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7 juil. 2022 — through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast ... ESP32 Technical Reference Manual.

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ESP32-SOLO-1 — это одноядерный модуль на базе чипа ESP32 со встроенным WiFi и Bluetooth | CNXSoft - Новости Андроид приставок и встраиваемых систем

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Document DEVICE REPORTesp32-solo-1 datasheet en ?ct=t(EMAIL CAMPAIGN 7 5 2018 19 28)&mc cid=fc92b600a8&mc eid=9b573361a7
ESP32SOLO1
Datasheet
NOTFROERCONMEWM(ENDNREDSNEIDGD)NS
Version v2.0 Espressif Systems Copyright © 2022
www.espressif.com

Contents

1 Overview

4

2 Pin Definitions

6

2.1 Pin Layout

6

2.2 Pin Description

6

2.3 Strapping Pins

8

3 Functional Description

10

3.1 CPU and Internal Memory

10

3.2 External Flash and SRAM

10

3.3 Crystal Oscillators

10

3.4 RTC and Low-Power Management

11

4 Peripherals and Sensors

12

5 Electrical Characteristics

13

5.1 Absolute Maximum Ratings

13

5.2 Recommended Operating Conditions

13

5.3 DC Characteristics (3.3 V, 25 °C)

13

5.4 Wi-Fi Radio

14

5.5 Bluetooth LE Radio

15

5.5.1 Receiver

15

5.5.2 Transmitter

15

6 Schematics

16

7 Peripheral Schematics

17

8 Physical Dimensions

18

9 Recommended PCB Land Pattern

19

10 Product Handling

20

10.1 Storage Conditions

20

10.2 Electrostatic Discharge (ESD)

20

10.3 Reflow Profile

20

10.4 Ultrasonic Vibration

21

11 Related Documentation and Resources

22

Revision History

23

List of Tables

1 ESP32-SOLO-1 Ordering Information

4

2 ESP32-SOLO-1 Specifications

4

3 Pin Definitions

6

4 Strapping Pins

8

5 Description of ESP32 Power-up and Reset Timing Parameters

9

6 Absolute Maximum Ratings

13

7 Recommended Operating Conditions

13

8 DC Characteristics (3.3 V, 25 °C)

13

9 Wi-Fi Radio Characteristics

14

10 Receiver Characteristics ­ Bluetooth LE

15

11 Transmitter Characteristics ­ Bluetooth LE

15

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List of Figures

1 ESP32-SOLO-1 Pin Layout (Top View)

6

2 ESP32 Power-up and Reset Timing

9

3 ESP32-SOLO-1 Schematics

16

4 ESP32-SOLO-1 Peripheral Schematics

17

5 Physical Dimensions of ESP32-SOLO-1

18

6 Recommended PCB Land Pattern of ESP32-SOLO-1

19

7 Reflow Profile

20

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1 Overview

1 Overview

ESP32-SOLO-1 is a powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU module that targets a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming and MP3 decoding.
Two different temperature variants of ESP32-SOLO-1 are available. Details are listed as follows:

Table 1: ESP32SOLO1 Ordering Information

Module
ESP32-SOLO-1 (Default Version) ESP32-SOLO-1 (High Temp Version)

Chip embedded ESP32-S0WD
ESP32-S0WD

Recommended operating ambient temperature ­40 °C ~ +85 °C
­40 °C ~ +105 °C

Flash 4 MB 4 MB

Dimensions (mm) 18 × 25.5 × 3.1 18 × 25.5 × 3.1

For detailed ordering information, please see ESP Product Selector. The information in this datasheet is applicable to both modules.
At the core of this module is the ESP32-S0WD chip. ESP32-S0WD is a member of the ESP32 family of chips, which features a single core and contains all the peripherals of its dual-core counterparts. Available in a 5×5 mm QFN, ESP32-S0WD offers great value for money, with its sustained performance when powering complex IoT applications.
Note: * For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.

