Infineon AIROC™ Wi-Fi and Bluetooth IoT partner module selection guide
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Document DEVICE REPORTInfineon-Wireless Module Partners Selector Guide-ProductSelectionGuide-v01 00-ENInfineon AIROCTM Wi-Fi and Bluetooth® IoT partner module selection guide www.infineon.com Internet of Things (IoT) Solutions Infineon AIROCTM Wi-Fi and Bluetooth® wireless connectivity Delivering differentiated capabilities purpose-built for the IoT Industry's broadest portfolio of Wi-Fi and Wi-Fi + Bluetooth® combo devices > Infineon has the ideal Wi-Fi solution for any application providing both single- and dual-band 802.11n/ac/ax SISO and MIMO devices. > Infineon provides Wi-Fi + Bluetooth® combo chipsets integrating our world-class Wi-Fi with powerful Bluetooth®/ Bluetooth® LE to ease onboarding of cloud-connected IoT devices via a mobile app. > Infineon provides AIROCTM Wi-Fi connectivity processors and PSoCTM Bluetooth® MCUs with Bluetooth® LE. > More than 1 billion Wi-Fi devices in the field > High-performance RF architecture provides longer range and better interference rejection > Ultra low power very low sleep, transmit, and receive current > Continuous improvements to battery life via a unique visibility into real-world power consumption > Most widely vetted Wi-Fi / Bluetooth® devices on the market, with security researchers extensively focused on Infineon > Deep domain knowledge and processes to help customers secure products throughout the lifecycle Infineon wireless module partner ecosystem Our global partner ecosystem enables development of IoT applications on time, on budget, and with minimized risk > Hardware: Avoid complicated and costly chip-down designs with a pre-built wireless module providing multiple antenna options and services. > Software: Take advantage of pre-configured connectivity software for common MPUs, operating systems, and development tools. > Certifications: Don't worry about multiple global regulatory bodies with full modular and reference-certified RF modules (CE, IC, FCC, etc.). > Support: Get to production with partner support and services including antenna and plastics design, EMC testing, and more. 2 Infineon IoT software solutions Internet of Things (IoT) Solutions Infineon provides reliable and consistently updated software development platforms for flexible and rapid development of your connected product. Solutions for RTOS designs Infineon delivers compute, connectivity, and HMI capabilities in a single unified platform: The ModusToolboxTM software environment > ModusToolboxTM is a set of multi-platform tools and a suite of middleware libraries enabling industry-leading feature-sets like CAPSENSETM capacitive-sensing, mesh, and system power optimization. > Enables an immersive development experience for Infineon MCU and wireless devices. You can use our Eclipse IDE for ModusToolboxTM, or 3rd-party IDEs such as Visual Studio Code, IAR Embedded Workbench, and Keil µVision. > Extensive support for 3rd-party cloud ecosystems including our own cloud management solution using the ultra-low-power AIROCTM Wi-Fi connectivity processors. 