Infineon AIROC™ Wi-Fi and Bluetooth IoT partner module selection guide

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Document DEVICE REPORTInfineon-Wireless Module Partners Selector Guide-ProductSelectionGuide-v01 00-EN
Infineon AIROCTM Wi-Fi and Bluetooth® IoT partner module selection guide
www.infineon.com

Internet of Things (IoT) Solutions

Infineon AIROCTM Wi-Fi and Bluetooth® wireless connectivity
Delivering differentiated capabilities purpose-built for the IoT Industry's broadest portfolio of Wi-Fi and Wi-Fi + Bluetooth® combo devices
> Infineon has the ideal Wi-Fi solution for any application providing both single- and dual-band 802.11n/ac/ax SISO and MIMO devices.
> Infineon provides Wi-Fi + Bluetooth® combo chipsets ­ integrating our world-class Wi-Fi with powerful Bluetooth®/ Bluetooth® LE to ease onboarding of cloud-connected IoT devices via a mobile app.
> Infineon provides AIROCTM Wi-Fi connectivity processors and PSoCTM Bluetooth® MCUs with Bluetooth® LE.

> More than 1 billion Wi-Fi devices in the
field
> High-performance RF architecture
provides longer range and better interference rejection
> Ultra low power ­ very low sleep,
transmit, and receive current
> Continuous improvements to battery
life via a unique visibility into real-world power consumption
> Most widely vetted Wi-Fi / Bluetooth®
devices on the market, with security researchers extensively focused on Infineon
> Deep domain knowledge and processes
to help customers secure products throughout the lifecycle

Infineon wireless module partner ecosystem
Our global partner ecosystem enables development of IoT applications on time, on budget, and with minimized risk

> Hardware:

Avoid complicated and costly chip-down designs with a pre-built wireless module providing multiple antenna options and services.

> Software:

Take advantage of pre-configured connectivity software for common MPUs, operating systems, and development tools.

> Certifications: Don't worry about multiple global regulatory bodies with full modular and reference-certified RF modules (CE, IC, FCC, etc.).

> Support:

Get to production with partner support and services including antenna and plastics design, EMC testing, and more.

2

Infineon IoT software solutions

Internet of Things (IoT) Solutions
Infineon provides reliable and consistently updated software development platforms for flexible and rapid development of your connected product.

Solutions for RTOS designs
Infineon delivers compute, connectivity, and HMI capabilities in a single unified platform: The ModusToolboxTM software environment

> ModusToolboxTM is a set of multi-platform tools and a
suite of middleware libraries enabling industry-leading feature-sets like CAPSENSETM capacitive-sensing, mesh, and system power optimization.
> Enables an immersive development experience for
Infineon MCU and wireless devices. You can use our Eclipse IDE for ModusToolboxTM, or 3rd-party IDEs such as Visual Studio Code, IAR Embedded Workbench, and Keil µVision.
> Extensive support for 3rd-party cloud ecosystems
including our own cloud management solution using the ultra-low-power AIROCTM Wi-Fi connectivity processors.

00045
ModusToolboxTM

Solutions for Linux/Android designs
Delivering integrated wireless products for Linux and Android designs. Infineon partners with the open-source community to provide quality and secure connectivity.
> Enabling a broad set of Wi-Fi and Bluetooth®/
Bluetooth® LE advanced feature sets for a wide variety of designs
> Supporting the latest Linux
and Android distributions along with backward-compatibility for previous versions
> Infineon RF and regulatory tools bring your
Linux- or Android-based prototype to production faster than ever
3

Internet of Things (IoT) Solutions

802.11ac Wi-Fi + Dual-Mode Bluetooth® combo partner module portfolio

Partner Azurewave Azurewave Azurewave

PN

Wi-Fi/ Bluetooth® PN

Wi-Fi/Bluetooth® Support

MCU

CPU (MHz)

