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Antenna SPEC
Adec & Partner AG MAX0124R earis MAX U94MAX0124R U94MAX0124R max0124r
Adec & Partner AG MAX0124R U94MAX0124R U94MAX0124R max0124r
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Document DEVICE REPORTGetApplicationAttachment.html?id=73904082.4GHz 3216 Chip Antenna: RANT3216F245C03 _ Application: WLAN, 802.11b/g, Bluetooth, WLAN, etc... Features SMD, high reliability, ultra Impact, Omni-directional... Part number Information RANT 3216 F 245 C 03 (A) (B) (C) (D) (E) (F) (A)Product Type Chip Antenna (B) Size Code 3.2x1.6mm(±0.2mm) (C) Material High K material (D) Frequency 2.4 ~ 2.5GHz (E) Feeding mode PIFA & Single Feeding (F) Antenna type Type=03 Electrical Specification Working Frequency Range Bandwidth Peak Gain Impedance Return loss Polarization Azimuth Beamwidth Operation Temperature() Resistance to Soldering Heats Termination 2400 ~2500 MHz 120 MHz (Min.) 2.25 dBi (Typ.) 50 Ohm 10 dB ( Min) Linear Omni-directional -40 ~85 10sec. ( @ 280) Ni / Au (Leadless) The specification is defined on EVB. Dimension and Terminal Configuration Dimension (mm) L 3.20 ± 0.20 W 1.60 ± 0.20 T 0.45 ± 0.20 No. Terminal Name 1 Feeding/GNG 2 GND/Feeding :13530576606 RAIN International Technology Co., Ltd. Room 707, Building F, Tongan Zhichuangyuan, xixiang street, Baoan District, Shenzhen. 2.4GHz 3216 Chip Antenna: RANT3216F245C03 _ Evaluation Board Reference PCB Antenna Layout Reference Dimension Unit :mm Electrical Characteristics Return Loss Return Loss & Radiation 1 Radiation Frequency(MHz) 2400 2450 2500 S11 (dB) -10.50 -30.62 -11.47 Z X Y Efficiency 2400MHz 82.52% 2450MHz 2500MHz 85.26% 83.01% 2.4GHz 3216 Chip Antenna: RANT3216F245C03 _ Taping Specifications Reel Specification Reel and Taping Specification TYPE 3216 SIZE 7" 5K/Reel A 9.0±0.5 Tapping Specification B 60±2 C 13.5±0.5 D 178±2 Packaging Type A B W E F G H T D P Paper Type 3216 1.90±0.2 3.50±0.2 8.0±0.2 1.75±0.1 3.5±0.05 4.0±0.10 2.0±0.05 0.75±0.1 1.50±0.1 4.0±0.1 0 0 0 0 00 2.4GHz 3216 Chip Antenna: RANT3216F245C03 _ Reliability Table Test Item Electrical Characterization Thermal Shock Temperature Cycling High Temperature Exposure Low Temperature Storage Solderability (SMD Bottom Side) Soldering Heat Resistance (RSH) Vibration Mechanical Shock Procedure 1. Preconditioning: 50 ± 10 / 1 hr , then keep for 24 ± 1 hrs at room temp. 2. Initial measure: Spec: refer Initial spec. 3. Rapid change of temperature test: -30 to +85; 100 cycles; 15 minutes at Lower category temperature; 15 minutes at Upper category temperature. 1. Initial measure: Spec: refer Initial spec. 2. 100 Cycles (-30 to +85), Soak Mode=1 (2 Cycle/hours). 3. Measurement at 24 ± 2Hours after test condition. 1. Initial measure: Spec: refer Initial spec. 2. Unpowered; 500hours @ T=+85. 3. Measurement at 24 ± 2 hours after test. 1. Initial measure: Spec: refer Initial spec. 2. Unpowered: 500hours @ T= -30. 3. Measurement at 24 ± 2 hours after test. Dipping method: a. Temperature: 235 ± 5°C b. Dipping time: 3 ± 0.5s Preheating temperature: 150 ± 10°C. Preheating time: 1~2 min. Solder temperature: 260 ± 5°C. Dipping time: 5 ± 0.5s 5g's for 20 min., 12 cycles each of 3 orientations Note: Use 8"X5" PCB .031" thick 7 secure points on, one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz. Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks) Peak value: 1,500g's Duration: 0.5ms Velocity change: 15.4 ft/s Waveform: Half-sine Requirements Ceramic Type Fulfill the electrical specification No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. The solder should cover over 95% of the critical area of bottom side. No Visible Damage. No Visible Damage. No Visible Damage. Remark (Reference) User Spec. MIL-STD-202 107 JESD22 JA104 MIL-STD-202 108 MIL-STD-202 108 IEC 60384-21/22 4.10 IEC 60384-21/22 4.10 MIL-STD-202 Method 204 MIL-STD-202 Method 213 Humidity Bias 1. Humidity: 85% R.H., Temperature: 85 ± 2 °C. 2. Time: 500 ± 24 hours. 3. Measurement at 24 ± 2hrs after test condition. No Visible Damage. Fulfill the electrical specification. MIL-STD-202 Method 106 2.4GHz 3216 Chip Antenna: RANT3216F245C03 Board Flex (SMD) 1. Mounting method: IR-Reflow. PCB Size (L:100 × W:40 × T:1.6mm) 2. Apply the load in direction of the arrow until bending reaches 2 mm. No Visible Damage. _ AEC-Q200 005 Adhesion Force of 1.8Kg for 60 seconds. No Visible Damage Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body terminals and body/terminal junction. AEC-Q200 006 Physical Dimension Any applicable method using x10 magnification, micrometers, calipers, gauges, contour projectors, or other measuring equipment, capable of determining the actual specimen dimensions. In accordance with specification. JESD22 JB100 Revision History Revision 1 2 3 Date 2019/03/01 2020/02/22 2020/02/22 Content New Datasheet Add 2D radiation characteristic Add 2D radiation characteristic
Related FCC IDs:
- U94MAX0124R - Adec & Partner AG earis MAX [MAX0124R]