NINA-W1 series, system integration manual

Stand-alone Wi-Fi and multiradio modules

NINA-W1 Series Manual

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Document DEVICE REPORTNINA-W1 SIM UBX-17005730

NINA-W1 series
Stand-alone Wi-Fi and multiradio modules
System integration manual

Abstract
This document describes the system integration of NINA-W1 series stand-alone modules, which includes the NINA-W13 (Wi-Fi) and NINA-W10 and NINA-W15 series (multiradio) modules. These modules feature a number of useful embedded security features, including secure boot that ensures that only authenticated software can run on the module. NINA-W1 modules are ideal for critical IoT applications where security is important. The modules connect to a host system using UART, high-speed RMII, or GPIO interfaces.

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NINA-W1 series - System integration manual

Document information

Title

NINA-W1 series

Subtitle

Stand-alone Wi-Fi and multiradio modules

Document type

System integration manual

Document number

UBX-17005730

Revision and date

R16

6-May-2022

Disclosure Restriction C1 - Public

Document status descriptions

Draft

For functional testing. Revised and supplementary data will be published later.

Objective Specification

Target values. Revised and supplementary data will be published later.

Advance Information

Data based on early testing. Revised and supplementary data will be published later.

Early Production Information

Data from product verification. Revised and supplementary data may be published later.

Production Information

Document contains the final product specification.

This document applies to the following products:

Product name NINA-W101 NINA-W102 NINA-W106 NINA-W131 NINA-W132 NINA-W151 NINA-W152 NINA-W156

Document status Early Production Information Early Production Information Early Production Information Early Production Information Early Production Information Early Production Information Early Production Information Early Production Information

For information about the hardware, software, and current status of the available product types,
see the NINA-W10, NINA-W13 and NINA-W15 data sheets [3], [2] and [4].

u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only permitted with the express written permission of u-blox. The information contained herein is provided "as is" and u-blox assumes no liability for its use. No warranty, either express or implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent documents, visit www.u-blox.com. Copyright © u-blox AG.

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Contents
Document information ................................................................................................................................ 2 Contents .......................................................................................................................................................... 3
System description...............................................................................................................................6
1.1 Overview ........................................................................................................................................................ 6 1.2 Architecture ................................................................................................................................................. 7
1.2.1 Block diagrams .................................................................................................................................... 7 1.3 CPU................................................................................................................................................................. 8 1.4 Operating modes......................................................................................................................................... 8
1.4.1 Power modes ....................................................................................................................................... 8 1.4.2 Low power modes with LPO.............................................................................................................. 9 1.5 Supply interfaces ......................................................................................................................................10 1.5.1 Module supply design (VCC)...........................................................................................................10 1.5.2 Digital I/O interfaces reference voltage (VCC_IO) ......................................................................10 1.5.3 VCC application circuits ..................................................................................................................10 1.6 System function interfaces ....................................................................................................................11 1.6.1 Boot strapping pins ..........................................................................................................................11 1.7 Data interfaces ..........................................................................................................................................11 1.7.1 Universal asynchronous serial interface (UART) .......................................................................11 1.7.2 Ethernet (RMII+SMI) ........................................................................................................................12 1.7.3 Serial peripheral interface (SPI) .....................................................................................................14 1.8 Antenna interfaces ...................................................................................................................................14 1.8.1 Antenna pin NINA-W1x1 ..............................................................................................................14 1.8.2 NINA-W1x2 and W1x6 integrated antennas ..............................................................................15 1.9 Reserved pins (RSVD) ..............................................................................................................................15 1.10 GND pins .....................................................................................................................................................15
Software ................................................................................................................................................ 16
2.1 NINA-W13 and NINA-W15 u-connectXpress software ....................................................................16 2.1.1 u-connectXpress software debug output....................................................................................17
2.2 s-center evaluation software..................................................................................................................17 2.3 SDK for open-CPU modules ....................................................................................................................17 2.4 Updating NINA-W13 and NINA-W15 software...................................................................................17
2.4.1 Introduction .......................................................................................................................................18 2.4.2 Prerequisites......................................................................................................................................18 2.4.3 Required information for upgrade.................................................................................................18 2.4.4 Updating software using bootloader interface ..........................................................................19 2.4.5 Updating software with AT commands .......................................................................................21 2.5 Developing and flashing NINA-W10 open-CPU software .................................................................22 2.5.1 Set up Toolchain and ESP-IDF v4 source files ............................................................................23 2.5.2 Setup path to ESP-IDF.....................................................................................................................23 2.5.3 Build and flash ...................................................................................................................................24 2.5.4 ESP-IDF Partition Table...................................................................................................................25 2.5.5 Automatic bootloader on NINA-W10 EVK ...................................................................................25

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2.6 Arduino support for NINA-W10..............................................................................................................25 2.6.1 Downloading the Arduino IDE.........................................................................................................25 2.6.2 Downloading from the GIT repository...........................................................................................26 2.6.3 Downloading the toolchain .............................................................................................................27
2.7 Output power configuration ...................................................................................................................30 2.7.1 NINA-W10 series ..............................................................................................................................30 2.7.2 NINA-W13/W15 series ....................................................................................................................30
2.8 NINA-W10 OTP and production information ......................................................................................30
Design-in................................................................................................................................................ 31
3.1 Overview ......................................................................................................................................................31 3.2 Supply interfaces ......................................................................................................................................31
3.2.1 Module supply (VCC) design...........................................................................................................31 3.2.2 Digital I/O interfaces reference voltage (VCC_IO) ......................................................................32 3.3 Antenna interface .....................................................................................................................................32 3.3.1 RF transmission line design (NINA-W1x1) ..................................................................................32 3.3.2 Antenna design (NINA-W1x1)........................................................................................................34 3.3.3 On-board antenna design ...............................................................................................................37 3.4 Data communication interfaces ............................................................................................................39 3.4.1 Asynchronous serial interface (UART) design............................................................................39 3.4.2 Ethernet (RMII+SMI) ........................................................................................................................39 3.5 General high-speed layout guidelines ...................................................................................................39 3.5.1 General considerations for schematic design and PCB floor-planning .................................40 3.5.2 Module placement ............................................................................................................................40 3.5.3 Layout and manufacturing .............................................................................................................40 3.6 Module footprint and paste mask .........................................................................................................41 3.7 Thermal guidelines ...................................................................................................................................41 3.8 ESD guidelines ...........................................................................................................................................41
Handling and soldering ..................................................................................................................... 43
4.1 ESD handling precautions .......................................................................................................................43 4.2 Packaging, shipping, storage, and moisture preconditioning .........................................................43 4.3 Reflow soldering process.........................................................................................................................44
4.3.1 Cleaning ..............................................................................................................................................45 4.3.2 Other remarks ...................................................................................................................................45
Approvals............................................................................................................................................... 46
5.1 General requirements ..............................................................................................................................46 5.2 FCC/IC End-product regulatory compliance........................................................................................46
5.2.1 NINA-W101 and NINA-W102 FCC ID and IC certification number ........................................46 5.2.2 NINA-W13/W15 series FCC ID and IC certification number ....................................................46 5.2.3 Antenna requirements ....................................................................................................................47
Product testing ................................................................................................................................... 48
6.1 u-blox in-line production test..................................................................................................................48 6.2 OEM manufacturer production test .....................................................................................................49
6.2.1 "Go/No go" tests for integrated devices ......................................................................................49
Appendix ....................................................................................................................................................... 50

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A Glossary ................................................................................................................................................. 50 B Updating software using s-center ................................................................................................ 51 Related documents ................................................................................................................................... 53 Revision history .......................................................................................................................................... 54 Contact.......................................................................................................................................................... 56

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System description

1.1 Overview

The NINA-W1 series of wireless and multiradio MCU IoT is suitable for industrial markets where security is important. NINA-W1 includes the following stand-alone modules:

Model

Description

NINA-W13 series

Wireless MCU modules integrate a powerful microcontroller (MCU) and a Wi-Fi radio for wireless communication. NINA-W13x modules come with pre-flashed application software and support 802.11b/g/n in the 2.4 GHz ISM band. Host systems set up and control the modules through an AT command interface to reduce the time and complexity of including Wi-Fi connectivity into your application designs. NINA-W13x modules offer top-grade security with secure boot functionality that ensures that applications start only with the original u-blox software, u-connectXpress.

NINA-W10 series

Multiradio MCU modules integrate a powerful microcontroller (MCU) and radio for wireless communication. With open CPU architecture, NINA-W10 series modules are ideal for advanced applications that run on dual core 32-bit MCUs. The radio provides support for Wi-Fi 802.11b/g/n in the 2.4 GHz ISM band, Bluetooth BR/EDR, and Bluetooth low energy communication. Leveraging integrated cryptographic hardware accelerators, NINA-W10 series modules offer top-grade security capable of secure boot.

NINA-W15 series

NINA-W15x modules have similar performance as NINA-W10x modules but come with pre-flashed application software. Serving as a multiradio gateway, these modules provide support for Wi-Fi 802.11b/g/n and dual-mode Bluetooth (Bluetooth BR/EDR low energy v4.2). Host systems set up and control the modules through an AT command interface to reduce the time and complexity of including Wi-Fi connectivity into your application designs. NINA-W15x series modules offer top-grade security with secure boot functionality that ensures that applications start only with the original u-blox software, u-connectXpress.

The modules are qualified for professional grade and support an extended temperature range of 40 °C to +85 °C.

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1.2 Architecture
1.2.1 Block diagrams

PIFA antenna
(NINA-W132)

Linear voltage regulators

ANT
(NINA-W131)

BPF

Wi-Fi baseband

Cryptographic hardware
accelerations
EFUSE
ROM

PLL

SRAM (4Mbit)

40 MHz

Quad SPI
Flash (16 Mbit)

Figure 1: NINA-W13 series block diagram

2xXtensa 32-bit LX6 MCU IO buffers

VCC (3.0-3.6 V)
VCC_IO Reset UART GPIO RMII SPI

PIFA antenna (NINA-W102)

ANT (NINA-W101)

BPF*

(NINA-W106) PCB trace antenna

Linear voltage regulators

2xXtensa 32-bit LX6 MCU IO buffers

Wi-Fi baseband RF Bluetooth Baseband
Cryptographic hardware
accelerators
EFUSE

ROM

PLL
40 MHz

SRAM (4Mbit)
Quad SPI
Flash (16/32/64 Mbit)**

VCC (3.03.6 V)
VCC_IO Reset UART GPIO RMII I2C SPI Quad SPI SDIO CAN JTAG ADC/DAC LPO

* Only on NINA-W101 and NINA-W102. ** 16 Mbit NINA-W101 and NINA-W102; 32 Mbit NINA-W106-00B; 64Mbit NINA-W106-10B
Figure 2: NINA-W10 series block diagram

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PIFA antenna
(NINA-W152)

ANT
(NINA-W151)

BPF*

(NINA-W156) PCB trace antenna

Linear voltage regulators
Wi-Fi baseband RF
Wi-Fi baseband
Cryptographic hardware
accelerations
EFUSE
ROM

PLL

SRAM (4Mbit)

40 MHz

Quad SPI
Flash (16 Mbit)

2xXtensa 32-bit LX6 MCU IO buffers

VCC (3.0-3.6 V) VCC_IO Reset UART GPIO RMII SPI
LPO**

* Only on NINA-W152 and NINA-W152 ** Only on NINA-W156. Support in u-connectXpress pending implementation
Figure 3: NINA-W15 series block diagram
1.3 CPU
NINA-W1 series modules use a dual-core system that includes two Harvard Architecture Xtensa LX6 CPUs with maximum 240 MHz internal clock frequency. The internal memory of NINA-W1 supports:
· 448 kB ROM for booting and core functions · 520 kB SRAM for data and instruction · 16 or 32 Mbit FLASH memory for code storage, including hardware encryption to protect programs
and data. · 1 kbit EFUSE (non- erasable memory) for MAC addresses, module configuration, flash-encryption,
and Chip-ID.
Open CPU variants (NINA-W10) also support external FLASH and SRAM memory through a Quad SPI interface.
1.4 Operating modes
1.4.1 Power modes
NINA-W1 series modules are power efficient devices capable of operating in different power saving modes and configurations. Different sections of the modules can be powered off when they are not needed, and complex wake up events can be generated from different external and internal inputs.
For details on the available power modes, see the data sheet for the corresponding module [2] [3] [4].