The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted, and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps, and 20 dBm output power at the antenna to ensure the widest physical range. Several peripherals facilitate integration with other electronic devices. As such the chip does offer industry-leading specifications and ultra-high performance for electronic integration, range, power consumption, and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that developers can upgrade their products even after their release at minimum cost and effort.
Table 2 provides the specifications of ESP32-SOLO-1. Table 2: ESP32SOLO1 Specifications

Categories Certification

Items RF certification Wi-Fi certification Green certification

Specifications See certificates for ESP32-SOLO-1 Wi-Fi Alliance RoHS/REACH

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1 Overview

Categories Test Wi-Fi
Bluetooth
Hardware

Items Reliablity
Protocols
Center frequency range of operating channel Protocols
Radio
Audio
Module interfaces
On-chip sensor Integrated crystal Integrated SPI flash Operating voltage/Power supply Minimum current delivered by power supply Operating ambient temperature range Package size Moisture sensitivity level (MSL)

Specifications HTOL/HTSL/uHAST/TCT/ESD 802.11 b/g/n (802.11n up to 150 Mbps) A-MPDU and A-MSDU aggregation and 0.4 µs guard interval support
2412 ~ 2484 MHz
Bluetooth v4.2 BR/EDR and Bluetooth LE specification NZIF receiver with ­97 dBm sensitivity Class-1, class-2 and class-3 transmitter AFH CVSD and SBC SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, Two-Wire Automotive Interface (TWAI®), compatible with ISO11898-1 (CAN Specification 2.0) Hall sensor 40 MHz crystal 4 MB 3.0 V ~ 3.6 V
500 mA
­40 °C ~ +85 °C or ­40 °C ~ +105 °C
(18.00±0.10) mm × (25.50±0.10) mm × (3.10±0.10) mm Level 3

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2 Pin Definitions
2 Pin Definitions
2.1 Pin Layout

Keepout Zone

1

GND

2

3V3

3

EN

4

SENSOR_VP

5

SENSOR_VN

6

IO34

7

IO35

8

IO32

9

IO33

10

IO25

11

IO26

12

IO27

13

IO14

14

IO12

39 GND

GND

38

IO23

37

IO22

36

TXD0

35

RXD0

34

IO21

33

NC

32

IO19

31

IO18

30

IO5

29

IO17

28

IO16

27

IO4

26

IO0

25

IO2 24 IO15 23 SD1 22 SD0 21 CLK 20 CMD 19 SD3 18 SD2 17 IO13 16 GND 15

Figure 1: ESP32SOLO1 Pin Layout (Top View)

2.2 Pin Description
ESP32-SOLO-1 has 38 pins. See pin definitions in Table 3.

Table 3: Pin Definitions

Name

No.

GND

1

3V3

2

EN

3

SENSOR_VP 4

SENSOR_VN 5

IO34

6

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Type P P I I I I

Function

Ground

Power supply

Module-enable signal. Active high.

GPIO36, ADC1_CH0, RTC_GPIO0

GPIO39, ADC1_CH3, RTC_GPIO3

GPIO34, ADC1_CH6, RTC_GPIO4

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2 Pin Definitions

Name

No.

IO35

7

IO32

8

IO33

9

IO25

10

IO26

11

IO27

12

IO14

13

IO12

14

GND

15

IO13

16

SHD/SD2* 17

SWP/SD3* 18

SCS/CMD* 19

SCK/CLK* 20

SDO/SD0* 21

SDI/SD1*

22

IO15

23

IO2

24

IO0

25

IO4

26

IO16

27

IO17

28

IO5

29

IO18

30

IO19

31

NC

32

IO21

33

RXD0

34

TXD0

35

IO22

36

IO23

37

GND

38

Type I
I/O
I/O
I/O I/O I/O
I/O
I/O
P
I/O
I/O I/O I/O I/O I/O I/O
I/O
I/O
I/O
I/O
I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O P

Function GPIO35, ADC1_CH7, RTC_GPIO5 GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 Ground GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK GPIO18, VSPICLK, HS1_DATA7 GPIO19, VSPIQ, U0CTS, EMAC_TXD0 GPIO21, VSPIHD, EMAC_TX_EN GPIO3, U0RXD, CLK_OUT2 GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 GPIO22, VSPIWP, U0RTS, EMAC_TXD1 GPIO23, VSPID, HS1_STROBE Ground

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2 Pin Definitions

Notice:
* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected to the integrated SPI flash integrated on the module and are not recommended for other uses.