00045 ModusToolboxTM Solutions for Linux/Android designs Delivering integrated wireless products for Linux and Android designs. Infineon partners with the open-source community to provide quality and secure connectivity. > Enabling a broad set of Wi-Fi and Bluetooth®/ Bluetooth® LE advanced feature sets for a wide variety of designs > Supporting the latest Linux and Android distributions along with backward-compatibility for previous versions > Infineon RF and regulatory tools bring your Linux- or Android-based prototype to production faster than ever 3 Internet of Things (IoT) Solutions 802.11ac Wi-Fi + Dual-Mode Bluetooth® combo partner module portfolio Partner Azurewave Azurewave Azurewave PN Wi-Fi/ Bluetooth® PN Wi-Fi/Bluetooth® Support MCU CPU (MHz) AW-AH306 CYW43012 2.4/5 GHz, 802.11a/b/g/n with ac friendly, Bluetooth®/ Bluetooth® LE Radio Only N/A AW-AM497 CYW43012 2.4/5 GHz, 802.11a/b/g/n with ac friendly, Bluetooth®/ Bluetooth® LE Radio Only N/A AW-CB511NF CYW54591 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.0 Radio Only N/A Area (mm) 8.5 x 7 Regulatory Linux Interfaces Highlights N Y SDIO, UART Bluetooth® 5.0, WLCSP, ultra-low power 12 x 12 N Y M.2 2230 CE/FCC/IC/ NCC/Japan/ Y AU/NZ SDIO, UART Bluetooth® 5.0, WLBGA, ultra-low power WLAN: PCIe Bluetooth®: UART Certified Wi-Fi + Bluetooth® module with RSDB Azurewave AW-CM467 CYW4373 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.1 Radio Only N/A 12 x 12 FCC/CE Y WLAN: SDIO/ Support SDIO or USB for Wi-Fi, UART, or USB USB for Bluetooth® Azurewave AW-CM572 CYW54591 Azurewave AM-342SM CYW43012 Azurewave AW-CM555 CYW4373 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.0 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.1 Azurewave AW-CM467USB-I CYW4373E 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.1 Azurewave AW-CM467SUR-I CYW4373E 11a/b/g/n/ac, Bluetooth® 5.2 Azurewave AW-CM590 CYW54590 11a/b/g/n/ac, Bluetooth® 5.1 Inventek ISM54907WBM-L170 CYW54907 CYW20707 Laird Connectivity SterlingLWB5+ (453-00045C) CYW4373E Laird Connectivity SterlingLWB5+ (453-00045R) CYW4373E 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE Radio Only N/A 13 x 15 N Y Radio Only N/A 12 x 12 N Y Radio Only N/A 12 x 12 N Y Radio Only N/A 12 x 12 Radio Only N/A 12 x 12 Radio Only N/A 13 x 15 Arm® Cortex®R4-Internal 160/ 320 MHz 11 x 11 Radio Only N/A 12 x 17 Radio Only N/A 12 x 17 CE/FCC/IC/ NCC/Japan/ Y AU/NZ CE/FCC/IC/ NCC/Japan/ Y AU/NZ CE/FCC/IC/ NCC/Japan/ Y AU/NZ N N FCC/IC/ ETSI/Giteki/ Y RCM FCC/IC/ ETSI/Giteki/ Y RCM WLAN: SDIO Bluetooth®: UART RSDB Wi-Fi + Bluetooth® module SDIO, UART SiP on FR4; ultra-low power WLAN: SDIO / USB Bluetooth®: UART / USB WLAN: SDIO / USB Bluetooth®: UART / USB WLAN: SDIO Bluetooth®: UART WLAN: SDIO Bluetooth®: UART XTAL inside; 3-wire co-ex w/ Zigbee XTAL inside; I-temp XTAL inside; I-temp XTAL inside; VSDB UART, SPI, USB Supported with SDK SDIO, UART, Industrial temperature (-40° C to +85°C). Integrated chip USB antenna (Cut Tape) SDIO, UART, Industrial temperature (-40°C to +85°C). USB Integrated chip antenna (Tape and Reel) 4 Internet of Things (IoT) Solutions 802.11ac Wi-Fi + Dual-Mode Bluetooth® combo partner module portfolio