user manual

Qingdao Richmat Intelligence Technology Inc HJ8258 Single mode Bluetooth(5.0) Module 2AJJGHJ8258 2AJJGHJ8258 hj8258

PDF Qingdao Richmat Intelligence Technology Inc Latest version|V1

Qingdao Richmat Intelligence Technology Inc. 版本号 time ;VJGZKXKIUXJ KJOZUXY V1.0 2020.09.18 The initial release 'HU[Z*GZGYNKKZ The specification of HJ8258 module provides an introduction of the basic functions of WLT8258

Qingdao Richmat Intelligence Technology Inc Latest version|V1

Qingdao Richmat Intelligence Technology Inc. 版本号 time ;VJGZKXKIUXJ KJOZUXY V1.0 2020.09.18 The initial release 'HU[Z*GZGYNKKZ The specification of HJ8258 module provides an introduction of the basic functions of WLT8258

Datasheet for Richmat models including: HJ8258, 2AJJGHJ8258, HJ8258 BLE Module, HJ8258, BLE Module

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Document DEVICE REPORTHJ8258-Users-Manual-Qingdao-Richmat-Intelligence-2ajjghj8258-ex-8-11
HJ8258 BLE Module datasheet
Latest version|V1.0 Qingdao Richmat Intelligence Technology Inc

About Datasheet

The specification of HJ8258 module provides an introduction of the basic functions of WLT8258 module, including the electrical specification, RF performance, pin size, and design of reference schematic diagram, etc. Readers can refer to this document to have a detailed understanding of the overall functional parameters of the module application,

Revision History
**Version information management**

 V1.0

time 2020.09.18

*Update record*
The initial release

*editors*

directory
About Datasheet Revision History
directory
1.Summary 1.1.Functions 1.2.Application fields
2.2Electrical specifications 3.The Bluetooth specification 4.Pin description
4.1.Pin assignment 4.2.4.2 UART interface 4.3.Pin definition 5.Reference design 5.1.Reference schematic 5.2.Matters needing attention 6.Reflux parameter 7. Packing size

8.Regulatory Module Integration Instructions
1.Summary
HJ8258 is a Bluetooth low energy transmission module. This module is mainly used in data communication of Internet of things, and data acquisition and control are realized through rich peripheral interface. In the transmission mode, the user's product can quickly complete the docking with the module, and communicate with the mobile device to achieve intelligent control and management of the product. HJ8258 is based on the Bluetooth low energy 5.0 protocol and can be used for point to point data transparent transmission and encryption transmission, users do not need to care about the transmission protocol, just a simple set up can be communication. The module supports Ble (Up to Bluetooth 5.0) , Ble Mesh. Built-in 512kB FLASH SUPPORTS DYNAMIC STACK and protocol Profile configurations, and the product features can be configured via software, providing the ultimate flexibility. At the same Time Support Hardware Ota upgrade, allowing convenient product function launch and upgrade.
Figure 1-1HJ8258 module
1.1.Functions
Built-in high performance 32-bit MCU, 512KB Flash, 64KB SRAM Comply with Bluetooth 5.0 standard, RF link data up to 2Mbps Transmission power: maximum +2.5dBm Receiving sensitivity
-96dBm@BLE 1Mbps -93dBm@ BLE 2Mbps mode -99dBm@ BLE 500kbps mode -101dBm@ BLE 125kbps mode Support UART interface Support AT instruction Support APP parameter configuration Onboard high performance PCB antenna Stamp hole pin, easy and reliable welding Super small package: 12.6x20mm Operating temperature: -40~+85

HJ8258 module only needs to connect VCC, GND, TX and RX to complete data transmission function. It also supports the use of the AT instruction to modify the default name and other related parameters (see the HJ8258 user manual for details).
1.2.Application fields
Personal equipment Wearable, mouse and keyboard, remote control toys;
Retail logistics Electronic shelf label, cold chain transport;
Smart home Lighting, sensor, intelligent lock, remote control, lawn mower, voice control, intelligent printer, lift
table and chair; Industrial control
Security monitoring, special printers, medical equipment;

2.2Electrical specifications

Table2-1Maximum rated parameter

Item The power supply voltage Pin input voltage Pin output voltage Storage temperature Welding temperature

Symbol VDD Vin Vout Tstr Tsld

Min -0.3 -0.3 0 -65 -

Max 3.6 VDD+0.3 VDD 150 260

Unit V V V ºC ºC

 Note:
1. The listed electrical characteristics are target specifications for reference only. Some data may
be updated based on actual test results.
2. The voltage value shown is based on GND in the module. Any voltage exceeding the
maximum rating may cause permanent damage to the equipment.