AW-AH306

CYW43012

2.4/5 GHz, 802.11a/b/g/n with ac friendly, Bluetooth®/ Bluetooth® LE

Radio Only

N/A

AW-AM497

CYW43012

2.4/5 GHz, 802.11a/b/g/n with ac friendly, Bluetooth®/ Bluetooth® LE

Radio Only

N/A

AW-CB511NF CYW54591

2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.0

Radio Only N/A

Area (mm)
8.5 x 7

Regulatory Linux Interfaces Highlights

N

Y

SDIO, UART Bluetooth® 5.0, WLCSP, ultra-low power

12 x 12 N

Y

M.2 2230

CE/FCC/IC/ NCC/Japan/ Y AU/NZ

SDIO, UART Bluetooth® 5.0, WLBGA, ultra-low power

WLAN: PCIe Bluetooth®: UART

Certified Wi-Fi + Bluetooth® module with RSDB

Azurewave AW-CM467

CYW4373

2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.1

Radio Only N/A

12 x 12 FCC/CE

Y

WLAN: SDIO/ Support SDIO or USB for Wi-Fi, UART, or

USB

USB for Bluetooth®

Azurewave AW-CM572

CYW54591

Azurewave AM-342SM

CYW43012

Azurewave AW-CM555

CYW4373

2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.0
2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE
2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.1

Azurewave

AW-CM467USB-I

CYW4373E

2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.1

Azurewave

AW-CM467SUR-I

CYW4373E

11a/b/g/n/ac, Bluetooth® 5.2

Azurewave AW-CM590

CYW54590

11a/b/g/n/ac, Bluetooth® 5.1

Inventek

ISM54907WBM-L170

CYW54907 CYW20707

Laird Connectivity

SterlingLWB5+ (453-00045C)

CYW4373E

Laird Connectivity

SterlingLWB5+ (453-00045R)

CYW4373E

2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE
2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE
2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE

Radio Only N/A

13 x 15 N

Y

Radio Only N/A

12 x 12 N

Y

Radio Only N/A

12 x 12 N

Y

Radio Only N/A

12 x 12

Radio Only N/A

12 x 12

Radio Only N/A

13 x 15

Arm® Cortex®R4-Internal

160/ 320 MHz

11 x 11

Radio Only N/A

12 x 17

Radio Only N/A

12 x 17

CE/FCC/IC/ NCC/Japan/ Y AU/NZ
CE/FCC/IC/ NCC/Japan/ Y AU/NZ
CE/FCC/IC/ NCC/Japan/ Y AU/NZ

N

N

FCC/IC/ ETSI/Giteki/ Y RCM
FCC/IC/ ETSI/Giteki/ Y RCM

WLAN: SDIO Bluetooth®: UART

RSDB Wi-Fi + Bluetooth® module

SDIO, UART SiP on FR4; ultra-low power

WLAN: SDIO / USB Bluetooth®: UART / USB
WLAN: SDIO / USB Bluetooth®: UART / USB
WLAN: SDIO Bluetooth®: UART
WLAN: SDIO Bluetooth®: UART

XTAL inside; 3-wire co-ex w/ Zigbee XTAL inside; I-temp XTAL inside; I-temp XTAL inside; VSDB

UART, SPI, USB

Supported with SDK

SDIO, UART, Industrial temperature (-40° C to +85°C). Integrated chip

USB

antenna (Cut Tape)

SDIO, UART, Industrial temperature (-40°C to +85°C).

USB

Integrated chip antenna (Tape and Reel)

4

Internet of Things (IoT) Solutions

802.11ac Wi-Fi + Dual-Mode Bluetooth® combo partner module portfolio

Partner
Laird Connectivity
Laird Connectivity

PN
SterlingLWB5+ (453-00046C)
SterlingLWB5+ (453-00046R)

Wi-Fi/ Bluetooth® PN

Wi-Fi/Bluetooth® Support

CYW4373E

2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE

CYW4373E

2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE

Laird Connectivity

SterlingLWB5+ (453-00047C)

CYW4373E

2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE

Laird Connectivity

SterlingLWB5+ (453-00047R)

CYW4373E

Laird Connectivity
Laird Connectivity

SterlingLWB5+ (453-00048)
SterlingLWB5+ (453-00049)

CYW4373E CYW4373E

2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE
2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE
2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE

