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Antenna Specification
Shenzhen Youzhisheng Technology Co., Ltd. 103BD 2BONL-103BD 2BONL103BD 103bd
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Document DEVICE REPORTGetApplicationAttachment.html?id=8198302Approval sheet APPROAL SHEET PCB ANTENNA RoHS Compliance 2.4 GHz ISM Band Working Frequency Page 1 of 9 *Contents in this sheet are subject to change without prior notice. Apr. 2010 Approval sheet FEATURES 1. High stability in Temperature / Humidity Change APPLICATIONS 1. 2.4GHz ISM band RF applications 2 . Bluetooth, Wireless, HomeRF CONSTRUCTION Page 2 of 9 Apr. 2010 Approval sheet ELECTRICAL CHARACTERISTICS Working Frequency Range Fc (GHz) Gain (dBi) VSWR Operation Temperature SOLDER LAND PATTERN DESIGN Figure Specification 2450 ± 50 MHz 2.9 2.12dBi 2 max. -40°C ~ +85°C Page 3 of 9 Apr. 2010 Approval sheet Antenna on Test Board ( Thickness 1 . 0 m) Antenna S11 on Test Board Antenna VSWR on Test Board Page 4 of 9 Apr. 2010 Approval sheet RADIATION PATTERN Radiation Pattern and Gain were dependent on measurement board design. The specification of antenna was measured based on the PCB size and installation position as shown in the below figure Test Board Vertical Y - Z Plane Average Gain= 0.891 dBi Peak Gain = 2.12dBi Average Gain = 0.64 dBi X - Z Plane Average Gain= -1.846 dBi Peak Gain= -7.78 dBi Average Gain= -11.97dBi Page 5 of 9 Horizontal Peak Gain= -6.07dBi Average Gain=-11.62dBi Peak Gain= 0.96 dBi Average Gain= -2.29 dBi Apr. 2010 Approval sheet X -Y Plane Average Gain= -2.556 dBi Peak Gain= -9.41 dBi Average Gain= -15.54dBi Peak Gain= 1.40 dBi Average Gain= -2.78 dBi Page 5 of 9 Apr. 2010 Approval sheet RELIABILITY TEST Test item Solderability JIS C 0050-4.6 JESD22-B102D Leaching (Resistance to dissolution of metallization) IEC 60068-2-58 Test condition / Test method *Solder bath temperature 235 ± 5C *Immersion time 2 ± 0.5 sec *Solder Sn3Ag0.5Cu for lead-free Specification At least 9 5 % of a surface of each terminal electrode must be covered by fresh solder. *Solder bath temperature 260 ± 5C *Leaching immersion time 30 ± 0.5 sec Loss of metallization on the edges of each electrode shall not exceed 2 5 % . *Solder : SN63A Resistance to soldering heat JIS C 0050-5.4 *Preheating temperature 120~150 , 1 minute. *Solder temperature 270±5C *Immersion time 10±1 sec *Solder Sn3Ag0.5Cu for lead-free Measurement to be made after keeping at room temperature for 24±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Loss of metallization on the edges of each electrode shall not exceed 2 5 % . Drop Test JIS C 0044 Adhesive Strength of Termination JIS C 0051- 7.4.3 Bending test JIS C 0051- 7.4.1 *Height 75 cm *Test Surface Rigid surface of concrete or steel. No mechanical damage. Samples shall satisfy electrical specification after test. *Times 6 surfaces for each units 2 times for each side. * Pressurizing force 5N(0603) 10N(>0603) No remarkable damage or removal of the termination. *Test time 10±1 sec The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm/s per second until the deflection becomes 1mm/s and then pressure shall be maintained for 5± 1 No mechanical damage. Samples shall satisfy electrical specification after test. sec. Measurement to be made after keeping at room temperature for 24±2 hours Page 6 of 9 Apr. 2010 Approval sheet Temperature cycle JIS C 0025 Vibration JIS C 0040 High temperature JIS C 0021 Humidity (steady conditions) JIS C 0022 Low temperature JIS C 0020 1. 30±3 minutes at -40C±3C, 2. 10~15 minutes at room temperature, 3. 30±3 minutes at +85C±3C, No mechanical damage. Samples shall satisfy electrical specification after test. 4. 10~15 minutes at room temperature, Total 100 continuous cycles Measurement to be made after keeping at room temperature for 24±2 hrs *Frequency 10Hz~55Hz~10Hz(1min) *Total amplitude 1.5mm *Test times 6hrs.(Two hrs each in three mutually perpendicular directions) No mechanical damage. Samples shall satisfy electrical specification after test. *Temperature 85C±2C *Test duration 1000+24/-0 hours Measurement to be made after keeping at room temperature for 24±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. *Humidity 90% to 95% R.H. *Temperature 40±2C *Time 1000+24/-0 hrs. No mechanical damage. Samples shall satisfy electrical specification after test. Measurement to be made after keeping at room temperature for 24±2 hrs 5 0 0 hrs measuring the first data then 1000hrs data *Temperature -40C±2C *Test duration 1000+24/-0 hours Measurement to be made after keeping at room temperature for 24±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Page 7 of 9 Apr. 2010 Approval sheet SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2 Fig 2. Infrared soldering profile CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition. Products should be storage in the warehouse on the following conditions. Temperature : -10 to +40 Humidity : 30 to 70% relative humidity Don't keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. Page 9 of 9 Apr. 2010 Approval sheet This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -- Reorient or relocate the receiving antenna. -- Increase the separation between the equipment and receiver. -- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -- Consult the dealer or an experienced radio/TV technician for help. The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction. Page 9 of 9 Apr. 2010
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