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1.4.2 Low power modes with LPO
An external 32.768 kHz LPO (Low Power Oscillator) signal is required for NINA-W10 series modules to enable the lowest possible power consumption, frequency stability, and RTC accuracy in the various ESP32 sleep and hibernate modes.
Support for LPO in u-connectXpress is pending implementation.
On NINA-W106 series modules, the LPO can be implemented using an external oscillator. The oscillator must be connected to the LPO_IN signal on pin 5. Also, a > 200 nF capacitor must be placed between pin 7 and ground. The amplitude range is 0.6 V < Vpp < VCC. If the input signal is square wave, the bottom voltage should be higher than 200 mV.
Pin 7 cannot be used as GPIO when LPO is used on NINA-W106 series modules.
For more information on the LPO, see the Espressif ESP32 datasheet [12], Espressif ESP32 Technical reference manual [13], and Espressif ESP32 Hardware design guidelines [14].
On NINA-W101 and NINA-W102, the functions of pin 5 and pin 7 are reversed.
It is possible to wake-up the module using several methods, out of which "wake-up on external GPIO" requires attention.
On NINA-W10 series modules, isolate the ESP32 GPIO pin 12 using rtc_gpio_isolate() to avoid current leakage prior to the invocation of esp_deep_sleep_start():
void cbPWR_MGR_enterDeepSleep() {
rtc_gpio_isolate(GPIO_NUM_12); esp_deep_sleep_start(); }
The rtc_gpio_isolate() function disables input, output, pullup, pulldown, and enables the hold feature for an RTC I/O pin. Use this function if any other RTC I/O pin also needs to be disconnected from ESP32-internal circuits in deep sleep and hibernation modes. Disconnecting minimizes leakage currents. The use of this function is typically necessary when an external pull-up or pull-down is used on a pin that also contains a pull-up or pull-down.
In other cases, it might be possible to manually use the internal pull-ups and pull-downs of the ESP32 using the specific enable/disable functions, followed by rtc_gpio_hold_en().
void cbPWR_MGR_enterDeepSleep() {
rtc_gpio_set_direction(EXT_WAKEUP_1_GPIO, RTC_GPIO_MODE_INPUT_ONLY); rtc_gpio_pullup_dis(EXT_WAKEUP_1_GPIO); rtc_gpio_pulldown_en(EXT_WAKEUP_1_GPIO); rtc_gpio_hold_en(EXT_WAKEUP_1_GPIO); esp_deep_sleep_start(); }
The rtc_gpio_hold_en()preserves the last known value during deep sleep and hibernate modes.
See the Espressif ESP32 data sheet [12] for more information about ESP32-internal circuits and external GPIOs capable of waking up the module.
The power consumption in the various sleep modes is affected by the RTC clock source. Define the appropriate RTC clock source, used during the sleep modes, by setting the CONFIG_ESP32_RTC_CLK_SRC configuration option accordingly.

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When using an LPO, also enable boot-time calibration by setting CONFIG_ESP32_RTC_CLK_CAL_CYCLES to at least 3000. The higher the number, the better accuracy, on the expense of boot time.
Frequency stability and system time accuracy is decreased when using sleep modes. To increase accuracy, use an LPO and enable both high-resolution and RTC timers by setting CONFIG_ESP32_TIME_SYSCALL accordingly.
If the ULP (ultra-low-power) co-processor is not required, the ULP functionality can be disabled by unsetting the CONFIG_ESP32_ULP_COPROC_ENABLED option.
If the LPO detection fails, increase the CONFIG_ESP32_RTC_XTAL_CAL_RETRY option.
If "flash read err, 1000" messages are printed to the console after deep sleep reset, increase the CONFIG_ESP32_DEEP_SLEEP_WAKEUP_DELAY value from its default 2000 µs.
See the Espressif ESP32 SDK [8] for more information on how these, and additional configuration options and API functions, affect power consumption, frequency stability, and boot-time behavior.
1.5 Supply interfaces
1.5.1 Module supply design (VCC)
NINA-W1 series modules include an integrated Linear Voltage converter that transforms the supply voltage. The output of the converter, presented at the VCC pin, provides a stable system voltage.
1.5.2 Digital I/O interfaces reference voltage (VCC_IO)
NINA-W1 series modules include an additional voltage supply input for setting the I/O voltage level.
A separate VCC_IO pin enables module integration in many applications with different voltage supply levels (1.8 V or 3.3 V for example) without level converters. NINA-W1 series modules currently support 3.3 V IO levels only.
1.5.3 VCC application circuits
The power for NINA-W1 series modules is applied through the VCC pins. These supplies are taken from either of the following sources:
· Switching Mode Power Supply (SMPS) · Low Drop Out (LDO) regulator
An SMPS is the ideal design choice when the available primary supply source is of a higher value than the operating supply voltage of the module. This offers the best power efficiency for the application design and minimizes the amount of current drawn from the main supply source.
When taking VCC supplies from an SMPS make sure that the AC ripple voltage is kept as low as
possible at the switching frequency. Design layouts should focus on minimizing the impact of any high-frequency ringing.
Use an LDO linear regulator for primary VCC supplies that have a relatively low voltage. As LDO linear regulators dissipate a considerable amount of energy, LDOs are not recommended for the step down of high voltages.
DC/DC efficiency should be regarded as a trade-off between the active and idle duty cycles of an application. Although some DC/DC devices achieve high efficiency at light loads, these efficiencies typically degrade as soon as the idle current drops below a few milliamps. This can have a negative impact on the life of the battery.

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If decoupling capacitors are needed on the supply rails, it is best practice to position these as close as possible to the NINA-W1 series module. The power routing of some host system designs makes decoupling capacitance unnecessary.
For electrical specifications, refer to the appropriate NINA-W1 series data sheet [2] [3] [4].

1.6 System function interfaces

1.6.1 Boot strapping pins

There are several boot configuration pins available on the module that must be set correctly during boot, or the module may not boot properly. Table 1 shows the condition of the bootstrap signals that determine the behavior of the module during the system startup.

Boot strap pins are configured to the default state internally on the module and must NOT be

configured externally, unless otherwise stated.

State during boot Default

Behavior

Description

Pull-up

ESP boot mode (factory boot) Normal Boot from internal Flash

ESP Factory boot Mode/RMII clock line.

Pull-up

Silent UART0 TXD Toggling

Printout on UART0 TXD during boot

VDD_SDIO=3.3V (Not allowed)

Internal flash voltage

10 k pull-up

VDD_SDIO=1.8V

(VDD_SDIO should always be at 1.8 V)

Table 1: NINA-W1 series boot strapping pins

Additional requirements apply to pin 27, depending on the intended use-case for the module:
o On NINA-W13/W15 modules, pin 27 must be in default state during the boot. o Care must be taken if an RMII interface is to be included in the application design. As pin 27
connect to the RMII, it is important that the pin is in the correct state during the module boot and before the RMII interface turns on. See also RMII Startup precautions. o On NINA-W10 modules, pin 27 is used to enter the ESP bootloader. Consequently, this pin must be exposed on a pin header (or similar) to flash the module.
During boot, pin 32 controls if additional system information should be transmitted on the UART
interface during startup. After the system has booted, it is reconfigured to SPI_CS, the SPI chip select signal.
During boot, pin 36 controls the voltage level of the internal flash during startup. After the system
has booted, it is reconfigured to SPI_MISO, the SPI slave data output signal. It must NOT be pulled down by an external MCU or circuitry.

For the timing and algorithm for the detection of the SPI and RMII interfaces, see also the "Data and command interfaces" section in the NINA-W13 and NINA-W15 data sheets [2] [4].

1.7 Data interfaces

1.7.1 Universal asynchronous serial interface (UART)
For data communication and firmware upgrade purposes, NINA-W1 series modules support an interface comprised of three UARTs. Each UART supports the following signals:
· Data lines (RXD as input, TXD as output) · Hardware flow control lines (CTS as input, RTS as output) · DSR and DTS set and indicate the system modes

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You can use the UARTs in 4-wire mode with hardware flow control, or in 2-wire mode with TXD and RXD only. In 2-wire mode, CTS must be connected to the GND on the NINA-W1 module.
2-wire mode is not recommended because it is prone to buffer overruns.
The UART interface is also be used for firmware upgrade. See also Software.
The u-connectXpress software adds the DSR and DTR pins to the UART interface. Although these pins are not used as they were originally intended, these control the state of NINA modules.
Depending on the configuration, DSR can be used to:
· Enter command mode · Disconnect and/or toggle connectable status · Enable/disable the UART interface · Enter/leave STOP mode
The functionality of the DSR and DTR pins are configured by AT commands. For further information about these commands, see also the u-connectXpress AT commands manual [1].
Typical UART interface characteristics are described in data sheet references [2] [3] [4].

Interface

Default configuration

UART interface Table 2: UART port default settings

115200 baud, 8 data bits, no parity, 1 stop bit, and hardware flow control

It is recommended that the UART is either connected to a header for firmware upgrade or made available for test points.

The IO level of the UART follows VCC_IO.