Lantronix

XPC270100B

CYW54907 CYW20707

2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE

Lantronix

XPC270100S

CYW54907 CYW20707

2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE

MCU

CPU (MHz)

Radio Only N/A

Area (mm)
12 x 17

Radio Only N/A

12 x 17

Radio Only N/A

12 x 17

Radio Only N/A

12 x 17

Radio Only N/A

22 x 30

Radio Only N/A

22 x 30

Arm® Cortex®R4-Internal

160/ 320 MHz

25 x 17

Arm® Cortex®R4-Internal

160/ 320 MHz

25 x 17

Regulatory Linux Interfaces Highlights

FCC/IC/ ETSI/Giteki/ Y RCM FCC/IC/ ETSI/Giteki/ Y RCM
FCC/IC/ ETSI/Giteki/ Y RCM
FCC/IC/ ETSI/Giteki/ Y RCM
FCC/IC/ ETSI/Giteki/ Y RCM FCC/IC/ ETSI/Giteki/ Y RCM
FCC/IC/CE N
FCC/IC/CE N

SDIO, UART, Industrial temperature (-40° C to +85°C). Integrated chip

USB

antenna (Cut Tape)

SDIO, UART, Industrial temperature (-40°C to +85°C).

USB

Integrated chip antenna (Tape and Reel)

SDIO, UART, USB
SDIO, UART, USB

Next-gen dual band wireless IoT with 802.11ac. Industrial temperature (-40°C to +85°C), variety of different modular form factors, and industry-leading RF performance. MHF4 (Cut Tape)
Next-gen dual band wireless IoT with 802.11ac. Industrial temperature (-40°C to +85°C), variety of different modular form factors, and industry-leading RF performance. MHF4 (Tape and Reel)

SDIO, UART

Industrial temperature (-40°C to +85°C). M.2 (E-Key) with SDIO (Wi-Fi) and UART (Bluetooth®)

USB
UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOs
UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOs

Industrial temperature (-40°C to +85°C). M.2 (E-Key) with USB for Wi-Fi and Bluetooth®
XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., LGA, 250 pc
XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., LGA, 25 pc

5

Internet of Things (IoT) Solutions

802.11ac Wi-Fi + Dual-Mode Bluetooth® combo partner module portfolio

Partner Lantronix
Lantronix Murata Murata Murata Murata Murata Quectel USI USI

PN

Wi-Fi/ Bluetooth® PN

Wi-Fi/Bluetooth® Support

XPC270300B

CYW54907 CYW20707

2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE

MCU
Arm® Cortex®R4-Internal

XPC270300S

CYW54907 CYW20707

2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE

Arm® Cortex®R4-Internal

Type 1LV (LBEE59B1LV-278)
Type 2AE (LBEE5PK2AE-564)
Type 2BC (LBEE5PK2BC-771)
Type 1XA (LBEE5XV1XA-540)
Type 1XZ (LBEE5XV1XZ-892)
FC80A

CYW43012 CYW4373E CYW4373 CYW54591 CYW54591 CYW54591

WM-BA-CYW-50

PSoCTM 6 CYW43012

WM-BN-CYW-62 CYW43012

2.4/5 GHz, 802.11a/b/g/n with ac friendly, Bluetooth®/ Bluetooth® LE

Radio only

2.4/5 GHz, 802.11a/b/g/n+ ac, Bluetooth®/ Bluetooth® LE

Radio only

2.4/5 GHz, 802.11a/b/g/n+ ac, Bluetooth®/ Bluetooth® LE

Radio only

2.4/5 GHz, 802.11a/b/g/n + ac MIMO/ RSDB, Bluetooth®/ Bluetooth® LE

Radio only

2.4/5 GHz, 802.11a/b/g/n + ac MIMO/ RSDB, Bluetooth®/ Bluetooth® LE

Radio only

2.4/5 GHz, 802.11a/b/g/n/ac , Bluetooth®/ Bluetooth® LE
2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE
2.4/5 GHz, 802. 11a/b/g/n + ac, Bluetooth® 5.0

