MICROCHIP WILCS02 Wi-Fi Module User Guide

WILCS02 Wi-Fi Module Data Sheet

Microchip Technology Inc.

User Manual WIUBS02UE

Microchip Technology Inc. WIXCS02U 2ADHKWIXCS02U 2ADHKWIXCS02U wixcs02u

User Guide for MICROCHIP models including: WILCS02, WILCS02 Wi-Fi Module, Wi-Fi Module, Module

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WIUBS02 Wi-Fi Module Data Sheet
WIUBS02

Introduction
The Wi-Fi Link Controller Module WIUBS02 is a low power 2.4 GHz IEEE® 802.11b/g/n compliant, fully RF certified wireless module designed for IoT (Internet of Things) applications. These modules are interfaced to a host microcontroller though SPI/SDIO/USB interface. · WILCS02 Module supports Host Interface via SPI/SDIO · WIUBS02 Module supports Host Interface via USB
The Module operates at a single supply voltage VDD (3.3V typical), certain Input Output (IOs) pins supports a voltage range of 1.8-3.6V by supplying the VDDIO pin separately. The WILCS02 module is available with an on-board Printed Circuit Board (PCB) antenna or U.FL connector for an external antenna.
Features
· Compliant with IEEE 802.11 b/g/n Single Spatial Stream of 20 MHz Channel Bandwidth · Transmission Control Protocol/Internet Protocol (TCP/IP)-Based Connectivity Protocols Along with SSL and
MQTT Capabilities. · Supports STA Mode and Soft AP Functionality in IEEE 802.11 Infrastructure and IBSS Networks · Protected Management Frame (PMF) Handled in Hardware, WPA3 Support · Integrated Power Amplifier (PA) and TX/RX Switch and Power Management · Internal Flash Memory to Store Firmware · Immutable Secure Boot with Hardware Root of Trust · Supports Host Assisted Over-the-Air (OTA) Firmware Update · On-Chip Network Stack to Offload MCU
Network features TCP, UDP, DHCP, ARP, HTTP, MQTT, IPv6 TLS 1.2/1.3 and DNS Hardware accelerators for Wi-Fi® and TLS security to improve connection time · Hardware Based Low-Power Modes with Support for Magic Packet-Based Snooze Mode Low Power modes Connected Sleep and Extreme Deep Sleep (XDS)
· Extreme Deep Sleep (XDS) current < 1 A Fast host wake-up from Sleep mode by a pin or the host I/O transaction Optional low-power secondary oscillator (RTCC oscillator) 32.768 KHz for real-time clock and calendar
applications(2) · Hardware-Based IEEE 802.15.2 Compliant Three-Wire Packet Traffic Arbitration (PTA) Interface for Wi-Fi/
Bluetooth® Coexistence(2) · SDIO/SPI/USB Host Interface · Secure Device Firmware Upgrade (DFU)
Security
· Hardware Accelerated Security Modes (CryptoMaster) with Built-in DMA Support

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WIUBS02
Encryption engines (AES and TDES with different NIST modes of operation): · Modes Electronic Code Book (ECB), Cypher Block Chaining (CBC), Counter Mode (CTR), Cypher Feedback Mode (CFB) and Output Feedback Mode (OFB) · AES key sizes: 128b, 192b and 256b
Authentication engines: · SHA-1 and SHA-2 · AES GCM (Galois/Counter mode) · HMAC and AES CMAC
On-chip oscillator for NDRNG generation · Multi-Purpose Public Key Crypto Engine Supporting the Following Algorithms:
ECC/ECDH/ECDSA with standard NIST prime curves up to 521-bit, Curve25519 and Ed25519 RSA up to 2048-bit keys
Operating Conditions
· Operating Voltage (VDD): 3.0-3.6V (3.3V Typical), (VDDIO): 1.8-3.6V · Operating Temperature: -40°C to 85°C
Module Variants
· PCB Antenna: WIUBS02PE
· U.FL Connector for External Antenna: WIUBS02UE
Package
· 28-Pin SMD Package with Shield CAN on Top · Size: 21.7 mm x 14.7 mm x 2.1 mm
Applications
· Smart Factories/Control Devices · Security Systems, CCTV · Smart Homes/Lighting, Smart Locks · Computing, Wi-Fi Dongles, Protocol Bridging · Internet of Things (IoT) Sensor Tag · Remote Control · Wearable Smart Devices · Industrial Control
Certifications
· WILCS02 Module is Planned to be Certified to FCC, ISED, UKCA and CE Radio Regulations · RoHS and REACH Compliant
Notes: 1. Refer to the WILCS02 Application Developer's Guide (TBA) for the latest supported features. 2. The WILCS02 module does not support the PTA interface and the RTCC oscillator function together. Refer to
2.1. Pin Details of WILCS02 Module for more details.

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WIUBS02
Table of Contents
Introduction........................................................................................................................................................................... 1
Features................................................................................................................................................................................. 1
1. Module Ordering Information..................................................................................................................................... 4
2. Device Overview............................................................................................................................................................ 5 2.1. Pin Details of WILCS02 Module........................................................................................................................ 6 2.2. Basic Connection Requirement........................................................................................................................8 2.3. WILCS02 Module Placement Guidelines....................................................................................................... 10 2.4. WILCS02 Module Routing Guidelines............................................................................................................ 12 2.5. WILCS02 Module RF Considerations............................................................................................................. 13 2.6. WILCS02 Module Antenna Considerations................................................................................................... 13 2.7. WILCS02 Module Reflow Profile Information............................................................................................... 20 2.8. WILCS02 Module Assembly Considerations................................................................................................. 21
3. Electrical Specifications.............................................................................................................................................. 22 3.1. WILCS02 Module Absolute Maximum Ratings............................................................................................. 22 3.2. Thermal Specifications.................................................................................................................................... 22 3.3. WILCS02 Module DC Characteristics............................................................................................................. 23 3.4. WILCS02 Module AC Characteristics..............................................................................................................25 3.5. WILCS02 Module Radio Specifications.......................................................................................................... 29
4. WILCS02 Module Packaging Information................................................................................................................. 38 4.1. WILCS02 Module Packaging Marking............................................................................................................ 38 4.2. WILCS02 Module Packaging Dimension........................................................................................................38
5. Appendix A: Regulatory Approval............................................................................................................................. 42 5.1. United States.................................................................................................................................................... 42 5.2. Canada.............................................................................................................................................................. 44 5.3. Europe............................................................................................................................................................... 45 5.4. UKCA (UK Conformity Assessed)....................................................................................................................46 5.5. Other Regulatory Information........................................................................................................................47
6. Appendix B: Acronyms and Abbreviations...............................................................................................................48
7. Document Revision History....................................................................................................................................... 50
Microchip Information....................................................................................................................................................... 51 The Microchip Website............................................................................................................................................... 51 Product Change Notification Service........................................................................................................................ 51 Customer Support.......................................................................................................................................................51 Microchip Devices Code Protection Feature............................................................................................................51 Legal Notice..................................................................................................................................................................51 Trademarks.................................................................................................................................................................. 52 Quality Management System.....................................................................................................................................53 Worldwide Sales and Service..................................................................................................................................... 54