2.3 Strapping Pins
ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics: · MTDI · GPIO0 · GPIO2 · MTDO · GPIO5
Software can read the values of these five bits from register "GPIO_STRAPPING". During the chip's system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of the strapping pins sample the voltage level as strapping bits of "0" or "1", and hold these bits until the chip is powered down or shut down. The strapping bits configure the device's boot mode, the operating voltage of VDD_SDIO and other initial system settings. Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCU's GPIOs to control the voltage level of these pins when powering on ESP32. After reset release, the strapping pins work as normal-function pins. Refer to Table 4 for a detailed boot-mode configuration by strapping pins.

Table 4: Strapping Pins

Voltage of Internal LDO (VDD_SDIO)

Pin

Default

3.3 V

1.8 V

MTDI Pull-down

0

1

Booting Mode

Pin

Default

SPI Boot

Download Boot

GPIO0 Pull-up

1

0

GPIO2 Pull-down

Don't-care

0

Enabling/Disabling Debugging Log Print over U0TXD During Booting

Pin

Default

U0TXD Active

U0TXD Silent

MTDO Pull-up

1

0

Timing of SDIO Slave

FE Sampling FE Sampling RE Sampling RE Sampling

Pin

Default FE Output RE Output FE Output RE Output

MTDO Pull-up

0

0

1

1

GPIO5 Pull-up

0

1

0

1

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2 Pin Definitions

Note:
· FE: falling-edge, RE: rising-edge. · Firmware can configure register bits to change the settings of "Voltage of Internal LDO (VDD_SDIO)" and "Timing
of SDIO Slave" after booting.

The illustration below shows the ESP32 power-up and reset timing. Details about the parameters are listed in Table 5.

t0

t1

VDD3P3_RTC Min

VDD

CHIP_PU

VIL_nRST

Figure 2: ESP32 Powerup and Reset Timing

Table 5: Description of ESP32 Powerup and Reset Timing Parameters

Parameters Description

Min. Unit

Time between the 3.3 V rails being brought up and CHIP_PU being

t0

activated

50

µs

t1

Duration of CHIP_PU signal level < VIL_nRST (refer to its value in 50

µs

Table 8 DC Characteristics) to reset the chip

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3 Functional Description
3 Functional Description
This chapter describes the modules and functions integrated in ESP32-SOLO-1.
3.1 CPU and Internal Memory
ESP32-S0WD contains one low-power Xtensa® 32-bit LX6 microprocessor. The internal memory includes:
· 448 KB of ROM for booting and core functions. · 520 KB of on-chip SRAM for data and instructions. · 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode. · 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor
during the Deep-sleep mode. · 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
3.2 External Flash and SRAM
ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to protect developers' programs and data in flash. ESP32 can access the external QSPI flash and SRAM through high-speed caches.
· The external flash can be mapped into CPU instruction memory space and read-only memory space simultaneously. ­ When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be reduced due to speculative reads by the CPU. ­ When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads are supported.
· External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads and writes are supported.
ESP32-SOLO-1 integrates a 4 MB SPI flash, which is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as regular GPIOs.
3.3 Crystal Oscillators
The module uses a 40-MHz crystal oscillator.

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3 Functional Description
3.4 RTC and LowPower Management
With the use of advanced power-management technologies, ESP32 can switch between different power modes. For details on ESP32's power consumption in different power modes, please refer to section "RTC and Low-Power Management" in ESP32 Datasheet.