Radio Only
Arm® Cortex®-M4 + Cortex®-M0 Internal
-

CPU (MHz) 160/ 320 MHz
160/ 320 MHz
N/A N/A
N/A
N/A N/A N/A 150/ 100 MHz N/A

Area (mm) 35 x 22
25 x 17
10 x 7.2 8.0 x 7.8 8.0 x 7.8 11.4 x 8.9 11.4 x 8.9 13 x 15 x 2.2

Regulatory
FCC/IC/CE
FCC/IC/CE
CE/FCC/IC/ TELEC CE/FCC/IC/ TELEC
CE/FCC/IC/ TELEC
FCC/IC/CE/ TELEC FCC/IC/CE/ TELEC FCC/CE/ ROHS

Linux N
N Y Y Y Y Y Y

Interfaces
UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOs
UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOs
WLAN: SDIO Bluetooth®: UART
WLAN: SDIO Bluetooth®: UART
WLAN: SDIO (USB) Bluetooth®: UART (USB)
WLAN: PCIe Bluetooth®: UART
WLAN:SDIO Bluetooth®: UART
SDIO, UART , PCM

10.9 x 10.9

N

SDIO

N

interface,

Radio only SiP

6.5 x 5.8 N

Y

-

Highlights
XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., edge, tray, 100 PC
XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., edge, single
1x1 SISO 11ac + Bluetooth® solution with SDIO interface, -20°C to +70°C, Bluetooth® 5.0 1x1 SISO 11ac + Bluetooth® solution (Bluetooth® 5.0) High throughput on 11ac, -40°C to +85°C
1x1 SISO 11ac + Bluetooth® solution (Bluetooth® 5.0) High throughput on 11ac, -20°C to +70°C
2x2 MIMO RSDB + Bluetooth® solution with SDIO interface, -30°C to +85°C 2x2 MIMO RSDB + Bluetooth® solution with SDIO interface, -30°C to +85°C External antenna, supports STA & SoftAP mode, Fast Roaming & EAP
1MB MCU FLASH+ 288KB RAM
-

6

Internet of Things (IoT) Solutions

802.11n/ac Wi-Fi + Dual-Mode Bluetooth® combo partner module portfolio

Partner Azurewave Azurewave

PN AW-NM512 AW-CU544

Wi-Fi/ Bluetooth® PN

Wi-Fi/Bluetooth® Support

MCU

CPU (MHz)

CYW43439

2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE

Radio Only N/A

P64 + CYW43439

2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE 5.2

Arm® Cortex®-M4F / Cortex®M0+

150MHz / 100MHz

Laird Connectivity

Sterling-

LWB+

CYW43439

(453-00083R)

2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE

Radio Only N/A

Laird Connectivity

SterlingLWB+

CYW43439

(453-00084R)

2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE

Radio Only N/A

Laird Connectivity

SterlingLWB+

CYW43439

(453-00085R)

2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE

Radio Only N/A

Area (mm)
12 x 12

Regulatory Linux Interfaces Highlights

N

N

SDIO,UART Low cost combo, 1x1 SISO, TCP keepalive, WPA-3

36 x 18

FCC/IC

N

12 x 12 x 3 (SiP module)

FCC/IC/CE/ Giteki/RCM

Y

21 x 15 x 4 (PCB module)

FCC/IC/CE/ Giteki/RCM

Y

21 x 15 x 4 (PCB module with chip antenna)

