HP ProDesk 400 G9 s PC´s
HP EliteDesk 705 G1 Series Business
QuickSpec; Worldwide; c08017709, DA-16998; Asteroids, Jenga; Mahjong; Mahjong 480; Boggle
HP Development Company
HP ProDesk 400 G9 s PC´s
28 juin 2022 — Pull-up webcam (optional). 6. Power button. 2. Combo Audio Jack with CTIA and OMTP headset support. 7. Power activity light. 3. Speakers (optional).
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HP ProOne 440 G9 (23.8", Intel Core i7 12400T, 16 GB, 512 GB SSD, Intel UHD Graphics 770) - Interdiscount
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Document DEVICE REPORT46219c89e2f09db04b88932bd18acea77ba4QuickSpecs Overview HP Pro Series 400 G9 Desktops PCs HP Pro Mini 400 G9 Desktop PC 1. Type-C® SuperSpeed USB 20Gbps signaling rate port (charge support up to 5V/3A) 4. Combo Audio Jack with CTIA and headset support 5. Dual-state power button 2. Type-A SuperSpeed USB 10Gbps signaling rate port 6. Hard drive activity light 3. Type-A SuperSpeed USB 10Gbps signaling rate port (charge support up to 5V/1.5A) Not Shown (2) M.2 (1 as M.2 2230 socket for WLAN/BT and 1 as M.2 2280 socket for storage) (1) 2.5" internal storage drive bay Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 1 QuickSpecs Overview HP Pro Series 400 G9 Desktops PCs HP Pro Mini 400 G9 Desktop PC 1. 2x Dual Mode DisplayPortTM 1.4a(DP++) 7. Type-A SuperSpeed USB 10Gbps signaling rate port 2. HDMI 2.1 8. Flex Port 22, choice of: 3. 2x Type-A SuperSpeed USB 5Gbps signaling rate port (Supporting wake from S4/S5 with keyboard/mouse connected and enabled in BIOS) 4. Cover release thumbscrew · 2x Type-A Hi-Speed USB 480Mbps signaling rate port · Serial · 2nd External Antenna 9. RJ45 network connector 5. Standard cable lock slot (10 mm) 10. External WLAN antenna opening2 6. Flex Port 1, choice of: 11. Power connector · DisplayPortTM1.4a with HBR3 · HDMI 2.0a · VGA · Serial1 12. Retractable Padlock loop · Type-C® SuperSpeed USB 10Gbps signaling rate port w/ DisplayPortTM Alt Mode and power intake via USB Type-C® Power Delivery up to 100W 1. Sold separately or as an optional feature. 2. Must be configured at time of purchase. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 2 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) HP Pro SFF 400 G9 Desktop PC 1. Slim optical drive (optional) 2. (1) Type-C® SuperSpeed USB 10Gbps signaling rate port 3. (1) Type-A SuperSpeed USB 10Gbps signaling rate port 4. (2) Type-A SuperSpeed USB 10Gbps signaling rate port 5. SD card 4.0 reader (optional) 6. Combo Audio Jack with CTIA and OMTP and headset support 7. Dual-state power button 8. Hard drive activity light Not Shown (1) PCI Express x16 (1) PCI Express x1 (2) M.2 (1 as M.2 2230 socket for WLAN/BT/storage1 and 1 as M.2 2280 socket for storage) 1. Must be configured at time of purchase. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 3 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) HP Pro SFF 400 G9 Desktop PC 1. Audio line-out connector 2. Dual-Mode DisplayPortTM 1.4a (DP++) 3. Serial Port (Optional) 4. HDMI 1.4 5. Flex Port, choice of: · DisplayPortTM1.4 · VGA · HDMI 2.1 · Serial · Dual Type-A SuperSpeed USB 5Gbps signaling rate · Type-C® SuperSpeed USB 10Gbps signaling rate with DisplayPortTM Alt mode 6. RJ45 network connector 7. (2) Type-A Hi-Speed USB 480Mbps signaling rate port (Supporting wake from S4/S5 with keyboard/mouse connected and enabled in BIOS) 8. (3) Type-A SuperSpeed USB 5Gbps signaling rate port 9. Internal WLAN antenna cover (optional) 10. Standard cable lock slot 11. HP Business PC Security Lock slot 12. Integrated accessory cable lock 13. Power cord connector Not Shown Port Optional PS/2 (2 ports) & serial port card1 (connected with mainboard via flyer cable) Optional parallel port1 Optional 4 Serial Port PCIe Card1 (1 to 4 serial port dongle) 1. Each of the legacy options will occupy one rear slot. Bay (1) 9.5mm internal optical drive bay (1) 3.5" internal storage drive bay Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 4 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) HP Pro Tower 400/480 G9 PCI Desktop PC 1. Slim optical drive (optional) 5. SD card 4.0 reader (optional)2 2. Hard drive activity light 6. (2) Type-A SuperSpeed USB 10Gbps signaling rate port 3. Dual-state power button 7. (1) Type-A SuperSpeed USB 10Gbps signaling rate port 4. Combo Audio Jack with CTIA and OMTP headset support 8. (1) Type-C® SuperSpeed USB 10Gbps signaling rate port Not Shown (1) PCI Express x16 (1) PCI Express x1 (1) PCI x1 (2) M.2 (1 as M.2 2230 socket for WLAN/BT/storage1 and 1 as M.2 2280 socket for storage) (1) Front Flex Port Dual SuperSpeed USB Type-A 5Gbps signaling rate2 1. Optional 2. SD card and front flex port can only select one at the same time Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 5 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) HP Pro Tower 400/480 G9 PCI Desktop PC 1. Audio line-out connector 2. Dual-Mode DisplayPortTM 1.4a (DP++) 3. HDMI 1.4 4. Flex Port, choice of: · DisplayPortTM1.4 · HDMI 2.1 · VGA · Serial · Dual Type-A SuperSpeed USB 5Gbps signaling rate · Type-C® SuperSpeed USB 10Gbps signaling rate with DisplayPortTM Alt mode) 5. (2) Type-A Hi-Speed USB 480Mbps signaling rate (Supporting wake from S4/S5 with keyboard/mouse connected and enabled in BIOS) 6. (3) Type-A SuperSpeed USB 5Gbps signaling rate port 7. Internal WLAN antenna cover (optional) 8. HP Business PC Security Lock slot 9. RJ45 network connector 10. Serial port (optional) 11. Integrated keyboard/mouse wire hoop 12. Pad lock 13. Power cord connector 14. Standard cable lock slot Not Shown Port Optional PS/2 (2 ports) & serial port card (connected with mainboard via flyer cable) 1 Optional parallel port1 Optional 4 Serial Port PCIe Card1 (1 to 4 serial port dongle) 1. Each of the legacy options will occupy one rear slot Bay (1) 9.5mm internal optical drive bay (2) 3.5" internal storage drive bay Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 6 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) HP ProOne 440 23.8 inch G9 All-in-One Desktop PC (Touch/Non-Touch) 1. Pull-up webcam (optional) 2. Combo Audio Jack with CTIA and OMTP headset support 3. Speakers (optional) 4. SD media card reader (optional) 5. On-screen display (OSD) buttons 6. Power button 7. Power activity light 8. Type-C® SuperSpeed USB 10Gbps signaling rate port (charge support up to 5V/3A) 9. Type-A SuperSpeed USB 10Gbps signaling rate port (charge support up to 5V/1.5A) 5MP webcam (optional) 5MP webcam with Infrared (IR) sensors (optional) 5MP webcam with Infrared (IR) / Color Light Sensor (optional) 1. Dual microphones 2. Webcam light 3. 5MP webcam 1. Dual microphones 2. Webcam light 3. IR/5MP webcam 4. IR light 1. Dual microphones 2. Webcam light 3. IR/5MP/CLS webcam 4. IR light Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 7 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) HP ProOne 440 23.8 inch G9 All-in-One Desktop PC (Touch & Non-Touch) 1. Pull-up webcam (optional) 2. Optical disc drive (optional) 3. Standard cable lock slot 4. Flex Port, choice of: · DisplayPortTM · Serial · HDMI 2.0a · Type-C 5. HDMI-in 1. Availability may vary by country 6. (2) Type-A SuperSpeed USB 5Gbps signaling rate port (Supporting wake in from S4/S5 with keyboard/mouse connected and enabled BIOS) 7. Dual-Mode DisplayPortTM 1.4 (DP++) 8. RJ45 network connector 9. (2) Type-A SuperSpeed USB 5Gbps signaling rate port 10. Power connector Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 8 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) AT A GLANCE · Choice of four form factors: Tower, Small Form Factor, Mini Desktop and All-in-One. · HP developed and engineered UEFI V2.7 BIOS supporting security, manageability and software image stability. · Latest commercial class Intel Q670 chipsets supporting latest Intel® 12th Generation CoreTM processors, featuring integrated Intel® UHD Graphics. o Intel Standard Manageability (ISM) comes standard for Intel® CoreTM and PentiumTM configurations. o Optional Intel® vProTM Technology upgrade with selected CoreTM i5 and CoreTM i7 processors (vProTM is optional and requires factory configuration). · Processors support up to 65W for TWR/SFF/AiO and up to 35W for Mini Desktop. · Choice of Windows 11 Professional, Windows 11 Home, and FreeDOS. · Integrated 10/100/1000 Ethernet Controller, with optional Wi-Fi 6E, Wi-Fi 6 (802.11ax) and Wi-Fi 5 (802.11ac) and Bluetooth®. · Up to 64GB of DDR4 Synchronous Dynamic Random Access Memory (SDRAM). · Support for up to three video outputs via three standard video connectors and an optional third video port connector which provides the following choices: DisplayPortTM, HDMI, VGA, or USB Type-C® with DisplayPortTM Output on TWR/SFF/Mini. · Power consumption of Desktop Mini PC varies per configuration, for the best user experience, please connect PC power cord while using USB-C® cable via Super Speed USB Type-C® port in the rear side of the platform. · Reduce clutter on Mini Desktop with single cable connection for power and video through USB Type-C® enabled displays with the optional USB- Type-C® port w/ DisplayPort Alt Mode and power intake via USB Type-C® Power Delivery up to 100W; reduce desktop footprint with the DM mounted behind a USB-CTM enabled display. · New flexibility is delivered by the All-in-One that can be used as a full PC or as an additional display for another desktop or laptop PC via the new HDMI-in functionality. · Monitor Mode disassociates Panel from CPU for a true monitor experience. · Optional Serial port available on all form factors. · Multiple HDD data drives set up in a SATA RAID array for TWR/SFF and support RAID 1 configured from factory. · M.2 raid array available on AiO. · Integrated accessory cable lock helps secure cabled mouse and keyboard on TWR/SFF. · Trusted Platform Module (TPM) 2.0. · HP BIOSphere Gen6. · HP Client Security Manager Gen6. · HP Sure Click. · HP Manageability Integration Kit Gen4. · HP Image Assistant Gen5. · HP Support Assistant. · High efficiency energy saving power supply. · ENERGY STAR® certified. EPEAT® registered where applicable. · TUV Low Blue Light certified for All-in-One. · Low halogen. · All form factors undergo MIL-STD tests.1 · Dust filter available for TWR/SFF/Mini Desktop. · Protected by HP Services, including limited warranty up to 1-1-1 (terms and conditions vary by country; certain restrictions and exclusions apply); Care Packs available with up to 5 years Next Business Day Onsite Hardware Support. · Compliance with CE (Class B) / FCC (Class B) / UL / UL62368-1) / CSA ( / CSA C22.2 No. 62368-1) / ICES-003 / CCC / VCCI (Class B) / KCC (Class B). 1. MIL-STD testing is not intended to demonstrate fitness for U.S. Department of Defense contract requirements or for military use. Test results are not a guarantee of future performance under these test conditions. Accidental damage requires an optional HP Accidental Damage Protection Care Pack. NOTE: See important legal disclosures for all listed specs in their respective features sections. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 9 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) PRODUCT NAME HP Pro Mini 400 G9 Desktop PC HP Pro SFF 400 G9 Desktop PC HP Pro Tower 400 G9 PCI Desktop PC HP Pro Tower 480 G9 PCI Desktop PC HP ProOne 440 23.8 inch G9 All-in-One Desktop PC OPERATING SYSTEM Preinstalled Windows 11 Pro1 Windows 11 Pro Education1 Windows 11 Home - HP recommends Windows 11 Pro for business1 Windows 11 Home Single Language - HP recommends Windows 11 Pro for business1 Windows 11 Pro (Windows 11 Enterprise available with a Volume Licensing Agreement)1 Windows 10 Pro (available through downgrade rights from Windows 11 Pro)1,3 FreeDOS 1. Device comes with Windows 10 and a free Windows 11 upgrade or may be preloaded with Windows 11. Upgrade timing may vary by device. Features and app availability may vary by region. Certain features require specific hardware (see Windows 11 Specifications). 2. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows is automatically updated and enabled. High speed interneet and Microsoft account required. ISP fees apply and additional requirements may apply over time for updates. See http://www.windows.com. 3. This system is preinstalled with Windows 10 Pro software and also comes with a license for Windows 11 Pro software and provision for recovery software. You may only use one version of the Windows software at a time. Switching between versions will require you to uninstall one version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and installing operating systems to avoid loss of your data. CHIPSET Intel® Q670 Mini SFF TWR AiO X X X X Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 10 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) PROCESSORS Intel® 12th Generation CoreTM Processors Mini SFF TWR AiO Intel® CoreTM i7-12700 Processor1 65W 2.1 GHz base frequency Up to 4.9 GHz max. turbo frequency with Intel® Turbo Boost Technology2 25 MB cache, 12 cores, 20 threads Intel® UHD Graphics 770 Supports DDR4 memory up to 3200 MT/s data rate Supports Intel® vProTM Technology and Intel® Stable Image Platform Program (SIPP)3 X X X* Intel® CoreTM i7-12700T Processor1 35W 1.4 GHz base frequency Up to 4.7 GHz max. turbo frequency with Intel® Turbo Boost Technology 3.02 25 MB cache, 12 cores, 20 threads X X Intel® UHD Graphics 770 Supports DDR4 memory up to 3200 MT/s data rate Supports Intel® vProTM Technology and Intel® Stable Image Platform Program (SIPP)3 Intel® CoreTM i5-12600 Processor1 65W 3.3 GHz base frequency Up to 4.8 GHz max. turbo frequency with Intel® Turbo Boost Technology2 18 MB cache, 6 cores, 12 threads Intel® UHD Graphics 770 Supports DDR4 memory up to 3200 MT/s data rate Supports Intel® vProTM Technology and Intel® Stable Image Platform Program (SIPP)3 X X X Intel® CoreTM i5-12600T Processor1 35W 2.1 GHz base frequency Up to 4.6 GHz max. turbo frequency with Single P-core turbo Technology 18 MB cache, 6 cores, 12 threads X X Intel® UHD Graphics 770 Supports DDR4 memory up to 3200 MT/s data rate Supports Intel® vProTM Technology and Intel® Stable Image Platform Program (SIPP)3 NOTE*: Only available with discrete graphics card. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 11 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Mini SFF TWR AiO Intel® CoreTM i5-12500 Processor1 65W 3.0 GHz base frequency Up to 4.6 GHz max. turbo frequency with Intel® Turbo Boost Technology2 18 MB cache, 6 cores, 12 threads Intel® UHD Graphics 770 Supports DDR4 memory up to 3200 MT/s data rate Supports Intel® vProTM Technology and Intel® Stable Image Platform Program (SIPP)3 X X X Intel® CoreTM i5-12500T Processor1 35W 2.0 GHz base frequency Up to 4.4 GHz max. turbo frequency with Single P-core Turbo Technology18 MB cache, 6 cores, 12 threads Intel® UHD Graphics 770 X X Supports DDR4 memory up to 3200 MT/s data rate Supports Intel® vProTM Technology and Intel® Stable Image Platform Program (SIPP)3 Intel® CoreTM i5-12400 Processor1 65W 2.5 GHz base frequency Up to 4.4 GHz max. turbo frequency with Intel® Turbo Boost Technology2 18 MB cache, 6 cores, 12 threads Intel® UHD Graphics 730 Supports DDR4 memory up to 3200 MT/s data rate X X X Intel® CoreTM i5-12400T Processor1 35W 1.8 GHz base frequency Up to 4.2 GHz max. turbo frequency with Single P-core Turbo Technology X X 18 MB cache, 6 cores, 12 threads Intel® UHD Graphics 730 Supports DDR4 memory up to 3200 MT/s data rate Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 12 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Intel® CoreTM i3-12300 Processor1 60W 3.5 GHz base frequency Up to 4.4 GHz max. turbo frequency with Single P-Core technology 12 MB cache, 4 cores, 8 threads Intel® UHD Graphics 730 Supports DDR4 memory up to 3200 MT/s data rate Mini SFF TWR AiO X X X Intel® CoreTM i3-12300T Processor1 35W 2.3 GHz base frequency Up to 4.2 GHz max. turbo frequency with Single P-Core technology X X 12 MB cache, 4 cores, 8 threads Intel® UHD Graphics 730 Supports DDR4 memory up to 3200 MT/s data rate Intel® CoreTM i3-12100 Processor1 60W 3.3 GHz base frequency Up to 4.3 GHz max. turbo frequency with Intel® Turbo Boost Technology2 12 MB cache, 4 cores, 8 threads Intel® UHD Graphics 730 Supports DDR4 memory up to 3200 MT/s data rate X X X Intel® CoreTM i3-12100T Processor1 35W 2.2 GHz base frequency Up to 4.1 GHz max. turbo frequency with Single P-core Technology12 MB cache, 4 cores, 8 threads X X Intel® UHD Graphics 730 Supports DDR4 memory up to 3200 MT/s data rate Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 13 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Intel® Pentium® Processors (For FY22 Mini 400, need to add Pentium/ Celeron 35W CPU) Mini SFF TWR AiO Intel® Pentium® Gold G-7400 Processor1 46W 3.7 GHz base frequency 6 MB cache, 2 cores, 4 threads Intel® UHD Graphics 710 Supports DDR4 memory up to 3200 MT/s data rate X X X Intel® Pentium® Gold G-7400T Processor1 35W 3.1 GHz base frequency 6 MB cache, 2 cores, 4 threads X X Intel® UHD Graphics 710 Supports DDR4 memory up to 3200 MT/s data rate Intel® Celeron® 6900 Processor1 46W 3.4 GHz base frequency 4 MB cache, 2 cores, 2 threads Intel® UHD Graphics 710 Supports DDR4 memory up to 3200 MT/s data rate X X Intel® Celeron® 6900T Processor1 35W 2.8 GHz base frequency 4 MB cache, 2 cores, 2 threads X X Intel® UHD Graphics 710 Supports DDR4 memory up to 3200 MT/s data rate 1. Multi-core is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. Intel's numbering, branding and/or naming is not a measurement of higher performance. 2. Intel® Turbo Boost technology requires a PC with a processor with Intel Turbo Boost capability. Intel Turbo Boost performance varies depending on hardware, software and overall system configuration. See www.intel.com/technology/turboboost for more information. 3. For full Intel® vProTM functionality, Windows, a vPro supported processor, vPro enabled chipset, vPro enabled WLAN card and discrete TPM 2.0 are required. See https://www.intel.com/content/www/us/en/architecture-and-technology/vpro/vpro-platform-general.html. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 14 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) GRAPHICS Integrated Graphics Mini SFF TWR AiO Intel® UHD Graphics 770 (integrated on 12th gen Core i7, Core i5-12500 and Core i5-12500T) X X X X Intel® UHD Graphics 730 (integrated on Core i3/i5-12400, i5-12400T) X X X X Intel® UHD Graphics 710 (integrated on Pentium® Gold and Celeron®) X X X X Optional Discrete Graphics Solutions NVIDIA T400 2GB LP PCIe x16 Blower Fan 3 mini DP Graphics NVIDIA® T400 4GB Graphics Card AMD RadeonTM 6300M with 2 GB GDDR6 Graphics X X X X X Adapters and Cables HP DisplayPortTM Cable HP DisplayPortTM to DVI-D Adapter HP DisplayPortTM to HDMI True 4K Adapter HP DisplayPortTM to VGA Adapter HP USB to Serial Port Adapter STORAGE 3.5 inch SATA Hard Disk Drives (HDD) 500GB* 7200RPM 3.5in SATA HDD 1TB* 7200RPM 3.5in SATA HDD 2TB* 7200RPM 3.5in SATA HDD X X X X X X X X X X X X X X X X X X X X Mini SFF TWR AiO X X X X X X 2.5 inch SATA Hard Disk Drives (HDD) 500GB* 7200RPM 2.5in SATA HDD X X 1TB* 7200RPM 2.5in SATA HDD X X 1TB* 5400RPM 2.5in SATA HDD X X 2TB* 5400RPM 2.5in SATA HDD X X 500GB 7200RPM 2.5in Self Encrypted OPAL2 SATA HDD** X X M.2 PCIe NMVe Solid State Drives (SSD) 256GB* M.2 2280 PCIe NVMe SSD X 512GB* M.2 2280 PCIe NVMe SSD X 1TB M*.2 2280 PCIe NVMe SSD X 256GB* M.2 2280 PCIe NVMe Three Layer Cell SSD X 512GB* M.2 2280 PCIe NVMe Three Layer Cell SSD X 1TB* M.2 2280 PCIe NVMe Three Layer Cell SSD X 2TB* M.2 2280 PCIe NVMe Three Layer Cell SSD X 256GB* M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD** X X X X X X X X X X X X X X X X X X X X X X X X Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 15 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) 512GB* M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD** X X X X * For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows) of system disk is reserved for the system recovery software **Storage DriveLock does not work with Self Encrypting or Optane based storage Optical Disc Drives HP 9.5mm Slim DVD-ROM Drive1 HP 9.5mm Slim DVD Writer Drive2 HP 9.5mm Slim Blu-Ray Writer Drive3 Mini SFF TWR AiO X X X X X X X X X 1. HD-DVD disks cannot be played on this drive. No support for DVD-RAM. Actual speeds may vary. Don't copy copyright-protected materials. Double Layer discs can store more data than single layer discs. Discs burned with this drive may not be compatible with many existing single-layer DVD drives and players. 2. Don't copy copyright-protected materials. 3. With Blu-Ray, certain disc, digital connection, compatibility and/or performance issues may arise, and do not constitute defects in the product. Flawless playback on all systems is not guaranteed. In order for some Blu-ray titles to play, they may require a DVI or HDMI digital connection and your display may require HDCP support. HD-DVD movies cannot be played on this Desktop PC. Media Card Reader Mini SFF TWR AiO SD 4.0 with 5-in-1 Interface (Supports SD, SDXC, SDHC, UHS-I, UHS-II) X X SD 3.0 with 4-in-1 Interface (Supports SD, SDXC, SDHC, UHS-I) X MEMORY Mini SFF TWR AiO DDR4-3200 (Transfer rates up to 3200 MT/s), Max 64 GB, 2 SO-DIMM X X DDR4-3200 (Transfer rates up to 3200 MT/s), Max 64 GB, 2 U-DIMM X X Memory Configuration 4GB (4GB x 1) 8GB (4GB x 2) 8GB (8GB x 1) 16GB (8GB x 2) 16GB (16GB x 1) 32GB (16GB x 2) 32GB (32GB x 1) 64GB (32GB x 2) X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X NOTE: For systems configured with more than 3GB of memory and a 32-bit operating system, all memory may not be available due to system resource requirements. Addressing memory above 4GB requires a 64-bit operating system. NOTE: Memory modules support data transfer rates up to 3200 MT/s respectively depending on memory module used; actual data rate is determined by the system's configured processor. See processor specifications for supported memory data rate. NOTE: All memory slots are customer accessible / upgradeable. NOTE: Memory speed 3200 MT/s can be achieved via two UDIMMs per channel (2DPC) when populated with the same part number. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 16 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) NETWORKING/COMMUNICATIONS Ethernet (RJ-45) Intel® I219-LM 1 Gigabit Network Connection LOM (vPro) Intel® Ethernet I225-T1 GbE NIC Wireless Intel® Wi-Fi 6E1 AX211 802.11ax 2x2 with Bluetooth® M.2 Combo Card vProTM2 Intel® Wi-Fi 6E1 AX211 802.11ax 2x2 with Bluetooth® M.2 Combo Card non-vProTM2 Realtek Wi-Fi61 RTL8852BE 802.11ax 2x2 with Bluetooth® M.2 Combo Card Realtek RTL8821CE 802.11ac3 1x1 with Bluetooth® M.2 Combo Card Mini SFF TWR AiO X X X X X X X X X X X X X X X X X X X 1. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 6 (802.11ax) is backwards compatible with prior 802.11 specs. 2. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless router, sold separately, that supports 80MHz and higher channels. 3. Wireless access point and internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 (802.11 ac) is backwards compatible with prior 802.11 specs. NOTE: Intel Wi-Fi 6E modules are available on Elite Tower and SFF G9, but the 6GHz band is not available. KEYBOARDS AND POINTING DEVICES Keyboards HP Business Slim PS/2 Wired Keyboard HP Wired Desktop 320K Keyboard HP USB Business Slim Wired SmartCard CCID Keyboard HP 125 Wired Keyboard HP 125 AntiMicrobial Wired Keyboard (China Only) Mini SFF TWR AiO X X X X X X X X X X X X X X X X X X Keyboard & Mouse Combo HP 655 Wireless Keyboard and Mouse Combo X X X X Mouse HP PS/2 Mouse HP Wired Desktop 320M Mouse HP 125 Wired Mouse HP 125 Wired Antimicrobial Mouse (China Only) HP 128 Wired Laser Mouse NOTE: Availability may vary by country X X X X X X X X X X X X X X X X X X Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 17 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) SECURITY Mini SFF TWR AiO TPM 2.0 (FW: 15.21) endpoint security controller (Infineon SLB9672) shipped with Windows 10. Common Criteria EAL4+ Certified. FIPS 140-2 X X X X Level 2 Certified. Intrusion Sensor (Optional) X X Intrusion Sensor (integrated in the system board, can be enabled/disabled through BIOS) X X Support for chassis cable lock devices X (10 mm barrel or X X X smaller) Support for chassis padlocks devices X X X Support for table lock X SATA port disablement (via BIOS) X X X X Serial, USB enable/disable (via BIOS) X X X X Intel® Identify Protection Technology (IPT)1 X X X X Removable media write/boot control X X X X Power-on password (via BIOS) X X X X Setup password (via BIOS) X X X X 1. Models configured with Intel® CoreTM processors have the ability to utilize advanced security protection for online transactions. IPT, used in conjunction with participating web sites, provides double identity authentication by adding a hardware component in addition to the usual user name and password. IPT is initialized through an HP Client Security module Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 18 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) PORTS Internal Slots and Ports M.2 PCIe PCI Express v4.0 x1 PCI Express v4.0 x16 PCI x1 SATA port Integrated SATA storage connector Mini SFF TWR AiO (1) M.2 PCIe x1 2230 (1) M.2 PCIe x1 (1) M.2 PCIe x1 (1) M.2 PCIe x1 (for WLAN/BT) 2230 (for 2230 (for 2230 (for WLAN) (1) M.2 PCIe x4 2280 WLAN/BT/storage1) WLAN/BT/storage1) (1) M.2 PCIe x4 (for storage) (1) M.2 PCIe x4 (1) M.2 PCIe x4 2280 (for storage) 2280 (for storage) 2280 (for storage) (1) M.2 PCIe x3 2280 (for storage) 1 1 1 1 1 3 3 1 1 NOTE: For Desktop Mini with M.2 Storage config, there will be no SATA drive bracket. If you plan to use or upgrade the storage with any 2.5" SATA drive, please select a DM SATA Drive Bracket (available as both factory configured and after market option). 1. Optional. Bays Mini 9.5mm Slim Optical Disc Drive (ODD) SD Card Reader1 (optional) 2.5" Internal Storage Drive 1 3.5" Internal Storage Drive SFF TWR AiO 1 1 11 1 1 1 1 1 2 1. Must be configured at time of purchase 2. Need to be configured at the time of purchase, either SATA or the ODD can only be selected one at the same time. Standard User Accessible Ports Mini SFF TWR AiO Type-A Hi-Speed USB 480Mbps signaling rate port 2 (rear) 2 (rear) Type-A SuperSpeed USB 5Gbps signaling rate port 2 (rear) 3 (rear) 3 (rear) 2 (rear) Type-A SuperSpeed USB 10Gbps signaling rate port 2 (front) 1 (rear) 3 (front) 3 (front) 2 (rear) 1 (side) Type-C® SuperSpeed USB 10Gbps signaling rate port 1 (front) 1 (front) 1 (side) Type-C® SuperSpeed USB 20Gbps signaling rate port 1 (front) Video 2 DisplayPortTM 1 DisplayPortTM 1.4 (rear) 1.4 (rear) 1 HDMI 2.1 1 HDMI 1.4 (rear) (rear) 1 DisplayPortTM 1.4 (rear) 1 HDMI 1.4 (rear) 1 DisplayPortTM 1.4 (rear) Audio 1 Combo Audio Jack with CTIA and headset support (front) 1 Combo Audio Jack with CTIA & OMTP and headset support (front) 1 Audio Lineout/Line-in (rear) 1 Combo Audio Jack with CTIA & OMTP and headset support (front) 1 Audio Lineout/Line-in (rear) 1 Combo Audio Jack with CTIA and OMTP headset support (side) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 19 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Network Interface 1 RJ45 (rear) 1 RJ45 (rear) 1 RJ45 (rear) 1 RJ45 (rear) 1. Upgradeable to SuperSpeed USB 10Gbps signaling rate port if configured with additional digital video port via Flex Port 1 and/or Intel® vProTM Rear Configurable Non-PCIe/PCI Slot User Accessible Ports Flexible Port 1, choice of one of the following: Mini SFF TWR AiO Type-A USB 2 Type-A SuperSpeed 2 Type-A SuperSpeed USB USB 5Gbps signaling 5Gbps signaling rate port rate port (rear) Type-C® USB 1 SuperSpeed USB 10Gbps signaling rate port w/ DisplayPortTM Alt Mode and power intake via USB Type-C® Power Delivery up to 100W 1 SuperSpeed USB 10Gbps signaling rate port w/ DisplayPortTM Alt Mode 1 SuperSpeed USB 10Gbps signaling rate port w/ DisplayPortTM Alt Mode 1 SuperSpeed USB 10Gbps signaling rate port w/ DisplayPortTM Alt Mode Video 1 DisplayPortTM 1.4 or 1 DisplayPortTM 1.4 or 1 DisplayPortTM 1.4 or 1 DisplayPortTM 1.4 or HDMI 2.1 or VGA HDMI 2.1 or VGA HDMI 2.1 or VGA HDMI 2.0a or USB-C Serial (RS-232) 11 1 1 1 1. Sold separately or as an optional feature (1) Flexible Port 2, choice of one of the following: Type-A USB Serial (RS-232) 2nd External antenna Mini 2 Hi-Speed USB 480Mbps signaling rate port1 11 11 SFF TWR AiO 2 Type-A SuperSpeed USB 5Gbps signaling rate port2 (front) 1. Must be configured at time of purchase 2. Front flex IO Dual USB port and SD card reader can only select one at the same time. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 20 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) USB SPECIFICATION AND MARKETING NAME MAPPING TABLE Marketing Name Hi-Speed USB 480Mbps signaling rate SuperSpeed USB 5Gbps signaling rate SuperSpeed USB 10Gbps signaling rate SuperSpeed USB 20Gbps signaling rate Technical Terminology USB 2.0 USB 3.2 Gen 1 USB 3.2 Gen 2 USB 3.2 Gen 2x2 Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 21 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS Software HP Easy Clean1 HP QuickDrop2 HP PC Hardware Diagnostics UEFI HP Desktop Support Utilities HP Privacy Settings HP Setup Integrated OOBE HP Support Assistant3 Touchpoint Customizer for Commercial myHP HP Notifications HP Connection Optimizer HP Smart Support4 Buy Microsoft Office (sold separately) Manageability Features HP Connect for Microsoft Endpoint Manager5 HP Image Assistant Gen5 (download) HP Manageability Integration Kit (download)6 HP Client Management Script Library (download) HP Patch Assistant (download)7 HP Driver Packs (download) HP Cloud Recovery8 HP Client Catalog (download) Security Management HP Wolf Security for Business9: HP Sure Click10 HP Sure Sense11 HP Sure Start Gen712 HP Tamper Lock HP Sure Admin13 BIOS HP BIOSphere Gen614 HP Secure Erase15 HP DriveLock & Automatic DriveLock BIOS Update via Network Absolute Persistence Module16 TPM 2.017 Embedded Security Chip (Common Criteria EAL4+ Certified) (FIPS 140-2 Level 2 Certified) 1. HP Easy Clean requires Windows 10 RS3 and will disable the keyboard, touchscreen, and clickpad only. Ports are not disabled. See user guide for cleaning instructions. 2. HP Quick Drop requires Internet access and Windows 10 or higher PC preinstalled with HP QuickDrop app and either an Android device (phone or tablet) running Android 7 or higher with the Android HP QuickDrop app, and /or an iOS device (phone or tablet) running iOS 12 or higher with the iOS HP QuickDrop app. 3. HP Support Assistant requires Windows and Internet Access 4. HP Smart Support automatically collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data and health insights and is available preinstalled on select products, or it can be downloaded. For more information about how to enable HP Smart Support or to download, please visit http://www.hp.com/smart-support. 5. HP Connect for Microsoft Endpoint Manager is available from the Azure Market Place for HP Pro, Elite, Z and Point-of-Sale PCs managed with Microsoft Endpoint Manager. Subscription to Microsoft Endpoint Manager required and sold separately. Network connection required. 6. HP Manageability Integration Kit can be downloaded from http://www.hp.com/go/clientmanagement. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 22 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) 7. HP Patch Assistant available on select HP PCs with the HP Manageability Kit that are managed through Microsoft System Center Configuration Manager. HP Manageability Integration Kit can be downloaded from http://www8.hp.com/us/en/ads/clientmanagement/overview.html. 8. HP Cloud Recovery is available for Z by HP, HP Elite and Pro desktops and laptops PCs with Intel® or AMD processors and requires an open, wired network connection. Note: You must back up important files, data, photos, videos, etc. before use to avoid loss of data. Detail, please refer to: https://support.hp.com/us-en/document/c05115630. 9. HP Wolf Security for Business requires Windows 10 or higher, includes various HP security features and is available on HP Pro, Elite, RPOS and Workstation products. See product details for included security features and OS requirement. 10. HP Sure Click requires Windows 10 Pro or higher or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details. 11. HP Sure Sense is available on select HP PCs with Windows 10 Pro, Windows 10 Enterprise, Windows 11 Pro, or Windows 11 Enterprise OS. 12. HP Sure Start Gen7 is available on select HP PCs and requires Windows 10 and higher 13. HP Sure Admin requires Windows 10 or higher, HP BIOS, HP Manageability Integration Kit from http://www.hp.com/go/clientmanagement and HP Sure Admin Local Access Authenticator smartphone app from the Android or Apple store. 14. HP BIOSphere Gen6 features may vary depending on the platform and configuration. 15. HP Secure Erase for the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 "Clear" sanitation method. HP Secure Erase does not support platforms with Intel® OptaneTM. 16. Absolute firmware module is shipped turned off and can only be activated with the purchase a license subscription and full activation of the software agent. License subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability outside the U.S. Certain conditions apply. For full details visit: http://www.absolute.com/about/legal/agreements/absolute. 17. In some scenarios, machines pre-configured with Windows OS or FreeDOS might ship with TPM turned off. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 23 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) UNIT ENVIRONMENT AND OPERATING CONDITIONS General Unit Operating Guidelines · Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range. · Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow. · Never restrict airflow into the computer by blocking any vents or air intakes. · Do not stack computers on top of each other or place computers so near each other that they are subject to each other's re-circulated or preheated air. · Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow. · If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply. Temperature Range Relative Humidity Maximum Altitude (unpressurized) Operating: 5° to 35° C1 Non-Operating for AiO: -20° to 60° C1 Non-Operating for MT/SFF/DM: -30° to 60° C1 Operating: 5% to 90% (non-condensing at ambient) Non-operating: 5% to 90% (non-condensing at ambient) Operating: 5000m Non-operating: 50000ft (15240 m) 1. Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 24 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) ENVIRONMENTAL & INDUSTRY HP Pro Mini 400 G9 Desktop PC Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may be & declarations labeled with one or more of these marks: · IT ECO declaration · US ENERGY STAR® · US Federal Energy Management Program (FEMP) · EPEAT Gold registered in the United States. See http://www.epeat.net for registration status in your country. · TCO Certified · China Energy Conservation Program (CECP) · China State Environmental Protection Administration (SEPA) · Taiwan Green Mark · Korea Eco-label · Japan PC Green label · Commission Regulation (EC) No 617/2013 (ErP Lot 3) System Configuration Energy Consumption (in accordance with US ENERGY STAR® test method) Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Heat Dissipation* Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Typically Configured Idle The configuration used for the Energy Consumption and Declared Noise Emissions data for the Desktop model is based on a Typically Configured Desktop. 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz 7.23 W 7.31 W 7.07 W 2.16 W 2.24 W 2.01 W 2.14 W 0.62 W 2.21 W 0.7 W 1.99 W 0.47 W NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are certified with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system. 