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WIUBS02 Module Ordering Information

1. Module Ordering Information
This chapter provides the ordering information of the WILCS02 and WIUBS02 module.

Table 1-1. WILCS02 and WIUBS02 Module Ordering Details

Module Name

Description

WIUBS02PE

Wi-Fi Link Controller Module with PCB Antenna and USB Interface

WIUBS02UE

Wi-Fi Link Controller Module with U.FL connector for external Antenna and USB Interface

Ordering Code WIUBS02PE-I WIUBS02UE-I

The following figure illustrates the details of the WIUBS02 module ordering information.

Figure 1-1. WILCS02 and WIUBS02 Module Ordering Information

WI
Wi-Fi®
UB USB
Stacked Flash Flash Memory Size
02 = 2 MB Flash Antenna
P PCB Antenna U U.FL Connector
Encryption E No Encryption
Packing - Tray T - Tape & Reel
Temperature Industrial: -40°C to +85°C
Firmware Version

S 02 P/U E

-/T -I XXX

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WIUBS02 Device Overview

2. Device Overview
The WILCS02 module is a fully RF certified wireless module. The WILCS02 module is available with the following antenna variants: · PCB antenna (WIUBS02PE) · U.FL connector (WIUBS02UE) for external antenna
The following figure illustrates the WILCS02 module block diagram and various peripherals supported by the module.
Figure 2-1. WILCS02 Module Block Diagram

MCLR SDIO/SPI/USB UART2_TX (Debug Log) PTA/RTCC OSC
VDD
VDDIO DFU_RX/STRAP1
DFU_TX/STRAP2

SDIO/SPI/USB Interfaces

WILCS02 Module
VDD, VDDIO
PMU

POSC

PCB Antenna or
U.FL Connector

CRYPTO FLASH RAM Memory

CPU

WLAN MAC

Baseband Phy

ADC/ DAC

System Bus

INT0 IRQn

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WIUBS02 Device Overview
2.1 Pin Details of WILCS02 Module
This section provides details on pin diagrams and pinout table of WILCS02 module.
Figure 2-2. WILCS02 Module Pin Diagram (Bottom View)

Table 2-1. WILCS02 Module Pinout Table

Pin Number Pin Name

Pin Type Pin Description

I2C_SCL

I2C_SDA

No connection

I2C clock. Recommended to connect external pull-up resistor

I/O

I2C data. Recommended to connect external pull-up resistor

MCLR

Master clear reset, active-low

USB_D+/PTA_WLAN_ACTIVE

USB Data+/ PTA interface, WLAN Active

USB_D- / PTA_BT_PRIO

I/O

USB Data-/ PTA interface, BT Priority

I/O

Reserved

No connection

GND

Ground

DFU_RX/Strap1

For device firmware update receive pin. Recommended to

connect to a pull-down resistor of 100K.

INT0/Wake

To wake-up the Wi-Fi® module from its Extreme Deep Sleep

(XDS) mode by the host

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WIUBS02 Device Overview

...........continued

Pin Number Pin Name

GND

IRQn(2)

SD_DATA3(2)

SD_DATA2/SPI_SDI

Pin Type Pin Description

Ground

Interrupt request (active-low) from the Wi-Fi module to wake-

up the host from its Sleep state

SDIO interface, SD DATA 3

SDIO interface, SD DATA 2/Serial interface, Serial Data In

SD_DATA1/SPI_CSn

SDIO interface, SD DATA 1/Serial interface Chip Select (Active

low)

SD_DATA0/SPI_SDO/

PTA_WLAN_ACTIVE

I/O

SDIO interface, SD Data 0/SPI interface, Serial Data Out/PTA

Interface, WLAN Active

SD_CMD/SPI_SCK/PTA_BT_ACTIVE

I/O

SDIO interface, SD Command signal PTA Interface, BT Active

SD_CLK/PTA_BT_PRIO(2)

I/O

SDIO interface, SD Clock Signal PTA Interface, BT Priority

VDD

VDD power supply (3.0-3.6V)

SOSCI/PTA_BT_ACTIVE (1)

RTCC oscillator input for 32.768 KHz external crystal/ PTA

Interface BT_ACTIVE

SOSCO

RTCC oscillator output

VDDIO

I/O power supply (1.8-3.6V)

Test point: 1.5V(3)

No connection

DFU_TX/Strap2

For device firmware update receive pin. Recommended to

connect to a pull-down resistor of 100K.

UART2_TX(2)

I/O

UART2 transmit signal for the debug log

GND

Ground

GND Paddle

Thermal ground pad

Notes:

1. This pin can be configured either as an oscillator input pin or as PTA BT_ACTIVE. The WILCS02 module does not support both the functionality together.

2. These pins support lower voltage by supplying the VDDIO pin separately (1.8V - 3.6V). 3. Do not connect any signal to source the voltage.

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WIUBS02 Device Overview
2.2 Basic Connection Requirement
The WILCS02 module requires attention to a minimal set of device pin connections before proceeding with development.
Figure 2-3. WILCS02 Module Basic Connection and Interface Diagram

Table 2-2. Configuration Details

Configuration Details

Module Pin10/Strap1

Module Pin26/Strap2

Host Interface Selection

Description

UART1

WILCS02 module with UART1

Note:The mentioned resistance values are only guidelines. For details on the application schematics, refer to the WILCS02 Wi-Fi Link Controller SD Board (TBA).

