Testo SE & Co. KGaA LSD4BT-S35系列产品规格书 Antenna infomation

LSD4BT-S35系列产品规格书

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Antenna infomation

Testo SE & Co. KGaA 05602770 testo 270 BT WAF-05602770 WAF05602770 05602770

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BT5.0-E92 Ser ies Pr oduct Specification
Pr oduct Name: E92 BLE Standar d Module Pr oduct Model: LSD4BT-E92 Ver sion: Rev01
1

Revision Histor y

Ser ial No.

Revision Log

Revised Reviewed

00 Initial version

Sun Sun Xin
Xiangtao

Update NFC function, adjust pin 17,

Sun

Sun Xin

18, 19, 20

Xiangtao

Ver sion Rev00 Rev01

Revision Date
2019-6-4
2019-7-16

Contents
CHAPTER 1 OVERVIEW........................................................................................................................ 4 1.1 FUNCTIONAL CHARACTERISTICS........................................................................................................ 4 1.2 APPLICATION OCCASIONS.................................................................................................................. 5
CHAPTER 2 SPECIFICATION & PARAMETERS............................................................................. 6 CHAPTER 3 HARDWARE LAYOUT AND INTERFACE DESCRIPTION.....................................8
3.1 DIMENSIONS....................................................................................................................................... 8 3.2 INTERFACE DESCRIPTION................................................................................................................... 9 3.3 PCB PACKAGING..............................................................................................................................11 CHAPTER 4 APPLICATION INSTRUCTIONS................................................................................ 12 4.1 ANTENNA DESIGN GUIDE..................................................................................................................12 4.2 NOTICE FOR BASE BOARD LAYOUT.................................................................................................. 13 4.3 NFC DESIGN GUIDE..........................................................................................................................14 4.4 NOTICES........................................................................................................................................... 15 CHAPTER 5 PRODUCTION GUIDANCE..........................................................................................15 5.1 PRODUCTION GUIDE.........................................................................................................................15 5.2 REQUIREMENTS ON POSITIONS OF MODULE ON BACKPLANE..........................................................16 5.3 OPENING DESIGN OF STEEL MESH...................................................................................................16 5.4 STANDARD OPERATION PROCEDURE (SOP) FOR REFLOW.............................................................. 17 CHAPTER 6 PRODUCT PACKAGE................................................................................................... 18 6.1 PACKAGING METHOD.......................................................................................................................18 6.2 STRIP SIZE........................................................................................................................................ 18 6.3 PRODUCT DIRECTION....................................................................................................................... 18 NOTICE TO USERS............................................................................................................................... 18
3

Chapter 1 Over view

E92 series of Bluetooth module is high-performance Bluetooth module which is based on

the low power consumption NORDIC Bluetooth SOC chip nRF52 series (support BLE

5.0) . The module adopts stamp hole-type interface, and with two antenna options : PCB

antenna and external antenna, which is compatible with E66 series module . The key

features of the module is low-power consumption, small size and high anti-interference

ability.

Based on the optimized Bluetooth SDK provided by Lierda, users can easily realize development of Bluetooth applications, shorten research and development cycle.

Table 1-1 Model Description

Par t number

Descr iption

LSD4BT-E92ASTD001

nRF52832, PCB antenna and external antenna. For the module with software, please communicate with the salesman over the specific part number, MPQ and other information.

1.1 Functional Char acter istics

Bluetooth 5 2 Mbps CSA #2 Advertising Extensions Data Length Extension
64 MHz ARM® Cortex-M4F 512 KB Flash + 64 KB RAM LE mode1 Mbps2 Mbps Link budget100dB Receiving sensitivity-96dB output powerMAX 4dBm RSSI 1dB Working voltage1.7-3.6V Available GPIO quantity19 ADC12 bits /200 ksps 50RF Port programmable peripheral interface (PPI)

DC-DC working mode Support user defined download protocol NFC 3 SPIs 2 TWIs 1 UART 3 PWMs 8 10/12bit ADCs
1.2 Application Occasions
2.4GHz low-power consumption Bluetooth system; PC,Tablet,smart phone,handset and low-power consumption Bluetooth devices (such as HID, remote controller ) ; Consumer electronics such as sports, health care ; Wireless sensor for smart meters, data collection; Smart cloud platform integration(such as Wechat, QQ ToT, JD, Alibaba,Xiaomi ); Smart home, LAN,Interactive devices , beacon lights
5