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz 24.7 BTU/hr 25 BTU/hr 24.2 BTU/hr 7.4 BTU/hr 7.7 BTU/hr 6.9 BTU/hr 7.3 BTU/hr 2.1 BTU/hr 7.6 BTU/hr 2.41 BTU/hr 6.8 BTU/hr 1.6 BTU/hr NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour. Sound Power (LWAd, bels) Sound Pressure (LpAm, decibels) 2.7 16 Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 25 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Fixed Disk Random writes Longevity and upgrading 2.7 16 This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include: · 2 SODIMM memory slots · Interchangeable M.2 PCIe NVME SSD & 2.5" SATA HDD Batteries Spare parts are available throughout the warranty period and or for up to "5" years after the end of production. This battery(s) in this product comply with EU Directive 2006/66/EC Batteries used in the product do not contain: Mercury greater than 1ppm by weight Cadmium greater than 20ppm by weight Additional Information Battery size: CR2032 (coin cell) Battery type: Lithium · This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive 2011/65/EC. · This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC. · This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986). · Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043. · This product contains a minimum of 35% post-consumer recycled (PCR) plastic (by wt.); including 10% ITE-derived post-consumer recycled plastic.* · This product is 95.1% recycle-able when properly disposed of at end of life. Packaging Materials (vary by country) Material Usage *Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard. External: PAPER/Paper 562g Internal: PAPER/Molded Pulp 79g PLASTIC/Polyethylene low density - LDPE 16g This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf): · Asbestos · Certain Azo Colorants · Certain Brominated Flame Retardants may not be used as flame retardants in plastics · Cadmium · Chlorinated Hydrocarbons · Chlorinated Paraffins · Formaldehyde · Halogenated Diphenyl Methanes · Lead carbonates and sulfates · Lead and Lead compounds · Mercuric Oxide Batteries · Nickel finishes must not be used on the external surface designed to be frequently handled or carried by the user. · Ozone Depleting Substances · Polybrominated Biphenyls (PBBs) · Polybrominated Biphenyl Ethers (PBBEs) · Polybrominated Biphenyl Oxides (PBBOs) · Polychlorinated Biphenyl (PCB) · Polychlorinated Terphenyls (PCT) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 26 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Packaging Usage End-of-life Management and Recycling · Polyvinyl Chloride (PVC) except for wires and cables, and certain retail packaging has been voluntarily removed from most applications. · Radioactive Substances · Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO) HP follows these guidelines to decrease the environmental impact of product packaging: · Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. · Eliminate the use of ozone-depleting substances (ODS) in packaging materials. · Design packaging materials for ease of disassembly. · Maximize the use of post-consumer recycled content materials in packaging materials. · Use readily recyclable packaging materials such as paper and corrugated materials. · Reduce size and weight of packages to improve transportation fuel efficiency. · Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards. HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment. Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html Eco-label certifications http://www8.hp.com/us/en/hp-information/environment/ecolabels.html ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_ Certificate.pdf and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 27 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) HP Pro SFF 400 G9 Desktop PC Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may be & declarations labeled with one or more of these marks: · IT ECO declaration · US ENERGY STAR® · US Federal Energy Management Program (FEMP) · EPEAT Gold registered in the United States. See http://www.epeat.net for registration status in your country. · TCO Certified · China Energy Conservation Program (CECP) · China State Environmental Protection Administration (SEPA) · Taiwan Green Mark · Korea Eco-label · Japan PC Green label · Commission Regulation (EC) No 617/2013 (ErP Lot 3) System Configuration Energy Consumption (in accordance with US ENERGY STAR® test method) Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Heat Dissipation* Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Typically Configured Idle The configuration used for the Energy Consumption and Declared Noise Emissions data for the Desktop model is based on a Typically Configured Desktop. 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz 12.1240 W 12.1460 W 12.0990 W 10.3820 W 10.4110 W 10.3460 W 0.9410 W 0.7770 W 0.9380 W 0.7750 W 0.9420 W 0.7750 W NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are certified with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system. 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz 41.3428 W 41.4179 W 41.2576 W 35.4026 W 35.5015 W 35.2799 W 3.2088 W 2.6496 W 3.1986 W 2.6428 W 3.2122 W 2.6428 W NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour. Sound Power (LWAd, bels) Sound Pressure (LpAm, decibels) 3.3 23 Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 28 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Fixed Disk Random writes Longevity and Upgrading 3.4 24.1 This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include: · 2 DIMM memory slots · Interchangeable M.2 PCIe NVME SSD & 2.5"/3.5" SATA HDD Batteries Spare parts are available throughout the warranty period and or for up to "5" years after the end of production. This battery(s) in this product comply with EU Directive 2006/66/EC Batteries used in the product do not contain: Mercury greater than 1ppm by weight Cadmium greater than 20ppm by weight Additional Information Battery size: CR2032 (coin cell) Battery type: Lithium · This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive 2011/65/EC. · This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC. · This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986). · Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043. · This product contains a minimum of 35% post-consumer recycled (PCR) plastic (by wt.); including 10% ITE-derived post-consumer recycled plastic.* · This product is 95.1% recycle-able when properly disposed of at end of life. Packaging Materials (vary by country) Material Usage *Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard. External: PAPER/Corrugated 1019g Internal: PAPER/Molded pulp 434g PLASTIC/Polyethylene low density 29g This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf): · Asbestos · Certain Azo Colorants · Certain Brominated Flame Retardants may not be used as flame retardants in plastics · Cadmium · Chlorinated Hydrocarbons · Chlorinated Paraffins · Formaldehyde · Halogenated Diphenyl Methanes · Lead carbonates and sulfates · Lead and Lead compounds · Mercuric Oxide Batteries · Nickel finishes must not be used on the external surface designed to be frequently handled or carried by the user. · Ozone Depleting Substances · Polybrominated Biphenyls (PBBs) · Polybrominated Biphenyl Ethers (PBBEs) · Polybrominated Biphenyl Oxides (PBBOs) · Polychlorinated Biphenyl (PCB) · Polychlorinated Terphenyls (PCT) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 29 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Packaging Usage End-of-life Management and Recycling · Polyvinyl Chloride (PVC) except for wires and cables, and certain retail packaging has been voluntarily removed from most applications. · Radioactive Substances · Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO) HP follows these guidelines to decrease the environmental impact of product packaging: · Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. · Eliminate the use of ozone-depleting substances (ODS) in packaging materials. · Design packaging materials for ease of disassembly. · Maximize the use of post-consumer recycled content materials in packaging materials. · Use readily recyclable packaging materials such as paper and corrugated materials. · Reduce size and weight of packages to improve transportation fuel efficiency. · Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards. HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. HP Inc. Corporate Environmental Information The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment. For more information about HP's commitment to the environment: Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html Eco-label certifications http://www8.hp.com/us/en/hp-information/environment/ecolabels.html ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_ Certificate.pdf and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 30 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) HP Pro Tower 400 G9 PCI Desktop PC Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may be & declarations labeled with one or more of these marks: · IT ECO declaration · US ENERGY STAR® · US Federal Energy Management Program (FEMP) · EPEAT Gold registered in the United States. See http://www.epeat.net for registration status in your country. · TCO Certified · China Energy Conservation Program (CECP) · China State Environmental Protection Administration (SEPA) · Taiwan Green Mark · Korea Eco-label · Japan PC Green label · Commission Regulation (EC) No 617/2013 (ErP Lot 3) System Configuration Energy Consumption (in accordance with US ENERGY STAR® test method) Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Heat Dissipation* Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Typically Configured Idle Fixed Disk Random writes The configuration used for the Energy Consumption and Declared Noise Emissions data for the Desktop model is based on a Typically Configured Desktop. 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz 12.6930 W 12.6980 W 12.6900 W 10.9580 W 10.9770 W 10.9590 W 0.9940 W 0.8030 W 0.9940 W 0.8020 W 0.9890 W 0.7990 W NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are certified with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system. 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz 43.2831 W 43.3002 W 43.2729 W 37.3668 W 37.4316 W 37.3702 W 3.3895 W 2.7382 W 3.3895 W 2.7348 W 3.3725 W 2.7246 W NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour. Sound Power (LWAd, bels) Sound Pressure (LpAm, decibels) 3.1 21 3.2 22 Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 31 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include: · 2 DIMM memory slots · Interchangeable M.2 PCIe NVME SSD & 2.5"/3.5" SATA HDD Batteries Spare parts are available throughout the warranty period and or for up to "5" years after the end of production. This battery(s) in this product comply with EU Directive 2006/66/EC Batteries used in the product do not contain: Mercury greater than 1ppm by weight Cadmium greater than 20ppm by weight Additional Information Packaging Materials (vary by country) Material Usage Battery size: CR2032 (coin cell) Battery type: Lithium · This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive 2011/65/EC. · This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC. · This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986). · This product is in compliance with the IEEE 1680.1 (EPEAT) standard at the <Gold> level, see www.epeat.net · Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043. · This product contains 44.4% post-consumer recycled plastic (by wt.) · This product is 95.0% recycle-able when properly disposed of at end of life. External: PAPER/Corrugated 1110 g PAPER/Molded Pulp 654 g Internal: PLASTIC/Polyethylene low density - LDPE 32 g This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf): · Asbestos · Certain Azo Colorants · Certain Brominated Flame Retardants may not be used as flame retardants in plastics · Cadmium · Chlorinated Hydrocarbons · Chlorinated Paraffins · Formaldehyde · Halogenated Diphenyl Methanes · Lead carbonates and sulfates · Lead and Lead compounds · Mercuric Oxide Batteries · Nickel finishes must not be used on the external surface designed to be frequently handled or carried by the user. · Ozone Depleting Substances · Polybrominated Biphenyls (PBBs) · Polybrominated Biphenyl Ethers (PBBEs) · Polybrominated Biphenyl Oxides (PBBOs) · Polychlorinated Biphenyl (PCB) · Polychlorinated Terphenyls (PCT) · Polyvinyl Chloride (PVC) except for wires and cables, and certain retail packaging has been voluntarily removed from most applications. · Radioactive Substances Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 32 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Packaging Usage End-of-life Management and Recycling · Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO) HP follows these guidelines to decrease the environmental impact of product packaging: · Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. · Eliminate the use of ozone-depleting substances (ODS) in packaging materials. · Design packaging materials for ease of disassembly. · Maximize the use of post-consumer recycled content materials in packaging materials. · Use readily recyclable packaging materials such as paper and corrugated materials. · Reduce size and weight of packages to improve transportation fuel efficiency. · Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards. HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. HP Inc. Corporate Environmental Information The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment. For more information about HP's commitment to the environment: Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html Eco-label certifications http://www8.hp.com/us/en/hp-information/environment/ecolabels.html ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_ Certificate.pdf and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 33 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) HP Pro Tower 480 G9 PCI Desktop PC Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may be & declarations labeled with one or more of these marks: · IT ECO declaration · US ENERGY STAR® · US Federal Energy Management Program (FEMP) · EPEAT Gold registered in the United States. See http://www.epeat.net for registration status in your country. · TCO Certified · China Energy Conservation Program (CECP) · China State Environmental Protection Administration (SEPA) · Taiwan Green Mark · Korea Eco-label · Japan PC Green label · Commission Regulation (EC) No 617/2013 (ErP Lot 3) System Configuration Energy Consumption (in accordance with US ENERGY STAR® test method) Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Heat Dissipation* Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Typically Configured Idle Fixed Disk Random writes The configuration used for the Energy Consumption and Declared Noise Emissions data for the Desktop model is based on a Typically Configured Desktop. 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are certified with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system. 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour. Sound Power (LWAd, bels) Sound Pressure (LpAm, decibels) Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 34 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Longevity and upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include: · 2 DIMM memory slots · Interchangeable M.2 PCIe NVME SSD & 2.5"/3.5" SATA HDD Batteries Spare parts are available throughout the warranty period and or for up to "5" years after the end of production. This battery(s) in this product comply with EU Directive 2006/66/EC Batteries used in the product do not contain: Mercury greater than 1ppm by weight Cadmium greater than 20ppm by weight Additional Information Packaging Materials (vary by country) Material Usage Battery size: CR2032 (coin cell) Battery type: Lithium · This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive 2011/65/EC. · This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC. · This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986). · This product is in compliance with the IEEE 1680.1 (EPEAT) standard at the <Gold> level, see www.epeat.net · Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043. · This product contains 44.4% post-consumer recycled plastic (by wt.) · This product is 95.0% recycle-able when properly disposed of at end of life. External: PAPER/Corrugated 1110 g PAPER/Molded Pulp 654 20 g Internal: PLASTIC/Polyethylene low density - LDPE 32 g This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf): · Asbestos · Certain Azo Colorants · Certain Brominated Flame Retardants may not be used as flame retardants in plastics · Cadmium · Chlorinated Hydrocarbons · Chlorinated Paraffins · Formaldehyde · Halogenated Diphenyl Methanes · Lead carbonates and sulfates · Lead and Lead compounds · Mercuric Oxide Batteries · Nickel finishes must not be used on the external surface designed to be frequently handled or carried by the user. · Ozone Depleting Substances · Polybrominated Biphenyls (PBBs) · Polybrominated Biphenyl Ethers (PBBEs) · Polybrominated Biphenyl Oxides (PBBOs) · Polychlorinated Biphenyl (PCB) · Polychlorinated Terphenyls (PCT) · Polyvinyl Chloride (PVC) except for wires and cables, and certain retail packaging has been voluntarily removed from most applications. · Radioactive Substances Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 35 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Packaging Usage End-of-life Management and Recycling · Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO) HP follows these guidelines to decrease the environmental impact of product packaging: · Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. · Eliminate the use of ozone-depleting substances (ODS) in packaging materials. · Design packaging materials for ease of disassembly. · Maximize the use of post-consumer recycled content materials in packaging materials. · Use readily recyclable packaging materials such as paper and corrugated materials. · Reduce size and weight of packages to improve transportation fuel efficiency. · Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards. HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. HP Inc. Corporate Environmental Information The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment. For more information about HP's commitment to the environment: Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html Eco-label certifications http://www8.hp.com/us/en/hp-information/environment/ecolabels.html ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_ Certificate.pdf and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 36 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) HP ProOne 440 23.8 inch G9 All-in-One Desktop PC Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may be & declarations labeled with one or more of these marks: · IT ECO declaration · US ENERGY STAR® · US Federal Energy Management Program (FEMP) · EPEAT Gold registered in the United States. See http://www.epeat.net for registration status in your country. · TCO Certified · China Energy Conservation Program (CECP) · China State Environmental Protection Administration (SEPA) · Taiwan Green Mark · Korea Eco-label · Japan PC Green label · Commission Regulation (EC) No 617/2013 (ErP Lot 3) System Configuration Energy Consumption (in accordance with US ENERGY STAR® test method) Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Heat Dissipation* Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Typically Configured Idle Fixed Disk Random writes The configuration used for the Energy Consumption and Declared Noise Emissions data for the Desktop model is based on a "Typically Configured Desktop". 