An Ceramiz 2450 3216 L00 0

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Antenna specification

Shanghai Yibo Technology Co., LTD RPT2024 2BGEC-RPT2024 2BGECRPT2024 rpt2024

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Document DEVICE REPORTGetApplicationAttachment.html?id=7387642
DATA SHEET
WIRELESS COMPONENTS
Ceramic Chip Antenna ANT3216LL00R2400A
2.4 - 2.5 GHZ
3216 Series
ManufacturerYAGEO Shanghai AddressRoom 2803-2807, Ganghui Plaza, No.1 Hongqiao Road, Xuhui District, Shanghai

Product Specification ­ March 27, 2013 V.0

WIRELESS COMPONENTS Ceramic Chip Antenna

Product specification 2
6

FEATURES z Compact size z Omni-directional radiation z Tape & reel automatic
mounting z Reflow process compatible z RoHS compliant
APPLICATIONS z 2.4 GHz WiFi device z Bluetooth gadget z Zigbee device z ISM band equipment

ORDERING INFORMATION All part numbers are identified by the series, packing type, material, size, antenna type, working frequency and packing quantity.
PART NUMBER
ANT 3216 L L00 R 2400A
(1) (2) (3) (4) (5) (6)
(1) PRODUCT ANT = Antenna
(2) SIZE 3216 = 3.2 × 1.6 mm
(3) ANTENNA TYPE L,F,A = Chip Antenna
(4) SERIAL NO. L00
(5) PACKING TYPE R = Tape and Reel
(6) WORKING FREQUENCY 2400 = 2.4GHz
PHYCOMP CTC CAN4311712002453K
12NC 431171200245

Mar. 27, 2013 V0

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WIRELESS COMPONENTS Ceramic Chip Antenna
SPECIFICATION Table 1
DESCRIPTION Working Frequency Bandwidth Polarization Azimuth Beamwidth Peak Gain Impedance Operating Temperature Maximum Power Termination Resistance to Soldering Heats
NOTE 1. The specification is defined on Yageo evaluation board

Product specification 3
6
VALUE 2.4 - 2.5 GHz
160 MHz Linear
Omni-directional 5.05 dBi (Typ.) 50 -40 ~105 1W
Ni / Sn (Environmentally-Friendly Leadless) 260 , 10sec.

DIMENSIONS

Table 2 Machinical Dimension

DIMENSION

L (mm)

3.20 ±0.15

W (mm)

1.60 ±0.15

T (mm)

1.20 ±0.15

C (mm)

0.40 ±0.20

Table 3 Termination configuration

TERMINAL NAME

FUNCTION

S1

Feeding Point

S2

Soldering Point

OUTLINES

Fig. 1 Antenna outlines

Top View L
W S1
Bottom View C

Side View T
S2
YNH0010

Mar. 27, 2013 V0

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WIRELESS COMPONENTS Ceramic Chip Antenna

REFERENCE DESIGN OF EVALUATION BOARD

30

10

Product specification 4
6

18

Fig. 2 Outlook and dimension of evaluation board

Unit : mm

Matching Circuit

2.0 2.5
0.4 1.8
3.5

Top Layer Bottom Layer
Unit : mm

Fig. 3 Details of soldering Pad

YNH0011

Mar. 27, 2013 V0

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WIRELESS COMPONENTS Ceramic Chip Antenna

ELECTRICAL PERFORMANCES

Return loss (dB)
50

YNH0012

30

10

-10

1

3

-30 2

-50 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 f (GHz)
Marker data
1. 2.37GHz, -10dB 2. 2.45GHz, -27.3dB 3. 2.53GHz, -10dB
Fig. 4 Return loss

Product specification 5
6

X Y
Z
Evaluation board and XYZ direction
Fig. 5 Radiation pattern

Gain (dBi)
5.00 - 0.00 - - 5.00 - - 10.00 - - 15.00 - - 20.00 - - 25.00 - - 30.00 - - 35.00 -

Z axle
X axle
Max gain = 5.05 dBi, at (180, 60) MEG (mean effective gain)= 0.45dBi Directivity (dB) = 7.15 Efficiency = -1.50dB, 70.74%

Y axle
YNH0013

Mar. 27, 2013 V0

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WIRELESS COMPONENTS Ceramic Chip Antenna

Product specification 6
6

REVISION HISTORY REVISION DATE
Version 0 Mar. 27, 2013

CHANGE NOTIFICATION -

DESCRIPTION
- New datasheet for Ceramic Chip Antenna, 2.4-2.5 GHz application, size 3216 series

Mar. 27, 2013 V0

www.yageo.com



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