FCC/IC/CE/ Giteki/RCM

Y

UART

Non video/audio host SoC, RTOS, CAPSENSETM, 2M Flash; OPTIGATM Trust M, Int. Ant

SDIO, UART, I2S
SDIO, UART, I2S
SDIO, UART, USB

Sterling-LWB+ Wi-Fi 4 with Bluetooth® 5.2 module, based on the Infineon AIROCTM CYW43439 chipset, is the latest member of the successful Sterling-LWB radio family. This new module series is available as a System-in-Package (SiP) and two certified module versions, supporting either an onboard chip antenna or a MHF connector for an external antenna. It is designed to meet the demands of medical and industrial IoT connectivity. Industrial temperature: Supports -40°C to +85°C industrial temperature operation.
Sterling-LWB+ Wi-Fi 4 with Bluetooth® 5.2 module, based on the Infineon AIROCTM CYW43439 chipset, is the latest member of the successful Sterling-LWB radio family. This new module series is available as a System-in-Package (SiP) and two certified module versions, supporting either an onboard chip antenna or a MHF connector for an external antenna. It is designed to meet the demands of medical and industrial IoT connectivity. Industrial temperature: Supports -40°C to +85°C industrial temperature operation.
Sterling-LWB+ Wi-Fi 4 with Bluetooth® 5.2 module, based on the Infineon AIROCTM CYW43439 chipset, is the latest member of the successful Sterling-LWB radio family. This new module series is available as a System-in-Package (SiP) and two certified module versions, supporting either an onboard chip antenna or a MHF connector for an external antenna. It is designed to meet the demands of medical and industrial IoT connectivity. Industrial temperature: Supports -40°C to +85°C industrial temperature operation.

7

Internet of Things (IoT) Solutions

802.11n/ac Wi-Fi partner module portfolio

Partner Lantronix
Lantronix
Lantronix
Lantronix Murata Murata Murata imp Murata Quectel USI USI

Wi-Fi/

PN

Bluetooth®

PN

XPC240100B-02 CYW43907

XPC240200B-02 CYW43907

XPC240300B-02 CYW43907

XPC240400B-02 CYW43907

Type 1GC (LBWA1UZ1GC-958)

CYW43907

Type 1PS (LBWA1UZ1PS-241)

CYW54907

Type 1GC

Imp005 (LB-

CYW43907

WA1UZ1GC-901)

Type 1YN (LBEE5KL1YN)

CYW43439

FC909A

CYW43439

WM-AN-BM-23 CYW43907

WM-BN-BM-26_ REF1

CYW43439

Wi-Fi/Bluetooth® Support

MCU

2.4/5 GHz, 802.11n

Arm® Cortex®R4-Internal

2.4/5 GHz, 802.11a/b/g/n

Arm® Cortex®R4-Internal

2.4/5 GHz, 802.11a/b/g/n

Arm® Cortex®R4-Internal

2.4/5 GHz, 802.11a/b/g/n

Arm® Cortex®R4-Internal

2.4/5 GHz, 802.11a/b/g/n

Arm® Cortex®R4-Internal

2.4/5 GHz, 802.11a/b/g/n + ac

Arm® Cortex®R4-Internal

2.4/5 GHz, 802.11a/b/g/n

Arm® Cortex®R4-Internal

802.11b/g/n + Bluetooth® 5.2 BR/EDR/LE
2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE

Radio Only Radio Only

2.4/5 GHz, 802.11a/b/g/n

Arm® Cortex®R4-Internal

2.4 GHz, 11b/g/n/ Bluetooth® 5.2

Radio Only

CPU (MHz)
160/ 320 MHz
160/ 320 MHz
160/ 320 MHz
160/ 320 MHz
160/ 320 MHz 160/ 320 MHz 160/ 320 MHz
N/A
N/A
160/ 320 MHz N/A

Area (mm)

Regulatory Linux

FCC/IC/ 25 x 17 CE/TELEC/ N
SRRC

FCC/IC/ 25 x 17 CE/TELEC/ N
SRRC

FCC/IC/ 25 x 17 CE/TELEC/ N
SRRC
FCC/IC/ 25 x 17 CE/TELEC/ N
SRRC

10 x 10 CE/FCC/IC N

10 x 10 CE/FCC/IC N

10 x 10 CE/FCC/IC N

6.95 x 5.15 x 1.1

FCC/IC

12 x 12 FCC/CE/ x 1.95 ROHS

Y

10 x 10 CE/FCC/IC N

15 x 9.5 N

Y

Interfaces

Highlights

UART x 1, Eth (RMII), USB (Host or Device), SPI, SDIO, I2C, 11 GPIOs

XPICO 240 embedded IoT gw, 802.11a/b/g/n + ac , ETH, dual U.FL, ind. temp., LGA, 250

UART x 1, Eth (RMII), USB (Host or Device), SPI (Master and Slave), SDIO, I2C, 11 GPIOs