Partner Laird Connectivity Laird Connectivity PN SterlingLWB5+ (453-00046C) SterlingLWB5+ (453-00046R) Wi-Fi/ Bluetooth® PN Wi-Fi/Bluetooth® Support CYW4373E 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE CYW4373E 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE Laird Connectivity SterlingLWB5+ (453-00047C) CYW4373E 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE Laird Connectivity SterlingLWB5+ (453-00047R) CYW4373E Laird Connectivity Laird Connectivity SterlingLWB5+ (453-00048) SterlingLWB5+ (453-00049) CYW4373E CYW4373E 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE Lantronix XPC270100B CYW54907 CYW20707 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE Lantronix XPC270100S CYW54907 CYW20707 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE MCU CPU (MHz) Radio Only N/A Area (mm) 12 x 17 Radio Only N/A 12 x 17 Radio Only N/A 12 x 17 Radio Only N/A 12 x 17 Radio Only N/A 22 x 30 Radio Only N/A 22 x 30 Arm® Cortex®R4-Internal 160/ 320 MHz 25 x 17 Arm® Cortex®R4-Internal 160/ 320 MHz 25 x 17 Regulatory Linux Interfaces Highlights FCC/IC/ ETSI/Giteki/ Y RCM FCC/IC/ ETSI/Giteki/ Y RCM FCC/IC/ ETSI/Giteki/ Y RCM FCC/IC/ ETSI/Giteki/ Y RCM FCC/IC/ ETSI/Giteki/ Y RCM FCC/IC/ ETSI/Giteki/ Y RCM FCC/IC/CE N FCC/IC/CE N SDIO, UART, Industrial temperature (-40° C to +85°C). Integrated chip USB antenna (Cut Tape) SDIO, UART, Industrial temperature (-40°C to +85°C). USB Integrated chip antenna (Tape and Reel) SDIO, UART, USB SDIO, UART, USB Next-gen dual band wireless IoT with 802.11ac. Industrial temperature (-40°C to +85°C), variety of different modular form factors, and industry-leading RF performance. MHF4 (Cut Tape) Next-gen dual band wireless IoT with 802.11ac. Industrial temperature (-40°C to +85°C), variety of different modular form factors, and industry-leading RF performance. MHF4 (Tape and Reel) SDIO, UART Industrial temperature (-40°C to +85°C). M.2 (E-Key) with SDIO (Wi-Fi) and UART (Bluetooth®) USB UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOs UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOs Industrial temperature (-40°C to +85°C). M.2 (E-Key) with USB for Wi-Fi and Bluetooth® XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., LGA, 250 pc XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., LGA, 25 pc 5 Internet of Things (IoT) Solutions 802.11ac Wi-Fi + Dual-Mode Bluetooth® combo partner module portfolio Partner Lantronix Lantronix Murata Murata Murata Murata Murata Quectel USI USI PN Wi-Fi/ Bluetooth® PN Wi-Fi/Bluetooth® Support XPC270300B CYW54907 CYW20707 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE MCU Arm® Cortex®R4-Internal XPC270300S CYW54907 CYW20707 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE Arm® Cortex®R4-Internal Type 1LV (LBEE59B1LV-278) Type 2AE (LBEE5PK2AE-564) Type 2BC (LBEE5PK2BC-771) Type 1XA (LBEE5XV1XA-540) Type 1XZ (LBEE5XV1XZ-892) FC80A CYW43012 CYW4373E CYW4373 CYW54591 CYW54591 CYW54591 WM-BA-CYW-50 PSoCTM 6 CYW43012 WM-BN-CYW-62 CYW43012 2.4/5 GHz, 802.11a/b/g/n with ac friendly, Bluetooth®/ Bluetooth® LE Radio only 2.4/5 GHz, 802.11a/b/g/n+ ac, Bluetooth®/ Bluetooth® LE Radio only 2.4/5 GHz, 802.11a/b/g/n+ ac, Bluetooth®/ Bluetooth® LE Radio only 2.4/5 GHz, 802.11a/b/g/n + ac MIMO/ RSDB, Bluetooth®/ Bluetooth® LE Radio only 2.4/5 GHz, 802.11a/b/g/n + ac MIMO/ RSDB, Bluetooth®/ Bluetooth® LE Radio only 2.4/5 GHz, 802.11a/b/g/n/ac , Bluetooth®/ Bluetooth® LE 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE 2.4/5 GHz, 802. 