2.2.1

Power Supply Pin
It is recommended to add a bulk and a decoupling capacitor at the input supply Pin 20 (VDD), Pin 23 (VDDIO) and GND of the WILCS02 module.
VDD and VDDIO can be connected to the same supply for the typical 3.3V operation. For I/Os to operate at a lower voltage, typically 1.8V, VDDIO can be connected separately along with a decoupling capacitor.

Figure 2-4. Recommended Module Power Supply Connections

C1 4.7 µF
GND

C2 0.1 µF
GND

VDDIO
VDD
WILCS02

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2.2.2

WIUBS02 Device Overview
The value of the C1 and C2 capacitors may vary based on the application requirements and source of supply voltage. The C1 and C2 capacitors must be placed close to the pin.
Master Clear (MCLR) Pin
The MCLR pin works as a device Reset.
Pulling the MCLR pin low generates a device Reset. The basic connection and interface diagram of the module illustrates a typical MCLR circuit. See the Module Basic Connection and Interface Diagram in the Basic Connection Requirement from Related Links.
Figure 2-5. Example of MCLR Pin Connections

VDD

R 10k R1(1)

0.1 µF(2)

C 1 k

WILCS02
MCLR

2.2.3

Notes:
1. 470 R1 1 k limits any current flowing into MCLR from the external capacitor C in the event of MCLR pin breakdown due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). Ensure that the MCLR pin VIH and VIL specifications are met without interfering with the Debug/ Programmer tools.
2. The capacitor can be sized to prevent unintentional Resets from brief glitches or to extend the device Reset period during POR.

Device Firmware Update
The WILCS02 module is available for purchase with pre-programmed firmware. Microchip periodically releases the firmware to fix reported issues or to implement the latest feature support. There are two ways to perform a regular firmware update:
1. Serial DFU command-based update over UART
2. Host-assisted Over-the-Air (OTA) update
Note:For the serial DFU and OTA programming guidance, refer to the WILCS02 Module Application Developer's Guide.

Figure 2-6. Basic Connection Diagram of DFU

R12

0R DFU_TX/STRAP2/PB1 MCLR

R11

0R DFU_RX/STRAP1/PB0

26 4
WILCS02 10

12345678

GND

2.2.4

Interface with Host Microcontroller
The WILCS02 module can be interfaced with the host microcontroller through the UART_TX and UART_RX data line and optional UART flow control signals UART_RTS and UART_CTS.

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Figure 2-7. WILCS02 Module Host Interface Diagram

WIUBS02 Device Overview

WILCS02

SDIO_SDO SDIO_SDI SDIO_CS SDIO_CLK

HOST MCU

Additional Signals
2.3 WILCS02 Module Placement Guidelines
· For any Wi-Fi product, the antenna placement affects the performance of the whole system. The antenna requires free space to radiate RF signals, and it must not be surrounded by the ground plane. Thus, for the best PCB antenna performance, it is recommended that the WILCS02PE/ WIUBS02PE module is placed at the edge of the host board.
· The WILCS02PE/WIUBS02PE module ground outline edge must be aligned with the edge of the host board ground plane as shown in the following figure.
· A low-impedance ground plane for the WILCS02 module ensures the best radio performance (best range and lowest noise). The ground plane can be extended beyond the minimum recommendation as required for the host board EMC and noise reduction.
· For the best performance, keep metal structures and components (such as mechanical spacers, bump-on and so on) at least 31.75 mm away from the PCB trace antenna as illustrated in the following figure.
· The antenna on the WILCS02 module must not be placed in direct contact with or in close proximity to plastic casing or objects. Keep a minimum clearance of 10 mm in all directions around the PCB antenna as shown in the following figure. Keeping metallic and plastic objects close to the antenna can detune the antenna and reduce the performance of the device.
· Exposed GND pads on the bottom of the WILCS02 module must be soldered to the host board (see the Example of Host Board on Top Layer figure in the WILCS02 Module Routing Guidelines from Related Links).
· A PCB cutout or a copper keepout is required under the RF test point (see WILCS02 Module Packaging Information from Related Links).
· Copper keepout areas are required on the top layer under voltage test points (see WILCS02 Module Packaging Information from Related Links).
· Alternatively, the entire region, except the exposed ground paddle, can be solder-masked.
The following figure illustrates the examples of WILCS02 Module placement on a host board with a ground plane. Refer to the following figure for placement-specific guidance.

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Figure 2-8. Module Placement Guidelines

No Copper Region

5.3 mm

Module PCB Edge 15.73 mm

Host PCB Ground Plane

WIUBS02 Device Overview
31.75 mm (keepout clearance region) for all metallic and plastic structures around the antenna. Refer to antennaspecific details of the respective antenna.
Edge of Host PCB Ground Plane

The following figure illustrates the examples of the WILCS02 module placement on a host board with a ground plane. Refer to Figure 2-8 for placement-specific guidance.

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Figure 2-9. WILCS02 Module Placement

WIUBS02 Device Overview

2.4 WILCS02 Module Routing Guidelines
· Use the multi-layer host board for routing signals on the inner layer and the bottom layer.
· The top layer (underneath the module) of the host board must be ground with as many GND vias as possible, shown in the following figure.
· Avoid fan-out of the signals under the module or antenna area. Use a via to fan-out signals to the edge of the WILCS02 module.
· For a better GND connection to the WILCS02 module, solder the exposed GND pads of the WILCS02 module on the host board.
· For the module GND pad, use a GND via of a minimum 10 mil (hole diameter) for good ground to all the layers and thermal conduction path.
· Having a series resistor on the host board for all GPIOs is recommended. These resistors must be placed close to the WILCS02 module. The following figure illustrates the placement of the series resistor.
· The SOSC crystal (32.768 kHz) on the host board must be placed close to the WILCS02 module and follow the shortest trace routing length with no vias (see the following figure).

