Antenna specifications

Shenzhen Warsong Technology Co., Ltd. R20 Xbox wireless converter 2AYJK-R20 2AYJKR20 r20

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Document DEVICE REPORTGetApplicationAttachment.html?id=6099508
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AAN3216F0V01
1. 2. 3. 4. 5.Antenna Gain0dBi
Dimension and Terminal Configuration
Dimension (mm) L 3.15+-0.15 W 1.55+-0.15 T 0.50+-0.10 A 0.35+-0.10

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Taping Specifications

Reel Specification

Reel and Taping Specification

TYPE 3216

SIZE

A

B

C

D

W

M

7" 5K/Reel 2.0±0.5 13.5±1.0 21±1.0 60±1.0 11.5±2.0 178±2.0

Tapping Specification

Packaging Paper Type

Type 3216

A

B

W

E

F

1.90±0.20 3.50±0.20 8.0±0.20 1.75±0.10 3.5±0.05

G 4.0±0.10

H 2.0±0.05

T

D

+0.10

0.75±0.10 1.50

-0

P 4.0±0.1

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Reliability Table

Test Item Electrical Characterization Thermal Shock
Temperature Cycling
High Temperature Exposure
Low Temperature Storage
Solderability (SMD Bottom Side)
Soldering Heat Resistance (RSH)
Vibration
Mechanical Shock

Procedure
1. Preconditioning: 50 ± 10 / 1 hr , then keep for 24 ± 1 hrs at room temp.
2. Initial measure: Spec: refer Initial spec. 3. Rapid change of temperature test:
-30 to +85; 100 cycles; 15 minutes at Lower category temperature; 15 minutes at Upper category temperature.

Requirements Ceramic Type
Fulfill the electrical s pecification
No Visible Damage. Fulfill the electrical s pecification.

1. Initial measure: Spec: refer Initial spec. 2. 100 Cycles (-30 to +85), Soak Mode=1 (2 Cycle/hours). 3. Measurement at 24 ± 2Hours after test condition.
1. Initial measure: Spec: refer Initial spec. 2. Unpowered; 500hours @ T=+85. 3. Measurement at 24 ± 2 hours after test.
1. Initial measure: Spec: refer Initial spec. 2. Unpowered: 500hours @ T= -30. 3. Measurement at 24 ± 2 hours after test.
Dipping method: a. Temperature: 235 ± 5°C b. Dipping time: 3 ± 0.5s
Preheating temperature: 150 ± 10°C. Preheating time: 1~2 min. Solder temperature: 260 ± 5°C. Dipping time: 5 ± 0.5s
5g's for 20 min., 12 cycles each of 3 orientations Note: Use 8"X5" PCB .031" thick 7 secure points on, one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz.
Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks) Peak value: 1,500g's Duration: 0.5ms Velocity change: 15.4 ft/s Waveform: Half-sine

No Visible Damage. Fulfill the electrical s pecification. No Visible Damage. Fulfill the electrical s pecification. No Visible Damage. Fulfill the electrical s pecification. The solder should cover over 95% of the critical area of bottom side. No Visible Damage.
No Visible Damage.
No Visible Damage.

Remark (Reference) User Spec. MIL-STD-202 107
JESD22 JA104
MIL-STD-202 108
MIL-STD-202 108
IEC 60384-21/22 4.10
IEC 60384-21/22 4.10
MIL-STD-202 Method 204
MIL-STD-202 Method 213

Humidity Bias

1. Humidity: 85% R.H., Temperature: 85 ± 2 °C. 2. Time: 500 ± 24 hours. 3. Measurement at 24 ± 2hrs after test condition.

No Visible Damage. Fulfill the electrical s pecification.

MIL-STD-202 Method 106

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Board Flex (SMD)

1. Mounting method: IR-Reflow. PCB Size (L:100 × W:40 × T:1.6mm)
2. Apply the load in direction of the arrow until bending reaches 2 mm.

No Visible Damage.

AEC-Q200 005

Adhesion

Force of 1.8Kg for 60 seconds.

No Visible Damage Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body terminals and body/terminal junction.

AEC-Q200 006

Physical Dimension

Any applicable method using x10 magnification, micrometers, calipers, gauges, contour projectors, or other measuring equipment, capable of determining the actual specimen dimensions.

In accordance with s pecification.

JESD22 JB100

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