11a/b/g/n + ac, Bluetooth® 5.0 Radio Only Arm® Cortex®-M4 + Cortex®-M0 Internal - CPU (MHz) 160/ 320 MHz 160/ 320 MHz N/A N/A N/A N/A N/A N/A 150/ 100 MHz N/A Area (mm) 35 x 22 25 x 17 10 x 7.2 8.0 x 7.8 8.0 x 7.8 11.4 x 8.9 11.4 x 8.9 13 x 15 x 2.2 Regulatory FCC/IC/CE FCC/IC/CE CE/FCC/IC/ TELEC CE/FCC/IC/ TELEC CE/FCC/IC/ TELEC FCC/IC/CE/ TELEC FCC/IC/CE/ TELEC FCC/CE/ ROHS Linux N N Y Y Y Y Y Y Interfaces UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOs UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOs WLAN: SDIO Bluetooth®: UART WLAN: SDIO Bluetooth®: UART WLAN: SDIO (USB) Bluetooth®: UART (USB) WLAN: PCIe Bluetooth®: UART WLAN:SDIO Bluetooth®: UART SDIO, UART , PCM 10.9 x 10.9 N SDIO N interface, Radio only SiP 6.5 x 5.8 N Y - Highlights XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., edge, tray, 100 PC XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., edge, single 1x1 SISO 11ac + Bluetooth® solution with SDIO interface, -20°C to +70°C, Bluetooth® 5.0 1x1 SISO 11ac + Bluetooth® solution (Bluetooth® 5.0) High throughput on 11ac, -40°C to +85°C 1x1 SISO 11ac + Bluetooth® solution (Bluetooth® 5.0) High throughput on 11ac, -20°C to +70°C 2x2 MIMO RSDB + Bluetooth® solution with SDIO interface, -30°C to +85°C 2x2 MIMO RSDB + Bluetooth® solution with SDIO interface, -30°C to +85°C External antenna, supports STA & SoftAP mode, Fast Roaming & EAP 1MB MCU FLASH+ 288KB RAM - 6 Internet of Things (IoT) Solutions 802.11n/ac Wi-Fi + Dual-Mode Bluetooth® combo partner module portfolio Partner Azurewave Azurewave PN AW-NM512 AW-CU544 Wi-Fi/ Bluetooth® PN Wi-Fi/Bluetooth® Support MCU CPU (MHz) CYW43439 2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE Radio Only N/A P64 + CYW43439 2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE 5.2 Arm® Cortex®-M4F / Cortex®M0+ 150MHz / 100MHz Laird Connectivity Sterling- LWB+ CYW43439 (453-00083R) 2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE Radio Only N/A Laird Connectivity SterlingLWB+ CYW43439 (453-00084R) 2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE Radio Only N/A Laird Connectivity SterlingLWB+ CYW43439 (453-00085R) 2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE Radio Only N/A Area (mm) 12 x 12 Regulatory Linux Interfaces Highlights N N SDIO,UART Low cost combo, 1x1 SISO, TCP keepalive, WPA-3 36 x 18 FCC/IC N 12 x 12 x 3 (SiP module) FCC/IC/CE/ Giteki/RCM Y 21 x 15 x 4 (PCB module) FCC/IC/CE/ Giteki/RCM Y 21 x 15 x 4 (PCB module with chip antenna) FCC/IC/CE/ Giteki/RCM Y UART Non video/audio host SoC, RTOS, CAPSENSETM, 2M Flash; OPTIGATM Trust M, Int. Ant SDIO, UART, I2S SDIO, UART, I2S SDIO, UART, USB Sterling-LWB+ Wi-Fi 4 with Bluetooth® 5.2 module, based on the Infineon AIROCTM CYW43439 chipset, is the latest member of the successful Sterling-LWB radio family. This new module series is