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Figure 2-10. Example of Host Board on Top Layer
Host Board Outline
Copper Keepout

WIUBS02 Device Overview
Module Outline Copper Keepout GND Plane on Host Board
Exposed GND Pad Underneath Module Module Footprint

RTCC Crystal Placement

2.5 WILCS02 Module RF Considerations
The overall performance of the system is significantly affected by the product design, environment and application. The product designer must ensure system-level shielding (if required) and verify the performance of the product features and applications.
Consider the following guidelines for optimal RF performance:
· The WILCS02 module must be positioned in a noise-free RF environment and must be kept far away from high-frequency clock signals and any other sources of RF energy.
· The antenna must not be shielded by any metal objects.
· The power supply must be clean and noise-free.
· Make sure that the width of the traces routed to GND, VDD rails are sufficiently large for handling peak TX current consumption. Note:The WILCS02 module includes RF shielding on top of the board as a standard feature.
2.6 WILCS02 Module Antenna Considerations

2.6.1

PCB Antenna
For the WILCS02PE/WIUBS02PE module, the PCB antenna is fabricated on the top copper layer and covered with a solder mask. The layers below the antenna do not have copper trace. It is recommended that the module be mounted on the edge of the host board and to have no PCB material below the antenna structure of the module and no copper traces or planes on the host board in that area.
The following table lists the technical specification of the PCB antenna when tested with the WILCS02 module mounted on the WILCS02 Wi-Fi Link Controller SD Board.

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WIUBS02 Device Overview

Table 2-3. PCB Antenna Specification for WILCS02 Module

Parameter

Specification

Operating frequency

2400-2485 MHz

Peak gain

1.18 dBi at 2445 MHz

Efficiency (average)

68.83%1

Note:

1. The size of the WILCS02 Wi-Fi Link Controller SD Board is 85 mm x 40 mm. The antenna efficiency will improve with larger ground plane base boards. If the best case routing guidelines are followed on a larger ground plane application board, the efficiency will be better.

PCB Antenna Radiation Pattern The following figure illustrates the module orientation in the measurement system for the PCB antenna radiation pattern.
Figure 2-11. Module Orientation for Radiation Pattern Measurement

Vertical Cut at Phi = +90°

Z+ Y+

Vertical Cut at Phi = 0°

X+

Horizontal Cut at Theta = 90°

3D Antenna Radiation Pattern The following figures illustrate the 3D cross section of the antenna radiation pattern.

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Figure 2-12. 3D Antenna Radiation Pattern (Slant view)
Z X
Y

WIUBS02 Device Overview

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Figure 2-13. 3D Antenna Radiation Pattern (XY view)
Y X

WIUBS02 Device Overview

Figure 2-14. 3D Antenna Radiation Pattern (XZ view)
Z X

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Figure 2-15. 3D Antenna Radiation Pattern (YZ view)
Z Y

WIUBS02 Device Overview

2D Antenna Radiation Pattern The following figures illustrate the 2D cross section of the antenna radiation pattern. Figure 2-16. Antenna Radiation Azimuth Plane Pattern @ Theta = 90°
90° 2400.00 MHz Polar H 90° 2400.00 MHz Polar V

Azimuth (°)
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Figure 2-17. Antenna Radiation Elevated Plane Pattern @ Phi = 0°
0° 2400.00 MHz Polar H 0° 2400.00 MHz Polar V

WIUBS02 Device Overview

Elevation (°)
Figure 2-18. Antenna Radiation Elevated Plane Pattern @ Phi = 90°
90° 2400.00 MHz Polar H 90° 2400.00 MHz Polar V

Elevation (°)
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2.6.2

WIUBS02 Device Overview
External Antenna Placement Recommendations
The user must ensure the following for the placement of the antenna and its cable:
· Do not route the antenna cable over circuits generating electrical noise on the host board or alongside or underneath the module. The recommendation is to route the cable straight out of the module.
· Do not place the antenna in direct contact or in close proximity of the plastic casing/objects.
· Do not enclose the antenna within a metal shield.
· The user must keep any components capable of radiating noise, signals or harmonics in the 2.4-2.5 GHz frequency range away from the antenna and, if feasible, provide shielding for such components. Any noise radiated from the host board in this frequency band degrades the sensitivity of the module.
· Place the antenna at a distance greater than 5 cm away from the module. The following figure illustrates the antenna keepout area (do not place the antenna in this area). This recommendation is based on an open-air measurement and does not take into account any metal shielding of the customer end product. When a metal enclosure is used, the antenna can be located closer to the WILCS02 module.
These recommendations are based on an open-air measurement and do not take into account any metal shielding of the customer end product. When a metal enclosure is used, the antenna can be located closer to the WILCS02 module.
The following figure illustrates how the antenna cable must be routed depending on the location of the antenna with respect to the WILCS02 PCB. There are two possible options for the optimum routing of the cable.
Figure 2-19. WILCS02 Module Antenna Placement Guidelines

5 cm from Board Edge

Preferred Antenna Cable Routing Direction

5 cm from Board Edge

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WIUBS02 Device Overview
Note:These are generic guidelines and the recommendation is that customers can check and fine-tune the antenna positioning in the final host product based on RF performance.
2.6.2.1 External Antennas
The WILCS02UE/WIUBS02UE modules have an ultra-small surface mount U.FL connector for an external antenna connection. The choice of antenna is limited to the antenna types that the module is tested and approved for.
The WILCS02UE/WIUBS02UE modules are approved to use with the antennas listed in the following table. It is permissible to use a different antenna, provided it is the same antenna type, has the same antenna gain (equal or less than) and similar in-band and out-of-band characteristics are present (refer to antenna specification sheet for cutoff frequencies).
If other antenna types are used, the OEM installer must conduct the necessary assessments and authorize the antenna with the respective regulatory agencies and ensure compliance.

Table 2-4. WILCS02 Module Approved External Antenna List with Antenna Gain

Antenna Part Number No.

Manufacturer

Antenna Antenna Gain (dBi) Type

Regulatory Certification
FCC/ISED(2) CE
(3)

WXE2400

TE Connectivity/Laird External 3

Dipole x

Antennas

ANT-2.4-CW-RCL-RPS

TE Connectivity/Linx

2.3

Dipole x

Technologies

RFA-02-C2M2-D034

Alead

Dipole x

RFA-02-L2H1(6)

Aristotle

Dipole x

RFA-02-C2H1-D034(6)

Alead

Dipole x

RFA-02-D3(6)

Aristotle

Dipole x

RFDPA870920IMLB301(6)

Walsin

1.84

Dipole x

RFDPA870920IMAB302(6)

Walsin

1.82

Dipole x

RFDPA870920IMAB305(6)

Walsin

1.82

Dipole x

RFDPA870910IMAB308(6)

Walsin

Dipole x

RFA-02-C2M2(6)

Aristotle

Dipole x

RN-SMA-S-RP(6)

Microchip

0.56

Dipole x

W1049B030(6)

Pulse

Dipole x

RN-SMA4-RP(6)

Microchip

2.2

Dipole x

Notes: 1. `x' denotes the antennas covered under the certification.