Table2-2Recommended operating conditions

Item The power supply voltage Power supply voltage rise time (from 1.6v to 2.8v) Operating temperature range

Symbol VDD TR Topr

Min 1.8 -40

Typ. 3.3 -

Max 3.6 10 85

Unit V ms ºC

Table2-3Working current(VDD=3.3V, T=25)

Item RX current
TX current
Sleep patterns

Sym. Min Typ. Max Unit Condition

IRx

-

5.3

-

mA

Whole Module Working

ITx

-

4.8

-

mA

Whole Module Working @0dBm With

DCDC enable

-

1.2

-

uA

Table2-4 Broadcast Current (VDD= 3.3v, T=25,2.5dBm)

Broadcast Interval 1 Channel 3 Channel

100ms 147 266

200ms 74 98

300ms 31 54

1s

2s

Unit

16

9

uA

28

18

uA

Table2-5 Connecting current (VDD= 3.3v, T=25,2.5dBm)

Interval Current

20ms 643

50ms 263

100ms 134

200s 68

500s 43

Table2-6Pin input/output characteristics(VDD=3.3V, T=25)

Unit uA

Item Input high level Input low level Output high level Output low level

Sym. VIH VIL VOH VOL

Min 0.7VDD VSS 0.9VDD VSS

Typ. -

Max VDD 0.3VDD VDD 0.1VDD

Unit V V V V

Condition

Item Frequency range
Data rate

Table2-7RF performance parameter

Sym. Min

Typ. Max Unit

Freq. 2380 -

MHz

BLE/2.4G Proprietary 1Mbps, ±250kHz deviation BLE/2.4G Proprietary 2Mbps, ±500kHz deviation BLE 125kbps, ±250kHz deviation BLE 500kbps, ±250kHz deviation

Condition
1MHz programmable frequency interval

3.The Bluetooth specification

Table3-1 BLE 1Mbps RF_Rx performance(±250kHz deviation)

Item The sensitivity Frequency offset error Same frequency suppression
Image reject
Intra-band blocking rejectionmodulation interference

Sym. 1Mbps -
-
-
±1 MHz offset ±2 MHz offset >=3 MHz offset

Min -250

Typ. -96 -

-

-11

-

37

Max +300 -
-

Unit dBm KHz dB
dB

Condition
Received signal strength -67dBm Received signal strength -67dBm

-

1/3

-

-

37/39 -

-

42

-

dB

Received

dB

signal

strength

-67dBm

dB

Table3-2BLE 1Mbps RF_Tx performance

Item Maximum output Minimum output Programmable power output range 20dB modulation bandwidth

Sym. -

Min. 55 -

Typ. 2.5 -45 55 2.5

Max. 55 -

Unit dBm dBm dBm MHz

Condition

Table3-3BLE 2Mbps RF_Rx performance(±500kHz deviation)

Item The sensitivity Frequency offset error Same frequency suppression
Image reject
Intra-band blocking rejectionmodulation interference

Sym. 2Mbps -
-
-
±2 MHz offset ±4 MHz offset >=4 MHz offset

Min. -300

Typ. -93 -

-

-10

-

25

Max. +200 -
-

Unit dBm KHz dB
dB

Condition
Received signal strength -67dBm Received signal strength -67dBm

-

6/6

-

-

39/38 -

-

42

-

dB

Received

signal

dB

strength

-67dBm

dB

Table3-4BLE 2Mbps RF_Tx performance

Item Maximum output Minimum output Programmable power output range 20dB modulation bandwidth

Sym. -

Min. 55 -

Typ. 2.5 -45 55 1.4

Max. 55 -

Unit dBm dBm dB MHz

Condition

Table3-5BLE 500kbps RF_Rx performance(±250kHz deviation)

Item The sensitivity Frequency offset error Same frequency suppression
Image reject
Intra-band blocking rejectionmodulation interference

Sym. 500kbps -
-
-
±1 MHz offset ±2 MHz offset >=3 MHz offset

Min. -150

Typ. -99 -

-

-1

-

42

Max. +50 -
-

Unit dBm KHz dB
dB

Condition
Received signal strength -67dBm Received signal strength -67dBm

-

34/36 -

-

42/42 -

-

42

-

dB

Received

dB

signal

strength

-67dBm

dB

Table3-6BLE 500kbps RF_Tx performance

Item Maximum output Minimum output Programmable power output range 20dB modulation bandwidth

Sym. -

Min. 55 -

Typ. 2.5 -45 55 2.5

Max. 55 -

Unit dBm dBm dB MHz

Condition

Table3-7BLE 125kbps RF_Rx performance(±250kHz deviation)