1.7.2 Ethernet (RMII+SMI)

NINA-W13 only supports Reduced Media-independent Interface (RMII) from software version
2.0.0 onwards.
NINA-W1 series modules include a full RMII for Ethernet MAC to PHY communication over the Station Management Interface (SMI). RMII and SMI use nine signals in total. The RMII and SMI interfaces require an external 50 MHz clock source either from a compatible PHY chip or from an external oscillator.
The two-wire SMI is used to configure the PHY chip. It uses a clock line and a data line to setup the internal registers on PHY chip.
The pin multiplexing of the RMII interface imposes limitations in the functionality of NINA-W13/W15 series module when using the interface. The following functions are turned off when RMII communication is initiated:
· Red, Green and Blue LEDs are disabled · UART is run without flow control as CTS and RTS functionality is disabled. In this case, CTS must
not be connected to ground. · DSR and DTR functionality is disabled
The following resistors must be added to enable RMII support:
· 1 k pull up to RMII_MDIO pin · 4.7 k pull up to RMII_CRSDV pin · 10 series resistors for all RMII/SMI pins

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1.7.2.1 RMII Startup precautions
The RMII_CLK input (GPIO27) is multiplexed with the ESP boot pin. Therefore, to ensure that the boot mode is not entered inadvertently, the RMII_CLK (GPIO27) must be held high during boot for at least 1.5 ms.
When using u-connectXpress, the RMII_CLK pin is monitored during boot. The u-connectXpress software checks the availability of the clock signal 1.2 s after boot. You must make sure to that the RMII_CLK signal is available at that time to enable the RMII interface. The clock signal can be enabled beforehand, but only if the requirement to avoid entering the ESP boot mode is not interfered with.
On EVK-NINA-W1, these startup precautions are implemented using two buffers and a RC delay circuit that override the RMII clock from the PHY. This delays the clock so that it starts a short time (50 ms) after the module boot.

Figure 4: EVK-NINA-W1 RMII clock delay circuit
1.7.2.2 MAC to PHY connection
When connecting NINA-W1 series modules to an external PHY circuit, both the RMII and SMI interfaces must be connected. The default PHY address (0x1) must be configured on the PHY side. Follow the recommendations of your chosen PHY chip supplier for implementation details. An example of a PHY implementation is shown in Figure 5. PHY KSZ8081 is recommended and is used on the EVK-NINA-W1.

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Figure 5: EVK-NINA-W1 Ethernet PHY implementation
1.7.2.3 MAC to MAC connection
When connecting NINA-W1 series modules using a direct MAC to MAC connection, the SMI interface can be left unconnected. Depending on the routing of the RMII interface on the host PCB, termination resistors can also be needed.
An external 50 MHz oscillator is needed while running a MAC-to-MAC connection.
1.7.3 Serial peripheral interface (SPI)
NINA-W13 and NINA-W15 modules support SPI from software version 3.0.0 onwards.
In addition to UART support, NINA-W13 and NINA-W15 modules also include a Serial Peripheral Interface (SPI) for data communication. The module acts as an SPI slave.
The following SPI signals are available: · Chip select as input (SPI_CS) · Data lines (SPI_MOSI as input, SPI_MISO as output) · Clock (SPI_SCLK as input) · Optional hardware flow control lines (SPI_NORX and SPI_DRDY as output)
For details on SPI operation, see also the u-connectXpress SPI peripheral protocol specification [10].
1.8 Antenna interfaces
Antenna interfaces are different for each module variant in the NINA-W1 series.
1.8.1 Antenna pin NINA-W1x1
NINA-W1x1 modules are equipped with an RF pin. The pin has a nominal characteristic impedance of 50 and must be connected to the antenna through a 50 transmission line. This allows reception of radio frequency (RF) signals in the 2.4 GHz frequency band.
Choose an antenna with optimal radiating characteristics for the best electrical performance and overall module functionality. An internal antenna, integrated on the application board or an external antenna connected to the application board through a proper 50 connector, can be used.
When using an external antenna, the PCB-to-RF-cable transition must be implemented using either a suitable 50 connector, or an RF-signal solder pad (including GND) that is optimized for 50 characteristic impedance.

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1.8.1.1 Antenna matching
The antenna return loss should be as low as possible across the entire band when the system is operational to provide optimal performance. The enclosure, shields, other components, and surrounding environment impacts the return loss that is seen at the antenna port. Matching components are often required to retune the antenna to 50 characteristic impedance.
It is difficult to predict the actual matching values for the antenna in the final form factor. Therefore, it is good practice to have a placeholder in the circuit with a "pi" network, with two shunt components and a series component in the middle. This allows maximum flexibility while tuning the matching to the antenna feed.
1.8.1.2 Approved antenna designs
NINA-W1 modules come with a pre-certified design that can be used to save costs and time during the certification process. To take full advantage of this service, you must implement the antenna layout in accordance with u-blox reference designs. Reference designs are available on request from u-blox.
The designer integrating a u-blox reference design into an end-product is solely responsible for any unintentional emission levels produced by the end product.
The module may be integrated with other antennas. In which case, the OEM installer must certify the design with respective regulatory agencies.
1.8.2 NINA-W1x2 and W1x6 integrated antennas
To simplify integration, NINA-W1x2 and W1x6 modules are equipped with an integrated antenna. An integrated antenna design means there is no need for an RF trace design on the host PCB. This means less effort is required in the test lab.
NINA-W1x2 modules use an internal metal sheet PIFA antenna, while the NINA-W1x6 modules are equipped with a PCB trace antenna that is based on technology licensed from Proant AB.
1.9 Reserved pins (RSVD)
Do not connect the reserved (RSVD) pin. Reserved pins are allocated for future interfaces and functionality.
1.10 GND pins
Good electrical connection of module GND pins, using solid ground layer of the host application board, is required for correct RF performance. Firm connections provide a thermal heat sink for the module and significantly reduce EMC issues.

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Software
2.1 NINA-W13 and NINA-W15 u-connectXpress software
NINA-W13/W15 stand-alone modules are delivered with embedded u-connectXpress software.
Using industry-standard AT commands, this is the software that manages the combination of Bluetooth, Bluetooth Low Energy and Wi-Fi connectivity supported in NINA-W13 and NINA-W15 standalone modules, specifically: · Wi-Fi (NINA-W13 and NINA-W15) · Bluetooth (NINA-W15) · Bluetooth Low Energy (NINA-W15) For information about the features, capabilities, and use of u-connectXpress software, see the u-connectXpress AT commands manual [1] and u-connectXpress user guide [6]. Typical examples of the applications and use cases supported by NINA-W13 and NINA-W15 series modules include:
· Gateway connection of Bluetooth low energy sensors to the cloud over Wi-Fi or Ethernet · Bridge communication over serial, Wi-Fi, PPP, or Ethernet interfaces · Wi-Fi hotspot connection using Local Area Network or Tethering · Device configuration using Bluetooth or Wi-Fi connected smartphones · Secure cloud connection using TLS and MQTT protocols Figure 6 shows the structure of the embedded u-connectXpress software delivered in NINA-W13 and NINA-W15 standalone modules.

Figure 6: NINA-W13/W15u-connectXpress software structure

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2.1.1 u-connectXpress software debug output
To accommodate debug support, NINA-W1 u-connectXpress software allows extra logs to be printed on the DBG_TXD pin. The output is disabled by default. This pin must be made available for u-blox to perform extended debugging of the module should the need arise.
2.2 s-center evaluation software
u-blox s-center client software provides a convenient tool with which to configure u-blox standalone modules. It runs on PCs running Windows XP onwards (x86 and x64), with Net Framework 4.5 or later, and is available for download at www.u-blox.com. For further information about how to use this tool, see also the s-center user guide [8].
2.3 SDK for open-CPU modules
As NINA-W10 open-CPU modules are delivered without flashed software, you develop your application design using the utilities and device-level APIs supported by the module chipset supplier. The ESP-IDF Software Development Kit is available from the Expressif website. It bundles the Wi-Fi stack and the broad range of drivers and libraries necessary for building your development environment. See also Output power configuration. Figure 7 shows the architecture of NINA-W10 open-CPU software in relation to the MCU, transceiver and ESP-IDF SDK.

Figure 7: NINA-W10 open CPU software
2.4 Updating NINA-W13 and NINA-W15 software
NINA-W13 and NINA-W15 u-connectXpress software includes a bootloader for flashing the module over the UART interface. The software is available for download from the respective product page [19][20].

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2.4.1 Introduction
Distributed in a single ZIP container, u-connectXpress includes binary connectivity software, a file signature, and one JSON file that includes the software label, software description, file name, version, flash address, image size, image id, file permissions, and signature file reference for the software files:
· JavaScript Object Notation: NINA-W1XX-CF-<version>.json. For example: NINA-W15X-CF-1.0.json
· ConnectivitySoftware: NINA-W10X-SW-x.y.z-<build>.bin. For example: NINA-W15X-SW-4.0.0-006.bin
· Signature file: NINA-W1XX-SI-x.y.z-<build>.txt. For example: NINA-W15X-SI-4.0.0-006.txt
You can send AT commands and download software to NINA-W13 and NINA-W15 over the serial
interface, using any terminal emulator software that supports XMODEM, like TeraTerm or ExtraPuTTy. Alternatively, you can use the s-center software, see Appendix B. All examples in this section have been created and tested on EVK-NINA-W15 using TeraTerm.
It is possible for the target device to implement XMODEM support in the connected MCU to perform the software update through the MCU. Alternatively, the device can use some sort of UART passthrough function from the host.
Refer to the u-connectXpress AT command manual [1] and Bootloader protocol specification [11] for more information about the AT commands and boot loader commands used.
2.4.2 Prerequisites
The following pins should be made available as either headers or test points to flash the module:
· UART (RXD, TXD) · RESET_N (optional, needed for Updating software using bootloader interface) · SWITCH_1 and SWITCH_2 (optional, needed for Updating software using bootloader interface)
To enable re-programming of the module, UART signals connected to host must not interfere with
the flashing procedure. UART pins must be put in tri-state by host or have the possibility to disconnect completely.
The bootloader must be running when the software is downloaded to the module. You start the bootloader by either:
· Driving the SWITCH_1 and SWITCH_2 signals low simultaneously during a module reset, initiated by setting RESET_N low, and then updating the software through the bootloader interface (preferred option). See also Updating software using bootloader interface.
· Entering the Update software command AT+UFWUPD together with parameters defined int the ConnectivitySoftware and JSON file. See also Updating software with AT commands.
UART hardware flow is not used for updating software. The file download uses standard
XMODEM-CRC16 protocol and 128 bytes packets.
2.4.3 Required information for upgrade
To get the necessary information for executing the software upgrade, you must open the JSON file included in the download container and make note of the defined values to be use during the update. You also need to copy the signatures given in the related txt files, as shown in Figure 8. This information is needed during the install.

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[ { "Label": "ConnectivitySoftware", "Description": "NINA-W15X u-blox connectivity software", "File": "NINA-W15X-SW-4.0.0-006.bin", "Version": "NINA-W15X-SW-4.0.0-006", "Address": "0x20000", "Size": "0x12F1E0", "Id": "0x0", "Permissions": "rwx", "SignatureFile": "NINA-W15X-SI-4.0.0-006.txt" }
]
Figure 8: Defined values for Connectivity Software shown in the JSON file
Z2f8x9cJbR1vMWkqg5o33KaIX1KwWe9L31y1Mw55ubtvXLcGwfN/RlSIAeaGZNfnQumLqKckY6+/krmjtM aYz3EHqhOa5gTCikjw0FrY4YumAsCXUOpqc1FFQtfKO5M+8tBMaVRM3LlNpsbRkixs3Gvkb1mBiP4NLG8C lGNgH6eW/8wPtQN1SV17Ctd6lNSM2uX+P36lXxKxeXudgqTzjFdy4/+n7Qz20OuCLlYKEytQqPGNxLsyP6 /efjznMc2+HQn1tUg6huKny2lE3pOpOkvgopYcqT2UD3s3xgKFsTlazMbn+CWpd51VfKECZX+nBJu65uCO X2uCQy3F+EdQfA==
Figure 9: Typical Connectivity Software signature file
2.4.4 Updating software using bootloader interface
For more information about the commands described in this section, see also the bootloader
protocol specification [11].
1. Connect the supplied USB cable from the J8 connector on EVK-NINA-W15 to the USB port your computer. For more information about setting up EVK-NINA-W15, see also the EVK-NINA-W1 user guide [7].
2. Download and unzip the latest u-connectXpress software. 3. Discover the COM port number for the USB Serial Port on your computer (MS Windows:
Start>Device Manager>Ports). See also "Setting up the evaluation board" in the EVK-NINA-W1 user guide [7]. 4. Start your chosen terminal emulator and open the connection to the USB serial port (COMx). Setup the serial port and connection. Use settings 115200, 8-N-1, no flow control.