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4 Peripherals and Sensors
4 Peripherals and Sensors
Please refer to Section Peripherals and Sensors in ESP32 Datasheet. Note: External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to the module's integrated SPI flash. For details, please see Section 6 Schematics.

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5 Electrical Characteristics

5 Electrical Characteristics

5.1 Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in Table 6 below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions.

Table 6: Absolute Maximum Ratings

Symbol Parameter

Min Max Unit

VDD33 Power supply voltage

­0.3 3.6 V

Ioutput1 Cumulative IO output current

- 1,100 mA

Tstore Storage temperature

­40 105 °C

1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains (VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX of ESP32 Datasheet for IO's power domain.

5.2 Recommended Operating Conditions

Table 7: Recommended Operating Conditions

Symbol Parameter

Min Typ Max

Unit

VDD33 Power supply voltage

3.0 3.3 3.6

V

IV DD Current delivered by external power supply 0.5 - -

A

T

Operating ambient temperature

85 or 105,

­40 -

°C

depending on model

5.3 DC Characteristics (3.3 V, 25 °C)

Table 8: DC Characteristics (3.3 V, 25 °C)

Symbol

Parameter

Min Typ

Max

Unit

CIN

Pin capacitance

-2

- pF

VIH

High-level input voltage

0.75×VDD1 - VDD1+0.3 V

VIL

Low-level input voltage

­0.3 - 0.25×VDD1 V

IIH

High-level input current

--

50 nA

IIL

Low-level input current

--

50 nA

VOH

High-level output voltage

0.8×VDD1 -

-V

VOL

Low-level output voltage

- - 0.1×VDD1 V

VDD3P3_CPU

High-level source current

(VDD1 = 3.3 V,

power domain 1, 2

VDD3P3_RTC

IOH

VOH >= 2.64 V,

power domain 1, 2

output drive strength set

- 40 - 40

- mA - mA

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5 Electrical Characteristics

Symbol
IOL RP U RP D VI L_nRS T

Parameter VDD_SDIO power domain 1, 3
Low-level sink current (VDD1 = 3.3 V, VOL = 0.495 V, output drive strength set to the maximum) Resistance of internal pull-up resistor Resistance of internal pull-down resistor Low-level input voltage of CHIP_PU to power off the chip

Min Typ - 20

Max

Unit

- mA

- 28
- 45 - 45 --

- mA
- k - k 0.6 V

Notes:
1. Please see Appendix IO_MUX of ESP32 Datasheet for IO's power domain. VDD is the I/O voltage for a particular power domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.

5.4 WiFi Radio

Table 9: WiFi Radio Characteristics

Parameter Center frequency range of operating channel note1 Output impedance note2 TX power note3
Sensitivity
Adjacent channel rejection

Condition -
11n, MCS7 11b mode 11b, 1 Mbps 11b, 11 Mbps 11g, 6 Mbps 11g, 54 Mbps 11n, HT20, MCS0 11n, HT20, MCS7 11n, HT40, MCS0 11n, HT40, MCS7 11g, 6 Mbps 11g, 54 Mbps 11n, HT20, MCS0 11n, HT20, MCS7

Min Typical Max Unit

2412

- 2484 MHz

-

note 2

12

13

17.5 18.5

-

­98

-

­89

-

­92

-

­74

-

­91

-

­71

-

­89

-

­69

-

31

-

14

-

31

-

13

-



14 dBm

20 dBm

- dBm

- dBm

- dBm

- dBm

- dBm

- dBm

- dBm

- dBm

- dB

- dB

- dB

- dB

1. Device should operate in the center frequency range of operating channel allocated by regional regulatory authorities. Target center frequency range of operating channel is configurable by software.
2. For the modules that use external antennas, the output impedance is 50 . For other modules without external antennas, users do not need to concern about the output impedance.
3. Target TX power is configurable based on device or certification requirements.