XPICO 240 embedded IoT gw, 802.11a/b/g/n, ETH, 0n-module ant, ind. temp., LGA, 250

UART x 1, Eth (RMII), USB (Host or Device), SPI, SDIO, I2C, 11 GPIOs

XPICO 240 embedded IoT gw, 802.11a/b/g/n, ETH, dual U.FL, ind. temp., edge conn, 100 pc

UART x 1, Eth (RMII), USB (Host or Device), SPI, SDIO, I2C, 11 GPIOs

XPICO 240 embedded IoT gw, 802.11a/b/g/n, ETH, 0n-module ant, ind. temp., edge conn, 100 pc

UART, SPI, I2C, I2S, PWM, GPIO, USB, Ethernet

High performance CPU. Gateway for WLAN and Ethernet. Audio streaming. Modular Cert. RAM 2 MB, -20°C to +70°C, Arrow Quicksilver EVK support

UART, SPI, I2C, I2S, PWM, GPIO, USB, Ethernet

High performance CPU. Gateway for WLAN and Ethernet. Audio streaming. Modular Cert. RAM 2 MB, -20°C to +70°C, Pin compatible with type 1GC (adds 802.11ac)

UART, SPI, I2C, PWM, Electric Imp, High performance CPU. Gateway for WLAN and Ethernet. GPIO, USB, Ethernet Audio streaming. Modular Cert. RAM 2 MB, -20°C to +70°C

WLAN-SDIOv2.0, UART & PCM

Small form factor, high-performance module with up to 65 Mbps PHY data rate on Wi-Fi and 3 Mbps PHY data rate on Bluetooth®

SDIO, UART, PCM

External antenna, supports STA & SoftAP mode, Fast Roaming & EA

QSPI, PWM, USB, SDIO, UART, I2C, I2S, MII, RMII

2 MB RAM

SDIO (WPA3)

-

8

Internet of Things (IoT) Solutions

Bluetooth® & Bluetooth®LE (Dual-Mode) partner module portfolio

Partner PN

Alinket

ALX41X

Wi-Fi/ Bluetooth® PN
CYW20736

Wi-Fi/Bluetooth® Support Bluetooth® LE

MCU
Arm® Cortex®M3-Internal

CPU (MHz)
24 MHz

Area (mm)

Regulatory Linux Interfaces

19 x 13.5 FCC/CE

N

UART, SPI ADC, GPIO

Highlights
PCB antenna, 1 MB Flash, Bluetooth® LE MIDI support, master mode (up to 8 slaves) & bridge mode.

Alinket

ALX420

CYW20706

Bluetooth®/ Bluetooth® LE

Arm® Cortex®M3-Internal

96 MHz 8 x 8

N

N

HCI UART, PUART Custom antenna designs supported, supports master/ SPI, I2S, I2C, ADC slave mode, A2DP SRC & SNK & iAP2, MFi (HomeKit).

Alinket Alinket

ALX420A ALX421A

Alinket

ALX422A

CYW20706

Bluetooth®/ Bluetooth® LE

Arm® Cortex®M3-Internal

96 MHz 16 x 10 FCC/CE

N

CYW20707

Bluetooth®/ Bluetooth® LE

Arm® Cortex®M4-STM32F411

100 MHz 19 x 12 FCC/CE

N

CYW20707

Bluetooth®/ Bluetooth® LE

Arm® Cortex®M4-STM32F412

100 MHz 21 x 12 FCC/CE

N

Alinket

ALXG30

CYW20706

Bluetooth®/ Bluetooth® LE

Arm® Cortex®M4-STM32F411

100 MHz 80 x 55 FCC/CE

Y

Azurwave AW-BT315W CYW20721 Inventek ISM20706A2S CYW20706

Inventek ISM20732S

CYW20732

Inventek ISM20736S

CYW20736

Bluetooth® 5.1 Bluetooth®/ Bluetooth® LE Bluetooth® LE Bluetooth® LE

Arm® Cortex® - M4 96 MHz

Arm® Cortex®M3-Internal
Arm® Cortex®M3-Internal
Arm® Cortex®M3-Internal

96 MHz 24 MHz 24 MHz

4 x 4

N

Y

6.0 x 8.6 N

N

6.5 x 6.5 FCC/IC/CE N

6.5 x 6.5 FCC/IC/CE N

Iton

BB2706-30

CYW20707 Bluetooth®/ Bluetooth® LE Radio Only

N/A

15 x 12 N

Y

HCI UART, PUART Onboard antenna, 1 MB Flash, supports Master/Slave SPI, I2S, I3C, ADC mode, A2DP SRC & SNK & iAP2, MFi (HomeKit).