Item The sensitivity Frequency offset error Same frequency suppression
Image reject
Intra-band blocking rejectionmodulation interference

Sym. 125kbps -
-
-
±1 MHz offset ±2 MHz offset >=3 MHz offset

Min. -150

Typ. -101 -

-

-3

-

42

Max. +50 -
-

Unit dBm KHz dB
dB

Condition
Received signal strength -67dBm Received signal strength -67dBm

-

32/34 -

-

42/42 -

-

42

-

dB

Received

dB

signal

strength

-67dBm

dB

Table3-8BLE 125kbps RF_Tx performance

Item Maximum output Minimum output Programmable power output range 20dB modulation bandwidth

Sym. -

Min. 55 -

Typ. 2.5 -45 55 2.5

Max. 55 -

Unit dBm dBm dB MHz

Condition

4.Pin description
4.1.Pin assignment

4-1 Figure

module pin diagram

Note: figure 4-1 pin functions can be redefined by pin reuse

4.2.4.2 UART interface

The module supports UART (universal asynchronous transceiver) and realizes full duplex transmission and reception through TX and RX interfaces. Support hardware flow control RTS and CTS.

Figure 4- 2UART communication

4.3.Pin definition

PIN # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

Pin name PD<2> PD<3> PD<4> PD<7> PA<0> PA<1> TX RX 3V3 GND 3V3 SWS GND RX TX PC<1> PB<4> PB<5> PB<6> PB<7> PC<0> NC PC<2> PC<4> RESET GND

Type Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O POWER POWER POWER Digital I/O POWER Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O NC Digital I/O Digital I/O RESET POWER

describe SPI_CN/I2S_LR/PWM3/PD<2> PWM1_N/I2S_SDI/7816_TRX/PD<3> SWM/I2S_SDO/PWM2_N/PD<4> SPI_CK/I2S_BCK/7816_TRX/PD<7> DMIC_DI/PWM0_N/UART_RX/PA<0> DMIC_CLK/7816_CLK/I2S_CLK/PA<1> PWM4/UART_TX/ATSEL2/lc_comp_ain<1>/sar_aio<1>/PB<1> PWM1/UART_RX/I2C_SCK/XC32K_I/PGA_N1/PC<3> 3.3V Power Supply Ground 3.3V Power Supply SWS/UART_RTS/PA<7> Ground PWM1/UART_RX/I2C_SCK/XC32K_I/PGA_N1/PC<3> PWM4/UART_TX/ATSEL2/lc_comp_ain<1>/sar_aio<1>/PB<1> I2C_SCK/PWM1_N/PWM0/PGA_N0/PC<1> SDM_P0/PWM4/lc_comp_ain<4>/sar_aio<4>/PB<4> SDM_N0/PWM5/lc_comp_ain<5>/sar_aio<5>/PB<5> SDM_P1/SPI_DI/UART_RTS/lc_comp_ain<6>/sar_aio<6>/PB<6> SDM_N1/SPI_DO/UART_RX/lc_comp_ain<7>/sar_aio<7>/PB<7> I2C_SDA/PWM4_N/UART_RTS/PGA_P0/PC<0> NC PWM0/7816_TRX/I2C_SDA/XC32K_O/PGA_P1/PC<2> PWM2/UART_CTS/PWM0_N/sar_aio<8>/BIAS/PC<4> Power on reset, active low Ground

Note: All digital IOs can be used as GPIOs with configurable pull-up/pull-down resistors.

5.Reference design
5.1.Reference schematic
Figure 5-1 Top View (Seen from Top) Bottom View (Seen from Bottom) Figure 5-2: Module thickness

Module outline dimensions (including process edges)
Antenna Position Dimension PCB Thickness Total thickness of module (including shielding case) Total thickness of module (including shielding case)

Length (X) Width (Y) Length (X) Width (Y) Height (H) Height (H) Height (H)

Table5-1 Module design dimensions

11.50± 0.3mm 16.40± 0.3 mm 11.20 mm± 0.15 mm 4.34 mm± 0.15 mm 0.80 ± 0.05 mm 2.50 ± 0.1 mm 1.67 ± 0.05 mm