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz 14.4900 W 14.5100 W 14.4700 W 1.5300 W 1.5300 W 1.5100 W 1.5100 W 0.8900 W 1.5100 W 0.8900 W 1.5100 W 0.8900 W NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are certified with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system. 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz 49.6 BTU/hr 49.6 BTU/hr 49.5 BTU/hr 5.2 BTU/hr 5.2 BTU/hr 5.2 BTU/hr 5.2 BTU/hr 3 BTU/hr 5.2 BTU/hr 3 BTU/hr 5.2 BTU/hr 3 BTU/hr NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour. Sound Power (LWAd, bels) Sound Pressure (LpAm, decibels) 2.8 15 2.8 15 Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 37 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Optical Drive Sequential reads Longevity and Upgrading 4.7 36.0 This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include: · 2 SODIMM memory slots · Interchangeable 2.5" SATA HDD Batteries Spare parts are available throughout the warranty period and or for up to "5" years after the end of production. This battery(s) in this product comply with EU Directive 2006/66/EC Batteries used in the product do not contain: Mercury greater than 1ppm by weight Cadmium greater than 20ppm by weight Additional Information Battery size: CR2032 (coin cell) Battery type: Lithium · This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive 2011/65/EC. · This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC. · This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986). · Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043. · This product contains a minimum of 50% post-consumer recycled (PCR) plastic (by wt.); including 10% ITE-derived post-consumer recycled plastic.* · This product is 95.1% recycle-able when properly disposed of at end of life. Packaging Materials (vary by country) Material Usage *Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard. External: PAPER/Corrugated 1605 g Internal: PLASTIC/Polyethylene Expanded - EPE 683 g PLASTIC/Polyethylene low density - LDPE 42 g This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf): · Asbestos · Certain Azo Colorants · Certain Brominated Flame Retardants may not be used as flame retardants in plastics · Cadmium · Chlorinated Hydrocarbons · Chlorinated Paraffins · Formaldehyde · Halogenated Diphenyl Methanes · Lead carbonates and sulfates · Lead and Lead compounds · Mercuric Oxide Batteries · Nickel finishes must not be used on the external surface designed to be frequently handled or carried by the user. · Ozone Depleting Substances · Polybrominated Biphenyls (PBBs) · Polybrominated Biphenyl Ethers (PBBEs) · Polybrominated Biphenyl Oxides (PBBOs) · Polychlorinated Biphenyl (PCB) · Polychlorinated Terphenyls (PCT) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 38 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) Packaging Usage · Polyvinyl Chloride (PVC) except for wires and cables, and certain retail packaging has been voluntarily removed from most applications. · Radioactive Substances · Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO) HP follows these guidelines to decrease the environmental impact of product packaging: · Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. · Eliminate the use of ozone-depleting substances (ODS) in packaging materials. · Design packaging materials for ease of disassembly. · Maximize the use of post-consumer recycled content materials in packaging materials. · Use readily recyclable packaging materials such as paper and corrugated materials. · Reduce size and weight of packages to improve transportation fuel efficiency. · Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards. End-of-life Management and Recycling HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment. Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html Eco-label certifications http://www8.hp.com/us/en/hp-information/environment/ecolabels.html ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_ Certificate.pdf and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 39 QuickSpecs HP Pro Series 400 G9 Desktops PCs Standard Features and Configurable Components (availability may vary by country) SERVICE AND SUPPORT On-site Warranty1: One-year (1-1-1) limited warranty delivers one year of on-site, next business day2 service for parts and labor support. Service offers terms up to 5 years by choosing an optional HP Care Pack. To choose the right level of service for your HP product, visit HP Care Pack Central: http://www.hp.com/go/cpc.3 1. Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may be offered in your region. 2. On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider and is not available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country. 3. Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit www.hp.com/go/cpc. HP services are governed by the applicable HP terms and conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided with your HP Product. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 40 QuickSpecs Technical Specifications - Processors HP Pro Series 400 G9 Desktops PCs PROCESSORS 12th Generation Intel® 12th Generation CoreTM Processors1 All HP ProDesk & ProOne 400 Business PC models featuring this technology include processors that are part of the Intel® Stable Image Platform Program (SIPP) designed to ensure the stability promise inherent in the value proposition of the HP ProDesk and ProOne 400 Business PC. Intel® Advanced Management Technology (AMT)1 v16 An advanced set of remote management features and functionality which provides network administrators the latest and most effective tools to remotely discover, heal, and protect networked client systems regardless of the system's health or power state. AMT 16 includes the following advanced management functions: · Support for configuration of Intel AMT 16.0 capabilities · No reset after provisioning · Support for Intel Enterprise Digital Fence · The Platform Discovery Utility can now discover these additional Intel products: o Intel Identity Protection Technology with One Time Password o Public Key Infrastructure o Multi Factor Authentication · Profile Editor and Profile Editor Plugin Interface · Required Permissions for Solutions Framework 1. Intel® Active Management Technology requires an Intel® AMT-enabled chipset, network hardware and software, as well as connection with a power source and a corporate network connection. Setup requires configuration by the purchaser and may require scripting with the management console or further integration into existing security frameworks to enable certain functionality. It may also require modifications of implementation of new business processes. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 41 QuickSpecs Technical Specifications - Display Panel Specifications HP Pro Series 400 G9 Desktops PCs DISPLAY PANEL SPECIFICATIONS NOTE: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance may vary either higher or lower. HP ProOne 440 23.8 inch G9 All-in-One Desktop PC 23.8" diagonal IPS widescreen WLED backlit anti-glare LCD (1920 x 1080) Projected Capacitive Touch supports up to 10 touch-points Support HW low blue light feature Type IPS WLED Backlit LCD Active area (mm) 527.04 x 296.46 Native Resolution (HxV) 1920 x 1080 Refresh Rate 60 Hz @ 1920 x 1080 Aspect ratio 16:9 Pixel pitch (HxV)(mm) 0.2745 x 0.2745 Contrast ratio 1000:1 Brightness* 300nits* Viewing angle (HxV) 178° x 178° Backlight lamp life (to half brightness) 30,000 hours minimum Color support Up to 16.7 million colors with 8 Bit(6 Bit + FRC) Color gamut sRGB 99% Anti-glare Yes Response Time 14ms Default color temperature Warm (6500K) *Actual brightness will be lower with touchscreen 23.8" diagonal IPS widescreen WLED backlit anti-glare LCD (1920 x 1080) non-touch Support HW low blue light feature Type IPS WLED Backlit LCD Active area (mm) 527.04 x 296.46 Native Resolution (HxV) 1920 x 1080 Refresh Rate 60 Hz @ 1920 x 1080 Aspect ratio 16:9 Pixel pitch (HxV)(mm) 0.2745 x 0.2745 Contrast ratio 1000:1 Brightness* 250nits* Viewing angle (HxV) 178° x 178° Backlight lamp life (to half brightness) 30,000 hours minimum Color support Up to 16.7 million colors with 8 Bit(6 Bit + FRC) Color gamut NTSC 72% Anti-glare Yes Response Time 14ms Default color temperature Warm (6500K) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 42 QuickSpecs Technical Specifications - Display Panel Specifications *Actual brightness will be lower with touchscreen HP Pro Series 400 G9 Desktops PCs Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 43 QuickSpecs Technical Specifications - All-in-One Stand Specifications HP Pro Series 400 G9 Desktops PCs ALL-IN-ONE STAND SPECIFICATIONS HP ProOne 440 23.8 inch G9 All-in-One Desktop PC Cantilever Stand (Fixed Height Tilt Stand) Tilt Angle Rotation (Swivel) Pivot -5° to +20° None None Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 44 QuickSpecs Technical Specifications - All-in-One Stand Specifications Adjustable Height Stand Height Adjustment (Landscape Mode) Height Adjustment (Portrait Mode) Tilt Angle Rotation (Swivel) Pivot HP Pro Series 400 G9 Desktops PCs 5.12 in / 130mm N/A -5° to +20° ±45° None Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 45 QuickSpecs Technical Specifications - All-in-One Stand Specifications No Stand Tilt Angle (VESA COVER with EPS Holder) Rotation (Swivel) Pivot HP Pro Series 400 G9 Desktops PCs None None None Adjustable Height Stand Height Adjustment (Landscape Mode) Height Adjustment (Portrait Mode) Tilt Angle Rotation (Swivel) Pivot 5.12 in / 130mm N/A -5° to +20° ±45° None Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 46 QuickSpecs Technical Specifications Graphics HP Pro Series 400 G9 Desktops PCs GRAPHICS Intel® UHD Graphics (integrated) Graphics Controller Integrated DisplayPortTM Multimode capable; supports HDCP, Display Port Audio (2 streams), HBR2 link rates and MultiStream Technology for a maximum of 4 displays connected to any output controlled by Intel® Graphics HDMI Supports HDMI 2.0a features Supports HDCP 2.2 Supports audio over HDMI VGA VGA output USB-C® DP Alt Mode DisplayPortTM over the USB-C® module Memory The actual amount of maximum graphics memory can be >4GB. System memory is allocated for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide an optimal balance between graphics and system memory use. Maximum Color Depth up to 10 bits/color Graphics/Video API Support HEVC 10b Enc/Dec HW VP9 10b Dec HW HDR Rec. 2020 DX12 Max. Resolution (VGA) 2048 x 1536@60Hz Max. Resolution (HDMI) 4096 x 2160@60Hz Max. Resolution (DP) 4096 x 2160@60Hz AMD RadeonTM 6300M with 2 GB GDDR6 Graphics Memory 2 GB 64-bit wide frame buffer operating at 1125MHz. Controller Clock Speed AMD RadeonTM 6300M GPU operating at 1024 MHz Architecture Hybrid Graphics AMD GPU uses Intel graphics controller for display control Bus Connection PCIE 4.0 x4 Graphics /API support DIRECTX 12, Open GL 4.6, Open CL2.0, UVD, Mantle, AMD LiquidVRTM Display support Same as for the Intel integrated graphics solution NVIDIA® Quadro T400 2GB Graphics Card Engine Clock 2100 MHz Memory Clock 5001 MHz Memory Size (width) 2GB (64-bit) Memory Type 256M x 16 GDDR6 Max. Resolution (DP) 7680x4320@120Hz Multi Display Support 4 displays HDCP Compliance Yes Rear I/O connectors (bracket) mDPx3 Cooling (active/passive) Active fan-sink (Active cooling with dynamic speed) Total power consumption (W) 30W PCB form-factor with bracket LP PCB with LP bracket Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 47 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Graphics NVIDIA® T400 4GB Graphics Card Engine Clock 2100 MHz Memory Clock 5001 MHz Memory Size (width) 4GB (64-bit) Memory Type 512M x 16 GDDR6 Max. Resolution (DP) 7680x4320@120Hz Multi Display Support 4 displays HDCP Compliance Yes Rear I/O connectors (bracket) mDPx3 Cooling (active/passive) Active fan-sink (Active cooling with dynamic speed) Total power consumption (W) 30W PCB form-factor with bracket LP PCB with LP bracket Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 48 QuickSpecs Technical Specifications Storage HP Pro Series 400 G9 Desktops PCs STORAGE 500GB 7200RPM 3.5in SATA HDD Capacity 500GB Rotational Speed 7,200 rpm Interface SATA 6.0 Gb/s Buffer Size 32MB Logical Blocks 976,773,168 Seek Time 11 ms (Average) Height 1in/2.54cm Width Media diameter: 3.5 in/8.89 cm Physical size: 4 in/10.2 cm Operating Temperature 41° to 131° F (5° to 55° C) NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 1TB 7200RPM 3.5in SATA HDD Capacity 1TB Rotational Speed 7,200 rpm Interface SATA 6 Gb/s Buffer Size 64MB Logical Blocks 1,953,525,168 Seek Time 11 ms (Average) Height 1in/2.54cm Width (nominal) Media diameter: 3.5 in/8.89 cm Physical size: 4 in/10.2 cm Operating Temperature 41° to 131° F (5° to 55° C) NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 2TB 7200RPM 3.5in SATA HDD Capacity 2TB Rotational Speed 7,200 rpm Interface SATA 6 Gb/s Buffer Size 128MB Logical Blocks 3,907,050,336 Seek Time 11 ms (Average) Height 1.028in/26.11mm Width (nominal) Media diameter: 3.5 in/8.89 cm Physical size: 4 in/10.2 cm Operating Temperature 41° to 131° F (5° to 55° C) NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 49 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Storage 500GB 7200RPM 2.5in SATA HDD Capacity 500GB Rotational Speed 7,200 rpm Interface SATA 6 Gb/s Buffer Size Up to 128MB Logical Blocks 976,773,168 Seek Time 12 ms (Average) Height 0.283in/7.2mm (Max) Width (nominal) 2.75 in/70 mm (nominal) Operating Temperature 41° to 131° F (5° to 55° C) NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 1TB 7200RPM 2.5in SATA HDD Capacity 1TB Rotational Speed 7,200 rpm Interface SATA 6 Gb/s Buffer Size Up to 128MB Logical Blocks 1,953,525,168 Seek Time 12 ms (Average) Height 0.283 in/7.2 mm (Max) Width (nominal) 2.75 in/70 mm (nominal) Operating Temperature 41° to 131° F (5° to 55° C) NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 1TB 5400RPM 2.5in SATA HDD Capacity 1TB Rotational Speed 5,400 rpm Interface SATA 6 Gb/s Buffer Size Up to 128MB Logical Blocks 1,953,525,168 Seek Time 12ms (Average) Height 0.283in/7.2mm (Max.) Width (nominal) 2.75in/70mm (nominal) Operating Temperature 41° to 131° F (5° to 55° C) NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 50 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Storage 2TB 5400RPM 2.5in SATA HDD Capacity 2TB Rotational Speed 5,400 rpm Interface SATA 6 Gb/s Buffer Size 128MB Logical Blocks 3,907,050,336 Seek Time 12 ms (Average) Height 0.374in/9.5mm (nominal) Width (nominal) 2.75in/70mm (nominal) Operating Temperature 41° to 131° F (5° to 55° C) NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 500GB 7200RPM 2.5in Self Encrypted Federal Information Processing Standard SATA HDD Capacity 500GB Architecture Self-Encrypting (SED) Solid State Drive with SATA interface Interface SATA 6 Gb/s Buffer Size 128MB Logical Blocks 976,773,168 Seek Time 12 ms (Average) Height 0.283in/7.2mm (Max.) Width 2.75in/70mm (nominal) Operating Temperature 41° to 131° F (5° to 55° C) NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 256GB M.2 2280 PCIe NVMe SSD Drive Weight < 10g Capacity 256 GB Height 2.3 mm Length 80 mm Width 22 mm Interface PCIe NVMe Maximum Sequential Read 3200 MB/s ±20% Maximum Sequential Write 2000 MB/s ±20% Logical Blocks 500,118,192 Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp] Features TRIM; L1.2 NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 51 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Storage 512GB M.2 2280 PCIe NVMe SSD Drive Weight < 10g Capacity 512 GB Height 2.3 mm Length 80 mm Width 22 mm Interface PCIe NVMe Maximum Sequential Read 3200 MB/s ±20% Maximum Sequential Write 3200 MB/s ±20% Logical Blocks 1,000,215,216 Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp] Features TRIM; L1.2 NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 1TB M.2 2280 PCIe NVMe SSD Drive Weight < 10g Capacity 1 TB Height 2.3 mm Length 80 mm Width 22 mm Interface PCIe NVMe Maximum Sequential Read 3200 MB/s ±20% Maximum Sequential Write 3200 MB/s ±20% Logical Blocks 2,000,409,264 Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp] Features TRIM; L1.2 NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 256GB M.2 2280 PCIe NVMe Three Layer Cell SSD Drive Weight < 10g Capacity 256 GB Height 2.3 mm Length 80 mm Width 22 mm Interface PCIE Gen4x4 Maximum Sequential Read 4000 MB/s ±20% Maximum Sequential Write 2000 MB/s ±20% Logical Blocks 500,118,192 Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp] Features TRIM; L1.2; Pyrite 2.0 Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 52 QuickSpecs Technical Specifications Storage HP Pro Series 400 G9 Desktops PCs NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 512GB M.2 2280 PCIe NVMe Three Layer Cell SSD Drive Weight < 10g Capacity 512 GB Height 2.3 mm Length 80 mm Width 22 mm Interface PCIE Gen4x4 Maximum Sequential Read 6400 MB/s ±20% Maximum Sequential Write 3500 MB/s ±20% Logical Blocks 1,000,215,216 Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp] Features TRIM; L1.2; Pyrite 2.0 NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 1TB M.2 2280 PCIe NVMe Three Layer Cell SSD Drive Weight < 10g Capacity 1 TB Height 2.3 mm Length 80 mm Width 22 mm Interface PCIE Gen4x4 Maximum Sequential Read 6400 MB/s ±20% Maximum Sequential Write 5000 MB/s ±20% Logical Blocks 2,000,409,264 Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp] Features TRIM; L1.2; Pyrite 2.0 NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 2TB M.2 2280 PCIe NVMe Three Layer Cell SSD Drive Weight < 10g Capacity 2 TB Height 2.3 mm Length 80 mm Width 22 mm Interface PCIE Gen4x4 Maximum Sequential Read 6400 MB/s ±20% Maximum Sequential Write 5000 MB/s ±20% Logical Blocks 4,000,797,360 Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 53 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Storage Operating Temperature Features 0° to 70°C (32° to 158°F) [ambient temp] TRIM; L1.2; Pyrite 2.0 NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 256GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD Drive Weight < 10g Capacity 256 GB Height 2.3 mm Length 80 mm Width 22 mm Interface PCIE Gen4x4 Maximum Sequential Read 4000 MB/s ±20% Maximum Sequential Write 2000 MB/s ±20% Logical Blocks 500,118,192 Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp] Features TRIM; L1.2; TCG Opal 2.0 NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. 512GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD Drive Weight < 10g Capacity 512 GB Height 2.3 mm Length 80 mm Width 22 mm Interface PCIE Gen4x4 Maximum Sequential Read 6400 MB/s ±20% Maximum Sequential Write 3500 MB/s ±20% Logical Blocks 1,000,215,216 Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp] Features TRIM; L1.2; TCG Opal 2.0 NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for system recovery software. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 54 QuickSpecs Technical Specifications Storage HP Pro Series 400 G9 Desktops PCs HP 9.5mm Slim DVD-ROM Drive Height 9.5 mm height Orientation Either horizontal or vertical Interface type SATA/ATAPI Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel Weight (max) Up to 0.31 lb (140g) without bezel Read Speeds DVD+R/-R/+RW/ -RW/+R DL /-R DL Up to 8X DVD-ROM Up to 8X CD-ROM, CD-R Up to 24X CD-RW Up to 24X Access time (typical reads, including settling) Random: DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical) Full stroke: DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical) Power Source Slimline SATA DC power receptacle DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum) Temperature 41° to 122° F (5° to 50° C) Environmental conditions Relative Humidity 10% to 80% (operating - non-condensing) Maximum Wet Bulb Temperature 84° F (29° C) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 55 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Storage HP 9.5mm Slim DVD Writer Drive Height 9.5 mm height Orientation Either horizontal or vertical Interface type SATA/ATAPI Disc recording capacity Up to 8.5 GB DL or 4.7 GB standard Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel Weight (max) 0.31 lb (140 g) Without bezel Write Speeds DVD-R DL - Up to 6X DVD+R - Up to 8X DVD+RW - Up to 8X DVD+R DL - Up to 6X DVD-R - Up to 8X DVD-RW - Up to 6X CD-R - Up to 24X CD-RW - Up to 10X Read Speeds Access time (typical reads, including settling) Power Environmental conditions (operating - non-condensing) DVD-RW, DVD+RW - Up to 8X DVD-R DL, DVD+R DL - Up to 8X DVD+R, DVD-R - Up to 8X DVD-ROM DL, DVD-ROM - Up to 8X CD-ROM, CD-R - Up to 24X CD-RW - Up to 24X Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical) Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical) Stop Time 6 seconds (typical) Source Slimline SATA DC power receptacle DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum) Temperature 41° to 122° F (5° to 50° C) Relative Humidity 10% to 80% Maximum Wet Bulb Temperature 84° F (29° C) HP 9.5mm Slim Blu-Ray Writer Drive Height 9.5 mm height Orientation Either horizontal or vertical Interface type SATA/ATAPI Disc recording capacity Up to 128 GB QL, 100 GB TL, 50 GB DL or 25 GB standard SL Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel Weight (max) 0.29 lb (132 g) Write Speeds BD-R SL/DL Up to 6X BD-R TL/QL Up to 4X BD-RE Up to 2X DVD-R Up to 8X DVD-RW Up to 6X DVD+R Up to 8X DVD+RW Up to 8X DVD-RAM Up to 5X CD-R Up to 24X CD-RW Up to 10X Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 56 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Storage Read Speeds Access time (typical reads, including settling) Power Environmental conditions (operating - non-condensing) BD-ROM Up to 6X BD-R Up to 6X BD-RE SL/DL Up to 6X BD-RE TL Up to 4X DVD-ROM Up to 8X DVD-R Up to 8X DVD-RW Up to 8X DVD+R Up to 8X DVD+RW Up to 8X BDMV (AACS Compliant Disc) Up to 6x/2x (Read/Play) DVD-RAM Up to 5x DVD-Video (CSS Compliant Disc) Up to 8x/4x (Read/Play) CD-R/RW/ROM Up to 24x CD-DA (DAE) Up to 24X/10X (Read/Play) Random BD-ROM: 205 ms (typical), DVD-ROM: 185 ms (typical), CD-ROM: 165 ms (typical) Full Stroke BD-ROM: 350 ms (typical), DVD-ROM: 345 ms (typical), CD-ROM: 340 ms (typical) Source Slimline SATA DC power receptacle DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p DC Current 5 VDC -1200 mA typical, 2000 mA maximum Temperature 41° to 122° F (5° to 50° C) Relative Humidity 10% to 80% Maximum Wet Bulb Temperature 84° F (29° C) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 57 QuickSpecs Technical Specifications Networking HP Pro Series 400 G9 Desktops PCs NETWORKING AND COMMUNICATIONS Intel® I219v 1 Gigabit Network Connection LOM (non-vPro) Connector RJ-45 System Interface PCI (Intel proprietary) + SMBus Data rates supported IEEE Compliance Performance Power consumption Power Management Management Interface IT Manageability Security & Manageability 1. 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 2. 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 3. 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 802.3 clauses 40) 4. Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10, 100 & 1000 Mbit/s IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet) IEEE 802.3i 10BASE-T IEEE 802.3u 100BASE-TX IEEE 802.3ab 1000BAE-T IEEE 802.3bz 2.5GBASE-T TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling (Hash Mode only) Jumbo Frame 9K Cable Disconnection: 25mW 100Mbps Full Run: 450mW 1000bps Full Run: 1000mW WoL Enable(S3/S4/S5): 50mW WoL Disable(S3/S4/S5): 25mW ACPI compliant multiple power modes Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption Auto MDI/MDIX Crossover cable detection Wake-on-LAN from modern standby or sleep state (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status Intel® non-vProTM support with appropriate Intel® chipset components Intel® I219-LM 1 Gigabit Network Connection LOM (vPro) Connector RJ-45 System Interface PCI (Intel proprietary) + SMBus Data rates supported 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40) Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s IEEE Compliance IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 58 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Performance Power consumption Power Management Management Interface IT Manageability Security & Manageability TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling (Hash Mode Only) Jumbo Frame 9K Cable Disconnection: 25mW 100Mbps Full Run: 450mW 1000bp Full Run: 1000mW WoL Enable (S3/S4/S5): 50mW WoL Disable (S3/S4/S5): 25mW ACPI compliant multiple power modes Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption Auto MDI/MDIX Crossover cable detection Wake-on-LAN from modern standby or sleep state (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status Intel® vProTM support with appropriate Intel® chipset components Intel® I225-LM 2.5 Gigabit Network Connection LOM (non-vPro) Connector RJ-45 System Interface PCI (Intel proprietary) + SMBus Data rates supported 1. 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 2. 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 3. 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 802.3 clauses 40) 4. 2.5 Gbit/s operation (2.5GBASE-T; IEEE 802.3bz Clause 126) 5. Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10, 100 & 1000 Mbit/s IEEE Compliance IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet) IEEE 802.3i 10BASE-T IEEE 802.3u 100BASE-TX IEEE 802.3ab 1000BAE-T IEEE 802.3bz 2.5GBASE-T Performance TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling (Hash Mode Only) Jumbo Frame 9K Power consumption Cable Disconnection: 25mW 100Mbps Full Run: 450mW 1000bp Full Run: 1000mW WoL Enable (S3/S4/S5): 50mW WoL Disable (S3/S4/S5): 25mW Power ACPI compliant multiple power modes Management Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption Management Interface Auto MDI/MDIX Crossover cable detection Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 59 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking IT Manageability Security & Manageability Wake-on-LAN from modern standby or sleep state (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status Intel® non-vProTM support with appropriate Intel® chipset components Realtek 802.11a/b/g/n/ac (1x1) WiFi and Bluetooth® 4.2 Combo1 Wireless LAN Standards IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac IEEE 802.11d IEEE 802.11e IEEE 802.11h IEEE 802.11i IEEE 802.11k IEEE 802.11r IEEE 802.11v Interoperability Wi-Fi certified modules Frequency Band 802.11b/g/n · 2.402 2.482 GHz 802.11a/n/ac · 4.9 4.95 GHz (Japan) · 5.15 5.25 GHz · 5.25 5.35 GHz · 5.47 5.725 GHz · 5.825 5.850 GHz Data Rates · 802.11b: 1, 2, 5.5, 11 Mbps · 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps · 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps · 802.11n: max 150Mbps · 802.11ac: max 433.3Mbps Modulation Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM Security2 · IEEE and WiFi certified 64 / 128 bit WEP encryption for a/b/g mode only · AES-CCMP: 128 bit in hardware · 802.1x authentication · WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES. · WPA2 certification · WPA3 certification · IEEE 802.11i · WAPI Network Architecture Models Roaming Output Power3 Ad-hoc (Peer to Peer) Infrastructure (Access Point Required) IEEE 802.11 compliant roaming between access points · 802.11b: +14dBm minimum · 802.11g: +12dBm minimum Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 60 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Power Consumption · 802.11a: +12dBm minimum · 802.11n HT20(2.4GHz): +12dBm minimum · 802.11n HT40(2.4GHz): +12dBm minimum · 802.11n HT20(5GHz): +10dBm minimum · 802.11n HT40(5GHz): +10dBm minimum · 802.11ac VHT80(5GHz): +10dBm minimum · Transmit mode 2.0 W · Receive mode 1.6 W · Idle mode (PSP) 180 mW (WLAN Associated) · Idle mode 50 mW (WLAN unassociated) · Connected Standby 10mW · Radio disabled 8 mW Power Management Receiver Sensitivity4 Antenna type Form Factor Dimensions Weight Operating Voltage Temperature Humidity Altitude LED Activity ACPI and PCI Express compliant power management 802.11 compliant power saving mode 802.11b, 1Mbps: -93.5dBm maximum 802.11b, 11Mbps: -84dBm maximum 802.11a/g, 6Mbps: -86dBm maximum 802.11a/g, 54Mbps: -72dBm maximum 802.11n, MCS07: -67dBm maximum 802.11n, MCS15: -64dBm maximum 802.11ac, MCS0: -84dBm maximum 802.11ac, MCS9: -59dBm maximum High efficiency antenna. One embedded dual band 2.4/5 GHz antenna is provided to the card to support WLAN communications and Bluetooth communications PCI-Express M.2 MiniCard Type 2230: 2.3 x 22.0 x 30.0 mm Type 2230: 2.8g 3.3v +/- 9% Operating: 14° to 158° F (10° to 70° C) Non-operating: 40° to 176° F (40° to 80° C) Operating: 10% to 90% (non-condensing) Non-operating: 5% to 95% (non-condensing) Operating: 0 to 10,000 ft (3,048 m) Non-operating: 0 to 50,000 ft (15,240 m) LED Amber Radio OFF; LED OFF Radio ON HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology Bluetoothâ Specification Frequency Band Number of Available Channels Data Rates and Throughput 4.0/4.1/4.2 Compliant 2402 to 2480 MHz Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH) Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps BLE: 1 Mbps data rate; throughput up to 0.2 Mbps Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5) The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 4 dBm for BR and EDR. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 61 QuickSpecs Technical Specifications Networking Transmit Power Power Consumption Bluetooth® Software Supported Link Topology Power Management Certifications Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW USB 2.0 compliant Microsoft Windows Bluetooth Software Microsoft Windows ACPI, and USB Bus Support FCC (47 CFR) Part 15C, Section 15.247 & 15.249 4.0/4.1/4.2 Compliant HP Pro Series 400 G9 Desktops PCs Power Management ETS 300 328, ETS 300 826 Certifications Low Voltage Directive IEC950 Bluetooth Profiles Supported UL, CSA, and CE Mark BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 Link Layer Privacy LE Privacy 1.2 Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP) 1. Wi-Fi 5 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless router, sold separately, that supports 80MHz and higher channels. Wireless access point and internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 (802.11 ac) is backwards compatible with prior 802.11 specs. 3. Check latest software/driver release for updates on supported security features. 3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels. 4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation). Realtek RTL8852AE 802.11ax 2x2 Wi-Fi + BT5.2 (802.11ax 2x2, supporting gigabit data rate)1 Wireless LAN Standards IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac IEEE 802.11ax IEEE 802.11d IEEE 802.11e IEEE 802.11h Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 62 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Interoperability Frequency Band Data Rates Modulation Security2 Network Architecture Models Roaming Output Power3 Power Consumption Power Management Receiver Sensitivity4 IEEE 802.11i IEEE 802.11k IEEE 802.11r IEEE 802.11v Wi-Fi certified modules 802.11b/g/n/ax · 2.402 2.482 GHz 802.11a/n/ac/ax · 4.9 4.95 GHz (Japan) · 5.15 5.25 GHz · 5.25 5.35 GHz · 5.47 5.725 GHz · 5.825 5.850 GHz · 802.11b: 1, 2, 5.5, 11 Mbps · 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps · 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps · 802.11n: max 300Mbps · 802.11ac: max 866.7Mbps · 802.11ax: max 1201Mbps Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM · IEEE and WiFi certified 64 / 128 bit WEP encryption for a/b/g mode only · AES-CCMP: 128 bit in hardware · 802.1x authentication · WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES. · WPA2 certification · WPA3 certification · IEEE 802.11i · WAPI Ad-hoc (Peer to Peer) Infrastructure (Access Point Required) IEEE 802.11 compliant roaming between access points · 802.11b: +18.5dBm minimum · 802.11g: +17.5dBm minimum · 802.11a: +18.5dBm minimum · 802.11n HT20(2.4GHz): +15.5dBm minimum · 802.11n HT40(2.4GHz): +14.5dBm minimum · 802.11n HT20(5GHz): +15.5dBm minimum · 802.11n HT40(5GHz): +14.5dBm minimum · 802.11ac VHT80(5GHz): +11.5dBm minimum · 802.11ax HE40(2.4GHz): +10dBm minimum · 802.11ax HE80(5GHz): +10dBm minimum · Transmit mode:2.5 W · Receive mode:2 W · Idle mode (PSP): 180 mW (WLAN Associated) · Idle mode:50 mW (WLAN unassociated) · Connected Standby/Modern Standby: 10mW · Radio disabled: 8 mW ACPI and PCI Express compliant power management 802.11 compliant power saving mode 802.11b, 1Mbps: -93.5dBm maximum 802.11b, 11Mbps: -84dBm maximum 802.11a/g, 6Mbps: -86dBm maximum Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 63 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Antenna type 802.11a/g, 54Mbps: -72dBm maximum 802.11n, MCS07: -67dBm maximum 802.11n, MCS15: -64dBm maximum 802.11ac, MCS0: -84dBm maximum 802.11ac, MCS9: -59dBm maximum ·802.11ax, MCS11(HE40): -57dBm maximum ·802.11ax, MCS11(HE80): -54dBm maximum High efficiency antenna with spatial diversity, mounted in the display enclosure Form Factor Dimensions Weight Operating Voltage Temperature Humidity Altitude LED Activity Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications PCI-Express M.2 MiniCard 1. Type 2230: 2.3 x 22.0 x 30.0 mm 2. Type 1216: 1.67 x 12.0 x 16.0 mm 1. Type 2230: 2.8g 2. Type 126: 1.3g 3.3v +/- 9% Operating: 14° to 158° F (10° to 70° C) Non-operating: 40° to 176° F (40° to 80° C) Operating: 10% to 90% (non-condensing) Non-operating: 5% to 95% (non-condensing) Operating: 0 to 10,000 ft (3,048 m) Non-operating: 0 to 50,000 ft (15,240 m) LED Amber Radio OFF; LED OFF Radio ON HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Technology Bluetooth® Specification Frequency Band Number of Available Channels Data Rates and Throughput Transmit Power Power Consumption 4.0/4.1/4.2/5.0/5.1 Compliant/5.2 Compliant 2402 to 2480 MHz Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH) Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps BLE: 1 Mbps data rate; throughput up to 0.2 Mbps Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5) The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 4 dBm for BR and EDR. Peak (Tx): 330 mW Peak (Rx): 230 mW Selective Suspend: 17 mW Bluetooth® Software Supported Link Microsoft Windows Bluetooth Software Topology Power Management Microsoft Windows ACPI, and USB Bus Support Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249 Power Management Certifications ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 64 QuickSpecs Technical Specifications Networking HP Pro Series 400 G9 Desktops PCs Bluetooth Profiles Supported UL, CSA, and CE Mark BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 Link Layer Privacy LE Privacy 1.2 Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP) BT5.1 ESR9/10 Compliance LE Advertisement Extensions Channel Selection Algo Limited High Duty Cycle Non-Connectable Advertising 2Mbps LE LE Long Range 1. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless router, sold separately, that supports 80MHz and higher channels. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 6 (802.11ax) is backwards compatible with prior 802.11 specs. 2. Check latest software/driver release for updates on supported security features. 3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels. 4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation). Realtek RTL8852BE 802.11ax 2x2 Wi-Fi + BT5.2 (802.11ax 2x2, supporting gigabit data rate)1 Wireless LAN Standards IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac IEEE 802.11ax IEEE 802.11d IEEE 802.11e IEEE 802.11h IEEE 802.11i IEEE 802.11k IEEE 802.11r IEEE 802.11v Interoperability Wi-Fi certified modules Frequency Band 802.11b/g/n/ax · 2.402 2.482 GHz 802.11a/n/ac/ax · 4.9 4.95 GHz (Japan) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 65 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Data Rates Modulation Security2 Network Architecture Models Roaming Output Power3 Power Consumption Power Management Receiver Sensitivity4 Antenna type · 5.15 5.25 GHz · 5.25 5.35 GHz · 5.47 5.725 GHz · 5.825 5.850 GHz · 802.11b: 1, 2, 5.5, 11 Mbps · 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps · 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps · 802.11n: max 300Mbps · 802.11ac: max 866.7Mbps · 802.11ax: max 1201Mbps Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM · IEEE and WiFi certified 64 / 128 bit WEP encryption for a/b/g mode only · AES-CCMP: 128 bit in hardware · 802.1x authentication · WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES. · WPA2 certification · WPA3 certification · IEEE 802.11i · WAPI Ad-hoc (Peer to Peer) Infrastructure (Access Point Required) IEEE 802.11 compliant roaming between access points · 802.11b: +18.5dBm minimum · 802.11g: +17.5dBm minimum · 802.11a: +18.5dBm minimum · 802.11n HT20(2.4GHz): +15.5dBm minimum · 802.11n HT40(2.4GHz): +14.5dBm minimum · 802.11n HT20(5GHz): +15.5dBm minimum · 802.11n HT40(5GHz): +14.5dBm minimum · 802.11ac VHT80(5GHz): +11.5dBm minimum · 802.11ax HE40(2.4GHz): +10dBm minimum · 802.11ax HE80(5GHz): +10dBm minimum · Transmit mode:2.5 W · Receive mode:2 W · Idle mode (PSP): 180 mW (WLAN Associated) · Idle mode:50 mW (WLAN unassociated) · Connected Standby/Modern Standby: 10mW · Radio disabled: 8 mW ACPI and PCI Express compliant power management 802.11 compliant power saving mode 802.11b, 1Mbps: -93.5dBm maximum 802.11b, 11Mbps: -84dBm maximum 802.11a/g, 6Mbps: -86dBm maximum 802.11a/g, 54Mbps: -72dBm maximum 802.11n, MCS07: -67dBm maximum 802.11n, MCS15: -64dBm maximum 802.11ac, MCS0: -84dBm maximum 802.11ac, MCS9: -59dBm maximum ·802.11ax, MCS11(HE40): -57dBm maximum ·802.11ax, MCS11(HE80): -54dBm maximum High efficiency antenna with spatial diversity, mounted in the display enclosure Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 66 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Form Factor Dimensions Weight Operating Voltage Temperature Humidity Altitude LED Activity Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications PCI-Express M.2 MiniCard 1. Type 2230: 2.3 x 22.0 x 30.0 mm 2. Type 1216: 1.67 x 12.0 x 16.0 mm 1. Type 2230: 2.8g 2. Type 126: 1.3g 3.3v +/- 9% Operating: 14° to 158° F (10° to 70° C) Non-operating: 40° to 176° F (40° to 80° C) Operating: 10% to 90% (non-condensing) Non-operating: 5% to 95% (non-condensing) Operating: 0 to 10,000 ft (3,048 m) Non-operating: 0 to 50,000 ft (15,240 m) LED Amber Radio OFF; LED OFF Radio ON HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Technology Bluetoothâ Specification Frequency Band Number of Available Channels Data Rates and Throughput Transmit Power Power Consumption 4.0/4.1/4.2/5.0/5.1 Compliant/5.2 Compliant 2402 to 2480 MHz Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH) Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps BLE: 1 Mbps data rate; throughput up to 0.2 Mbps Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5) The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 4 dBm for BR and EDR. Peak (Tx): 330 mW Peak (Rx): 230 mW Electrical Interface Bluetooth® Software Supported Link Topology Power Management Certifications Selective Suspend: 17 mW Microsoft Windows Bluetooth Software Microsoft Windows ACPI, and USB Bus Support FCC (47 CFR) Part 15C, Section 15.247 & 15.249 ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark Peak (Tx): 330 mW Peak (Rx): 230 mW Power Management Selective Suspend: 17 mW Microsoft Windows Bluetooth Software Certifications Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 67 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Bluetooth Profiles Supported BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 Link Layer Privacy LE Privacy 1.2 Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP) BT5.1 ESR9/10 Compliance LE Advertisement Extensions Channel Selection Algo Limited High Duty Cycle Non-Connectable Advertising 2Mbps LE LE Long Range 1. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless router, sold separately, that supports 80MHz and higher channels. 2. Check latest software/driver release for updates on supported security features. 3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels. 4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation). Intel AX211 Wi-Fi 6E +BT 5.2 M.2 160MHz CNVi WW WLAN1 Wireless LAN Standards IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac IEEE 802.11ax IEEE 802.11d IEEE 802.11e IEEE 802.11h IEEE 802.11i IEEE 802.11k IEEE 802.11r IEEE 802.11v Interoperability Wi-Fi certified Frequency Band 802.11b/g/n/ax · 2.402 2.482 GHz 802.11a/n/ac/ax · 4.9 4.95 GHz (Japan) · 5.15 5.25 GHz · 5.25 5.35 GHz · 5.47 5.725 GHz Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 68 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Data Rates Modulation · 5.825 5.850 GHz · 5.955 6.415 GHz · 6.435 6.515 GHz · 6.535 6.875 GHz · 6.895 7.115 GHz · 802.11b: 1, 2, 5.5, 11 Mbps · 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps · 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps · 802.11n: max 300Mbps · 802.11ac: 1733Mbps · 802.11ax: max 2.4Gbps Direct Sequence Spread Spectrum Security2 Network Architecture Models Roaming Output Power3 Power Consumption OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM , 1024QAM · IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only · AES-CCMP: 128 bit in hardware · 802.1x authentication · WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES. · WPA2 certification · WPA3 certification · IEEE 802.11i · WAPI Ad-hoc (Peer to Peer) Infrastructure (Access Point Required) IEEE 802.11 compliant roaming between access points · 802.11b: +17dBm minimum · 802.11g: +16dBm minimum · 802.11a: +17dBm minimum · 802.11n HT20(2.4GHz): +14dBm minimum · 802.11n HT40(2.4GHz): +13dBm minimum · 802.11n HT20(5GHz): +14dBm minimum · 802.11n HT40(5GHz): +13dBm minimum · 802.11ac VHT80(5GHz): +10dBm minimum · 802.11ac VHT160(5GHz): +10dBm minimum · 802.11ax HE40(2.4GHz): +12dBm minimum · 802.11ax HE80(5GHz): +10dBm minimum · 802.11ax HE160(5GHz): +10dBm minimum · Transmit mode 2.0 W · Receive mode 1.6 W · Idle mode (PSP) 180 mW (WLAN Associated) · Idle mode 50 mW (WLAN unassociated) · Connected Standby 10mW Power Management Receiver Sensitivity4 · Radio disabled 8 mW ACPI and PCI Express compliant power management 802.11 compliant power saving mode ·802.11b, 1Mbps: -93.5dBm maximum ·802.11b, 11Mbps: -84dBm maximum Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 69 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Antenna type · 802.11a/g, 6Mbps: -86dBm maximum · 802.11a/g, 54Mbps: -72dBm maximum · 802.11n, MCS07: -67dBm maximum · 802.11n, MCS15: -64dBm maximum · 802.11ac, MCS0(VHT80): -84dBm maximum · 802.11ac, MCS9(VHT80): -59dBm maximum · 802.11ac, MCS9(VHT160): -58.5dBm maximum ·802.11ax, MCS11(HE40): -57dBm maximum ·802.11ax, MCS11(HE80): -54dBm maximum ·802.11ax, MCS11(HE160): -53.5dBm maximum High efficiency antenna with spatial diversity, mounted in the display enclosure Form Factor Dimensions Weight Operating Voltage Temperature Humidity Altitude LED Activity Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications PCI-Express M.2 MiniCard 1. Type 2230: 2.3 x 22.0 x 30.0 mm 2. Type 1216: 1.67 x 12.0 x 16.0 mm 1. Type 2230: 2.8g 2. Type 1216: 1.3g 3.3v +/- 9% Operating: 14° to 158° F (10° to 70° C) Non-operating: 40° to 176° F (40° to 80° C) Operating: 10% to 90% (non-condensing) Non-operating: 5% to 95% (non-condensing) Operating: 0 to 10,000 ft (3,048 m) Non-operating: 0 to 50,000 ft (15,240 m) LED Amber Radio OFF; LED OFF Radio ON HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Technology Bluetooth® Specification Frequency Band Number of Available Channels Data Rates and Throughput Transmit Power Power Consumption 4.0/4.1/4.2/5.0/5.1/5.2 Compliant 2402 to 2480 MHz Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH) Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps BLE: 1 Mbps data rate; throughput up to 0.2 Mbps Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5) The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 9.5 dBm for BR and EDR. Peak (Tx): 330 mW Peak (Rx): 230 mW Bluetooth® Software Supported Link Topology Power Management Certifications Power Management Certifications Selective Suspend: 17 mW Microsoft Windows Bluetooth Software Microsoft Windows ACPI, and USB Bus Support FCC (47 CFR) Part 15C, Section 15.247 & 15.249 ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 70 QuickSpecs Technical Specifications Networking HP Pro Series 400 G9 Desktops PCs UL, CSA, and CE Mark Bluetooth Profiles Supported BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 Link Layer Privacy LE Privacy 1.2 Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP) BT5.2 ESR9/10 Compliance LE Advertisement Extensions Channel Selection Algo Limited High Duty Cycle Non-Connectable Advertising 2Mbps LE LE Long Range 1. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless router, sold separately, that supports 80MHz and higher channels. 2. Check latest software/driver release for updates on supported security features. 3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels. 4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation). Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 71 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Intel AX211 Wi-Fi 6E +BT 5.2 M.2 vPro 160MHz CNVi WW WLAN1 Wireless LAN Standards IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac IEEE 802.11ax IEEE 802.11d IEEE 802.11e IEEE 802.11h IEEE 802.11i IEEE 802.11k IEEE 802.11r IEEE 802.11v Interoperability Wi-Fi certified Frequency Band 802.11b/g/n/ax · 2.402 2.482 GHz 802.11a/n/ac/ax · 4.9 4.95 GHz (Japan) · 5.15 5.25 GHz · 5.25 5.35 GHz · 5.47 5.725 GHz · 5.825 5.850 GHz · 5.955 6.415 GHz · 6.435 6.515 GHz · 6.535 6.875 GHz · 6.895 7.115 GHz Data Rates · 802.11b: 1, 2, 5.5, 11 Mbps · 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps · 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps · 802.11n: max 300Mbps · 802.11ac: 1733Mbps · 802.11ax: max 2.4Gbps Modulation Direct Sequence Spread Spectrum OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM , 1024QAM Security2 · IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only · AES-CCMP: 128 bit in hardware · 802.1x authentication · WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES. · WPA2 certification · WPA3 certification · IEEE 802.11i · WAPI Network Architecture Ad-hoc (Peer to Peer) Models Infrastructure (Access Point Required) Roaming IEEE 802.11 compliant roaming between access points Output Power3 · 802.11b: +17dBm minimum · 802.11g: +16dBm minimum · 802.11a: +17dBm minimum · 802.11n HT20(2.4GHz): +14dBm minimum · 802.11n HT40(2.4GHz): +13dBm minimum · 802.11n HT20(5GHz): +14dBm minimum · 802.11n HT40(5GHz): +13dBm minimum Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 72 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Power Consumption · 802.11ac VHT80(5GHz): +10dBm minimum · 802.11ac VHT160(5GHz): +10dBm minimum · 802.11ax HE40(2.4GHz): +12dBm minimum · 802.11ax HE80(5GHz): +10dBm minimum · 802.11ax HE160(5GHz): +10dBm minimum · Transmit mode 2.0 W · Receive mode 1.6 W · Idle mode (PSP) 180 mW (WLAN Associated) · Idle mode 50 mW (WLAN unassociated) · Connected Standby 10mW Power Management Receiver Sensitivity4 Antenna type · Radio disabled 8 mW ACPI and PCI Express compliant power management 802.11 compliant power saving mode ·802.11b, 1Mbps: -93.5dBm maximum ·802.11b, 11Mbps: -84dBm maximum · 802.11a/g, 6Mbps: -86dBm maximum · 802.11a/g, 54Mbps: -72dBm maximum · 802.11n, MCS07: -67dBm maximum · 802.11n, MCS15: -64dBm maximum · 802.11ac, MCS0(VHT80): -84dBm maximum · 802.11ac, MCS9(VHT80): -59dBm maximum · 802.11ac, MCS9(VHT160): -58.5dBm maximum ·802.11ax, MCS11(HE40): -57dBm maximum ·802.11ax, MCS11(HE80): -54dBm maximum ·802.11ax, MCS11(HE160): -53.5dBm maximum High efficiency antenna with spatial diversity, mounted in the display enclosure Form Factor Dimensions Weight Operating Voltage Temperature Humidity Altitude LED Activity Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications PCI-Express M.2 MiniCard 1. Type 2230: 2.3 x 22.0 x 30.0 mm 2. Type 1216: 1.67 x 12.0 x 16.0 mm 1. Type 2230: 2.8g 2. Type 1216: 1.3g 3.3v +/- 9% Operating: 14° to 158° F (10° to 70° C) Non-operating: 40° to 176° F (40° to 80° C) Operating: 10% to 90% (non-condensing) Non-operating: 5% to 95% (non-condensing) Operating: 0 to 10,000 ft (3,048 m) Non-operating: 0 to 50,000 ft (15,240 m) LED Amber Radio OFF; LED OFF Radio ON HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Technology Bluetooth® Specification Frequency Band Number of Available Channels 4.0/4.1/4.2/5.0/5.1/5.2 Compliant 2402 to 2480 MHz Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 73 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Networking Data Rates and Throughput Transmit Power Power Consumption Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps BLE: 1 Mbps data rate; throughput up to 0.2 Mbps Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5) The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 9.5 dBm for BR and EDR. Peak (Tx): 330 mW Peak (Rx): 230 mW Bluetooth® Software Supported Link Topology Power Management Certifications Power Management Certifications Selective Suspend: 17 mW Microsoft Windows Bluetooth Software Microsoft Windows ACPI, and USB Bus Support FCC (47 CFR) Part 15C, Section 15.247 & 15.249 ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 Bluetooth Profiles Supported UL, CSA, and CE Mark BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 Link Layer Privacy LE Privacy 1.2 Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP) BT5.2 ESR9/10 Compliance LE Advertisement Extensions Channel Selection Algo Limited High Duty Cycle Non-Connectable Advertising 2Mbps LE LE Long Range 1. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless router, sold separately, that supports 80MHz and higher channels. 2. Check latest software/driver release for updates on supported security features. 3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels. 4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation). Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 74 QuickSpecs Technical Specifications Input/Output Devices HP Pro Series 400 G9 Desktops PCs I/O DEVICES HP Business Slim Standalone USB/PS2 Wired Keyboard Physical Characteristics Keys 104, 105, 106, 107, 109 layout (depending upon country) Dimensions (L x W x H) 171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0± 1.0 cm) Weight 1.32 lb (0.6± 0.08 kg) Electrical Operating voltage 4.4-5.25VDC Power consumption 50-mA maximum (with 5 VDC power supplied and three LEDs ON)/ System interface USB or PS/2 ESD Contact Discharge: 2, 4,6,8KV Air Discharge: 2, 4, 8,10,12.5KV EMI RFI Conforms to FCC rules for a Class B computing device Mechanical Keycaps Low-profile design Switch actuation 60±12.5g nominal peak force with tactile feedback Switch life 10 million keystrokes (Life tester) Switch type Contamination-resistant switch membrane Key-leveling mechanisms For all double-wide and greater-length keys Cable length 6 ft (1.8 m) Environmental Acoustics 43-dBA maximum sound pressure level Operating temperature 50° to 122° F (10° to 50° C) Non-operating temperature Minus 30 degress to 60 degress Celsius Operating humidity 10% to 90% (non-condensing at ambient) Non-operating humidity 20% to 80% (non-condensing at ambient) Operating shock 40 g, six surfaces Non-operating shock 80 g, six surfaces Operating vibration 2-g peak acceleration Non-operating vibration 4-g peak acceleration Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence Approvals UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 75 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Input/Output Devices HP USB Business Slim Wired SmartCard CCID Keyboard Physical Characteristics Keys 104, 105, 109 layout (depending upon country) Dimensions (L x W x H) 17.34 x 5.68 x 0.78in (440.6 x 144.5 x 1.98 cm) Weight 1.32 lb (598g) Electrical Operating voltage 5 VDC, +/-5% Power consumption 100mA (All LED on) System interface USB Type A plug connector ESD Contact Discharge: 8 KV Air Discharge: 12.5 KV EMI - RFI Conforms to FCC rules for a Class B computing device Mechanical Keycaps Low-profile design Switch actuation 60±10g nominal peak force with tactile feedback Switch life 10 million keystrokes (Life tester) Switch type Contamination-resistant switch membrane Key-leveling mechanisms For all double-wide and greater-length keys Cable length 6 ft (1.8 m) Environmental Acoustics 43-dBA maximum sound pressure level Operating temperature 50° to 122° F (10° to 50° C) Non-operating temperature -22° to 140° F (-30° to 60° C) Operating humidity 10% to 90% (non-condensing at ambient) Non-operating humidity 20% to 80% (non-condensing at ambient) Operating shock 40 g, six surfaces Non-operating shock 80 g, six surfaces Operating vibration 2-g peak