Chapter 2 Specification & Par ameter s

Table 2-1 Limit Parameters

Per for mance

Main Par ameter s

Minimum Maximum Remar ks

Value

Power supply voltageV

-0.3

3.9

IO voltageV

No more than

-0.3

VDD+0.3

3.9

Maximum RF input dBm

NFC maximum currentmA

Storage temperature

-40

+125

Operating temperature

-40

+85

VESD

Electrostatic discharge(ESD) performance

Human Body Model(HBM),per ANSI/ESDA/JEDEC/JS001(1) Charged Device Model(CDM),per JESd22-C101(2)

4000V

All pins

1000V

RF pins

1000V Non-RF pins

(1)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process

(2)JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process

Table 2-2 Working Parameters of the Module @25

Per for mance

Main Par ameter s Minimum Typical Maximum

Remar ks

Value

Value Value

The ripple of the power supply

Working voltageV 1.7

3.3

3.6

requires the peak value to be

within 30mV

Power supply voltage /
rising timems

Power supply voltage rises to 1.7V

within 60ms

Working frequency

2402

2480

(MHz)

Payload length

Default payload length is 37, extension

255

bytes

length is 255

Working mode

1 Mbps/2 Mbps

Default value is 1Mbps

Communication

BLE 5.0

protocol

Number of channels

Modulation type

GFSK

Communication distance1

100m

@3.3V;4dBm;BLE mode-1M ;PCB antenna

@3.3V;4dBm;BLE mode-1M ;PCB

Connection distance2

50m

antenna

Transmittance power

@3.3V ;software can be set -20dBm to

(dBm)

+4dBm

Receiving sensitivity

-96

@BLE mode-1MbpsPayload=37

(dBm)

Receiving sensitivity

-95

@BLE mode-1MbpsPayload=255

(dBm)

NFC working

13.56

frequencyMHz

NFC ratekbps

106

1. "Communication distance" is affected by the measuring environment, air humidity and other

factors around, and only for reference.

2. Communication distance is the maximum communication distance after connection, connection

distance is the maximum distance that connection can be created.

Table 2-3 Power Consumption of the Module @25

Per for mance

Main Par ameter s Minimum Typical Maximum

Remar ks

Value

Value Value

7.5

@3.3VDCDC-Mode;4dBm

Transmitting current

16.6

@3.3VLDO-Mode;4dBm

(mA)

5.3

@3.3VDCDC-Mode;0dBm

11.6

@3.3VLDO-Mode;0dBm

5.4

@3.3VDCDC-Mode;1Mbps

Receiveing current

11.7

@3.3VLDO-Mode;1Mbps

(mA)

5.8

@3.3VDCDC-Mode;2Mbps

12.9

@3.3VLDO-Mode;2Mbps

Sleep mode current

0.3

System OFF current, no RAM retention

(uA)

1.2

System ON base current, no RAM retentio

RAM current (nA)

per 4 KB RAM section

7.4

running from flash, cache enabled, LDO

CPUcurrent1(mA)

3.7

running from flash, cache enabled, DCDC

1. CPU clock speed is 64MHz, set external as idle status, supply voltage is 3.3V

Chapter 3 Har dwar e Layout and Inter face Descr iption
3.1 Dimensions
When this product is designed, the tantalum capacitors and PCBs have optional material models. On the premise that the performance requirements are met, the appearance color may be different, and the actual product shall prevail. The main materials (main chips, crystal oscillators, etc.) do not have any substitutional models. Any change will be notified in advance.

19
Fig. 3-1 The dimensions of the module E92 *The dimensional tolerance which is not marked in the figure is subject to the standard GB/T1804-m.
8

Fig. 3-2 E92 module internal diagram
3.2 Inter face Descr iption

Module Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Table 3-1 Functional Description of Pins of E92 Series of Module

Chip Pin

Remar ks

P0.27 GND P0.28/AIN4 P0.29/AIN5 P0.30/AIN6 P0.31/AIN7 P0.02/AIN0 P0.03/AIN1 P0.04/AIN2 VBAT GND RSTN SWDCLK SWDIO P0.07 P0.08 P0.14/UART_TX

Digital I/O pin PWR GND Digital I/O pin; analog I/O pin Digital I/O pin; analog I/O pin Digital I/O pin; analog I/O pin Digital I/O pin; analog I/O pin Digital I/O pin; analog I/O pin Digital I/O pin; analog I/O pin Digital I/O pin; analog I/O pin Power supply PWR GND RESET Clock debugging pin Data debugging pin Digital I/O pin Digital I/O pin Digital I/O pin; serial data TXD pin
9