Figure 10 Teraterm serial port dialog
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5. Enter Software version identification AT+GMR command to find out the current version of your u-connectXpress software.
AT+GMR "2.0.0-025" OK
6. Enter boot loader mode by holding SW1+SW2 low during module reset. Type something on the boot loader prompt to stop auto boot. For further information about the module reset, see also the data sheet [2] [3] [4].

> ?

NINA-W13/B2/W15 boot loader 3.0.0 u-blox All parameters in HEX format

? b <image_id>||<image_addr> image s <image_id> <base64_encoded_signature> signature f <image_id> firmware, rewrite boot database e <start_addr> <size> d <start_addr> <size> i x <to_addr> <image_size> <image_name> <permissions> <image_id> using xmodem, erase+program memory r <baud_rate> q h <start_addr> <size> memory l images v information

Help Boot (execute)
Store image
Set startup
Erase flash memory Dump memory Get information Download image
Set baud rate Watchdog reset Dump hash of
List all firmware
Get version

OK >

7. Download the signature from the signature file
> s 0 Z2f8x9cJbR1vMWkqg5o33KaIX1KwWe9L31y1Mw55ubtvXLcGwfN/RlSIAeaGZNfnQumLqKckY6+/krmjtM aYz3EHqhOa5gTCikjw0FrY4YumAsCXUOpqc1FFQtfKO5M+8tBMaVRM3LlNpsbRkixs3Gvkb1mBiP4NLG8C lGNgH6eW/8wPtQN1SV17Ctd6lNSM2uX+P36lXxKxeXudgqTzjFdy4/+n7Qz20OuCLlYKEytQqPGNxLsyP6 /efjznMc2+HQn1tUg6huKny2lE3pOpOkvgopYcqT2UD3s3xgKFsTlazMbn+CWpd51VfKECZX+nBJu65uCO X2uCQy3F+EdQfA==
OK >

8. Start the download

> x 20000 12F1E0 ConnectivitySoftware rwx 0 CCCCCCCC
NINA-W15 returns a series of "C" characters for as long as the bootloader is running and ready to receive the software update.

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9. While the bootloader is running, send the u-connectXpress NINA-W1XX-SW-4.0.0-0.006.bin file to NINA-W15. The file is sent using XMODEM protocol.

10. After flashing is finalized set the boot database and boot the board.
> f 0 OK > b 0

2.4.5 Updating software with AT commands
Command syntax You use the software update command AT+UFWUPD with following syntax to update the u-connectXpress software. AT+UFWUPD=<mode>,<baud_rate>[,<id>,<size>,<signature>,<name>,<flags>]

The defined values for each parameter are shown in Table 3.

Parameter <mode>

Type Enumerator

Enumerator Integer Integer

Description
Download mode: 0: Update mode for the ConnectivitySoftware through the serial port 1: Bootloader mode for updating through the serial port. (not supported by NINA-W1)
Baud rate in bits per second: 115200 (default), 230400, 460800, or 921600
ID number of the software image.
Size of the firmware image. Enter the size integer for the respective software as defined in the NINA-W1XX-SI-x.x.x-xxx.txt file. Shown in hex format in the JSON file but must entered as bytes in decimal notation in the command.

<signature> String

String String

RSA signature of the firmware image as base64-encoded string. Enter the 344-character text string defined in the NINA-W1XX-SI-x.x.x-xxx.txt file.
The name of the firmware. Maximum string length is 22.
Permissions for using the firmware image. Permission flags are marked in UNIX style: "rwx" is the default flag for the u-connectXpress software. "rw" is the default flag for other binary images.

Table 3: Defined values for update parameters

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Procedure
1. Open the serial port by following steps 1 to 5 in Updating software using bootloader interface. 2. Prepare the module to accept a binary file for download and start the bootloader at the
appropriate baud rate. Enter the Update software command AT+UFWUPD together with the ConnectivitySoftware values defined in the NINA-W15X-CF-<version>.json file and the signature in the NINA-W1XX-SI-x.x.x-xxx.txt file. The bootloader must be running when the software is "sent" to the module in the next step. Note particularly that <mode>=0. See also Prerequisites.
AT+UFWUPD=0,115200,0,1241568,Z2f8x9cJbR1vMWkqg5o33KaIX1KwWe9L31y1Mw55ubtvXLcGwfN/R lSIAeaGZNfnQumLqKckY6+/krmjtMaYz3EHqhOa5gTCikjw0FrY4YumAsCXUOpqc1FFQtfKO5M+8tBMaVR M3LlNpsbRkixs3Gvkb1mBiP4NLG8ClGNgH6eW/8wPtQN1SV17Ctd6lNSM2uX+P36lXxKxeXudgqTzjFdy4 /+n7Qz20OuCLlYKEytQqPGNxLsyP6/efjznMc2+HQn1tUg6huKny2lets Jul 29 2019 12:21:46FsTlazMbn+CWpd51VfKECZX+nBJu65uCOX2uCQy3F+EdQfA==,NINA-W15X-SW-4.0.0006,rwx
The module returns a series of "C" characters for as long as the bootloader is running and ready to receive the software update.
CCCCCCCCCCCCCCCCCCCCCCCCCC
3. While the bootloader is running, send the u-connectXpress NINA-W1XX-SW-4.0.0-0.006.bin file to NINA-W15. The file is sent using XMODEM protocol.

4. Once the binary file has been sent, NINA-W15 displays the greeting text +STARTUP. Enter the Software version identification AT+GMR command again to make sure that the latest software version is now installed. +STARTUP AT+GMR "3.0.0-005" OK
2.5 Developing and flashing NINA-W10 open-CPU software
In NINA-W10 modules, the following pins should be made accessible through a header or similar connector: · Mandatory:
o ESP_BOOT (GPIO27) · Additionally recommended:
o RESET_N

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As the u-connectXpress software embedded in NINA-W13/15 series modules is not available for use with the NINA-W10 open CPU series, you use Espressif SDK utilities and device-level APIs to develop your application hardware.
For the latest Espressif SDK documentation, see also reference [8]. This URL provides information on how to set up the software environment using the hardware based on the Espressif ESP32, such as NINA-W10. This resource also describes how to use the latest ESP-IDF (Espressif IoT Development Framework) which might have been changed since the publication of this document.
Use the following workflow setup to compile, flash, and execute a program on NINA-W10:
1. Setup Toolchain and ESP-IDF v4 source files. Windows, Mac, and Linux are supported. 2. Get ESP-IDF. Download the GIT repository provided by Espressif 3. Setup Path to ESP-IDF. The toolchain program can access the ESP-IDF using the IDF_PATH
environment variable 4. Build and Flash. Start a Project, Connect, Configure, Build and Flash a program
See also the ESP-IDF Programming Guide [17].
2.5.1 Set up Toolchain and ESP-IDF v4 source files
ESP-IDF v4 is mandatory for NINA-W106.
Follow the appropriate toolchain instructions to use ESP-IDF v4 for your development environment:
· Windows · Linux · Pip, homebrew and other macros
After installing the appropriate toolchain, install ESP-IDF using the Get ESP-IDF instructions on the Espressif web site. The toolchain for the ESP-IDF uses the IDF_PATH environment variable, which must be set up to build the toolchain projects.
The source files for Espressif ESP-IDF repository are located on github at:
https://github.com/espressif/esp-idf.
Building and flashing the examples in the ESP-IDF v4 is done in the same way as it is for ESP-IDF v3, but rather than using make the idf.py script is invoked instead. Generally, the same command-line parameters apply with the following caveats:
NINA-W106 modules with prototype status: On NINA-W106 prototype modules, it may be
necessary to add the --no-stub parameter to the esptool.py command when flashing the software. This parameter makes a manual verification of the software using a second invocation of esptool.py in case the flashing and verification procedure fails.
2.5.2 Setup path to ESP-IDF
The Toolchain and ESP-IDF v4 source files include the resources to install all the required tools. If you want to install the tools without the help of ESP-IDF Tools Installer, open the Command Prompt in Windows and use the following commands:
cd %userprofile%\esp\esp-idf install.bat esp32
The toolchain for the ESP-IDF uses the IDF_PATH environment variable. This variable must be set up for building the projects.
%userprofile%\esp\esp-idf\export.bat

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2.5.3 Build and flash
The environment is now ready to build and flash a project. Use the following procedure to build a sample project. This project prints out "Hello World" ten times on the UART and then reboots. 1. Build the sample project. Go to the "hello world" folder using the following command:
cd examples/get-started/hello_world
2. Plug in NINA-W10 to the PC and note down the com port number with which it is connected. In this example, the com port number is assumed to be "COM10".
3. Enter "idf.py menuconfig" to open the ESP-IDF configuration window. 4. In the ESP-IDF configuration window, select and modify the configuration options to suit your
environment. idf.py set-target esp32 idf.py menuconfig
5. In the following example, only the com port that is used to flash NINA-W10 is modified.

6. Exit the configuration window by pressing "Q" and confirm save the configuration. Now the project is ready to build.
7. Before building and flashing, prepare NINA-W10 to accept the downloaded file. Hold the BOOT button while resetting or powering on the board.
8. Use the following command to compile the application and all ESP-IDF components and generate the bootloader, partition table, and application binaries. After all files are compiled, the application is flashed to the port defined by "-p" and the series monitor starts.
Idf.py -p COM10 flash monitor
The idf.py command can be used on different variations with different arguments. For the full
options list, enter idf.py --help.
NINA-W101/NINA-W102: When running the command idf.py menuconfig, set the configuration
flag CONFIG_SPI_FLASH_USE_LEGACY_IMPL flag to Y. The application fails to start unless this flag is set.
NINA-W106: When running command idf.py menuconfig, set the CONFIG_BOOTLOADER_
VDDSDIO_BOOST_1_9V and CONFIG_SPI_FLASH_SUPPORT_ISSI_CHIP configuration flags to Y.

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2.5.4 ESP-IDF Partition Table

NINA-W1 flash can contain multiple apps, as well as different kinds of data (calibration data, file systems, bootloader, OTA, and so on). To specify the module flash size as well as which data is allocated in a specific section of the flash, the partition table is used.

When running "menuconfig" under "Partition Table" or CONFIG_PARTITION_TABLE_TYPE, few predefined options are available when configuring the project.