2. If the end product using the module is designed to have an antenna port that is accessible to the end user, a unique (non-standard) antenna connector (as permissible by FCC) must be used (for example, RP (Reverse Polarity)-SMA socket).

3. If an RF coaxial cable is used between the module RF output and the enclosure, a unique (non-standard) antenna connector must be used in the enclosure wall to interface with the antenna.

4. Contact the antenna vendor for detailed antenna specifications to review the suitability to the end product operating environment and to identify alternatives.

5. If any external antenna is used other than the recommended antennas in the list, it may need an extra step of post-calibration on the customer's application board.

6. These antennas need post calibration, refer to the application note for post calibration process.

2.7 WILCS02 Module Reflow Profile Information
The WILCS02 module was assembled using the IPC/JEDEC J-STD-020 standard lead-free reflow profile. The WILCS02 module can be soldered to the host board using standard leaded or lead-free solder reflow profiles. To avoid damaging the module, adhere to the following recommendations:

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2.7.1
2.8
2.8.1

WIUBS02 Device Overview
· For solder reflow recommendations, refer to the AN233 Solder Reflow Recommendation Application Note (DS00233).
· Do not exceed a peak temperature (TP) of 250°C.
· For specific reflow profile recommendations from the vendor, refer to the Solder Paste Data Sheet.
· Use no-clean flux solder paste.
· Do not wash as moisture can be trapped under the shield.
· Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
Cleaning
The exposed GND pad helps to self-align the module, avoiding pad misalignment. The recommendation is to use the no clean solder pastes. Ensure full drying of no-clean paste fluxes as a result of the reflow process. As per the recommendation by the solder paste vendor, this requires longer reflow profiles and/or peak temperatures toward the high end of the process window. The uncured flux residues can lead to corrosion and/or shorting in accelerated testing and possibly the field.
WILCS02 Module Assembly Considerations
The WILCS02 module is assembled with an EMI shield to ensure compliance with EMI emission and immunity rules. The EMI shield is made of a tin-plated steel (SPTE) and is not hermetically sealed. Solutions like IPA and similar solvents can be used to clean the WILCS02 module. However, do not use the cleaning solutions that contain acid on the module.
Conformal Coating
The modules are not intended for use with a conformal coating, and the customer assumes all risks (such as the module reliability, performance degradation and so on) if a conformal coating is applied to the modules.

Draft Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

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WIUBS02 Electrical Specifications

3.
3.1
3.2

Electrical Specifications
This chapter provides the electrical specifications and the characteristics of the WILCS02 Module across the operating temperature range of the product.
WILCS02 Module Absolute Maximum Ratings
The following table provides details about the list of absolute maximum ratings for the WILCS02 module. Exposure to these maximum rating conditions for extended periods can affect the device's reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied.

Table 3-1. Absolute Maximum Ratings

Parameter

Value

Ambient temperature under bias(1)

-40°C to +85°C

Storage temperature

-65°C to +150°C

Voltage on VDD with respect to GND Voltage on any pin(s) with respect to GND Voltage on (Pin 13-19 and 27) with respect to GND Maximum current out of GND pins(2)

-0.3V to +4.0V -0.3V to (VDD+0.3V) -0.3V to (VDDIO+0.3V) 500 mA

Maximum current into VDD pins(2) ESD Qualification

500 mA

Human Body Model (HBM) per JESD22-A114

2000V

Charged Device Model (CDM) (ANSI/ESD STM 5.3.1)

±500V

Notes:

1. The preceding table provides the list of stresses that can cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied.

2. Maximum allowable current is a function of the device's maximum power dissipation.

Thermal Specifications

Table 3-2. Thermal Operating Conditions
Rating Industrial Temperature Devices: Operating ambient temperature range Operating junction temperature range

Table 3-3. Recommended Operating Voltages

Param. No.

Symbol

Characteristics

DC_1 DC_4

VDD VDDIO

VDD voltage range VDDIO voltage range

Symbol
TA TJ
Min. 3 1.8

DC_7

GNDDB Common EDP ground reference VSS

Min.

Typ

-40

Max.

Unit

+85

°C

+125

°C

Typ. 3.3 3.3
VSS

Max. Unit Conditions

3.6

Module pins (13-19 and 27)

only. All other I/Os are at

VDD.

VSS

Draft Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DSxxxxxxxxA - 22

3.3
3.3.1
3.3.2

WILCS02 Module DC Characteristics

WIUBS02 Electrical Specifications

I/O Pin DC Electrical Specifications

Table 3-4. I/O Pin DC Electrical Specifications
DC Characteristics

Param. No. DI_1 DI_3 DI_5 DI_9
DI_13

Symbol
VIL VIH VOL VOH
IIL

Characteristics
Input low voltage I/O pins Input high voltage Output low voltage Output high voltage Output high voltage Input pin leakage current

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Min.

Typ.(1) Max.

Units Conditions

GND

0.2*VDDIO

0.8*VDDIO

VDDIO

0.4

2.4

-1

VDDIO = 1.8V

µA --

Wi-Fi Current Consumption

Table 3-5. Wi-Fi Current Consumption DC Electrical Specifications

DC Characteristics(1)(2)

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. Symbol Device States No.

IWF_TX IDD

On_Transmit(5)

IWF_RX IDD

On_Receive

Code Rate
802.11b 1 Mbps 802.11b 1 Mbps 802.11b 11 Mbps 802.11g 6 Mbps 802.11g 54 Mbps 802.11n MCS0 802.11n MCS7 802.11n MCS7 802.11n MCS7 802.11b 1 Mbps 802.11n MCS7

Output Power (Typ.) (dBm) 19 14 20 19 16 17 17 15.5 10.5 -- --

Current

Max.