P0.15/UART_RX Digital I/O pin; serial data RXD pin

Digital I/O pin; NFC antenna pin; using NFC need to reserve

P0.09/NFC1

tuned-circuit

Digital I/O pin; NFC antenna pin; using NFC need to reserve

P0.10/NFC2

tuned-circuit

P0.16

Digital I/O pin

P0.17

Digital I/O pin

P0.18

Digital I/O pin

P0.19

Digital I/O pin

P0.20

Digital I/O pin

GND

PWR GND

External antenna interface; when using need to reserve

ANT

matching circuit

For detail pin descriptions, please refer to nRF52832 data sheet.

Note: When customizing software, user can keep the original configuration of P 0.25 and P 0.26 without change, or you can set pull-down.

3.3 PCB packaging
Fig. 3-3 E92series module PCB packaging-Top View Note: The shaded ar ea is PCB antenna. No copper or devices can be placed on either floor of the base plate in this ar ea.
11

Chapter 4 Application Instr uctions
4.1 Antenna design guide
If customers have high requirements for distance, they can use an external antenna, and the IO port for using an external antenna is PIN27 (ANT). The bottom of the module, including the original antenna position, should be completely covered with copper. The following figure shows the circuit from the module ANT pin to the external antenna. The red thick wire should ensure the impedance control of 50. The routing should be as short as possible, without punching holes and taking sharp corners. More GND holes are punched around the RF routing.
Fig. 4.1 Schematic diagram of impedance matching circuit for external antenna
Fig. 4.2 PCB schematic diagram and route description of impedance matching circuit for external antenna
The wiring of the highlight part is to control the impedance of 50. The relationship
12

between plate thickness, line width and line spacing can be referred as following: FR4 double-sided boards recommended value H=Board thicknessW=Line widthD=Spacing between wiring and copper-clad H=1.0mmW=0.8mmD=0.2mm H=1.0mmW=1.0mmD=0.254mmRecommended H=1.2mmW=1.0mmD=0.2mmRecommended H=1.6mmW=1.0mmD=0.2mm Recommended Ask Lierda engineer for more design support
4.2 Notice for base boar d layout
Save enough clearance zone for antenna . Clearance refers to the space area in the projection area of the vertical plane of the antenna (both upper and lower areas should be considered). In the projection area of the antenna, whether patch or side insertion, do not lay the ground (especially for PCB antenna ), do not have metal or devices, and keep enough clearance to improve the radiation efficiency of the antenna. The height (distance) between the antenna and the motherboard also need to be taken into consideration. Generally , the height of the antenna from the motherboard should be at least 10 mm, and at least 5 mm in extreme conditions. When the antenna height is less than 8 mm, the radiation efficiency of the antenna will be limited. The radio frequency part of the module should avoid being covered by metal cavity. The distance between the radio frequency part and the interference source should be more than 10 mm. Common interference sources include battery (including electrical connection base), capacitance, inductance, buttons, oscillator, power cord, metal screw or nut, CPU, LCD, transformer, horn, camera and products internal communication interface, power supply circuit, motor, etc. If PCB antenna is used in the module, the PCB antenna should be on the edge of the PCB on the whole base board. The distance between the PCB antenna and other parts should be kept at 10 mm. No copper, wiring or components can be arranged in all layers around the antenna. If there are multiple antennas, the distance between the antenna and the antenna should be as far as possible to avoid co-frequency interference and cross-modulation interference. Users should pay attention to the design, leave windowing area for the antenna pad in the product bottom layer, and can not be placed through the hole so that to prevent short circuit.
13