available as a System-in-Package (SiP) and two certified module versions, supporting either an onboard chip antenna or a MHF connector for an external antenna. It is designed to meet the demands of medical and industrial IoT connectivity. Industrial temperature: Supports -40°C to +85°C industrial temperature operation. Sterling-LWB+ Wi-Fi 4 with Bluetooth® 5.2 module, based on the Infineon AIROCTM CYW43439 chipset, is the latest member of the successful Sterling-LWB radio family. This new module series is available as a System-in-Package (SiP) and two certified module versions, supporting either an onboard chip antenna or a MHF connector for an external antenna. It is designed to meet the demands of medical and industrial IoT connectivity. Industrial temperature: Supports -40°C to +85°C industrial temperature operation. Sterling-LWB+ Wi-Fi 4 with Bluetooth® 5.2 module, based on the Infineon AIROCTM CYW43439 chipset, is the latest member of the successful Sterling-LWB radio family. This new module series is available as a System-in-Package (SiP) and two certified module versions, supporting either an onboard chip antenna or a MHF connector for an external antenna. It is designed to meet the demands of medical and industrial IoT connectivity. Industrial temperature: Supports -40°C to +85°C industrial temperature operation. 7 Internet of Things (IoT) Solutions 802.11n/ac Wi-Fi partner module portfolio Partner Lantronix Lantronix Lantronix Lantronix Murata Murata Murata imp Murata Quectel USI USI Wi-Fi/ PN Bluetooth® PN XPC240100B-02 CYW43907 XPC240200B-02 CYW43907 XPC240300B-02 CYW43907 XPC240400B-02 CYW43907 Type 1GC (LBWA1UZ1GC-958) CYW43907 Type 1PS (LBWA1UZ1PS-241) CYW54907 Type 1GC Imp005 (LB- CYW43907 WA1UZ1GC-901) Type 1YN (LBEE5KL1YN) CYW43439 FC909A CYW43439 WM-AN-BM-23 CYW43907 WM-BN-BM-26_ REF1 CYW43439 Wi-Fi/Bluetooth® Support MCU 2.4/5 GHz, 802.11n Arm® Cortex®R4-Internal 2.4/5 GHz, 802.11a/b/g/n Arm® Cortex®R4-Internal 2.4/5 GHz, 802.11a/b/g/n Arm® Cortex®R4-Internal 2.4/5 GHz, 802.11a/b/g/n Arm® Cortex®R4-Internal 2.4/5 GHz, 802.11a/b/g/n Arm® Cortex®R4-Internal 2.4/5 GHz, 802.11a/b/g/n + ac Arm® Cortex®R4-Internal 2.4/5 GHz, 802.11a/b/g/n Arm® Cortex®R4-Internal 802.11b/g/n + Bluetooth® 5.2 BR/EDR/LE 2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE Radio Only Radio Only 2.4/5 GHz, 802.11a/b/g/n Arm® Cortex®R4-Internal 2.4 GHz, 11b/g/n/ Bluetooth® 5.2 Radio Only CPU (MHz) 160/ 320 MHz 160/ 320 MHz 160/ 320 MHz 160/ 320 MHz 160/ 320 MHz 160/ 320 MHz 160/ 320 MHz N/A N/A 160/ 320 MHz N/A Area (mm) Regulatory Linux FCC/IC/ 25 x 17 CE/TELEC/ N SRRC FCC/IC/ 25 x 17 CE/TELEC/ N SRRC FCC/IC/ 25 x 17 CE/TELEC/ N SRRC FCC/IC/ 25 x 17 CE/TELEC/ N SRRC 10 x 10 CE/FCC/IC N 10 x 10 CE/FCC/IC N 10 x 10 CE/FCC/IC N 6.95 x 5.15 x 1.1 FCC/IC 12 x 12 FCC/CE/ x 1.95 ROHS Y 10 x 10 CE/FCC/IC N 15 x 9.5 N Y Interfaces Highlights UART x 1, Eth (RMII), USB (Host or Device), SPI, SDIO, I2C, 11 GPIOs XPICO 240 embedded IoT gw, 802.11a/b/g/n + ac , ETH, dual U.FL, ind. temp., LGA, 250 UART x 1, Eth (RMII), USB (Host or Device), SPI (Master and Slave), SDIO, I2C, 11 GPIOs XPICO 240 embedded IoT gw, 802.11a/b/g/n, ETH, 0n-module