UART, SPI, USB, SDIO, I2S, I2C

Onboard antenna, 1 MB Flash, supports master/Slave mode, A2DP SRC & SNK & iAP2, MFi (HomeKit).

UART, SPI, USB, SDIO, I2S, I2C

Bluetooth® 4.2, onboard antenna, 1 MB Flash, support both slave & master mode, A2DP SRC & SNK, HFP & iAP2, MFi (HomeKit).

RS485

Onboard or external antenna (with U.FL connector), 1 MB Flash, supports Bluetooth® slave mode, SPP, MFi, RS485 to Bluetooth®, RS-485 to 2G.

UART

Small form-factor Bluetooth® SiP module.

SPI, I2C, JTAG

Embedded antenna Bluetooth®4.2+HS SiP module.

SPI, I2C, JTAG SPI, I2C, JTAG SPI, UART, I2C

Lowest cost Bluetooth® LE SiP module solution.
Wireless charging, simultaneous central and peripheral operation.
Bluetooth® 4.2, supported profile: HFP with WBS, HID, SPP, GATT, AVRCP, HOGP, A2DP, HID, etc; supports SiG Bluetooth® LE mesh, customized flow control for portable printers.

9

Internet of Things (IoT) Solutions

Bluetooth® & Bluetooth®LE (Dual-Mode) partner module portfolio

Partner

PN

Wi-Fi/ Bluetooth® PN

Wi-Fi/Bluetooth® Support

MCU

CPU (MHz)

Area (mm)

Laird

Bluetooth®-

Connectivity 850-SA

CYW20704

Bluetooth®/ Bluetooth® LE

Radio Only

N/A

8.5 x 13

Laird

Bluetooth®-

Connectivity 850-ST

CYW20704

Bluetooth®/ Bluetooth® LE

Radio Only

N/A

8.5 x 13

Regulatory Linux Interfaces

FCC/IC/CE/ RCM/Giteki/ Y Korea

USB, HCI, I2S, PCM, GPIO

FCC/IC/CE/ RCM/Giteki/ Y Korea

USB, HCI, I2S, PCM, GPIO

Highlights
The Bluetooth® 85x series of USB HCI modules and adapters that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 850 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host USB interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin.
The Bluetooth® 85x series of USB HCI modules and adapters that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 850 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host USB interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin.

10

Internet of Things (IoT) Solutions

Bluetooth® & Bluetooth®LE (Dual-Mode) partner module portfolio

Partner

PN

Wi-Fi/ Bluetooth® Wi-Fi/Bluetooth® Support MCU PN

CPU Area (MHz) (mm)

Regulatory

Laird Connectivity

Bluetooth® 851

CYW20704 Bluetooth®/ Bluetooth® LE Radio Only N/A

17.4 x 46.75

FCC/IC/CE/ RCM/Giteki

Laird Connectivity

Bluetooth® -860-SA

CYW20704

Bluetooth®/ Bluetooth® LE

Radio Only

N/A

8.5 x 12.85

FCC/IC/CE/ RCM/Giteki

Laird Connectivity

Bluetooth®-860-ST

CYW20704

Bluetooth®/ Bluetooth® LE

Radio Only

N/A

8.5 x 12.85

FCC/IC/CE/ RCM/Giteki

Linux Y Y
Y

Interfaces

Highlights

USB, HCI, I2S, PCM, GPIO
UART, HCI, I2S, PCM, GPIO
UART, HCI, I2S, PCM, GPIO

The Bluetooth® 851 is a packaged USB adapter that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy.
The Bluetooth® 86x series of UART HCI modules that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 860 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host UART interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin.
The Bluetooth® 86x series of UART HCI modules that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 860 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host UART interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin.