For example, "Single factory app, no OTA":

# ESP-IDF Partition Table

# Name, Type, SubType, Offset, Size,

nvs,

data, nvs,

0x9000, 0x6000,

phy_init, data, phy,

0xf000, 0x1000,

factory, app, factory, 0x10000, 1M,

Flags

At a 0x10000 (64 KB) offset in the flash is the app labelled "factory". The bootloader runs this app by default.

There are also two data regions defined in the partition table for storing NVS library partition and PHY init data.

If the preconfigured options do not include the suitable configuration for the project a custom partition scheme can also be set, where addresses and data type are defined. See also the Espressif Creating Custom Tables [16].

2.5.5 Automatic bootloader on NINA-W10 EVK

The "esptool.py" flash tool supports automatic entry to the bootloader on the NINA-W10 EVK without pressing the BOOT button and RESET the module. To use this functionality, you need to connect the following pins:
· RESET to IO19 (CTS) · IO0 (IO zero) to IO26 (DSR)
The jumpers CTS (J14-8) and DSR (J14-7) should also be removed so that they do not interfere.
It is not possible to use the Hardware Flow control or the DSR signals on the UART while using this
setup.
More information about esptool is available at https://github.com/espressif/esptool

2.6 Arduino support for NINA-W10
It is possible to use Arduino electronics platform on the NINA-W10. The Arduino platform and opensource community provides the possibility to access a lot of third-party hardware such as displays and sensors.
2.6.1 Downloading the Arduino IDE
Windows, Mac, and Linux environment are supported. The example below uses the Windows environment. Download the Arduino IDE using the URL https://www.arduino.cc/en/Main/Software.

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Figure 11: Arduino IDE install setup
Click Install button in the dialog box that pops up during installation as shown in Figure 12:

Figure 12: Install device software dialogs
Open the Arduino IDE - "C:\Program Files (x86)\Arduino\arduino.exe" and then close the program again. Do this to ensure that the folder is created correctly before downloading the Arduino files as mentioned in the next step. The Arduino IDE user folder is typically located in "C:\Users\user_name\Documents\Arduino"
2.6.2 Downloading from the GIT repository
Download from the URL - https://github.com/espressif/arduino-esp32.git The files should be placed in "C:\Users\user_name\Documents\Arduino\hardware\espressif\esp32" Open the "mingw32.exe" located in c:\msys32. The Arduino user folder is normally stored at "C:\Users\user_name\Documents\Arduino" Check if the hardware folder exists. If not, create the same by entering the following command:
mkdir hardware cd hardware

Check if the espressif folder exists; if not, create the same by entering the following command:
mkdir espressif cd espressif

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Now clone the repository to the folder esp32 folder. git clone --recursive https://github.com/espressif/arduino-esp32.git esp32

Figure 13: Cloning the Arduino Esp32 repository
2.6.3 Downloading the toolchain
Go to the folder - "C:\Users\user_name\Documents\Arduino\hardware\espressif\esp32\tools" to execute the program "get.exe". Double click on the "get.exe" to start the download. This will download the toolchain that is needed to build and flash the project. All the files are extracted on successful download.

Figure 14: Screenshot after selecting "get.exe"
Normally, it takes around 15-30 minutes to download this program.

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Figure 15: Sample screenshot during download
Open the Arduino application again from the following location: "C:\Program Files (x86)\Arduino\arduino.exe" In the Tools -> Board menu, select "ESP32 Dev Module" and then select the following: · Flash Mode: "DIO" · Flash Frequency: "40 MHz" · Flash Size: "2 MB (16 Mb)" · Upload Speed "921600" · Core Debug Level "Debug" (optional)

Figure 16: Screenshot that depicts selection of the ESP32 Dev Module
The NINA-W10 module will soon be added to the list of supported boards. Until then, use the
ESP32 Dev Module.

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Start the WiFiScan example, which is available at the following folder: C:\Users\ user_name \Documents\Arduino\hardware\espressif\esp32\libraries\WiFi\examples\WiFiScan Press the "->" (arrow) button highlighted in red in Figure 17) to start the upload to NINA-W10.

Figure 17: Screenshot that depicts the arrow at the top
Select Serial Monitor from the Tools menu as shown in Figure 18 to view the events.
Figure 18: Screenshot that depicts selection of the "Serial Monitor"
The Wi-Fi scan starts and displays the results, as shown in Figure 19.

Figure 19: Sample screenshot of the Wi-Fi scan

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2.7 Output power configuration
2.7.1 NINA-W10 series
To operate within the regulatory output power limits, the integrator must configure the module using the instructions given in this section. The following power configurations for Wi-Fi, Bluetooth BR/EDR, and Bluetooth low energy are only valid for the official esp-idf git repositories.
2.7.1.1 Wi-Fi output power configuration for version v4.0 and v4.3
The components required to perform the output power configuration and RF calibration are included (with examples) in the u-blox-sho-OpenCPU repository, under the product subfolder [15].
2.7.1.2 Bluetooth BR/EDR output power configuration
No output power configuration for Bluetooth BR/EDR is required. With default settings, the module operates at ~6 dBm, which is within the regulatory limit for NINA-W1.
2.7.1.3 Bluetooth low energy output power configuration
No output power configuration for Bluetooth low energy is required. Using the default settings, the module operates at ~6 dBm, which is within the regulatory limit for NINA-W1.
2.7.2 NINA-W13/W15 series
No output power configuration is required by the integrator. Using the u-connectXpress operates NINA-W1 within the regulatory limits.
2.8 NINA-W10 OTP and production information
As part of the manufacturing process, u-blox loads some information to the module for traceability and calibration purposes. Some of the information that can be retrieved includes:
· RF_FREQ_CALIBRATION: Measured in our production, and individual for all modules. · 4 u-blox MAC addresses: WiFI Station, WiFi AP, Ethernet, and Bluetooth. · UUID: Unique ID for the unit · SERIAL: Serial number of the module · TYPE_CODE: For example "NINA-W101-00B-00" For examples and information about the changes required to access the memory, see also the SHOOpenCPU GitHub [15].

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Design-in
3.1 Overview
For an optimal integration of NINA-W1 series modules in the final application board, it is recommended to follow the design guidelines stated in this chapter. Every application circuit must be properly designed to ensure the correct functionality of the related interface; however, a number of points require high attention during the design of the application device. The following list provides important points sorted by rank of importance in the application design, starting from the highest relevance: 1. Module antenna connection: Ant pad
Antenna circuit affects the RF compliance of the device integrating NINA-W1x1 modules with applicable certification schemes. For schematic and layout design recommendations, see also Antenna interface. 2. Module supply: VCC, VCC_IO, and GND pins
The supply circuit affects the performance of the device integrating NINA-W1 series module. For schematic and layout design recommendations, see also Supply interfaces.
3. High speed interfaces: UART pins High speed interfaces can be a source of radiated noise and can affect compliance with regulatory standards for radiated emissions. For schematic and layout design recommendations, see also Antenna interface.
4. System functions: RESET_N, GPIO and other System input and output pins Accurate design is required to ensure that the voltage level is well defined during module boot.
5. Other pins: Accurate design is required to ensure proper functionality.
3.2 Supply interfaces
3.2.1 Module supply (VCC) design
Good connection of the module's VCC pin with DC supply source is required for correct RF performance. The guidelines are summarized below:
· The VCC connection must be as wide and short as possible. · The VCC connection must be routed through a PCB area separated from sensitive analog signals
and sensitive functional units. It is a good practice to interpose at least one layer of the PCB ground between VCC track and other signal routing.
There is no strict requirement of adding bypass capacitance to the supply net close to the module. However, depending on the layout of the supply net and other consumers on the same net, bypass capacitors might still be beneficial. Though the GND pins are internally connected, connect all the available pins to solid ground on the application board, as a good (low impedance) connection to an external ground can minimize power loss and improve RF and thermal performance.

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3.2.2 Digital I/O interfaces reference voltage (VCC_IO)
Good connection of the module's VCC_IO pin with DC supply source is required for correct performance. The guidelines are summarized below:
· The VCC_IO connection must be as wide and short as possible. · The VCC_IO connection must be routed through a PCB area separated from sensitive analog
signals and sensitive functional units. It is a good practice to interpose at least one layer of PCB ground between VCC_IO track and other signal routing.
There is no strict requirement of adding bypass capacitance to the supply net close to the module. However, depending on the layout of the supply net and other consumers on the same net, bypass capacitors might still be beneficial. Though the GND pins are internally connected, connect all the available pins to solid ground on the application board, as a good (low impedance) connection to an external ground can minimize power loss and improve RF and thermal performance.
3.3 Antenna interface
As the unit cannot be mounted arbitrarily, the placement should be chosen with consideration so that it does not interfere with radio communication. The NINA-W1x2 and W1x6 modules with an internal surface mounted PIFA antenna or PCB trace antenna cannot be mounted in a metal enclosure. No metal casing or plastics using metal flakes should be used. Avoid metallic based paint or lacquer as well. NINA-W1x1 modules offer more freedom as an external antenna can be mounted further away from the module.
According to the FCC regulations, the transmission line from the module's antenna pin to the
antenna or antenna connector on the host PCB is considered part of the approved antenna design. Therefore, module integrators must either follow exactly one of the antenna reference design used in the module's FCC type approval or certify their own designs.
3.3.1 RF transmission line design (NINA-W1x1)
RF transmission lines, such as the ones from the ANT pad up to the related antenna connector or up to the related internal antenna pad, must be designed so that the characteristic impedance is as close as possible to 50 .
Figure 20 shows the design options and the main parameters to be considered when implementing a transmission line on a PCB:
· The micro strip (a track coupled to a single ground plane, separated by dielectric material) · The coplanar micro strip (a track coupled to the ground plane and side conductors, separated by
dielectric material) · The strip line (a track sandwiched between two parallel ground planes, separated by dielectric
material).

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Figure 20: Transmission line trace design
To properly design a 50 transmission line, the following remarks should also be considered:
· The designer should provide enough clearance from surrounding traces and ground in the same layer; in general, a trace to ground clearance of at least two times the trace width should be considered. The transmission line should also be `guarded' by ground plane area on each side.
· The characteristic impedance can be calculated as first iteration using tools provided by the layout software. It is advisable to ask the PCB manufacturer to provide the final values that are usually calculated using dedicated software and available stack-ups from production. It could also be possible to request an impedance coupon on panel's side to measure the real impedance of the traces.
· FR-4 dielectric material, although its high losses at high frequencies can be considered in RF designs provided that:
o RF trace length must be minimized to reduce dielectric losses.
o If traces longer than few centimeters are needed, it is recommended to use a coaxial connector and cable to reduce losses
o Stack-up should allow for thick 50 traces and at least 200 µm trace width is recommended to assure good impedance control over the PCB manufacturing process.
o FR-4 material exhibits poor thickness stability and thus less control of impedance over the trace length. Contact the PCB manufacturer for specific tolerance of controlled impedance traces.
· The transmission lines width and spacing to the GND must be uniform and routed as smoothly as possible: route RF lines in 45 °C angle or in arcs.
· Add GND stitching vias around transmission lines. · Ensure solid metal connection of the adjacent metal layer on the PCB stack-up to main ground
layer, providing enough vias on the adjacent metal layer. · Route RF transmission lines far from any noise source (as switching supplies and digital lines) and
from any sensitive circuit to avoid crosstalk between RF traces and Hi-impedance or analog signals. · Avoid stubs on the transmission lines, any component on the transmission line should be placed with the connected pad over the trace. Also avoid any unnecessary component on RF traces.