ant, ind. temp., LGA, 250 UART x 1, Eth (RMII), USB (Host or Device), SPI, SDIO, I2C, 11 GPIOs XPICO 240 embedded IoT gw, 802.11a/b/g/n, ETH, dual U.FL, ind. temp., edge conn, 100 pc UART x 1, Eth (RMII), USB (Host or Device), SPI, SDIO, I2C, 11 GPIOs XPICO 240 embedded IoT gw, 802.11a/b/g/n, ETH, 0n-module ant, ind. temp., edge conn, 100 pc UART, SPI, I2C, I2S, PWM, GPIO, USB, Ethernet High performance CPU. Gateway for WLAN and Ethernet. Audio streaming. Modular Cert. RAM 2 MB, -20°C to +70°C, Arrow Quicksilver EVK support UART, SPI, I2C, I2S, PWM, GPIO, USB, Ethernet High performance CPU. Gateway for WLAN and Ethernet. Audio streaming. Modular Cert. RAM 2 MB, -20°C to +70°C, Pin compatible with type 1GC (adds 802.11ac) UART, SPI, I2C, PWM, Electric Imp, High performance CPU. Gateway for WLAN and Ethernet. GPIO, USB, Ethernet Audio streaming. Modular Cert. RAM 2 MB, -20°C to +70°C WLAN-SDIOv2.0, UART & PCM Small form factor, high-performance module with up to 65 Mbps PHY data rate on Wi-Fi and 3 Mbps PHY data rate on Bluetooth® SDIO, UART, PCM External antenna, supports STA & SoftAP mode, Fast Roaming & EA QSPI, PWM, USB, SDIO, UART, I2C, I2S, MII, RMII 2 MB RAM SDIO (WPA3) - 8 Internet of Things (IoT) Solutions Bluetooth® & Bluetooth®LE (Dual-Mode) partner module portfolio Partner PN Alinket ALX41X Wi-Fi/ Bluetooth® PN CYW20736 Wi-Fi/Bluetooth® Support Bluetooth® LE MCU Arm® Cortex®M3-Internal CPU (MHz) 24 MHz Area (mm) Regulatory Linux Interfaces 19 x 13.5 FCC/CE N UART, SPI ADC, GPIO Highlights PCB antenna, 1 MB Flash, Bluetooth® LE MIDI support, master mode (up to 8 slaves) & bridge mode. Alinket ALX420 CYW20706 Bluetooth®/ Bluetooth® LE Arm® Cortex®M3-Internal 96 MHz 8 x 8 N N HCI UART, PUART Custom antenna designs supported, supports master/ SPI, I2S, I2C, ADC slave mode, A2DP SRC & SNK & iAP2, MFi (HomeKit). Alinket Alinket ALX420A ALX421A Alinket ALX422A CYW20706 Bluetooth®/ Bluetooth® LE Arm® Cortex®M3-Internal 96 MHz 16 x 10 FCC/CE N CYW20707 Bluetooth®/ Bluetooth® LE Arm® Cortex®M4-STM32F411 100 MHz 19 x 12 FCC/CE N CYW20707 Bluetooth®/ Bluetooth® LE Arm® Cortex®M4-STM32F412 100 MHz 21 x 12 FCC/CE N Alinket ALXG30 CYW20706 Bluetooth®/ Bluetooth® LE Arm® Cortex®M4-STM32F411 100 MHz 80 x 55 FCC/CE Y Azurwave AW-BT315W CYW20721 Inventek ISM20706A2S CYW20706 Inventek ISM20732S CYW20732 Inventek ISM20736S CYW20736 Bluetooth® 5.1 Bluetooth®/ Bluetooth® LE Bluetooth® LE Bluetooth® LE Arm® Cortex® - M4 96 MHz Arm® Cortex®M3-Internal Arm® Cortex®M3-Internal Arm® Cortex®M3-Internal 96 MHz 24 MHz 24 MHz 4 x 4 N Y 6.0 x 8.6 N N 6.5 x 6.5 FCC/IC/CE N 6.5 x 6.5 FCC/IC/CE N Iton BB2706-30 CYW20707 Bluetooth®/ Bluetooth® LE Radio Only N/A 15 x 12 N Y HCI UART, PUART Onboard antenna, 1 MB Flash, supports Master/Slave SPI, I2S, I3C, ADC mode, A2DP SRC & SNK & iAP2, MFi (HomeKit). UART, SPI, USB, SDIO, I2S, I2C Onboard antenna, 1 MB Flash, supports master/Slave mode, A2DP SRC & SNK & iAP2, MFi (HomeKit). UART, SPI, USB, SDIO, I2S, I2C Bluetooth® 4.2, onboard antenna, 1 MB Flash, support both slave & master mode, A2DP SRC & SNK, HFP & iAP2, MFi (HomeKit). RS485 Onboard or external antenna (with U.FL connector), 1 MB