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5 Electrical Characteristics

5.5 Bluetooth LE Radio
5.5.1 Receiver

Table 10: Receiver Characteristics ­ Bluetooth LE

Parameter Sensitivity @30.8% PER Maximum received signal @30.8% PER Co-channel C/I
Adjacent channel selectivity C/I
Out-of-band blocking performance Intermodulation

Conditions

Min Typ Max Unit

-

- ­97

- dBm

-

0

-

- dBm

-

- +10

- dB

F = F0 + 1 MHz

- ­5

- dB

F = F0 ­ 1 MHz

- ­5

- dB

F = F0 + 2 MHz

- ­25

- dB

F = F0 ­ 2 MHz

- ­35

- dB

F = F0 + 3 MHz

- ­25

- dB

F = F0 ­ 3 MHz

- ­45

- dB

30 MHz ~ 2000 MHz ­10

-

- dBm

2000 MHz ~ 2400 MHz ­27

-

- dBm

2500 MHz ~ 3000 MHz ­27

-

- dBm

3000 MHz ~ 12.5 GHz ­10

-

- dBm

-

­36

-

- dBm

5.5.2 Transmitter

Table 11: Transmitter Characteristics ­ Bluetooth LE

Parameter RF transmit power Gain control step RF power control range
Adjacent channel transmit power
 f 1avg  f 2max  f 2avg/ f 1avg ICFT Drift rate Drift

Conditions F = F0 ± 2 MHz F = F0 ± 3 MHz F = F0 ± > 3 MHz -

Min Typ Max Unit

-

0

- dBm

-

3

- dB

­12

- +9 dBm

- ­52

- dBm

- ­58

- dBm

- ­60

- dBm

-

- 265 kHz

247

-

- kHz

- 0.92

--

- ­10

- kHz

- 0.7

- kHz/50 µs

-

2

- kHz

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6 Schematics

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6 Schematics
This is the reference design of the module.

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The values of C1 and C2 vary with the selection of the crystal.
The value of R2 varies with the actual PCB board.
GND

3

4

GND

U1

GND

GND XOUT

XIN GND

VDD33

C1 22pF/6.3V(10%)

VDD33
VDD33 C11 1uF

C3

C20

100pF

1uF

GND

GND

GND

C5 10nF/6.3V(10%)

R1 C6

20K(5%)

C9 0.1uF
GND L5

2.0nH

GND

3.3nF/6.3V(10%)

49 GND

C12

C13

C10

C21

NC

10uF

0.1uF

NC

ANT1 GND
1 2

GND

GND

C14 TBD

GND

PCB ANT

C15 TBD

C16

L4

NC

TBD

C17 NC

GND GND

GND

The values of C15, C14 and L4 vary with the actual PCB board.

GND

1 2 3 4 SENSOR_VP 5 6 7 SENSOR_VN8 CHIP_PU 9 GPIO34 10 GPIO35 11 GPIO32 12 GPIO33 13 GPIO25 14

VDDA LNA_IN VDD3P3 VDD3P3 SENSOR_VP SENSOR_CAPP SENSOR_CAPN SENSOR_VN CHIP_PU VDET_1 VDET_2 32K_XP 32K_XN GPIO25

U2

15 16 GPIO26 17 GPIO27 18 MTMS 19 MTDI 20 VDD3P3_RTC 21 MTCK 22 MTDO 23 GPIO2 24 GPIO0
GPIO4

48 CAP1 47 CAP2 46 VDDA 45 XTAL_P 44 R2 XTAL_N 43 VDDA 42 GPIO21 41 U0TXD 40 U0RXD 39 GPIO22

100R

1

C2 22pF/6.3V(10%)

2

GND 40MHz+/-10ppm

R3

499R

GPIO21 U0TXD U0RXD GPIO22

GND

C4 0.1uF

VDD33

VDD_SDIO

38 GPIO19 37 VDD3P3_CPU 36 GPIO23 35 GPIO18 34
GPIO5 33 SD_DATA_1 32 SD_DATA_0 31
SD_CLK 30 SD_CMD 29 SD_DATA_3 28 SD_DATA_2 27
GPIO17 26 VDD_SDIO 25
GPIO16 ESP32-S0WD