5.2.Matters needing attention
Bluetooth working at 2.4GHz frequency, should try to avoid the impact of various factors on wireless transceiver, pay attention to the following points:
Avoid using metal in the product shell that surrounds the module. If the shell is metal, consider using an external antenna.
Metal screws inside the product should be away from the RF part of the module. To maximize RF performance, the user motherboard layout should follow the following recommendations:
Antenna clearance area: the user mainboard located directly below the module antenna area shall not have any copper foil wiring (including power supply, ground and signal layer). 1) Module position: the module should ideally be placed in the corner of the user's main board, and the PCB antenna is located at the far end of the main board. This position minimizes the clearance area of the antenna.
Refer to the definition of antenna clearance area below

Figure 5- 3Antenna Keep out

6.Reflux parameter
Backflow parameters can be set as follows:

6- 1 Figure

reflux recommendation curve

Temperature range Preheat zone(<150) Uniform temperature zone(150-200) Recirculation zone(>217) Cooling zone

Time 60-120S 60-120S 40-60S Ramp down rate:1/sSlope4/s

Key parameters Ramp up rate:2S Ramp up rate:<1S Peak:240-260

Table6- 1recommended reflux parameters

7. Packing size
The HJ8258 module adopts taping package by default. Taping dimensions are as follows:
Reel dimensions are as follows 

8.Regulatory Module Integration
Instructions
List of applicable FCC rules
This device complies with part 15.247 of the FCC Rules.
Limited module procedures
Not applicable
Summarize the specific operational use conditions
This module can be applied in remote control toys, sports and fitness sensors , health sensors, mobile accessories as well as smart home. The input voltage to the module should be nominally 1.8-3.6 V DC  typical value 3.3V DC and the ambient temperature of the module should not exceed 85.
Trace antenna designs
Not applicable
RF exposure considerations
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .If the device built into a host as a portable usage the additional RF exposure evaluation may be required as specified by 2.1093.
Antennas
This module using PCB antennas with maximum gain is 3 dBi .
Label and compliance information
The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as:"Contains Transmitter Module FCC ID: 2AJJGHJ8258 "  Any similar wording that expresses the same meaning may be used.
Information on test modes and additional testing requirements

a) The modular transmitter has been fully tested by the module grantee on the required number of channels modulation types and modes it should not be necessary for the host installer to re-test all the available transmitter modes or settings. It is recommended that the host product manufacturer  installing the modular transmitter  perform some investigative measurements to confirm that the resulting composite system does not exceed the spurious emissions limits or band edge limits (e.g.  where a different antenna may be causing additional emissions).
b) The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitters digital circuitry or due to physical properties of the host product (enclosure). This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a stand-alone configuration. It is important to note that host product manufacturers should not assume that because the modular transmitter is certified that they do not have any responsibility for final product compliance.
c) If the investigation indicates a compliance concern the host product manufacturer is obligated to mitigate the issue. Host products using a modular transmitter are subject to all the applicable individual technical rules as well as to the general conditions of operation in Sections 15.5 15.15 and 15.29 to not cause interference. The operator of the host product will be obligated to stop operating the device until the interference has been corrected The HJ8258 module is based on TLSR8258 chip .support standard Bluetooth 5.0 commands. For the testing module on your product, user can refer to specification of the Bluetooth system on how to configure and evaluate the module. This specification can also be found on the official Bluetooth website:
https://www.bluetooth.org/en-us/specification/adopted-specifications.
 Additional testing Part 15 subpart B disclaimer
The final host / module combination need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device .
The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules including the transmitter operation and should refer to guidance in KDB 996369.
Frequency spectrum to be investigated
For host products with certified modular transmitter  the frequency range of investigation of the composite system is specified by rule in Sections 15.33(a)(1) through (a)(3) or the range applicable to the digital device  as shown in Section 15.33(b)(1)  whichever is the higher frequency range of investigation.
Operating the host product
When testing the host product all the transmitters must be operating. The transmitters can be enabled by using publicly-available drivers and turned onso the transmitters are active. In certain conditions it might be appropriate to use a technology-specific call box (test set) where accessory devices or drivers are not available. When testing for emissions from the unintentional radiator the transmitter shall be placed in the receive mode or idle mode  if possible. If receive mode only is not possible then  the radio shall be passive (preferred) and/or active scanning. In these cases  this would need to enable

activity on the communication BUS (i.e.  PCIe  SDIO  USB) to ensure the unintentional radiator circuitry is enabled. Testing laboratories may need to add attenuation or filters depending on the signal strength of any active beacons (if applicable) from the enabled radio(s). See ANSI C63.4  ANSI C63.10 and ANSI C63.26 for further general testing details.The product under test is placed into a normal `paired' mode with another BLE device as per the normal intended use of the product (for example transferring data).
FCC Statement
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference,and (2) This device must accept any interference received, including interference that may cause undesired operation. The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end user has no manual instruction to remove or install module.



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