acceleration Non-operating vibration 4-g peak acceleration Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence Approvals CE Marking, TUV, EAC, FCC, cULus/CSAus, ICES, RCM, VCCI, KCC, BSMI Ergonomic compliance ISO 9241-4, TUVGS Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 76 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Input/Output Devices HP 125 (AntiMicrobial) Wired Keyboard (China only) Physical Characteristics Keys 104/105/107/109layout (depending upon country) Dimensions (L x W x H) 436 x 138 x24.7 mm Weight 471g Electrical Operating voltage 5V +- 5% Power consumption 50mA System interface USB Type A plug connector ESD Contact Discharge: 8 KV Air Discharge: 12.5 KV EMI - RFI Conforms to FCC rules for a Class B computing device Mechanical Keycaps Low-profile design Switch actuation 55±10g nominal peak force with tactile feedback Switch life 10 million keystrokes (Life tester) Switch type Contamination-resistant switch membrane Key-leveling mechanisms For all double-wide and greater-length keys Cable length 1.8 m Environmental Acoustics 43-dBA maximum sound pressure level Operating temperature 50° to 122° F (10° to 50° C) Non-operating temperature -4° to 149° F (-20° to 65° C) Operating humidity 10% to 95% (non-condensing at ambient) Non-operating humidity 0% to 95% (non-condensing at ambient) Operating shock 40 g, six surfaces Non-operating shock 80 g, six surfaces Operating vibration 2-g peak acceleration Non-operating vibration 4-g peak acceleration Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence Approvals UL, cUL, FCC, CE, TUV GS, VCCI, BSMI, RCM, KCC, USB-IF, WHQL, EN/IEC 60601-1 Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 77 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Input/Output Devices HP 655 wireless Keyboard Physical Characteristics Electrical Mechanical Environmental Approvals Ergonomic compliance Keys 104, 105, 107,109 layouts Dimensions (L x W x H) 16.86 x 4.55 x 0.71 in (428.22 x 115.47 x 18.06 mm) Weight 0.96 lb (435g) Operating voltage 3 VDC, +/-5% Power consumption 20 mA Max (All LED on) System interface 2.4GHz Wireless ESD Contact Discharge: 8 KV Air Discharge: 15 KV EMI - RFI Conforms to FCC rules for a Class B computing device Keycaps Plunger, 2.0 mm key travel Key actuation 60±10g nominal peak force with tactile feedback Key life 10 million keystrokes (Life tester) Key structure type Rubber dome & Membrane Key-leveling mechanisms For all double-wide and greater-length keys Operating temperature 50° to 122° F (10° to 50° C) Non-operating temperature -22° to 140° F (-30° to 60° C) Operating humidity 10% to 90% (non-condensing at ambient) Non-operating humidity 20% to 80% (non-condensing at ambient) Operating shock 40 g, six surfaces Non-operating shock 80 g, six surfaces Operating vibration 2-g peak acceleration Non-operating vibration 4-g peak acceleration Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence CB, CE, FCC, cULus, ICES, IC, I TRC, TRA, CASA, UA, EAC, CNC, ANATEL, NOM-NYCE SCT, IFETEL, MPTC, RCM, BIS, PosTel, VCCI, TELEC, KC, MCMC, IDA, BSMI, NCC, DWLF&M, TP-BY, MOC TUVGS HP Wired Desktop 320K Keyboard Keys Physical Characteristics Dimensions(L x W x H) Weight Operating voltage Electrical Power consumption System interface ESD 104, 105, 107,109 layouts 18.86*4.55*0.66 in (426.2 x 110.9 x 16.7 mm) 1.00 lb(452g) 5 VDC, +/-5% 50 mA Max (All LED on) USB Port Contact Discharge: 8 KV Air Discharge: 15 KV (Class B) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 78 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Input/Output Devices Mechanical EMI - RFI European Standard EN 55022: 2006+A1: 2007, Class B. FCC/CFR 47 : Part 15 Class B Keycaps 2.0mm +/-0.2mm at 120gf Key travel Operating temperature 10° C to 90° C Non-operating temperature -30° C to 95° C Operating humidity N/A Non-operating humidity 10% to 90% (non-condensing at ambient) Operating shock N/A Environmental Non-operating shock i. Half-Sine Shock End-Use Handling, Non-Operational Sample size: 5pcs. Condition: Sample power off. Axis: X, Y, Z axis (all 6 faces) sample normal mode of operation. Number of shocks: 1 shock/face. Pulse duration: < 3 ms Velocity change: 50lps (inch-per-second)- 65lps desired. ii. Trapezoidal Shock- Transportation Environment, Non-Operational Sample size: 5pcs. Condition: Sample power off. Orientation: All six faces: Front, Rear, Left, Right, Bottom, and Top. Configuration: As intended for shipment Number of shocks: 1 shock/face. Minimum faired acceleration: 30G's. Test also at 40 and 50G's to find margin. Velocity change: 266lps (inch-per-second) for product mass (m) 20<m<40lbs. Frequency (Hz) Slope (dB/oct) PSD (g2/Hz) Operating vibration Non-operating vibration Drop (out of box) 5-350 350-500 500 0 -6 (~0.21Gnms) Total Test time: 10 minutes Frequency (Hz) Slope (dB/oct) 5.100 0 100-137 -6 137-350 0 350-500 -6 500 - 76cm on carpet, six-drop sequence 0.0001 - 0.00005 PSD (g2/Hz) 0.015 0.008 0.0039 Drop (in box) 10 times drop including 6 faces, one corner and 3 edges on rigid surface. Drop Height: 91cm Approvals CB, CE, FCC, ICES, EAC, NOM-NYCE SCT, RCM, BIS, VCCI, KC, BSMI Ergonomic compliance TUVGS Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 79 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Input/Output Devices HP Wired Desktop 320M Mouse Keys Left/right key Physical Characteristics Dimensions(L x W x H) 4.09 x2.50 x 1.40 in (103.8x 63.4 x 35.5 mm) Weight 0.16 lb(72g) Operating voltage 5 VDC, +/-0.25V Power consumption 100 mA Max Electrical System interface ESD EMI - RFI Keycaps USB Port Contact Discharge: 8 KV Air Discharge: 15 KV (Class B) European Standard EN 55022: 2006+A1: 2007, Class B. FCC/CFR 47 : Part 15 Class B 0.3mm key travel Key actuation 75±20g Mechanical Key life 1million cycles Key structure type Tact Switch Key-leveling mechanisms N/A Operating temperature 10° to 90° C Non-operating temperature -30° C to 95° C Operating humidity N/A Non-operating humidity 10% to 90% (non-condensing at ambient) Operating shock N/A i. Half-Sine Shock End-Use Handling, Non-Operational Sample size: 5pcs. Condition: Sample power off. Axis: X, Y, Z axis (all 6 faces) sample normal mode of operation. Number of shocks: 1 shock/face. Pulse duration: < 3 ms Velocity change: 50lps (inch-per-second)- 65lps desired. Environmental Non-operating shock ii. Trapezoidal Shock- Transportation Environment, Non-Operational Sample size: 5pcs. Condition: Sample power off. Orientation: All six faces: Front, Rear, Left, Right, Bottom, and Top. Configuration: As intended for shipment Number of shocks: 1 shock/face. Minimum faired acceleration: 30G's. Test also at 40 and 50G's to find margin. Velocity change: 266lps (inch-per-second) for product mass (m) 20<m<40lbs. Operating vibration Frequency (Hz) 5-350 350-500 500 Slope (dB/oct) 0 -6 (~0.21Gnms) PSD (g2/Hz) 0.0001 - 0.00005 Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 80 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Input/Output Devices Non-operating vibration Drop (out of box) Total Test time: 10 minutes Frequency (Hz) Slope (dB/oct) 5.100 0 100-137 -6 137-350 0 350-500 -6 500 - 76cm on carpet, six-drop sequence Drop (in box) N/A Approvals CB, CE, FCC, cULus, ICES, EAC, NOM-NYCE SCT, RCM, VCCI, KC, BSMI Ergonomic compliance TUVGS PSD (g2/Hz) 0.015 - 0.008 - 0.0039 HP 655 wireless Mouse Dimensions (H x L x W) Weight Environmental Electrical Mechanical Regulatory approvals Ergonomic compliance 4.74 x 2.75 x 1.63 in (120.29 x 69.97 x41.39 mm) 0.194lb (88g) Operating temperature 50° to 122° F (10° to 50° C) Non-operating temperature Operating humidity -22° to 140° F (-30° to 60° C) 10% to 90% (non-condensing at ambient) Non-operating humidity 20% to 80% (non-condensing at ambient) Operating shock 40 g, six surfaces Non-operating shock 80 g, six surfaces Operating vibration 2-g peak acceleration Non-operating vibration 4-g peak acceleration Operating voltage 3 VDC, +/-5% Power consumption (typical) 10 mA Max Resolution 1,200 DPI (Default) Sensor Pixart PAW3222DB-TJDS Tracking speed 10G(max), 1G=9.8m/s2 Tracking acceleration 2.4GHz Wireless Color Compliant Compliant Jack Black CB, CE, FCC, cULus, ICES, IC, TRC, TRA, ICASA, UA, EAC, CNC, ANATEL, NOM-NYCE SCT, IFETEL, MPTC, RCM, PosTel, VCCI, TELEC, KC, MCMC, IDA, BSMI, NCC, DWLF&M, TP-BY, MOC TUVGS Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 81 QuickSpecs Technical Specifications Input/Output Devices HP Pro Series 400 G9 Desktops PCs HP PS/2 Mouse Dimensions (H x L x W) Weight Environmental Electrical Mechanical Regulatory approvals 4.53 x 2.48 x1.46 in (115.2x 63 x37 mm) 0.22lb (101.6g) Operating temperature 41° to 122° F (5° to 50° C) Non-operating temperature Operating humidity (-4° to 140° F )(-20° to 60° C) 10% to 85% (non-condensing at ambient) Non-operating humidity 5% to 95% (non-condensing at ambient) Operating shock 40 g, six surfaces Non-operating shock 80 g, six surfaces Operating vibration 2-g peak acceleration Non-operating vibration 4-g peak acceleration Tracking speed 30 inch/sec (max) Tracking acceleration 8G(max), 1G=9.8m/s2 System interface PS/2 Switch actuation 60±15g nominal peak force with tactile feedback Switch life 3 million keystrokes (Life tester) Switch type Contamination-resistant switch membrane Key-leveling mechanisms For all double-wide and greater-length keys Cable length 6 ft (1.8 m) Color Jack Black Compliant UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC HP USB 125 (Antimicrobial)/128 Laser Mouse (China only) Dimensions (H x L x W) 112 x 63 x 36.2 mm (L x W x H) Weight 85 g Environmental Operating temperature 50° to 122° F (10° to 50° C) Non-operating temperature Operating humidity -22° to 140° F (-30° to 60° C) 10% to 90% (non-condensing at ambient) Non-operating humidity 20% to 80% (non-condensing at ambient) Operating shock 40 g, six surfaces Non-operating shock 80 g, six surfaces Operating vibration 2-g peak acceleration Non-operating vibration 4-g peak acceleration Electrical Operating voltage 5 VDC, +/-5% Power consumption (typical) 100mA Resolution 1,200 DPI Sensor Optical/ Laser USB mouse sensor Tracking speed 30 inch/sec (max) Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 82 QuickSpecs Technical Specifications Input/Output Devices Mechanical Regulatory approvals Tracking acceleration Connector Cable length Color Compliant HP Pro Series 400 G9 Desktops PCs 8G(max), 1G=9.8m/s2 USB 6 ft (1.8 m) Jack Black UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC, EAC Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 83 QuickSpecs Technical Specifications Audio/Multimedia HP Pro Series 400 G9 Desktops PCs AUDIO/MULTIMEDIA HP Pro Mini 400 G9 Desktop PC Type Integrated HD Stereo Codec Realtek ALC3252 Audio I/O Ports Front: Headset connector supports a CTIA and style headset and is retaskable as a Line-in, Lineout, Microphone-in or Headphone-out port Internal Speaker Amplifier 2W class D mono amplifier for the internal speaker only. External speakers must be powered Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio streams to be sent to/from the front jacks or integrated speaker. Sampling Supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and ADC Wavetable Syntheses Yes - Uses OS soft wavetable Analog Audio Yes # of Channels on Line-Out Stereo (Left & Right channels) Internal Speaker Yes HP Pro SFF 400 G9 Desktop PC Type Integrated HD Stereo Codec Realtek ALC3252 Audio I/O Ports Front: Headset connector supports a CTIA and style headset and is retaskable as a Line-in, Lineout, Microphone-in or Headphone-out port Rear: Line-out, port, 3.5mm and support stereo and retasking Internal Speaker Amplifier 2W class D mono amplifier for the internal speaker only. External speakers must be powered Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio streams to be sent to/from the front and rear jacks or integrated speaker. Sampling Supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and ADC Wavetable Syntheses Yes - Uses OS soft wavetable Analog Audio Yes # of Channels on Line-Out Stereo (Left & Right channels) Internal Speaker Yes Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 84 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Audio/Multimedia HP Pro Tower 400 G9 PCI Desktop PC Type Integrated HD Stereo Codec Realtek ALC3252 Audio I/O Ports Front: Headset connector supports a CTIA and style headset and is retaskable as a Line-in, Line-out, Microphone-in or Headphone-out port Rear: Line-out, Line-in*, 3.5mm and support stereo and retasking Internal Speaker Amplifier 2W class D mono amplifier for the internal speaker only. External speakers must be powered Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio streams to be sent to/from the front and rear jacks or integrated speaker. Sampling Supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and ADC Wavetable Syntheses Yes - Uses OS soft wavetable Analog Audio Yes # of Channels on Line-Out Stereo (Left & Right channels) Internal Speaker Yes *NOTE: Line-in port only available on product with legacy PCI version HP Pro Tower 480 G9 PCI Desktop PC Type Integrated HD Stereo Codec Realtek ALC3252 Audio I/O Ports Front: 3.5mm headset connector supports an OMTP or CTIA style headset and is re-taskable as a Line-in, Line-out, Microphone-in or Headphone-out port Rear: Line-out, Line-in*, 3.5mm and support stereo and retasking Internal Speaker Amplifier 2W per channel class D stereo amplifier for the internal speakers only Multi-streaming Capable Playback multi-streaming allows independent audio streams to be sent to/from the side jack and integrated speakers. Sampling Supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and ADC Wavetable Syntheses Yes Uses OS Soft Wavetable Analog Audio Yes # of Channels on Line-Out Stereo (Left & Right channels) Internal Speaker Yes HP ProOne 440 G9 24 All-in-One PC Type Integrated HD Stereo Codec Realtek ALC3252 Audio I/O Ports Side 3.5mm headset connector supports an OMTP or CTIA style headset and is re-taskable as a Line-in, Line-out, Microphone-in or Headphone-out port Internal Speaker Amplifier 2W per channel class D stereo amplifier for the internal speakers only Multi-streaming Capable Playback multi-streaming allows independent audio streams to be sent to/from the side jack and integrated speakers. Sampling Supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and ADC Wavetable Syntheses Yes Uses OS Soft Wavetable Analog Audio Yes # of Channels on Line-Out Stereo (Left & Right channels) Internal Speaker Yes - Stereo Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 85 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Audio/Multimedia INTEGRATED WEBCAM AND MICROPHONE Optional integrated 5 MP RGB webcam & microphone; maximum resolution of 2592 x 1944 Optional integrated 5 MP RGB webcam with IR sensor & microphone; maximum resolution of 2592 x 1944 Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 86 QuickSpecs Technical Specifications Power HP Pro Series 400 G9 Desktops PCs POWER External Power Supplies1 80 PLUS Gold 80 PLUS Platinum Operating Voltage Range Rated Voltage Range Rated Line Frequency Operating Line Frequency Rated Input Current with Energy Efficient* Power Supply Mini SFF TWR AiO 90W EPS, active PFC, 88% N/A N/A 120W EPS, active PFC, average efficiency at 88% average efficiency 115V & 89% at 230Vac at 115V & 89% at 230Vac 150W EPS, active PFC, 88% efficiency in 115Vac / 89% efficiency in 230Vac 180W EPS, active PFC, 88% average efficiency at 115V & 89% at 230Vac 230W EPS, active PFC, 89% average efficiency at 115V / 230Vac N/A 180W active PFC / 80 180W active PFC / 80 N/A PLUS Gold PLUS Gold 87/90/87% efficient at 87/90/87% efficient at 20/50/100% load 20/50/100% load (115V) (115V) 90/92/89% efficient at 90/92/89% efficient at 20/50/100% load 20/50/100% load (230V) (230V) N/A 240W active PFC / 80 260W active PFC / 80 N/A PLUS Platinum PLUS Platinum 90/92/89% efficient at 400Wactive PFC / 80 20/50/100% load PLUS Platinum (115V) 90/92/89% efficient at 91/93/90% efficient at 20/50/100% load 20/50/100% load (115V) (230V) 91/93/90% efficient at 20/50/100% load (230V) 90Vac~264Vac 90Vac~264Vac 90Vac~264Vac 90Vac~264Vac 100Vac~240Vac 100Vac~240Vac 100Vac~240Vac 100Vac~240Vac 50HZ~60HZ 50HZ~60HZ 50HZ~60HZ 50HZ~60HZ 47HZ~63HZ 47HZ~63HZ 47HZ~63HZ 47HZ~63HZ 65W1.6A 90W1.7A 180W Gold 2.3A 180W2.3A 240W Platinum 2.9A 260W3.1A 400W5.2A 120W1.7A 150W2.5A 180W2.5A 230W3.5A DC Output Current Leakage (NFPA 99: 2012) +19.5V +12V +12V +19.5V Less than 500 microamps Less than 500 Less than 500 Less than 500 of leakage current at 264 microamps of leakage microamps of leakage microamps of leakage Vac with the ground wire current at 264 Vac with current at 264 Vac with current at 264 Vac with Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 87 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Power Power Supply Fan Power cord length* Dimensions disconnected, as required the ground wire the ground wire the ground wire for Non-patient Electrical disconnected, as disconnected, as disconnected, as Appliances and required for Non- required for Non- required for Non- Equipment used in a patient Electrical patient Electrical patient Electrical patient care facility or Appliances and Appliances and Appliances and that contact patients in Equipment used in a Equipment used in a Equipment used in a normal use. Per section patient care facility or patient care facility or patient care facility or 10.3.5.1. that contact patients in that contact patients in that contact patients in Less than 100 microamps normal use. Per section normal use. Per section normal use. Per section of leakage current at 264 10.3.5.1. 10.3.5.1. 