GPIO19
GPIO23 GPIO18 GPIO5 SDI/SD1 SDO/SD0 SCK/CLK SCS/CMD SWP/SD3 SHD/SD2 GPIO17
GPIO16

SCS/CMD SCK/CLK SHD/SD2

U3 1
/CS 6
CLK 7
/HOLD FLASH

GND VCC

5 DI
2 DO
3 /WP

4

GND

8

VDD_SDIO C18 1uF

GND

VDD33

SDI/SD1 SDO/SD0 SWP/SD3

GPIO26 GPIO27 GPIO14 GPIO12 GPIO13 GPIO15 GPIO2 GPIO0 GPIO4

C19 0.1uF
GND

Pin.1 GND
Pin.2 3V3

Pin.15 GND
GND

D1

Pin.16

LESD8D3.3CAT5G IO13

VDD33

GND GPIO13

Pin.3 CHIP_PU/EN
CHIP_PU

Pin.17 SD2

SHD/SD2

Pin.4 SENSOR_VP
SENSOR_VP

Pin.18 SD3

SWP/SD3

Pin.5 SENSOR_VN
SENSOR_VN

Pin.19 CMD

SCS/CMD

Pin.6 IO34

GPIO34

Pin.20 CLK

SCK/CLK

Pin.7 IO35

GPIO35

Pin.21 SD0

SDO/SD0

Pin.8 IO32

GPIO32

Pin.22 SD1

SDI/SD1

Pin.9 IO33

GPIO33

Pin.23 IO15

GPIO15

Pin.10 IO25

GPIO25

Pin.24 IO2

GPIO2

Pin.11 IO26

GPIO26

Pin.12 IO27

GPIO27

Pin.13 IO14

GPIO14

Pin.14 IO12

GPIO12

Pin.39 GND
GND

Pin.38 GND
Pin.37 IO23

GND GPIO23

Pin.36 IO22

GPIO22

Pin.35 U0TXD

U0TXD

Pin.34 U0RXD

U0RXD

Pin.33 IO21

GPIO21

Pin.32 NC

Pin.31 IO19

GPIO19

Pin.30 IO18

GPIO18

Pin.29 IO5

GPIO5

Pin.28 IO17

GPIO17

Pin.27 IO16

GPIO16

Pin.26 IO4

GPIO4

Pin.25 IO0

GPIO0

Figure 3: ESP32SOLO1 Schematics

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ESP32-SOLO-1 Datasheet v2.0

7 Peripheral Schematics

5

4

3

2

7 Peripheral Schematics

This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface).

VDD33 VDD33

C1 10uF C2 0.1uF

GND

R1 TBD
GND C3 TBD EN

GND

U1

1

2

3

SENSOR_VP 4

SENSOR_VN 5

IO34

6

IO35

7

IO32

8

IO33

9

IO25

10

IO26

11

IO27

12

13

14

GND1 3V3 EN SENSOR_VP SENSOR_VN IO34 IO35 IO32 IO33 IO25 IO26 IO27 IO14 IO12

39 P_GND 38
GND3 37 IO23 36 IO22 35 TXD0 34
RXD0 33 IO21 32 NC 31 IO19 30 IO18 29 IO5 28 IO17 27 IO16 26 IO4 25 IO0

GND
IO23 IO22 TXD RXD IO21
IO19 IO18 IO5 IO17 IO16 IO4 IO0

3

2

1

UART DOWNLOAD J1 GND
GND

2

1

15 16 GND2 17 IO13 18 SD2 19 SD3 20 CMD 21 CLK 22 SD0 23 SD1 24 IO15
IO2

J2 BOOT OPTION

SD2 SD3 CMD CLK SD0 SD1 IO2

U2 1
MTMS 2 MTDI 3 MTCK 4
MTDO JTAG

R2 100R R3 100R R4 100R R5 100R

MTMS MTDI MTCK MTDO

GND

MTDI should be kept at a low electric level when powering up the module.