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Figure 21: Example of RF trace and ground design from NINA-W1 Evaluation Kit (EVK)
3.3.2 Antenna design (NINA-W1x1)
NINA-W1x1 is suited for designs when an external antenna is needed due to mechanical integration or placement of the module.
Designers must take care of the antennas from all perspective at the beginning of the design phase when the physical dimensions of the application board are under analysis/decision, as the RF compliance of the device integrating NINA-W1 module with all the applicable required certification schemes heavily depends on the radiating performance of the antennas. The designer is encouraged to consider one of the u-blox suggested antenna part numbers and follow the layout requirements.
· External antennas such as linear monopole: o External antennas basically do not imply physical restriction to the design of the PCB where the module is mounted. o The radiation performance mainly depends on the antennas. It is required to select antennas with optimal radiating performance in the operating bands. o RF cables should carefully be selected with minimum insertion losses. Additional insertion loss will be introduced by low quality or long cable. Large insertion loss reduces radiation performance. o A high quality 50 coaxial connector provides proper PCB-to-RF-cable transition.
· Integrated antennas such as patch-like antennas: o Internal integrated antennas imply physical restriction to the PCB design: Integrated antenna excites RF currents on its counterpoise, typically the PCB ground plane of the device that becomes part of the antenna; its dimension defines the minimum frequency that can be radiated. Therefore, the ground plane can be reduced down to a minimum size that should be similar to the quarter of the wavelength of the minimum frequency that has to be radiated, given that the orientation of the ground plane related to the antenna element must be considered. The RF isolation between antennas in the system must be as high as possible and the correlation between the 3D radiation patterns of the two antennas has to be as low as possible. In general, an RF separation of at least a quarter wavelength between the two antennas is required to achieve a maximum isolation and low pattern correlation; increased separation should be considered, if possible, to maximize the performance and fulfil the requirements described in Table 4.

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As a numerical example, the physical restriction to the PCB design can be considered as shown below: Frequency = 2.4 GHz Wavelength = 12.5 cm Quarter wavelength = 3.125 cm1 o Radiation performance depends on the whole product and antenna system design, including product mechanical design and usage. Antennas should be selected with optimal radiating performance in the operating bands according to the mechanical specifications of the PCB and the whole product.

Table 4 summarizes the requirements for the antenna RF interface:

Item Impedance Frequency Range Return Loss
Efficiency Maximum Gain

Requirements 50 nominal characteristic impedance 2400 - 2500 MHz S11 < -10 dB (VSWR < 2:1) recommended S11 < -6 dB (VSWR < 3:1) acceptable
> -1.5 dB ( > 70% ) recommended > -3.0 dB ( > 50% ) acceptable
Refer to Data sheet

Remarks
The impedance of the antenna RF connection must match the 50 impedance of the ANT pin.
Wi-Fi and Bluetooth.
The Return loss or the S11, as the VSWR, refers to the amount of reflected power, measuring how well the primary antenna RF connection matches the 50 characteristic impedance of the ANT pin. The impedance of the antenna termination must match as much as possible the 50 nominal impedance of the ANT pin over the operating frequency range, thus maximizing the amount of the power transferred to the antenna.
The radiation efficiency is the ratio of the radiated power to the power delivered to the antenna input; the efficiency is a measure of how well an antenna receives or transmits.
The maximum antenna gain must not exceed the value specified in type approval documentation to comply with the radiation exposure limits specified by regulatory agencies.

Table 4: Summary of antenna interface (ANT) requirements for NINA-W1x1

Observe the following recommendations while selecting external or internal antennas:
· Select antennas that provide optimal return loss (or VSWR) figure over all the operating frequencies.
· Select antennas that provide optimal efficiency figure over all the operating frequencies. · Select antennas that provide appropriate gain figure (that is, combined antenna directivity and
efficiency figure) so that the electromagnetic field radiation intensity does not exceed the regulatory limits specified in some countries (for example, by FCC in the United States).
3.3.2.1 RF Connector Design
If an external antenna is required, the designer should consider using a proper RF connector. It is the responsibility of the designer to verify the compatibility between plugs and receptacles used in the design.
Table 5 suggests several RF connector plugs that can be used by the designers to connect RF coaxial cables based on the declaration of the respective manufacturers. The Hirose U.FL-R-SMT RF receptacles (or similar parts) require a suitable mated RF plug from the same connector series. Due to wide usage of this connector, several manufacturers offer compatible equivalents.

1 Wavelength referred to a signal propagating over the air.

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Manufacturer Hirose I-PEX Tyco Amphenol RF Lighthorse Technologies, Inc.

Series

Remarks

U.FL® Ultra Small Surface Mount Coaxial Connector Recommended

MHF® Micro Coaxial Connector

UMCC® Ultra-Miniature Coax Connector

AMC® Amphenol Micro Coaxial

IPX ultra micro-miniature RF connector

Table 5: U.FL compatible plug connector

Typically, the RF plug is available as a cable assembly. Different types of cable assembly are available; the user should select the cable assembly best suited to the application. The key characteristics are:
· RF plug type: select U.FL or equivalent · Nominal impedance: 50 · Cable thickness: Typically, from 0.8 mm to 1.37 mm. Select thicker cables to minimize insertion
loss. · Cable length: Standard length is typically 100 mm or 200 mm; custom lengths may be available on
request. Select shorter cables to minimize insertion loss. · RF connector on the other side of the cable: For example, another U.FL. (for board-to-board
connection) or SMA (for panel mounting)
Consider that SMT connectors are typically rated for a limited number of insertion cycles. Additionally, the RF coaxial cable may be relatively fragile compared to other types of cables. To increase application ruggedness, connect U.FL connector to a more robust connector such as SMA fixed on panel.
A de-facto standard for SMA connectors implies the usage of reverse polarity connectors
(RP-SMA) on Wi-Fi and Bluetooth® end products to increase the difficulty for the end user to replace the antenna with higher gain versions and exceed regulatory limits.
The following recommendations apply for proper layout of the connector:
· Strictly follow the connector manufacturer's recommended layout: o SMA Pin-Through-Hole connectors require GND keep-out (that is, clearance, a void area) on all the layers around the central pin up to annular pads of the four GND posts. o U.FL. surface mounted connectors require no conductive traces (that is, clearance, a void area) in the area below the connector between the GND land pads.
· If the connector's RF pad size is wider than the micro strip, remove the GND layer beneath the RF connector to minimize the stray capacitance thus keeping the RF line 50 . For example, the active pad of the U.FL. connector must have a GND keep-out (that is, clearance, a void area) at least on the first inner layer to reduce parasitic capacitance to ground.
3.3.2.2 Integrated antenna design
If integrated antennas are used, the transmission line is terminated by the integrated antennas themselves. Follow the guidelines mentioned below:
· The antenna design process should begin at the start of the whole product design process. Selfmade PCBs and antenna assembly are useful in estimating overall efficiency and radiation path of the intended design.
· Use antennas designed by an antenna manufacturer providing the best possible return loss (or VSWR).
· Provide a ground plane large enough according to the related integrated antenna requirements. The ground plane of the application PCB may be reduced to a minimum size that must be similar to one quarter of wavelength of the minimum frequency that has to be radiated; however overall antenna efficiency may benefit from larger ground planes.

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· Proper placement of the antenna and its surroundings is also critical for antenna performance. Avoid placing the antenna close to conductive or RF-absorbing parts such as metal objects, ferrite sheets and so on as they may absorb part of the radiated power or shift the resonant frequency of the antenna or affect the antenna radiation pattern.
· It is highly recommended to strictly follow the detailed and specific guidelines provided by the antenna manufacturer regarding correct installation and deployment of the antenna system, including PCB layout and matching circuitry.
· Further to the custom PCB and product restrictions, antennas may require tuning/matching to comply with all the applicable required certification schemes. It is recommended to consult the antenna manufacturer for the design-in guidelines and plan the validation activities on the final prototypes like tuning/matching and performance measures. See also Table 4.
· RF section may be affected by noise sources like hi-speed digital buses. Avoid placing the antenna close to buses such as DDR or consider taking specific countermeasures like metal shields or ferrite sheets to reduce the interference.
Take care of the interaction between co-located RF systems like LTE sidebands on 2.4 GHz band.
Transmitted power may interact or disturb the performance of NINA-W1 modules.
3.3.3 On-board antenna design
If a plastic enclosure is used, it is possible to use NINA-W1 with the embedded antenna. To reach optimum operating performance, follow the instructions in this section.
3.3.3.1 NINA-W1x2 Internal PIFA antenna
· The module shall be placed in the corner of the host PCB with the antennas feed point in the corner (pins 15 and 16), as shown in Figure 22. Other edge placements positions, with the antenna closest to the edge, are also possible. However, these placements give only a moderately reduced antenna performance compared to a corner placement.
· A large ground plane on the host PCB is a prerequisite for good antenna performance. · The host PCB shall include a full GND plane underneath the entire module, including the antenna
section. This to facilitate efficient grounding of the module. · High / large parts including metal shall not be placed closer than 10 mm to the module's antenna. · At least 5 mm clearance between the antenna and the casing is needed. If the clearance is less
than 5 mm, the antenna performance will be affected. PC and ABS gives less impact and POS type plastic gives more. · The module shall be placed such that the antenna faces outwards from the product and is not obstructed by any external items in close vicinity of the products intended use case.

Figure 22: Placement of NINA-W1x2 with internal PIFA antenna

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Take care while handling the EVK-NINA-W1x2. Applying force to the module might damage the
internal antenna.
Make sure that the end-product design is done in such a way that the antenna is not subject to
physical force.
3.3.3.2 NINA-W1x6 PCB trace antenna
· The module shall be placed in the center of an edge of the host PCB. · A large ground plane on the host PCB is a prerequisite for good antenna performance. It is
recommended to have the ground plane extending at least 10 mm on the three non-edge sides of the module. See also Figure 23. · The host PCB shall include a full GND plane underneath the entire module, with a ground cut out under the PCB trace antenna according to the description in Figure 24. · The NINA-W1x6 has four extra GND pads under the antenna that need to be connected for a good antenna performance. Detailed measurements of the footprint including this extra GND pads can be found in the NINA-W1 series data sheets [3] [4]. · High / large parts including metal shall not be placed closer than 10 mm to the module's antenna. · At least 10 mm clearance between the antenna and the casing is recommended. If the clearance is less than 10 mm, the antenna performance can be adversely affected. · The module shall be placed such that the antenna faces outwards from the product and is not obstructed by any external items in close vicinity of the products intended use case.