Flash, supports Bluetooth® slave mode, SPP, MFi, RS485 to Bluetooth®, RS-485 to 2G. UART Small form-factor Bluetooth® SiP module. SPI, I2C, JTAG Embedded antenna Bluetooth®4.2+HS SiP module. SPI, I2C, JTAG SPI, I2C, JTAG SPI, UART, I2C Lowest cost Bluetooth® LE SiP module solution. Wireless charging, simultaneous central and peripheral operation. Bluetooth® 4.2, supported profile: HFP with WBS, HID, SPP, GATT, AVRCP, HOGP, A2DP, HID, etc; supports SiG Bluetooth® LE mesh, customized flow control for portable printers. 9 Internet of Things (IoT) Solutions Bluetooth® & Bluetooth®LE (Dual-Mode) partner module portfolio Partner PN Wi-Fi/ Bluetooth® PN Wi-Fi/Bluetooth® Support MCU CPU (MHz) Area (mm) Laird Bluetooth®- Connectivity 850-SA CYW20704 Bluetooth®/ Bluetooth® LE Radio Only N/A 8.5 x 13 Laird Bluetooth®- Connectivity 850-ST CYW20704 Bluetooth®/ Bluetooth® LE Radio Only N/A 8.5 x 13 Regulatory Linux Interfaces FCC/IC/CE/ RCM/Giteki/ Y Korea USB, HCI, I2S, PCM, GPIO FCC/IC/CE/ RCM/Giteki/ Y Korea USB, HCI, I2S, PCM, GPIO Highlights The Bluetooth® 85x series of USB HCI modules and adapters that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 850 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host USB interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin. The Bluetooth® 85x series of USB HCI modules and adapters that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 850 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host USB interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin. 10 Internet of Things (IoT) Solutions Bluetooth® & Bluetooth®LE (Dual-Mode) partner module portfolio Partner PN Wi-Fi/ Bluetooth® Wi-Fi/Bluetooth® Support MCU PN CPU Area (MHz) (mm) Regulatory Laird Connectivity Bluetooth® 851 CYW20704 Bluetooth®/ Bluetooth® LE Radio Only N/A 17.4 x 46.75 FCC/IC/CE/ RCM/Giteki Laird Connectivity Bluetooth® -860-SA CYW20704 Bluetooth®/ Bluetooth® LE Radio Only N/A 8.5 x 12.85 FCC/IC/CE/ RCM/Giteki Laird Connectivity Bluetooth®-860-ST CYW20704 Bluetooth®/ Bluetooth® LE Radio Only N/A 8.5 x 12.85 FCC/IC/CE/ RCM/Giteki Linux Y Y Y Interfaces Highlights USB, HCI, I2S, PCM, GPIO UART, HCI, I2S, PCM, GPIO UART, HCI, I2S, PCM, GPIO The Bluetooth® 851 is a packaged USB adapter that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 86x series of UART HCI modules that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 860 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host UART interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin. The Bluetooth® 86x series of UART HCI modules that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 860 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host UART interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin. 11 Internet of Things (IoT) Solutions Bluetooth® & Bluetooth®LE (Dual-Mode) partner module portfolio Partner Murata Murata Pairlink Pairlink Pairlink Pairlink PN Type 1GR (LBCA1ZZ1GR-084) Wi-Fi/ Bluetooth® PN CYW20736 Type1WA CYW20721 Dragon-B CYW20706 Dragon-C CYW20706 Mouselet-B Mouselet-C CYW20736 CYW20736 Wi-Fi/Bluetooth® Support MCU CPU (MHz) Area (mm) Bluetooth® LE Bluetooth®/ Bluetooth® LE Arm® Cortex®M3-Internal 