(Typ.) (mA)(3)

266

243

268

269

236

239

238

233

224

Units Conditions mA VDD = VDDIO = 3.3V

Draft Data Sheet
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WIUBS02 Electrical Specifications

...........continued
DC Characteristics(1)(2)

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)
Operating Temperature: -40°C TA +85°C for Industrial

Param. Symbol Device States No.

Code Rate

Output Power (Typ.) (dBm)

Current

Max.

(Typ.) (mA)(3)

Units Conditions

Notes: 1. Measured along with the RF matching network (assume 50 impedance)

2. The test conditions for IDD current measurements are as follows: CPU, Flash panel and SRAM data memory are operational

CPU is operating at 50 MHz

CPU is in Wi-Fi RF Test mode

All peripheral modules are disabled (ON bit = 0) but the associated PMD bit is cleared

WDT and FSCM are disabled

All I/O pins are configured as inputs and pulled to VDD MCLR = VDD 3. Data in the "Typ." column is at 3.3V, 25°C unless otherwise stated.

4. This parameter is characterized, but not tested in manufacturing.

5. Tested at channel 7 in Fixed mode gain.

3.3.3

Extreme Deep Sleep (XDS) Current Consumption

Table 3-6. Extreme Deep Sleep (XDS) Current Consumption

DC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. No. Symbol

XDSPWR_1

IDD_XDS(2)

Notes:

1. Typical values at 25°C only

Characteristics IDD in XDS mode

Typ(1) 0.7

Max. --

Units µA

Conditions VDD = VDDIO = 3.3V

2. Conditions: All peripherals inactive

All IO configured as input and pulled down internally

Draft Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DSxxxxxxxxA - 24

3.4
3.4.1

WILCS02 Module AC Characteristics
SDIO Controller AC Timing Specifications
Figure 3-1. SDIO Controller AC Timing Diagram

WIUBS02 Electrical Specifications

Table 3-7. SDIO Controller AC Timing Specifications

AC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. Symbol

Characteristics

Min.

Typ

Max. Units Conditions(1)

SD/SDIO Default Speed Mode

SD_5

tSDCK

Clock frequency

MHz

SD_7

tDUTY

Duty cycle

SD_9

tHIGH

Clock high time

4.5

ns --

SD_11

tLOW

Clock low time

ns --

SD_13

tRISE

Clock rise time

See I/O pin specification parameter DI25

SD_15

tFALL

Clock fall time

See I/O pin specification parameter DI27

SD_17

tIN_SETUP

Input setup time

ns --

SD_19

tIN_HOLD

Input hold time

ns --

SD_21 SD_23

tOUT_DLY

Output delay time 3

tOUT_SETUP Output hold time

VDDIO = 3.3V, CLOAD = 15 pF (Max)

Notes: 1. All output pins with 15 pF load.

2. Maximum clock frequency specified is limited by the SDIO Host interface internal design; actual maximum clock frequency can be lower and depends on the specific PCB layout.

3.4.2

SPI Electrical Specifications
Note:Traditional Serial Communication Interface documentation uses the terminology "Master" and "Slave". The equivalent Microchip terminology used in this document is "Host" and "Client", respectively.

Draft Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DSxxxxxxxxA - 25

Figure 3-2. SPI Client CPHA=0 Timing Diagram

SCK CPOL=0
SCK CPOL=1
MISO (Mstr Data In)
MOSI (Mstr Data Out)
SSP_19
__ SS

SSP_1

SSP_15
MSB

SSP_17

MSB
SSP_11

WIUBS02 Electrical Specifications

SSP_5

SSP_9

SSP_7 SSP_13

SSP_3

LSB
LSB
SSP_21

Figure 3-3. SPI Client CPHA=1 Timing Diagram

SCK CPOL=0
SCK CPOL=1
MISO (Mstr Data In)

SSP_1

SSP_15
MSB

SSP_17

MOSI (Mstr Data Out)
SSP_11
__ SS

MSB
SSP_19

SSP_5
SSP_3

SSP_9

SSP_7 SSP_13

LSB
LSB
SSP_21

Table 3-8. SPI Client Mode Electrical Specifications

AC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. Symbol

SSP_1

FSCK

SSP_3 SSP_5 SSP_7 SSP_9

TSCL TSCH TSCF TSCR

Characteristics SCK frequency
SCK output low time SCK output high time SCK and MOSI output fall time SCK and MOSI output rise time

Min.

Typ

1/(2*FSCK) --

Max. 20 40 --

Units MHz
ns

Conditions SPI2 CLOCK on PA6 SPI1 CLOCK on PA0 --

DI27 ns DI25 ns

See parameter DI27 I/O spec
See parameter DI25 I/O spec

Draft Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

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WIUBS02 Electrical Specifications

...........continued
AC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)
Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. Symbol

Characteristics

Min.

Typ

Max. Units

SSP_11

TSOV

MOSI data output -- valid after SCK

SSP_15

TSIS

MISO setup time of 5 data input to SCK

SSP_17

TSIH

MISO hold time of 5 data input to SCK

Notes: 1. Assumes VDDIOx (min) and 10 pF external load on all SPIx pins unless otherwise noted.

2. CPHA=0.

3. CPHA=1.

4. These parameters are characterized, but not tested in manufacturing.

Conditions --

3.4.3

USB OTG AC Electrical Specifications

Table 3-9. USB OTG AC Electrical Specifications

AC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. Symbol

Characteristics Min.

Typ

Max.

Units

Conditions(1)

USB_1

VDDUSB

USB Transceiver 3 Voltage

3.6

Voltage on VDDIOx

must be in this

range for proper

USB operation

VBUS Supply

USB_3

VBUS

High-power Port 4.75

5.25

500 mA load

USB_5

Low-power Port 4.4

5.25

100 mA Load

USB_7

VILUSB

Input Low Voltage --

0.8

for USB Buffer

USB_9

VIHUSB

Input High

Voltage for USB

Buffer

USB_11

VDIFS

Differential Input --

0.2

The difference

Sensitivity

between D+ and D-

must exceed this

value while VCM is

met

USB_13

VCM

Differential

0.8

Common Mode

Range

2.5

VUSB = 3.0V to 3.6V

USB_15

ZOUT

Driver Output

Impedance

USB_17

VOLUSB

Voltage Output --

0.3

1.425 kW load

Low

connected to VUSB

= 3.6V

Draft Data Sheet
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3.4.4

...........continued
AC Characteristics

Param. No. Symbol

USB_19

VOHUSB

USB_21

VBUS

WIUBS02 Electrical Specifications

Characteristics Voltage Output High
USB VBUS Input range

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Min.

