.90 0.1 0.90 10.50 0.85 Side View Bottom View Figure 5: Physical Dimensions of ESP32SOLO1 Note: For information about tape, reel, and product marking, please refer to Espressif Module Package Information. Espressif Systems Not Recommended For New Designs (NRND) 18 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 9 Recommended PCB Land Pattern 9 Recommended PCB Land Pattern Unit: mm Via for thermal pad Copper 25.50 1.50 1.27 38x0.90 6.19 18.00 38x1.50 Antenna Area 1 3.70 38 0.90 0.50 16.51 7.50 10.29 0.50 0.90 3.70 0.50 14 15 1.27 11.43 24 25 1.50 0.50 3.28 Figure 6: Recommended PCB Land Pattern of ESP32SOLO1 Espressif Systems Not Recommended For New Designs (NRND) 19 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 10 Product Handling 10 Product Handling 10.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60 %RH. If the above conditions are not met, the module needs to be baked. 10.2 Electrostatic Discharge (ESD) · Human body model (HBM): ±2000 V · Charged-device model (CDM): ±500 V 10.3 Reflow Profile Solder the module in a single reflow. Temperature () 250 Preheating zone 150 ~ 200 60 ~ 120 s 217 200 Ramp-up zone 1 ~ 3 /s 100 Peak Temp. 235 ~ 250 Reflow zone !217 60 ~ 90 s Soldering time > 30 s Cooling zone 1 ~ 5 /s 50 25 0 0 50 100 150 200 Ramp-up zone -- Temp.: 25 ~ 150 Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 /s Preheating zone -- Temp.: 150 ~ 200 Time: 60 ~ 120 s Reflow zone -- Temp.: >217 7LPH60 ~ 90 s; Peak Temp.: 235 ~ 250 Time: 30 ~ 70 s Cooling zone -- Peak Temp. ~ 180 Ramp-down rate: 1 ~ 5 /s Solder -- Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 7: Reflow Profile Time (sec.) 250 Espressif Systems Not Recommended For New Designs (NRND) 20 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 10 Product Handling 10.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems Not Recommended For New Designs (NRND) 21 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback 11 Related Documentation and Resources 11 Related Documentation and Resources Related Documentation · ESP32 Series Datasheet Specifications of the ESP32 hardware. · ESP32 Technical Reference Manual Detailed information on how to use the ESP32 memory and peripherals. · ESP32 Hardware Design Guidelines Guidelines on how to integrate the ESP32 into your hardware product. · ESP32 ECO and Workarounds for Bugs Correction of ESP32 design errors. · Certificates https://espressif.com/en/support/documents/certificates · ESP32 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns · ESP32 Advisories Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories · Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone · ESP-IDF Programming Guide for ESP32 Extensive documentation for the ESP-IDF development framework. · ESP-IDF and other development frameworks on GitHub. https://github.com/espressif · ESP32 BBS Forum Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ · The ESP Journal Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ · See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products · ESP32 Series SoCs Browse through all ESP32 SoCs. https://espressif.com/en/products/socs?id=ESP32 · ESP32 Series Modules Browse through all ESP32-based modules. https://espressif.com/en/products/modules?id=ESP32 · ESP32 Series DevKits Browse through all ESP32-based devkits. https://espressif.com/en/products/devkits?id=ESP32 · ESP Product Selector Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us · See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems Not Recommended For New Designs (NRND) 22 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback Revision History Revision History Date 2022-07-07 2022-03-04 2021-02-04 2020-11-27 2019.09 2019.07 2019.01 2018.09 2018.09 Version v2.0 v1.9 V1.8 V1.7 V1.6 V1.5 V1.4 V1.3 V1.2 Release notes Added Section 10: Product Handling Added Figure 2 and Table 5 in Section 2.3: Strapping Pins Added a label of (Not Recommended For New Designs) to this document Updated Table 1 Added a link to RF certificates in Table 2 Updated Table 6 Added a note below Figure 5 Added Section 11: Related Documentation and Resources Replaced Espressif Product Ordering Information with ESP Product Selector Updated Figure 5: Physical Dimensions of ESP32-SOLO-1 and Figure 6: Recommended PCB Land Pattern of ESP32-SOLO-1. Modified the note below Figure 7: Reflow Profile. Updated the trade mark from TWAITM to TWAI®. Added TWAITM in Table 2; Updated Figure 7 and added a note under it; Added notes about schematics and peripheral schematics; Fixed some typos; Updated the C value in RC delay circuit from 0.1 µF to 1 µF; Provided feedback link. Changed the supply voltage range from 2.7 V ~ 3.6 V to 3.0 V ~ 3.6 V; Updated Section 7 Peripheral Schematics and added a note about RC delay circuit under it; Updated Figure 9 Recommended PCB Land Pattern. Added a new variant with high temperature range (40 °C ~ +105 °C) in Chapter 1 Overview; Added Moisture sensitivity level (MSL) 3 in Table 2 ESP32-SOLO-1 Specifications; Added notes about "Operating frequency range" and "TX power" under Table 9 Wi-Fi Radio Characteristics. Changed the RF power control range in Table 11 from 12 ~ +12 to 12 ~ +9 dBm. · Updated the descriptions of pins IO16 and IO17 in Table 3: Pin Definitions; · Added "Cumulative IO output current" entry to Table 6: Absolute Maximum Ratings; · Added more parameters to Table 8: DC Characteristics. Updated the hole diameter in the shield from 1.00 mm to 0.50 mm, in Figure 5. Added RoHS certification. Espressif Systems Not Recommended For New Designs (NRND) 23 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback Revision History Date 2018.08 2018.06 Version V1.1 V1.0 Release notes · Added certifications and reliability test items the module has passed in Table 2: ESP32-SOLO-1 Specifications, and removed softwarespecific information; · Updated section 3.4: RTC and Low-Power Management; · Changed the modules' dimensions from (18±0.2) mm x (25.5 ±0.2) mm x (3.1±0.15) mm to (18.00±0.10) mm x (25.50±0.10) mm x (3.10±0.10) mm; · Updated Table 9: Wi-Fi Radio; · Updated Figure 8: Physical Dimensions. First release. Espressif Systems Not Recommended For New Designs (NRND) 24 ESP32-SOLO-1 Datasheet v2.0 Submit Documentation Feedback www.espressif.com Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY'S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2022 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. Not Recommended For New Designs (NRND)
References
- The ESP Journal
- Get Started - ESP32 - — ESP-IDF Programming Guide latest documentation
- ESP32 Forum - Index page
- Sales Questions | Espressif Systems
- ESP DevKits | Espressif Systems
- ESP Modules | Espressif Systems
- ESP SoCs | Espressif Systems
- Advisories | Espressif Systems
- Certificates | Espressif Systems
- PCNs | Espressif Systems
- Technical Documents | Espressif Systems
- SDKs & Demos | Espressif Systems
- Espressif Systems · GitHub
- ESP Product Selector
- ESP Product Selector
- Wireless SoCs, Software, Cloud and AIoT Solutions | Espressif Systems
- Documentation Feedback | Espressif Systems
- Longevity Commitment | Espressif Systems
- Certificates | Espressif Systems