Figure 4: ESP32SOLO1 Peripheral Schematics

Note:

Espressif Systems

Title

Application of ESP32-WROOM-32
· Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users

Size Document Number

do want to solder it, they need to ensure that the correct quantity of soldering paste is applied. A4 <Doc>

Date:

Wednesday, August 07, 2019

She

5

· To ensure the power suppl4y to the ESP32 chip during power-up,3it is advised to add an RC delay circui2t at the EN pin.

The recommended setting for the RC delay circuit is usually R = 10 k and C = 1 µF. However, specific parameters

should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing

of the chip. For ESP32's power-up and reset sequence timing diagram, please refer to Section Power Scheme in

ESP32 Datasheet.

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ESP32-SOLO-1 Datasheet v2.0

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3.60 6.19
10.29

8 Physical Dimensions
8 Physical Dimensions

Unit: mm

25.50±0.15

16.51

1.50

1.27

0.90

1.05

0.45
15.80 Ø0.50
8.89 11.43 18.00±0.15
Top View

17.60 6.19

3.10±0.15

0.80

0.85

3.60

0.90

0.1

0.90

10.50 0.85

Side View

Bottom View

Figure 5: Physical Dimensions of ESP32SOLO1
Note: For information about tape, reel, and product marking, please refer to Espressif Module Package Information.

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9 Recommended PCB Land Pattern
9 Recommended PCB Land Pattern
Unit: mm Via for thermal pad Copper

25.50 1.50
1.27 38x0.90

6.19

18.00

38x1.50

Antenna Area

1

3.70 38

0.90

0.50

16.51

7.50

10.29 0.50 0.90 3.70

0.50

14 15

1.27 11.43

24 25

1.50

0.50 3.28

Figure 6: Recommended PCB Land Pattern of ESP32SOLO1

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ESP32-SOLO-1 Datasheet v2.0

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10 Product Handling
10 Product Handling
10.1 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60 %RH. If the above conditions are not met, the module needs to be baked.
10.2 Electrostatic Discharge (ESD)
· Human body model (HBM): ±2000 V · Charged-device model (CDM): ±500 V
10.3 Reflow Profile
Solder the module in a single reflow.

Temperature ()

250 Preheating zone
150 ~ 200  60 ~ 120 s 217 200
Ramp-up zone 1 ~ 3 /s
100

Peak Temp. 235 ~ 250 
Reflow zone !217  60 ~ 90 s
Soldering time > 30 s

Cooling zone ­1 ~ ­5 /s

50

25

0

0

50

100

150

200

Ramp-up zone -- Temp.: 25 ~ 150  Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 /s Preheating zone -- Temp.: 150 ~ 200  Time: 60 ~ 120 s Reflow zone -- Temp.: >217  7LPH60 ~ 90 s; Peak Temp.: 235 ~ 250  Time: 30 ~ 70 s Cooling zone -- Peak Temp. ~ 180  Ramp-down rate: ­1 ~ ­5 /s Solder -- Sn-Ag-Cu (SAC305) lead-free solder alloy

Figure 7: Reflow Profile

Time (sec.) 250

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10 Product Handling
10.4 Ultrasonic Vibration
Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate.