Figure 23: GND plane guard area enclosing the NINA-W1x6 module

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Figure 24: Size of the GND cut out for the NINA-W1x6 module's PCB trace antenna
3.4 Data communication interfaces
3.4.1 Asynchronous serial interface (UART) design
The layout of the UART bus should be done so that noise injection and cross talk are avoided. It is recommended to use the hardware flow control with RTS/CTS to prevent temporary UART buffer overrun.
The flow control signals RTS/CTS are active low. Consequently, 0 (ON state =low level) allows the UART to transmit.
· CTS is an input to the NINA-W1 module. If the host sets this input to 0 (ON state = low level) the module can transmit.
· RTS is an output off the NINA-W1 module. The module sets the output to 0 (ON state = low level) when it is ready to receive transmission.
It is recommended to make Pin 29 (DBG_TXD) accessible by the external application for debug
prints, please contact your local support team for further information.
3.4.2 Ethernet (RMII+SMI)
It is recommended to route all signals in the RMII bus with the same length and have appropriate grounding in the surrounding layers; total bus length should also be minimized. The layout of the RMII bus should be done so that crosstalk with other parts of the circuit is minimized providing adequate isolation between the signals, the clock and the surrounding busses/traces.
Termination resistors are recommended for the RX and TX lines on the RMII bus.
A pull-up resistor is required for RMII_MDIO and RMII_CRSDV.
General high-speed layout guidelines are applicable for the RMII and SMI bus.
3.5 General high-speed layout guidelines
These general design guidelines are considered as best practices and are valid for any bus present in the NINA-W1 series modules. The designer should prioritize the layout of higher speed busses. Low frequency signals are generally not critical for layout.

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One exception is represented by High Impedance traces (such as signals driven by weak pull
resistors) that may be affected by crosstalk. For those traces, supplementary 4W isolation from other busses is recommended.
3.5.1 General considerations for schematic design and PCB floor-planning
· Verify which signal bus requires termination and add series resistor terminations to the schematics.
· Carefully consider the placement of the module with respect to antenna position and host processor.
· Verify with PCB manufacturer allowable stack-ups and controlled impedance dimensioning. · Verify that the power supply design and power sequence are compliant with the specification of
NINA-W1 series module.
3.5.2 Module placement
· Accessory parts like bypass capacitors should be placed as close as possible to the module to improve filtering capability, prioritizing the placement of the smallest size capacitor close to module pads.
Particular care should be taken not to place components close to the antenna area. The designer
should carefully follow the recommendations from the antenna manufacturer about the distance of the antenna vs. other parts of the system. The designer should also maximize the distance of the antenna to Hi-frequency busses like DDRs and related components or consider an optional metal shield to reduce interferences that could be picked up by the antenna thus reducing the module's sensitivity. · An optimized module placement allows better RF performance. For more information about the module placement and other antenna considerations, see also Antenna interface.
3.5.3 Layout and manufacturing
· Avoid stubs on high-speed signals. Even through-hole vias may have an impact on signal quality. · Verify the recommended maximum signal skew for differential pairs and length matching of buses. · Minimize the routing length; longer traces will degrade signal performance. Ensure that maximum
allowable length for high-speed busses is not exceeded. · Ensure that you track your impedance matched traces. Consult with your PCB manufacturer early
in the project for proper stack-up definition. · RF and digital sections should be clearly separated on the board. · Ground splitting is not allowed below the module. · Minimize bus length to reduce potential EMI issues from digital busses. · All traces (including low speed or DC traces) must couple with a reference plane (GND or power);
Hi-speed busses should be referenced to the ground plane. In this case, if the designer needs to change the ground reference, an adequate number of GND vias must be added in the area of transition to provide a low impedance path between the two GND layers for the return current. · Hi-Speed busses are not allowed to change reference plane. If a reference plane change is unavoidable, some capacitors should be added in the area to provide a low impedance return path through the different reference planes. · Trace routing should keep a distance greater than 3W from the ground plane routing edge. · Power planes should keep a distance from the PCB edge sufficient to route a ground ring around the PCB, the ground ring must then be connected to other layers through vias.

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3.6 Module footprint and paste mask
The mechanical outline of the NINA-W1 series modules can be found in the NINA-W1 series data sheets [2] [3] [4]. The proposed land pattern layout reflects the pads layout of the module.
The Non-Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD) pad type, which implements the solder mask opening 50 m larger per side than the corresponding copper pad.
The suggested paste mask layout for the NINA-W1 series modules is to follow the copper mask layout as described in the NINA-W1 series data sheets [2] [3] [4].
These are recommendations only and not specifications. The exact mask geometries, distances
and stencil thicknesses must be adapted to the specific production processes of the customer.
3.7 Thermal guidelines
The NINA-W1 series modules have been successfully tested in -40 °C to +85 °C. A good grounding should be observed for temperature relief during high ambient temperature.
3.8 ESD guidelines
The immunity of devices integrating NINA-W1 modules to Electro-Static Discharge (ESD) is part of the Electro-Magnetic Compatibility (EMC) conformity, which is required for products bearing the CE marking, compliant with the R&TTE Directive (99/5/EC), the EMC Directive (89/336/EEC) and the Low Voltage Directive (73/23/EEC) issued by the Commission of the European Community.
Compliance with these directives implies conformity to the following European Norms for device ESD immunity: ESD testing standard CENELEC EN 61000-4-2 and the radio equipment standards ETSI EN 301 489-1, ETSI EN 301 489-7, ETSI EN 301 489-24, the requirements of which are summarized in Table 6.
The ESD immunity test is performed at the enclosure port, defined by ETSI EN 301 489-1 as the physical boundary through which the electromagnetic field radiates. If the device implements an integral antenna, the enclosure port is seen as all insulating and conductive surfaces housing the device. If the device implements a removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the antenna element and its interconnecting cable surfaces.
The applicability of ESD immunity test to the whole device depends on the device classification as defined by ETSI EN 301 489-1. Applicability of ESD immunity test to the related device ports or the related interconnecting cables to auxiliary equipment, depends on the device accessible interfaces and manufacturer requirements, as defined by the ETSI EN 301 489-1.
Contact discharges are performed at conductive surfaces, while air discharges are performed at insulating surfaces. Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling planes as defined in the CENELEC EN 61000-4-2.
For the definition of integral antenna, removable antenna, antenna port, and device classification, refer to the ETSI EN 301 489-1. For the contact and air discharges definitions, refer to CENELEC EN 61000-4-2.

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Parameter

Min. Typical Max. Unit

ESD immunity. All exposed surfaces of the radio equipment and ancillary equipment in a representative configuration

8* kV

ESD sensitivity, tested for all pins except ANT and RSVD pins #11, #15, #33

2.0 kV

Remarks Indirect discharge according to IEC 61000-4-2
Human body model according to JEDEC JS001

* Tested on EVK-NINA-W1 evaluation board.

Table 6: Electro-Magnetic Compatibility ESD immunity requirements as defined by CENELEC EN 61000-4-2, ETSI EN 301 489-1, ETSI EN 301 489-7, ETSI EN 301 489-24

NINA-W1 is manufactured with consideration to the specific standards for minimizing the occurrence of ESD events. The highly automated process complies with the IEC61340-5-1 (STM5.2-1999 Class M1 devices) standard. Consequently, the designer should implement proper measures to protect from ESD events on any pin that may be exposed to the end user.
Compliance with standard protection level specified in the EN61000-4-2 can be achieved by including the ESD protections in parallel to the line, close to areas accessible by the end user.

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Handling and soldering
No natural rubbers, hygroscopic materials or materials containing asbestos are employed.
NINA-W1 series modules are Electrostatic Sensitive Devices that demand the observance of
special handling precautions against static damage. Failure to observe these precautions can result in severe damage to the product.
4.1 ESD handling precautions
As the risk of electrostatic discharge in the RF transceivers and patch antennas of the module is of particular concern, standard ESD safety practices are prerequisite. See also Figure 25.
Consider also:
· When connecting test equipment or any other electronics to the module (as a standalone or PCBmounted device), the first point of contact must always be to local GND.
· Before mounting an antenna patch, connect the device to ground. · When handling the RF pin, do not touch any charged capacitors. Be especially careful when
handling materials like patch antennas (~10 pF), coaxial cables (~50-80 pF/m), soldering irons, or any other materials that can develop charges. · To prevent electrostatic discharge through the RF input, do not touch any exposed antenna area. If there is any risk of the exposed antenna being touched in an unprotected ESD work area, be sure to implement proper ESD protection measures in the design. · When soldering RF connectors and patch antennas to the RF pin on the receiver, be sure to use an ESD-safe soldering iron (tip).

Figure 25: Standard workstation setup for safe handling of ESD-sensitive devices
4.2 Packaging, shipping, storage, and moisture preconditioning
For information pertaining to reels, tapes, or trays, moisture sensitivity levels (MSL), storage, shipment, and drying preconditioning, see the NINA-W1 series data sheets [2] [3] [4], and Packaging information guide [5].

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4.3 Reflow soldering process

NINA-W1 series modules are surface mount modules supplied on a FR4-type PCB with gold plated connection pads and are produced in a lead-free process with a lead-free soldering paste. The thickness of solder resist between the host PCB top side and the bottom side of the NINA-W1 series module must be considered for the soldering process.
The module is compatible with industrial reflow profile for RoHS solders. Use of "No Clean" soldering paste is strongly recommended.
The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used. The optimal soldering profile used has to be trimmed for each case depending on the specific process and PCB layout.

The target values given in Table 7 and Figure 26 are given as general guidelines for a Pb-free
process only. For further information, see also the JEDEC J-STD-020E standard [18].

Process parameter

Pre-heat
Peak Cooling

Ramp up rate to TSMIN TSMIN TSMAX tS (from +25 °C) tS (Pre-heat) TL tL (time above TL) TP (absolute max) Ramp-down from TL Allowed soldering cycles

Table 7: Recommended reflow profile

Unit K/s °C °C s s °C s °C K/s -

Value 3 150 200 150 60 to 120 217 40 to 60 245 4 2

Figure 26: Reflow profile
Lower value of TP and slower ramp down rate (2 3 °C/sec) is preferred.

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4.3.1 Cleaning
Cleaning the modules is not recommended. Residues underneath the modules cannot be easily removed with a washing process.
· Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-jet printed text.
· Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the two housings areas that are not accessible for post-wash inspections. The solvent will also damage the sticker and the ink-jet printed text.
· Ultrasonic cleaning will permanently damage the module and crystal oscillators in particular.
For best results use a "no clean" soldering paste and circumvent the need for a cleaning stage after the soldering process.
4.3.2 Other remarks
· Two reflow soldering processes are allowed for boards with a module soldered on it. · Boards with combined through-hole technology (THT) components and surface-mount technology
(SMT) devices may require wave soldering to solder the THT components. Only a single, wavesoldering process is allowed for boards populated with the modules. Miniature Wave Selective Solder processes are preferred over traditional wave soldering processes. · Hand soldering is not recommended. · Rework is not recommended. · Conformal coating may affect the performance of the module, it is important to prevent the liquid from flowing into the module. The RF shields do not provide protection for the module from coating liquids with low viscosity; therefore, care is required when applying the coating. Conformal coating of the module will void the warranty. · Grounding metal covers: Attempts to improve grounding by soldering ground cables, wick, or other forms of metal strips directly onto the EMI covers is done at the customer's own risk and will void the module warranty. The numerous ground pins on the module are adequate to provide optimal immunity to interferences. · The modules contain components that are sensitive to Ultrasonic Waves. Use of any ultrasonic processes, such as cleaning, welding, etc., may damage the module. The use of ultrasonic processes during the integration of the module into an end product will void the warranty.