Typ

Max.

Units

Conditions(1)

2.8

3.6

14.25 kW load

connected to

ground w/VUSB =

3.0V

5.5

Note: 1. These parameters are characterized, but not tested in manufacturing.

XOSC32 RTCC Oscillator AC Electrical Specifications

Table 3-10. XOSC32 RTCC Oscillator AC Electrical Specifications

AC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. No. Symbol

Characteristics

Min. Typ. Max. Units Conditions(1)

XOSC32_1

FOSC_XOSC32

XOSC32 oscillator crystal -- 32.768 -- frequency

kHz SOSCI, SOSCO RTCC oscillator

XOSC32_15 TOSC32

TOSC32 = 1/FOSC_XOSC32 -- --

µs See parameter XOSC32_1 for

FOSC_XOSC32 value

XOSC32_21 XCLK32_DC

Ext clock oscillator duty

-- 50

cycle

Notes: 1. Crystal oscillator requirements:
Crystal load capacitance = 12 pF

Maximum Drive level = 200 µW

2. This parameter is characterized but not tested in manufacturing.

3.4.5

Power on Reset AC Electrical Specifications
Table 3-11. Power on Reset AC Electrical Specifications
AC Characteristics

Param. No. Symbol

DC_11

VPOR

DC_12

SVDD

DC_13

TRST

Characteristics VDD start voltage to ensure internal POR signal VDD rise rate to ensure internal POR signal External Reset valid active pulse width

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Min. Typ. Max. 1.45 -- 1.65

Units Conditions

0.03 -- 0.115 V/ms 0-3.0V in 0.1s

----

Draft Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

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3.5
3.5.1

WILCS02 Module Radio Specifications

WIUBS02 Electrical Specifications

Table 3-12. WILCS02 Module Radio Specifications
Feature WLAN standards Frequency range Number of channels

Description IEEE® 802.11b, IEEE 802.11g, and IEEE 802.11n 2.412 GHz ~ 2.472 GHz (2400 ~ 2483.5 MHz ISM band) 11 for North America and 13 for Europe and Japan

WILCS02 Module Receiver Performance

Table 3-13. WILCS02 Module Receiver Performance Characteristics(1)

RF Characteristics

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. No.

Characteristics

Description(5)

Min.

Typ

Max.

Units

WF_RX_1

Frequency

2412

2472

MHz

WF_RX_2

Sensitivity 802.11b

1 Mbps DSSS

-97

dBm

2 Mbps DSSS

-93

5.5 Mbps DSSS

-92

11 Mbps DSSS(6)

-88

WF_RX_3

Sensitivity 802.11g

6 Mbps OFDM

-91

dBm

9 Mbps OFDM

-90

12 Mbps OFDM

-88

18 Mbps OFDM

-86

24 Mbps OFDM

-83

36 Mbps OFDM

-80

48 Mbps OFDM

54 Mbps OFDM(6)

-75

-74

WF_RX_4

Sensitivity 802.11n

MCS 0

(Bandwidth at 20 MHz) MCS 1 (Both long GI and

short GI)

MCS 2

MCS 3

-89

dBm

-86

-84

-81

MCS 4

-78

MCS 5

-74

MCS 6 MCS 7(6)

-72

-70

WF_RX_5

Maximum receive

1, 2 Mbps DSSS

signal level

5.5, 11 Mbps DSSS

dBm

6 Mbps OFDM

-1.5

54 Mbps OFDM

-8.5

MCS 0

-0.5

MCS 7

-8.5

Draft Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

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WIUBS02 Electrical Specifications

...........continued
RF Characteristics

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. No.

Characteristics

Description(5)

Min.

Typ

Max.

Units

WF_RX_6

Adjacent channel rejection

1 Mbps DSSS (30 MHz offset)

43.5

11 Mbps DSSS

38.5

(25 MHz offset)

6 Mbps OFDM

46.5

(25 MHz offset)

54 Mbps OFDM

28.5

(25 MHz offset)

MCS 0 20 MHz Bandwidth 45.5

(25 MHz offset)

MCS 7 20 MHz Bandwidth 25.5

(25 MHz offset)

WF_RX_7

RSSI accuracy

-5

Notes: 1. Measured after RF matching network (assume 50 impedance)

2. RF performance is ensured at 3.3V, 25°C, with a 2-3 dB change at boundary conditions.

3. The availability of some specific channels and/or operational frequency bands are country-dependent and must be programmed in the host product at the factory to match the intended destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via host implementation.

4. The host product manufacturer must ensure that the RF behavior adheres to the certification (for example, FCC, ISED) requirements when the module is installed in the final host product.

5. This parameter is characterized but not tested in manufacturing.

6. This parameter is characterized and tested in manufacturing.

3.5.2

WILCS02 Module Transmitter Performance

Table 3-14. WILCS02 Module Transmitter Performance Characteristics

RF Characteristics

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. Characteristics No.

Description(8)

Min. Typ(3)

Max.

Units

WF_TX_1 Frequency WF_TX_2 Output power(1)(2) 802.11b

-- 1 Mbps DSSS(9)

2412 --

2472 --

MHz dBm

2 Mbps DSSS

5.5 Mbps DSSS

11 Mbps DSSS

DSxxxxxxxxA - 30

WIUBS02 Electrical Specifications

...........continued
RF Characteristics

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. No.
WF_TX_3

Characteristics Output power(1)(2) 802.11g

Description(8) 6 Mbps OFDM

Min. Typ(3)

Max. --

Units dBm

9 Mbps OFDM

12 Mbps OFDM

18 Mbps OFDM

24 Mbps OFDM

36 Mbps OFDM

WF_TX_4 Output power(1)(2) 802.11n (Bandwidth at 20 MHz)

48 Mbps OFDM 54 Mbps OFDM(9) MCS 0 MCS 1

17.5

dBm

MCS 2

MCS 3

17.5

MCS 4

17.5

MCS 5

WF_TX_5 WF_TX_6

Transmit Power Control (TPC) accuracy
Harmonic output power (Radiated, Regulatory mode)

MCS 6 MCS 7(9) --
2nd 3rd

±2(2)

74(7)

Below noise floor

74(7)

dB dBuV/m

Notes: 1. Measured at IEEE® 802.11 specification compliant EVM/Spectral mask

2. Measured after RF matching network (assume 50 impedance)

3. RF performance is ensured at 3.3V, 25°C, with a 2-3 dB change at boundary conditions.

4. With respect to TX power, different (higher/lower) RF output power settings can be used for specific antennas and/or enclosures, in which case, re-certification can be required. Program the custom gain table to control the transmit power using the MCHPRT3 tool.