4.3 NFC design guide
The design of NFC antenna is rather complex. It is not recommended that customers without antenna design experience design their own antenna. It is suggested that the NFC antenna be designed by referring to the NFC reference design provided by Lierda or by professional antenna designers.
Note: When using NFC antenna, tuning circuit should be reserved on the bottom board. If the antenna needs to be assembled or exposed to the outside of the product, it is necessary to add two TVS diodes to the circuit at the antenna entrance. If the antenna is exposed to a strong NFC magnetic field, the current may flow backwards on the power supply. If the power supply cannot withstand the back flow, current needs to be protected by a diode in series between the power supply and the module.
Fig. 4.3 Tuning circuit
Tuning method: Network analyzer is used to test the echo loss of antenna at 13.56 MHz frequency. The test requires two antennas, one antenna connected to the module's NFC interface, and the module does not need to be connected to power supply. Another test antenna port is directly connected to the network analyzer. The distance between the test antenna and the antenna connected to the module should not be less than 1 cm, and the distance should not be too far, at least to ensure that the echo loss can be seen on the network analyzer. The resonant frequency of the antenna corresponds to the frequency at the deepest point of the echo loss. Adjust the tuning capacitance value on the board so that the resonance frequency falls near 13.56 MHz. If the frequency is low, the tuning capacitance value can be reduced, and if the frequency is high, the tuning capacitance value
14

can be increased. Note that the tuning capacitance of both sides should be equal.
4.4 Notices
1. Power Supply It is suggested supplying power to the module with DC regulated power supply. The ripple of power supply should as small as possible. Usually the ripple is less than 30 mV. Excessive ripple will lead to poor sensitivity and other connection abnormalities. At the same time, the transmitting signal of Bluetooth will be coupled into the interference signal, which will cause the radio frequency to exceed the Bluetooth specification, and even will result in failed connection and communication. It is recommended to use LDO as power supply for the module. At the same time, LDO should be far away from DC-DC power supply and inductance to prevent DC-DC radiation from polluting LDO power supply. The module should be grounded reliably, and pay attention to the correct connection of the positive and negative poles of the power supply, and reverse connection may cause permanent damage to the module. 2. Electro-static discharge notices The user shall pay attention to the electrostatic requirements (as shown in Table 2-1) of the product, and add the electrostatic prevention measures when designing the end products.
Chapter 5 Pr oduction Guidance
5.1 Pr oduction Guide
It is suggested the stamp hole packaging module mounted by an SMT machine, and the mounting shall be finished within 24 hours after unpacking. Otherwise, its need to repackage by vacuumizing, so as to prevent poor mounting effect due to damp. If the package includes a humidity indicator card, it is suggested judging if the module needs to be baked according to the indication of the humidity indicator card. The baking conditions are as follows:
Baking temperature: 125±5; The alarm temperature is set to be 130; SMT mounting can be carried out after the temperature cools down to be <36 under natural conditions;
15

If the product is unpacked for over 3 months, please pay special attention if the product is affected with damp, because the PCB gold immersion process may lead to the oxidation of the land after more than 3 months, and may lead to such problems as false welding and missing welding during the mounting process. In order to ensure the pass rate of reflow, it is suggested picking 10% of products for visual inspection and AOI detection in the first time of mounting, so as to ensure the reasonableness of the furnace temperature, device absorption method and placement method; Operators at all stations must wear the anti-electrostatic gloves during the whole production process;
5.2 Requir ements on Positions of Module on Backplane
It is suggested the green oil thickness at the module position of the backplane be less than 0.02mm, so as to prevent the phenomenon that the green oil is too thick, the module is blocked up and cannot be effectively contacted with solder paste, and the welding quality is affected. In addition, please do not place other devices within 2mm around the module position on the interface board, so as to ensure the convenience for repairing the module.
5.3 Opening Design of Steel Mesh
The thickness of the stencil on the backplane shall be selected by comprehensively considering the packaging type of the devices in the board, and special attention shall be paid to the following requirements: The land position of the module can be locally thickened to 0.15~0.20mm, so as to prevent void solder;
16

5.4 Standar d Oper ation Pr ocedur e (SOP) for Reflow
Note: This SOP is only applicable to lead-free operation, and only for reference.
17

Chapter 6 Pr oduct Package

6.1 Packaging Method

Tape

Foam

6.2 Str ip Size

Electrostatic bag

6.3 Pr oduct Dir ection
The placement direction of the tape packaging module is shown as following:
Protecting tape

Cover tape

Round hole

Carrier tape rubber wheel Product information label

Carrier tape

Depression Discharge direction

Notice To user s
Welcome to use the products of Lierda Science & Technology Group Co., Ltd.. Prior to the use of our products, please first read this notice; if you have started using our products, you will be considered as having read and accepted the notice. Lierda Science & Technology Group Co., Ltd. reserves the final interpretation and revision rights over all attached materials, and any modification of them will not be further notified.

Related FCC IDs:

WAF-05602770 - Testo SE & Co. KGaA testo 270 BT [-05602770]

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