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Approvals
Country approval for NINA-W1x6 is pending.
For additional regulatory information, see also the NINA-W1 series data sheets [2], [3], [4].
5.1 General requirements
The NINA-W1 series modules comply with the regulatory demands of Federal Communications Commission (FCC), Industry Canada (IC)2 and the CE mark. This section provides the instructions that must be followed by an integrator when including NINA-W1 series into an end product.
· Any changes to hardware, hosts or co-location configuration may require new radiated emission and SAR evaluation and/or testing.
· The regulatory compliance of NINA-W1 series does not exempt the end product from being evaluated against applicable regulatory demands; for example, FCC Part 15B criteria for unintentional radiators [9].
· Only authorized antenna(s) may be used. · Any notification to the end user about how to install or remove the integrated radio module is NOT
allowed.
5.2 FCC/IC End-product regulatory compliance
u-blox warrants that the modular transmitter fulfills the FCC/IC regulations when operating in authorized modes on any host product given that the integrator follows the instructions as described in this document.
5.2.1 NINA-W101 and NINA-W102 FCC ID and IC certification number
The u-blox FCC ID and IC certification number for NINA-W101 and NINA-W102 is restricted and can be used only by u-blox. Integrators other than u-blox may not refer to the u-blox FCC ID and IC certification number on their end products.
Following the processes called "Change in ID" (FCC) and "Multiple listing" (IC), an integrator can use all the certifications done by u-blox. Through these processes, the integrator becomes the grantee of a copy of the original u-blox FCC/IC certification. As grantee, the integrator is free to perform any updates to the new certification if needed; for example, adding new antennas to the authorization for NINA-W101 module using the antenna pin.
u-blox will guide customers through these processes and support with the approval letter that must be filed as a Cover Letter exhibit with the application to the authority.
It is the responsibility of the integrator to comply with any upcoming regulatory requirements.
5.2.2 NINA-W13/W15 series FCC ID and IC certification number
An end product integrating the NINA-W13 series or NINA-W15 series module using u-connectXpress can refer to the u-blox FCC ID and IC certification number.
u-blox can support updates to the u-blox regulatory authorization, if needed. For example, adding new antennas to the u-blox authorization for NINA-W131 module using the antenna pin.

2 Official name is Innovation, Science and Economic Development (ISED) Canada.

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5.2.3 Antenna requirements
In addition to the general requirement to use only authorized antennas, the u-blox grant also requires a separation distance of at least 20 cm from the antenna to all persons. Also, the antenna must not be co-located with any other antenna or transmitter (simultaneous transmission) as well. If this cannot be met, a Permissive Change as described below must be made to the grant.
5.2.3.1 Separation distance
If the required separation distance of 20 cm cannot be fulfilled, a SAR evaluation must be performed. This consists of additional calculations and/or measurements. The result must be added to the grant file as a Class II Permissive Change.
5.2.3.2 Co-location (simultaneous transmission)
If the module is to be co-located with another transmitter, additional measurements for simultaneous transmission is required. The results must be added to the grant file as a Class II Permissive Change.
5.2.3.3 Adding a new antenna for authorization
If the authorized antennas and/or antenna trace design cannot be used, the new antenna and/or antenna trace designs must be added to the grant file. This is done by a Class I Permissive Change or a Class II Permissive Change, depending on the specific antenna and antenna trace design.
· Antennas of the same type and with less or same gain as an already approved antenna can be added under a Class I Permissive Change.
· Antenna trace designs deviating from the u-blox reference design and new antenna types are added under a Class II Permissive Change.
Integrators who want to refer to the u-blox FCC ID / IC certification ID should contact their local
support team to discuss the Permissive Change Process. Class II Permissive Changes will be subject to NRE costs.

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Product testing
6.1 u-blox in-line production test
As part of our focus on high quality products, u-blox maintain stringent quality controls throughout the production process. This means that all units in our manufacturing facilities are fully tested and that any identified defects are carefully analyzed to improve future production quality.
The Automatic test equipment (ATE) deployed in u-blox production lines logs all production and measurement data from which a detailed test report for each unit can be generated. Figure 27 shows the ATE typically used during u-blox production.
u-blox in-line production testing includes:
· Digital self-tests (firmware download, MAC address programming) · Measurement of voltages and currents · Functional tests (host interface communication) · Digital I/O tests · Measurement and calibration of RF characteristics in all supported bands, including RSSI
calibration, frequency tuning of reference clock, calibration of transmitter power levels, etc. · Verification of Wi-Fi and Bluetooth RF characteristics after calibration, like modulation accuracy,
power levels, and spectrum, are checked to ensure that all characteristics are within tolerance when the calibration parameters are applied.

Figure 27: Automatic test equipment for module test

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6.2 OEM manufacturer production test
As all u-blox products undergo thorough in-series production testing prior to delivery, OEM manufacturers do not need to repeat any firmware tests or measurements that might otherwise be necessary to confirm RF performance. Testing over analog and digital interfaces is also unnecessary during an OEM production test.
OEM manufacturer testing should ideally focus on:
· Module assembly on the device; it should be verified that: o Soldering and handling process did not damage the module components o All module pins are well soldered on device board o There are no short circuits between pins
· Component assembly on the device; it should be verified that: o Communication with host controller can be established o The interfaces between module and device are working o Overall RF performance test of the device including antenna
In addition to this testing, OEMs can also perform other dedicated tests to check the device. For example, the measurement of module current consumption in a specified operating state can identify a short circuit if the test result deviates that from that taken against a "Golden Device".
The standard operational module firmware and test software on the host can be used to perform functional tests (communication with the host controller, check interfaces) and perform basic RF performance testing. Special manufacturing firmware can also be used to perform more advanced RF performance tests.
6.2.1 "Go/No go" tests for integrated devices
A "Go/No go" test compares the signal quality of the Device under Test (DUT) with that of "Golden Device" in a location with a known signal quality. This test can be performed after establishing a connection with an external device.
A very simple test can be performed by just scanning for a known Bluetooth low energy device and checking that the signal level (Received Signal Strength Indicator (RSSI) is acceptable.
Tests of this kind may be useful as a "go/no go" test but are not appropriate for RF performance
measurements.
Go/No go tests are suitable for checking communication between the host controller and the power supply. The tests can also confirm that all components on the DUT are well soldered.
A basic RF functional test of the device that includes the antenna can be performed with standard Bluetooth low energy devices configured as remote stations. In this scenario, the device containing NINA-W and the antennas should be arranged in a fixed position inside an RF shield box. The shielding prevents interference from other possible radio devices to ensure stable test results.

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Appendix

A Glossary

Abbreviation AEC AFA AP ARM ASCII ATE BBR BER BP BPF BT CAN CPU CPU CTS DC DC DCE DDC DDR DL DRX DSR DTE DTR EIRP EMC EMI ESD GND IoT ISM LED LPO LTE MAC MCS MCU MISO MOSI MSL

Definition Automotive Electronics Council Automatic Frequency Adaption Access Point Arm (Advanced RISC Machines) Holdings American Standard Code for Information Interchange Automatic Test Equipment Battery Backed RAM Bit Error Rate Band Pass Band Pass Filter Bluetooth Controller Area Network Central Processing Unit Central Processing Unit Clear To Send Direct Current Direct Current Data Circuit-terminating Equipment* / Data Communication Equipment* Display Data Channel Double Data Rate Down Link (Reception) Discontinuous Reception Data Set Ready Data Terminal Equipment Data Terminal Ready Equivalent Isotropically Radiated Power Electro-magnetic Compatibility Electromagnetic Interference Electro-Static Discharge Ground Internet of Things Industrial, Scientific, and Medical radio Light-Emitting Diode Low Power Oscillator Long-Term Evolution Media Access Control Modulation Coding Scheme Microcontroller Master Input Slave Output Master Output Slave Input Moisture Sensitivity Level

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Abbreviation Definition

NSMD OEM

Non Solder Mask Defined Original Equipment Manufacturer

PCB

Printed Circuit Board

Radio Frequency

RMII

Reduced Media-independent Interface

ROM RSSI

Read-only Memory Received Signal Strength Indicator

RTC

Real-Time Clock

SDK

Software Development Kit

SMA

SubMiniature version A

SMI

Station Management Interface

SPI

Serial Peripheral Interface

SRAM TBD

Static random-access memory To be Defined

THT

Through-hole Technology

UART

Universal Asynchronous Receiver-Transmitter

ULP

Ultra-low-power

UTC

Coordinated Universal Time

Table 8: Explanation of the abbreviations and terms used

B Updating software using s-center

To update NINA-W1 u-connectXpress requires s-center software version 4.6.2 or later. See also
the s-center user guide [9].
Procedure
1. Connect the supplied serial cable from the J8 connector on EVK-NINA-W1 to the USB port your computer. For further information about setting up EVK-NINA-W1, see also EVK-NINA-W1 user guide [7].
2. Download and the latest version of the s-center and u-connectXpress software from u-blox Product Resources. See also the EVK-NINA-W1 user guide [7] and s-center user guide [9].
3. Start s-center and choose "USB Serial Port (COMx)" in the drop-down "COM Port" menu. All other dialog settings are set to default.
4. Select Open Port. A series of AT commands and response are shown in the "Console Window".

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5. Select Tools > Software Update.

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6. Check that the correct COM port is shown in "Settings". Select File and choose the NINA-W1XXCF-<version>.json file from the unzipped u-connectXpress container.
7. Select Update. The module then reboots using the secure bootloader and flashing of the application starts automatically.

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Related documents
[1] u-connectXpress AT commands manual, UBX-14044127 [2] NINA-W13 series data sheet, UBX-17006694 [3] NINA-W10 series data sheet, UBX-17065507 [4] NINA-W15 series data sheet, UBX-18006647 [5] Packaging information reference, UBX-14001652 [6] u-connectXpress user guide, UBX-16024251 [7] EVK-NINA-W1/EVK-NINA-B2 user guide, UBX-17011007 [8] Expressif SDK Get Started [9] s-center user guide, UBX-16012261 [10] u-connectXpress SPI peripheral protocol specification, UBX-20028725 [11] u-connectXpress bootloader protocol specification, UBX-17065404 [12] Espressif ESP32 Datasheet, v3.4 [13] Espressif ESP32 Technical reference manual, v4.3 [14] Espressif ESP32 Hardware design guidelines, v3.0 [15] u-blox-sho-OpenCPU GitHub repository [16] Espressif Custom Partition table [17] ESP-IDF Programming Guide [18] JEDEC J-STD-020E - Moisture/Reflow Sensitivity Classification for Nonhermetic Surface
Mount Devices [19] NINA-W13 product page, https://www.u-blox.com/en/product/nina-w13-series-u-connect [20] NINA-W15 product page, https://www.u-blox.com/en/product/nina-w15-series-u-connect
For product change notifications and regular updates of u-blox documentation, register on our
website, www.u-blox.com.

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