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ESP32-SOLO-1 Datasheet v2.0

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11 Related Documentation and Resources
11 Related Documentation and Resources
Related Documentation
· ESP32 Series Datasheet ­ Specifications of the ESP32 hardware. · ESP32 Technical Reference Manual ­ Detailed information on how to use the ESP32 memory and peripherals. · ESP32 Hardware Design Guidelines ­ Guidelines on how to integrate the ESP32 into your hardware product. · ESP32 ECO and Workarounds for Bugs ­ Correction of ESP32 design errors. · Certificates
https://espressif.com/en/support/documents/certificates · ESP32 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns · ESP32 Advisories ­ Information on security, bugs, compatibility, component reliability.
https://espressif.com/en/support/documents/advisories · Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
· ESP-IDF Programming Guide for ESP32 ­ Extensive documentation for the ESP-IDF development framework. · ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif · ESP32 BBS Forum ­ Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ · The ESP Journal ­ Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ · See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos
Products
· ESP32 Series SoCs ­ Browse through all ESP32 SoCs. https://espressif.com/en/products/socs?id=ESP32
· ESP32 Series Modules ­ Browse through all ESP32-based modules. https://espressif.com/en/products/modules?id=ESP32
· ESP32 Series DevKits ­ Browse through all ESP32-based devkits. https://espressif.com/en/products/devkits?id=ESP32
· ESP Product Selector ­ Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en
Contact Us
· See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions

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ESP32-SOLO-1 Datasheet v2.0

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Revision History

Revision History

Date 2022-07-07 2022-03-04
2021-02-04 2020-11-27 2019.09 2019.07 2019.01 2018.09 2018.09

Version v2.0 v1.9
V1.8 V1.7 V1.6 V1.5 V1.4 V1.3 V1.2

Release notes Added Section 10: Product Handling Added Figure 2 and Table 5 in Section 2.3: Strapping Pins Added a label of (Not Recommended For New Designs) to this document Updated Table 1 Added a link to RF certificates in Table 2 Updated Table 6 Added a note below Figure 5 Added Section 11: Related Documentation and Resources Replaced Espressif Product Ordering Information with ESP Product Selector Updated Figure 5: Physical Dimensions of ESP32-SOLO-1 and Figure 6: Recommended PCB Land Pattern of ESP32-SOLO-1. Modified the note below Figure 7: Reflow Profile. Updated the trade mark from TWAITM to TWAI®. Added TWAITM in Table 2; Updated Figure 7 and added a note under it; Added notes about schematics and peripheral schematics; Fixed some typos; Updated the C value in RC delay circuit from 0.1 µF to 1 µF; Provided feedback link. Changed the supply voltage range from 2.7 V ~ 3.6 V to 3.0 V ~ 3.6 V; Updated Section 7 Peripheral Schematics and added a note about RC delay circuit under it; Updated Figure 9 Recommended PCB Land Pattern. Added a new variant with high temperature range (­40 °C ~ +105 °C) in Chapter 1 Overview; Added Moisture sensitivity level (MSL) 3 in Table 2 ESP32-SOLO-1 Specifications; Added notes about "Operating frequency range" and "TX power" under Table 9 Wi-Fi Radio Characteristics. Changed the RF power control range in Table 11 from ­12 ~ +12 to ­12 ~ +9 dBm.
· Updated the descriptions of pins IO16 and IO17 in Table 3: Pin Definitions;
· Added "Cumulative IO output current" entry to Table 6: Absolute Maximum Ratings;
· Added more parameters to Table 8: DC Characteristics. Updated the hole diameter in the shield from 1.00 mm to 0.50 mm, in Figure 5. Added RoHS certification.

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ESP32-SOLO-1 Datasheet v2.0

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Revision History

Date 2018.08 2018.06

Version V1.1 V1.0

Release notes · Added certifications and reliability test items the module has passed in Table 2: ESP32-SOLO-1 Specifications, and removed softwarespecific information; · Updated section 3.4: RTC and Low-Power Management; · Changed the modules' dimensions from (18±0.2) mm x (25.5 ±0.2) mm x (3.1±0.15) mm to (18.00±0.10) mm x (25.50±0.10) mm x (3.10±0.10) mm; · Updated Table 9: Wi-Fi Radio; · Updated Figure 8: Physical Dimensions.
First release.

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ESP32-SOLO-1 Datasheet v2.0

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www.espressif.com

Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY'S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2022 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.
Not Recommended For New Designs (NRND)



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