11

Internet of Things (IoT) Solutions

Bluetooth® & Bluetooth®LE (Dual-Mode) partner module portfolio

Partner Murata Murata Pairlink Pairlink Pairlink Pairlink

PN
Type 1GR (LBCA1ZZ1GR-084)

Wi-Fi/ Bluetooth® PN
CYW20736

Type1WA

CYW20721

Dragon-B

CYW20706

Dragon-C

CYW20706

Mouselet-B Mouselet-C

CYW20736 CYW20736

Wi-Fi/Bluetooth® Support

MCU

CPU (MHz)

Area (mm)

Bluetooth® LE
Bluetooth®/ Bluetooth® LE

Arm® Cortex®M3-Internal

24 MHz

Arm® Cortex®M4-Internal

N/A

9.0 x 7.0 5.9 x 5.1

Bluetooth®/ Bluetooth® LE

Arm® Cortex®M3-Internal

96 MHz

11 x 16.8

Bluetooth®/ Bluetooth® LE

Arm® Cortex®M3-Internal

96 MHz

11 x 16.8

Bluetooth® LE Bluetooth® LE

Arm® Cortex®M3-Internal

24 MHz

Arm® Cortex®M3-Internal

24 MHz

14 x 18 14 x 18

Regulatory
CE/FCC/IC
FCC/IC/CE BQB/MIC/ FCC/IC/CE/ ROHS BQB/MIC/ FCC/IC/CE/ ROHS
BQB/MIC
BQB/MIC

Linux Interfaces

Highlights

N

UART, SPI

Bluetooth® 4.1, includes antenna

Y

UART, SPI

Bluetooth® 5.1, Performance Audio

N

UART, 4*PWM, MFi, IIS

Chip antenna, 1 MB Flash, supports connected mesh, SIG mesh

N

UART, 4*PWM, MFi, IIS

IPEX connecter, 1 MB Flash, supports connected mesh, SIG mesh

N

UART, 4*PWM Chip antenna, 512 KB Flash, supports connected mesh

N

UART, 4*PWM IPEX connecter, 512 KB Flash, supports connected mesh

12

Connectivity devices: Wi-Fi + Bluetooth® Combo Devices www.infineon.com/wi-fi-and-bluetooth-combos
Software and support: ModusToolboxTM software environment www.infineon.com/modustoolbox
Infineon Partner Network www.infineon.com/partnerfinder
Infineon Developer Community https://community.infineon.com

Wi-Fi MCU devices www.infineon.com/wi-fi-mcu
Bluetooth® and Bluetooth® LE devices www.infineon.com/airoc-bluetooth-le-bluetooth-multiprotocol
Technical forum for ModusToolboxTM www.infineon.com/modustoolbox-community
Technical forum for Linux www.infineon.com/wi-fi-bluetooth-linux-drive-community

Internet of Things (IoT) Solutions

www.infineon.com
Published by Infineon Technologies AG 81726 Munich, Germany
© 2022 Infineon Technologies AG. All Rights Reserved.
Document Number: 002-33054 Rev. ** Date: 09 / 2022

Please note! This document is for information purposes only and any information given herein shall in no event be regarded as a warranty, guarantee or description of any functionality, conditions and/or quality of our products or any suitability for a particular purpose. With regard to the technical specifications of our products, we kindly ask you to refer to the relevant product data sheets provided by us. Our customers and their technical departments are required to evaluate the suitability of our products for the intended application.
We reserve the right to change this document and/or the information given herein at any time.
Additional information For further information on technologies, our products, the application of our products, delivery terms and conditions and/or prices, please contact your nearest Infineon Technologies office (www.infineon.com).

Warnings Due to technical requirements, our products may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by us in a written document signed by authorized representatives of Infineon Technologies, our products may not be used in any life-e ndangering applications, including but not limited to medical, nuclear, military, life-critical or any other applications where a failure of the product or any consequences of the use thereof can result in personal injury.
Any sales transactions involving the partner modules referenced herein, including their terms and conditions, are between you and the partner.

13


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