HP ZHAN 66 Pro 14 G4 Notebook PC Product End-of-Life Disassembly instruction

standards, Annex II, Directive 2002/96/EC, disassemble, disassembly, disposal, dispose, electrical, electronic, end-of-life, equipment, EU WEEE, instructions, recycle, recycler, selective, treatment, waste, WEEE, e-waste, e-waste, product

"standards, Annex II, Directive 2002/96/EC, disassemble, disassembly, disposal, dispose, electrical, electronic, end-of-life, equipment, EU WEEE, instructions, recycle, recycler, selective, treatment, waste, WEEE, e-waste, e-waste, product"

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Document DEVICE REPORTdisassembly notebo 20201028223034229
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs

Marketing Name / Model [List multiple models if applicable.]
HP ProBook 440 G8 HP ZHAN 66 Pro 14 G4 Notebook PC HP ProBook 440 G8 Notebook PC / HSN-Q28C-4
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the plastic part. For any questions on plastic marking, please contact HP's Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description

Notes

Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries, excluding Li-Ion batteries.

All types including standard alkaline, coin or button style batteries

Li-Ion batteries. Include all Li-Ion batteries if more than Battery(ies) are attached to the product by (check all

1

one is provided with the product (such as a detachable that apply with an "x" inside the "[ ]"):

notebook keyboard battery, RTC coin cell, etc.)

[3] screws

[X] snaps

[1] adhesive

[X] other. Explain X

NOTE: Add detailed removal procedures including

required tools in the sections 3.1 and 3.2.

Mercury-containing components

For example, mercury in lamps, display backlights,

0

scanner lamps, switches, batteries NA

Liquid Crystal Displays (LCD) with a surface greater than Includes background illuminated displays with gas

100 sq cm

discharge lamps LED

Cathode Ray Tubes (CRT)

NA

Capacitors / condensers (Containing PCB/PCT)

NA

Electrolytic Capacitors / Condensers measuring greater NA than 2.5 cm in diameter or height

External electrical cables and cords

DC Cable for External Power Supply

Gas Discharge Lamps

NA

Plastics containing Brominated Flame Retardants

NA

0

EL-MF877-00 Template Revision C

Page 1

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Item Description

Notes

Quantity of items included in product

weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)

Components and parts containing toner and ink,

Include the cartridges, print heads, tubes, vent

0

including liquids, semi-liquids (gel/paste) and toner

chambers, and service stations. NA

Components and waste containing asbestos

NA

0

Components, parts and materials containing refractory NA

0

ceramic fibers

Components, parts and materials containing

N

0

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if applicable)

T8 Screwdriver

#T8

Screwdriver

#T1

3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure:
1. Us Use screwdriver to release base cover #1 screw 5PCS, and disassemble base cover from hinge side. 2. Use screwdriver to release battery screw 4 PCS and release Battery. 3. Use screwdriver to release main board #1 screw 6 PCS 4. Release below cable: Speaker cable, DC-IN Cable, HDD cable, Finger Printer cable, backlight cable, TP cable , SD
card cable, KB Cable, Power board cable ,EDP cable ,WWan antenna cable, Wlan antenna cable. And Disassemble Type-C BKT, RJ-45. Final step release main board 5. release hinge screw with screwdriver 6. Set Hinge UP to 90 degree and release hinge up
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Use screwdriver to release base cover #1 screw 5PCS, and disassemble base cover from hinge side

EL-MF877-00 Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

Page 2

3.22 Use screwdriver to release battery screw 4 PCS and release Battery.

3.23 Use screwdriver to release main board #1 screw 6 PCS
EL-MF877-00 Template Revision C Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

Page 3

3.24 Release below cable: Speaker cable, DC-IN Cable, HDD cable, Finger Printer cable, backlight cable, TP cable , SD card cable, KB Cable, Power board cable ,EDP cable ,WWan antenna cable, Wlan antenna cable. And Disassemble TypeC BKT, RJ-45. Final step release main board

3.25 release hinge screw with screwdriver
EL-MF877-00 Template Revision C Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

Page 4

3.26 Set Hinge UP to 90 degree and release hinge up

EL-MF877-00 Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

Page 5


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