24 MHz Arm® Cortex®M4-Internal N/A 9.0 x 7.0 5.9 x 5.1 Bluetooth®/ Bluetooth® LE Arm® Cortex®M3-Internal 96 MHz 11 x 16.8 Bluetooth®/ Bluetooth® LE Arm® Cortex®M3-Internal 96 MHz 11 x 16.8 Bluetooth® LE Bluetooth® LE Arm® Cortex®M3-Internal 24 MHz Arm® Cortex®M3-Internal 24 MHz 14 x 18 14 x 18 Regulatory CE/FCC/IC FCC/IC/CE BQB/MIC/ FCC/IC/CE/ ROHS BQB/MIC/ FCC/IC/CE/ ROHS BQB/MIC BQB/MIC Linux Interfaces Highlights N UART, SPI Bluetooth® 4.1, includes antenna Y UART, SPI Bluetooth® 5.1, Performance Audio N UART, 4*PWM, MFi, IIS Chip antenna, 1 MB Flash, supports connected mesh, SIG mesh N UART, 4*PWM, MFi, IIS IPEX connecter, 1 MB Flash, supports connected mesh, SIG mesh N UART, 4*PWM Chip antenna, 512 KB Flash, supports connected mesh N UART, 4*PWM IPEX connecter, 512 KB Flash, supports connected mesh 12 Connectivity devices: Wi-Fi + Bluetooth® Combo Devices www.infineon.com/wi-fi-and-bluetooth-combos Software and support: ModusToolboxTM software environment www.infineon.com/modustoolbox Infineon Partner Network www.infineon.com/partnerfinder Infineon Developer Community https://community.infineon.com Wi-Fi MCU devices www.infineon.com/wi-fi-mcu Bluetooth® and Bluetooth® LE devices www.infineon.com/airoc-bluetooth-le-bluetooth-multiprotocol Technical forum for ModusToolboxTM www.infineon.com/modustoolbox-community Technical forum for Linux www.infineon.com/wi-fi-bluetooth-linux-drive-community Internet of Things (IoT) Solutions www.infineon.com Published by Infineon Technologies AG 81726 Munich, Germany © 2022 Infineon Technologies AG. All Rights Reserved. Document Number: 002-33054 Rev. ** Date: 09 / 2022 Please note! This document is for information purposes only and any information given herein shall in no event be regarded as a warranty, guarantee or description of any functionality, conditions and/or quality of our products or any suitability for a particular purpose. With regard to the technical specifications of our products, we kindly ask you to refer to the relevant product data sheets provided by us. Our customers and their technical departments are required to evaluate the suitability of our products for the intended application. We reserve the right to change this document and/or the information given herein at any time. Additional information For further information on technologies, our products, the application of our products, delivery terms and conditions and/or prices, please contact your nearest Infineon Technologies office (www.infineon.com). Warnings Due to technical requirements, our products may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by us in a written document signed by authorized representatives of Infineon Technologies, our products may not be used in any life-e ndangering applications, including but not limited to medical, nuclear, military, life-critical or any other applications where a failure of the product or any consequences of the use thereof can result in personal injury. Any sales transactions involving the partner modules referenced herein, including their terms and conditions, are between you and the partner. 13Adobe PDF Library 16.0.7 Adobe InDesign 17.4 (Windows)