10.3.5.1. Vac with the ground wire Less than 100 Less than 100 Less than 100 intact with normal microamps of leakage microamps of leakage microamps of leakage polarity, as required for current at 264 Vac with current at 264 Vac with current at 264 Vac with Non-patient Electrical the ground wire intact the ground wire intact the ground wire intact Appliances and with normal polarity, as with normal polarity, as with normal polarity, as Equipment used in a required for Non- required for Non- required for Non- patient care facility or patient Electrical patient Electrical patient Electrical that contact patients in Appliances and Appliances and Appliances and normal use. Per section Equipment used in a Equipment used in a Equipment used in a 10.3.5.1. patient care facility or patient care facility or patient care facility or that contact patients in that contact patients in that contact patients in normal use. Per section normal use. Per section normal use. Per section 10.3.5.1. 10.3.5.1. 10.3.5.1. N/A 50mm variable speed 70mm variable speed N/A 6.0 ft. (1.83 m) 6.0 ft. (1.83 m) 6.0 ft. (1.83 m) 6.0 ft. (1.83 m) 65W: 90 x 51 x 28.5mm / 200 x 85 x 53 mm 102 x 55 x 30mm 90W: 126 x 50 x 30mm 165 x 95 x 73 mm 120W: 138mm x 68.5mm x 25.4mm 150W: 148 x 75.5 x 25. 4mm 180W: 165.5mm x 79mm x 25.4mm 230W: 180mm x 88mm x 25.4mm 1. External power supplies, power cords, cables and peripherals are not low halogen. Service parts obtained after purchase may not be low halogen. *NOTE: 2m for India The power supply shall comply with harmonic input current requirements as detailed in EN61000-3-2 and JEIDA MITI standards. The harmonic input current requirements must be met under the following operating conditions: Load Requirements: 50% and 100% Input Voltage: 230Vac/50Hz. For active power factor correction the power factor at 50% &100% loads shall be greater than 0.9 over the entire nominal input voltage range (100-127VAC and 200-240VAC). Condition 10% of Rated Load 20% of Rated Load 50% of Rated Load 100% of Rated Load Standard Efficiency - PF>0.9 70% 82/85/82% 75% 82% 85% PF>0.9 82% 85/88/85% 81% 85% 88% PF>0.9 85% 87/90/87% 84% 87% 90% PF>0.9 87% 90/92/89% 86% 90% 92% PF>0.95 89% Input Voltage 115Vac/60HZ 115Vac/60HZ 115Vac/60HZ 115Vac/60HZ Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 88 QuickSpecs Technical Specifications Power PF>0.9 PF>0.9 PF>0.9 HP Pro Series 400 G9 Desktops PCs PF>0.9 PF>0.9 230Vac/50HZ Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 89 QuickSpecs Technical Specifications Weights and Dimensions HP Pro Series 400 G9 Desktops PCs WEIGHTS & DIMENSIONS1 Chassis (W x D x H) System Volume System Weight1 Max Supported Weight (desktop orientation) Packaging Dimension (W x D x H) Shipping Weight Palletization Profile (Fabricated EPE) Palletization Profile (Molded Pulp) DM SFF 6.97 x 6.89 x 1.35 in 177 x 175 x 34.2 mm 10.63 x 12.12 x 2.74 in 270 x 308 x 95 mm 64 cu in 1.05 L 481.85 cu in 7.9 L 2.74 lbs 1.25 kg 9.59 lbs 4.35 kg N/A 10.42 lbs 4.73 kg 19.57 x 5.04 x 8.78 in (497 x 128 x 223 mm) 15.52 x 19.65 x 8.07 in (394 x 499 x 205 mm) MPP: 19.61 x 9.25 x 5.20 in (498 x 235 x 132 mm) MPP: 15.52 x 19.65 x 8.07 in (394 x 499 x 205 mm) 6.52 lbs (2.97 kg) 15.31 lbs (6.95 kg) MPP: 7.50 lbs (3.40 kg) MPP: 15.97 lbs (7.25 kg) 18-units per layer 6-units per layer 5 or 6 layers max depending on details 11 layer max of air freight 66 per pallet 90 or 108 units per pallet depending on 47.24 x 39.37 x 93.90 in, 1200 x 1000 x details of air freight 2380 mm (including pallet) 45.354 x 39.13 x 57.80 in, 1152 x 994 x 1468 mm (include pallet) 10-units per layer 6-units per layer 10 to 19 layers max depending on 11 layer max details of freight 66 per pallet 100 or 190 units per pallet depending 47.24 x 39.37 x 93.90 in, 1200 x 1000 x on details of freight 2380 mm (including pallet) 46.26 x 39.21 x 103.74 in, 1175 x 996 x 2635 mm (including pallet) 1. Packaging material used will vary by country 2. Configured with 1 HDD & 1 ODD; DM configured with 1 HDD only Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 90 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Weights and Dimensions Chassis (W x D x H) System Volume System Weight1 Max Supported Weight (desktop orientation) Packaging Dimension (W x D x H) Shipping Weight Palletization Profile (Fabricated EPE) Palletization Profile (Molded Pulp) TWR 6.1 x 12.13 x 13.27 in 155x 308 x 337 mm 981.9 cu in 16.1 L 11.7 lbs 5.31 kg 14.5 lbs 6.58 kg 15.75 x 19.65 x 11.30 in (400 x 499 x 287 mm) MPP: 15.75 x 19.65 x 11.30 in (400 x 499 x 287 mm) 17.69 lbs (8.03 kg) MPP: 18.5 lbs (8.4 kg) 6-units per layer 8 layer max 48 per pallet 47.24 x 39.37 x 95.12 in, 1200 x 1000 x 2416 mm (including pallet) 6-units per layer 8 layer max 48 per pallet 47.24 x 39.37 x 95.12 in, 1200 x 1000 x 2416 mm (including pallet) 1. Packaging material used will vary by country 2. Configured with 1 HDD & 1 ODD; DM configured with 1 HDD only Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 91 QuickSpecs HP Pro Series 400 G9 Desktops PCs Technical Specifications Weights and Dimensions ALL-IN-ONE DIMENSIONS1 Without Stand (VESA Cover Plate) cm/kg inch/lbs Cantilever Stand (Fixed Height Tilt Stand) cm/kg inch/lbs Adjustable Height Stand cm/kg inch/lbs Product Width Length/Depth Height Weight 53.93 cm 8.96 cm 35.36 cm 6.93 kg 21.23 in 3.53 in 13.92 in 15.28 lbs 53.93 cm 18.70 cm 40.28 cm 7.315 kg 21.23 in 7.36 in 15.85 in 16.12 lbs 53.93 cm 22.5 cm 37.94 ~ 50.94 cm 7.775kg 21.23 in 8.85 in 14.93 ~ 20.05 in 17.57 lbs Package Width Length/Depth Height Weight 66.0 cm 24.0 cm 46.2 cm 10.85 kg 25.98 in 9.45 in 18.19 in 23.92 lbs 66.0 cm 24.0 cm 46.2 cm 12.04 kg 25.98 in 9.45 in 18.19 in 26.54 lbs 66.0 cm 24.0 cm 46.2 cm 12.69 kg 25.98 in 9.45 in 18.19 in 27.98 lbs Palletization for Sea/Rail Width Length/Depth Height Weight Qty / Layer Layers 120.0 cm 100.0 cm 198.8 cm 260.4 kg 47.24 in 39.37 in 78.27 in 574.08 lbs 6 4 120.0 cm 47.24 in 100.0 cm 39.37 in 198.8 cm 78.27 in 288.96 kg 663.96 kg 6 4 120.0 cm 47.24 in 100.0 cm 39.37 in 198.8 cm 78.27 in 304.56 kg 671.52 lbs 6 4 Qty / Pallet via Sea/Rail 24 24 24 Qty / Pallet via Air 18 18 18 1. Packaging material used will vary by country. 2. Configured with 1 HDD & 1 ODD. 3. Package weight is based on EPE package. 4. Actual system weight will depend on the system configuration. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 92 QuickSpecs HP Pro Series 400 G9 Desktops PCs Miscellaneous Features MISCELLANEOUS FEATURES Management Features · Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode. Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system. · Intel® Wired for Management support; industry wide initiative to make Intel® architecture based PCs, servers and mobile computers more inherently manageable out-of-the-box and over the network · Dual State Power Button; acts as both an on/off button and a suspend-to-sleep button Serviceability Features · Dual colored power LED on front of computer to indicate either normal or fault condition · Diagnostic LED Explanation Table: o Power LED will blink red 2 to 5 times, then blink white 2 or more times, then repeat (with beep tones for each blink initially): 2 red + 2 white User must provide file for BIOS recovery (USB storage typically) 2 red + 3 white User must enter a key sequence to proceed with recovery by policy 2 red + 4 white BIOS recovery is in progress 3 red + 2 white Memory could not be initialized 3 red + 3 white Graphics adaptor could not be found 3 red + 4 white Power supply failure / not connected 3 red + 5 white Processor not installed 3 red + 6 white Current processor does not support an enabled feature 4 red + 2 white Processor has exceeded its temperature threshold / system thermal shutdown 4 red + 3 white System internal temperature has exceeded its threshold 5 red + 2 white System controller firmware is not valid 5 red + 3 white System controller detected BIOS is not executing 5 red + 4 white BIOS could not complete initialization / mainboard failure 5 red + 5 white System controller rebooted the system after a health or recovery timer triggered · HP PC Hardware Diagnostics UEFI: o This utility enables hardware level testing outside the operating system on many components. The diagnostics can be invoked by pressing F2 at POST, and is available as a download from HP Support · System/Emergency ROM · Flash ROM · CMOS Battery Holder for easy replacement · Flash Recovery with Video Configuration Record Software · 1 Aux Power LED on System PCA · Processor ZIF Socket for easy Upgrade · Over-Temp Warning on Screen (Requires IM Agents) · DIMM Connectors for easy Upgrade · Clear CMOS Button · NIC LEDs (integrated) (Green & Amber) · Dual Color Power and HD LED - To Indicate Normal Operations and Fault Conditions · Color coordinated cables and connectors · Tool-less Hood Removal · Front power switch · System memory can be upgraded without removing the system board or any internal components · Tool-less Hard Drive, memory & optical drive Removal (For MT, SFF, and DM only) · Green Pull Tabs, and Quick Release Latches for easy Identification Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 93 QuickSpecs HP Pro Series 400 G9 Desktops PCs Miscellaneous Features Additional Features Product Orientation Boot Sectors Protection Drive Protection System SMART Technology (Self-Monitoring, Analysis and Reporting Technology) SMART I - Drive Failure Prediction SMART II - Off-Line Data Collection SMART III - Off-Line Read Scanning with Defect Reallocation SMART IV - End-to-End CRC for hard drives Description Microtower (MT) can be oriented in a tower (vertical) orientation. Small Form Factor (SFF) can be oriented as either a desktop (horizontal) or a tower (vertical) with optional vertical stand. Desktop Mini (DM) can be oriented as either a desktop (horizontal) or a tower (vertical) with optional vertical stand. MBR and GPT sectors of the hard drive are critical to booting the operating system. By saving the MBR or GPT data (depending on the how the OS was installed), the BIOS will be able to monitor for changes and allow the user to override them with the backup copy at boot-up. DPS Access through F10 Setup during Boot A diagnostic hard drive self- test. It scans critical physical components and every sector of the hard drive for physical faults and then reports any faults to the user Running independently of the operating system, it can be accessed through a Windowsbased diagnostics utility or through the computer's setup procedure. It produces an evaluation on whether the hard drive is the source of the problem and needs to be replaced The system expands on the Self-Monitoring, Analysis, and Reporting Technology (SMART), a continuously running systems diagnostic that alerts the user to certain types of failures Allows hard drives to monitor their own health and to raise flags if imminent failures were predicted Predicts failures before they occur. Tracks fault prediction and failure indication parameters such as re-allocated sector count, spin retry count, calibration retry count By avoiding actual hard drive failures, SMART hard drives act as "insurance" against unplanned user downtime and potential data loss from hard drive failure IOEDC: I/O Error Detection Circuitry Detects errors in Read/Write buffers on HDD cache RAM Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 94 QuickSpecs After Market Options AFTER MARKET OPTIONS Graphics Solutions NVIDIA T400 2GB GDDR6 3mDP HP DisplayPortTM To HDMI True 4k Adapter HP DVI Cable Kit HP HDMI Standard Cable Kit HP DisplayPortTM Cable Kit HP DisplayPortTM To VGA Adapter HP DisplayPortTM To DVI-D Adapter Desktop Mini Accessories HP Desktop Mini Port Cover v3 HP Desktop Mini 2.5" SATA Drive Bay kit v2 HP Desktop Mini LockBox V2 HP Desktop Mini DVD-Writer ODD Expansion Module HP Desktop Mini Security/Dual VESA Sleeve v3 HP Desktop Mini Security/Dual VESA Sleeve v3 With Power Supply Holder HP B250 PC Mounting Bracket HP B300 PC Mounting Bracket HP B300 PC Mounting Bracket with Power Supply Holder HP Desktop Mini Vertical Chassis Stand B550 PC Mounting Bracket HP DM Power Supply Holder Kit v2 HP Quick Release Bracket 2 HP Single Monitor Arm HP Integrated Work Center Stand 5 Data Storage Drives HP PCIe NVME TLC 256GB SSD M.2 Drive HP PCIe NVME TLC 512GB SSD M.2 Drive HP PCIe Gen 4 NVME TLC M.2 512GB SSD HP PCIe Gen 4 NVME TLC M.2 1TB SSD HP 500GB 7200PRM SATA 6.0Gb/s 3.5" Hard Drive HP 1TB 7200rpm SATA 6Gb/s 3.5" Hard Drive HP 9.5mm G3 8/6/4 SFF G4 400 SFF/MT DVD Writer HP SFF SATA DVD-Writer ODD HP TWR SATA DVD-Writer ODD Mini X X X X X Mini X X X X X X X X X X X X X X X Mini X X X X HP Pro Series 400 G9 Desktops PCs SFF TWR AiO Part Number X X 340K8AA X X X 2JA63AA X X DC198A X X X T6F94AA X X X VN567AA X X X AS615AA X X X FH973AA SFF TWR AiO Part Number 13L69AA 13L70AA 3EJ57AA K9Q83AA 13L67AA 13L68AA 8RA46AA 2DW53AA 7DB37AA G1K23AA 16U00AA 7DB38AA 6KD15AA BT861AA G1V61AA SFF TWR AiO Part Number X X X 1CA51AA X X X X8U75AA X X X 406L8AA X X X 406L7AA X X QK554AA X X QK555AA X X 1CA53AA X 52D76AA X 52D77AA Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 95 QuickSpecs After Market Options Input Devices HP Wired Desktop 320K Keyboard HP USB Business Slim CCID SmartCard Keyboard HP Wired Desktop 320MK Mouse and Keyboard HP Wired Desktop 320M Mouse HP 655 Wireless Keyboard and Mouse Combo HP 455 Programmable Wireless Keyboard HP 125 Wired Keyboard HP 125 Wired Mouse HP 128 Laser Wired Mouse HP 225 Wired Mouse and Keyboard Combo HP 225 Antimicrobial Wired Mouse and Keyboard Combo (China Only) HP Pro Series 400 G9 Desktops PCs Mini SFF TWR AiO Part Number X X X X 9SR37AA X X X X Z9H48AA X X X X 9SR36AA X X X X 9VA80AA X X X X 4R009AA X X X X 4R177AA X X X X 266C9AA X X X X 265A9AA X X X X 265D9AA X X X X 286J4AA X X X X 286K3AA System Memory HP 4GB DDR4-3200 UDIMM HP 8GB DDR4-3200 UDIMM HP 16GB DDR4-3200 UDIMM HP 32GB DDR4-3200 UDIMM HP 4GB DDR4-3200 SODIMM HP 8GB DDR4-3200 SODIMM HP 16GB DDR4-3200 SODIMM HP 32GB DDR4-3200 SODIMM Mini SFF TWR AiO Part Number X X 13L78AA X X 13L76AA X X 13L74AA X X 13L72AA X X 13L79AA X X 13L77AA X X 13L75AA X X 13L73AA Multimedia Devices Mini HP S101 Speaker Bar X HP Stereo 3.5mm Headset G2 X HP Stereo USB Headset G2 X HyperX Cloud MIX Gaming Headset (BlackGunmetal) X HyperX Cloud Flight Wireless Gaming Headset (Black-Red) X HyperX Cloud Stinger Core Gaming Headset (Black) X HyperX Cloud Core + 7.1 Gaming Headset (Black) X HyperX SoloCast USB WHT Microphone (Black) X SFF TWR X X X X X X X X X X X X X X X X AiO Part Number 5UU40AA X 428K7AA X 428K6AA X 4P5K9AA X 4P5L4AA X 4P4F4AA X 4P4F2AA X 4P5P8AA Communication Devices Intel® Ethernet I225-T1 GbE NIC Mini SFF TWR AiO Part Number X X 406L9AA Security Devices HP Business PC Security Lock v3 Kit Mini SFF TWR X X Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 AiO Part Number X 3XJ17AA Page 96 QuickSpecs After Market Options HP Keyed Cable Lock 10mm HP Master Keyed Cable Lock 10mm HP Pro Series 400 G9 Desktops PCs X X X X T1A62AA X X X X T1A63AA Stands and Mounting Accessories Mini SFF TWR AiO Part Number HP B250 PC Mounting Bracket X 8RA46AA HP B300 PC Mounting Bracket X 2DW53AA HP B550 PC Mounting Bracket X 16U00AA HP Quick Release Bracket 2 X X 6KD15AA HP Single Monitor Arm X BT861AA HP ProOne G9 VESA Plate with Power Supply Holder X 56P78AA HP ProOne G9 Height Adjustable Stand X 13L65AA I/O Devices Mini HP DisplayPort Port Flex IO v2 X HP HDMI Port Flex IO v2 X HP Type-C USB 3.1 Gen2 Port Flex IO v2 HP Type-C USB 3.1 Gen2 Port with 100W PD Flex IO v2 X HP VGA Port Flex IO v2 X HP Serial Port Flex IO v2 X HP Serial Port Flex IO 2nd X HP Internal Serial Port (400) HP PCIe x1 Parallel Port Card HP 800/600/400 G3 Serial/ PS/2 Adapter HP USB to Serial Port Adapter X HP USB-C to Display Port Adapter X HP Serial Port Flex IO v3 X HP Thunderbolt 3.0 Flex IO v3 X HP USB-C To DisplayPort Adapter X HP Single Mini Display Port Adapter to Display Port Adapter X SFF TWR AiO X X X X X X X X X X X X X X X X X X X X X X X X X X NOTE: For more detail on HP I/O Devices please refer to the HP FLEX IO Option Cards QuickSpecs. URL is: http://h20195.www2.hp.com/v2/GetDocument.aspx?docname=c06042607 Part Number 13L54AA 13L55AA 13L59AA 13L60AA 13L53AA 13L56AA 13L57AA 3TK81AA N1M40AA 1VD82AA J7B60AA N9K78AA 5B895AA 440A5AA N9K68AA 2MY05AA Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 97 QuickSpecs HP Pro Series 400 G9 Desktops PCs © Copyright 2022 HP Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries. Intel, Celeron, Core, Pentium are registered trademarks or trademarks of Intel Corporation in the U.S. and/or other countries. Bluetoothâ is a trademark of its proprietor, used by HP, Inc. under license. USB Type-CTM and USB-CTM are trademarks of USB Implementers Forum. NVIDIA, GeForce and NVS are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. AMD and Radeon are trademarks of Advanced Micro Devices, Inc. ENERGY STAR is a registered trademark owned by the U.S. Environmental Protection Agency. DisplayPortTM and the DisplayPortTM logo are trademarks owned by the Video Electronics Standards Association (VESA®) in the United States and other countries. Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 98 QuickSpecs Change Log HP Pro Series 400 G9 Desktops PCs Date March 22, 2022 March 23, 2022 March 24, 2022 April 14, 2022 April 21, 2022 May 6, 2022 May 10, 2022 June 2, 2022 June 9, 2022 June 27, 2022 June 28, 2022 Version History From v1 to v2 From v2 to v3 From v3 to v4 From v4 to v5 From v5 to v6 From v6 to v7 From v7 to v8 From v8 to v9 From v9 to v10 From v10 to v11 From v11 to v12 From v12 to v13 From v13 to v14 From v14 to v15 From v15 to v16 From v16 to v17 From v17 to v18 From v18 to v19 From v19 to v20 From v20 to v21 From v21 to v22 From v22 to v23 Action Correction Addition Correction Addition Removal Addition Addition Removal Update Addition Update Description of Change 440 G9 Environmental table edited Environmental information added to AiO table AiO Environmental information table Type-C® SuperSpeed USB 20Gbps signaling rate port for DM HSA Fusion for Commercial and HSA Telemetry for Commercial removed Environmental information added SFF and Pro Tower Declared Noise Emissions values added to DM environmental Table 12700T and 6900T processors removed for SFF / T400 graphic card corrected Environmental tables certifications updated Power consumption bullet added to At a glance section Intel® CoreTM i7-12700 Processor updated to 4.9 GHz max. turbo frequency Not all configuration components are available in all regions/countries. c08017709 DA 16998 Worldwide -- Version 12 -- June 28, 2022 Page 99