5. The availability of some specific channels and/or operational frequency bands are country-dependent and must be programmed in the host product at the factory to match the intended destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via host implementation.

6. The host product manufacturer must ensure that the RF behavior adheres to the certification (for example, FCC, ISED) requirements when the module is installed in the final host product.

7. FCC Radiated Emission limits (Restricted Band)

8. This parameter is characterized but not tested in manufacturing.

9. This parameter is characterized and tested in manufacturing.

DSxxxxxxxxA - 31

3.5.3

WILCS02 Module Receiver and Transmitter Characteristics Graphs

Figure 3-4. Receive Current vs Temperature, MCS7, Channel 7, 3.3V

120

100

Receive Current (mA)

-40

-20

Temperature (°C)

Figure 3-5. Receive Current vs Receive Signal Power, MCS7, Channel 7, 3.3V, 25
100

Current (mA)

-70

-65

-60

-55

-50

Receive Signal Power (dBm)

WIUBS02 Electrical Specifications

-40

-30

DSxxxxxxxxA - 32

Figure 3-6. Transmit Current vs Temperature, MCS7, Channel 7, 3.3V
350

300

250

Current (mA)

200

150

100

-40

-20

Temperature(°C)

Figure 3-7. Transmit Current vs Transmit Output Power, MCS7, Channel 7, 3.3V, 25
300

250

200

Current (mA)

150

100

9.5

10.5

11.5

12.5

13.5

14.5

TX Output Power (dBm)

WIUBS02 Electrical Specifications

15.5

DSxxxxxxxxA - 33

Figure 3-8. Transmit Power vs Voltage, 1M, Channel 7, 3.3V, 25
25.00

20.00

Transmit Power (dBm)

15.00

10.00

5.00

0.00 3

3.1

3.2

3.3

3.4

Voltage (V)

Figure 3-9. Transmit Power vs Temperature, 1M, Channel 7, 3.3V
25.00

20.00

Transmit Power (dBm)

15.00

10.00

5.00

0.00

-40

-20

Temperature(°C)

WIUBS02 Electrical Specifications

3.5

3.6

DSxxxxxxxxA - 34

Figure 3-10. Transmit Power vs Channel, 1M, Channel 7, 3.3V, 25
25.00

WIUBS02 Electrical Specifications

20.00

Transmit Power (dBm)

15.00

10.00

5.00

0.00

Channel

Figure 3-11. RX RSSI vs RX Input Power, MCS7, 3.3V, 25

RSSI

-18.00

-23.00

-28.00

-33.00

-38.00

-43.00

-48.00

-53.00

-58.00

-63.00

-68.00

-73.00

-73

-68

-63

-58

-53

-48

-43

-38

-33

-28

-23

-18

RX Input Power

DSxxxxxxxxA - 35

Figure 3-12. RX Sensitivity vs Channel, MCS7, 3.3V, 25
-20.00

-30.00

-40.00

Sensitivity (dBm)

-50.00

-60.00

-70.00

-80.00

-90.00

-100.00

Channel

Figure 3-13. Receive Sensitivity vs Voltage, MCS7, Channel 7, 3.3V, 25
-20

-30

-40

Receive Sensitivity (dBm)

-50

-60

-70

-80

-90

-100 3

3.1

3.2

3.3

3.4

Voltage (V)

WIUBS02 Electrical Specifications

3.5

3.6

DSxxxxxxxxA - 36

Figure 3-14. Receive Sensitivity vs Temperature, MCS7, Channel 7, 3.3V
-20.00

-30.00

-40.00

Receive Sensitivity (dBm)

-50.00

-60.00

-70.00

-80.00

-90.00

-100.00 -40

25
Temperature(°C)

WIUBS02 Electrical Specifications
85

DSxxxxxxxxA - 37

4. WILCS02 Module Packaging Information
4.1 WILCS02 Module Packaging Marking
Figure 4-1. WILCS02 Module Packaging Marking

WIUBS02 WILCS02 Module Packaging Information

4.2

XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN
XX XX

WIUBS02PE FCC ID: 2ADHKWIXCS02 IC: 20266-WIXCS02 YYWWNNN

WIUBS02UE FCC ID: 2ADHKWIXCS02U IC: 20266-WIXCS02U YYWWNNN

Legend: XX....X YY: WW NNN

Module part number and version and regulatory designator Year code (last 2 digits of calendar year) Week code (week of January 1 is week "01") Alphanumeric traceability code

WILCS02 Module Packaging Dimension
This section provides the package dimension details of the WILCS02 module.

DSxxxxxxxxA - 38

WIUBS02 WILCS02 Module Packaging Information
28-Lead PCB Module (TEC) - 14.73x21.72x2.1 mm Body [MODULE] With Metal Shield and Coaxial Connector
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

1.64

THERMAL RELIEF
HOLES 10X
10 11 12 13 14
15.46 15
16 17 18 19

Ø 0.80 10X

5.95

8 7

COAXIAL

CONNECTOR

21.72

12.40
4 3 2 1

6.27 0.80 9X 0.90
5.82 0.80

21 22 23 24 25 26 27 28

13.63 14.73

6.88 0.65

21 22 23 24 25 26 27 28

0.20 1.20

1.20

0.90

Ø2.7

O.D.

Ø1.7 I.D.

METAL SHIELD
28X 0.80
28X 0.60
1 2 3 4
1.02
5
6 7 8 9
8.86 6.00

0.80
1.30 2.10
SIDE VIEW

0.80 6.95

1.91 5.06
Microchip Technology Drawing C04-21567 Rev B Sheet 1 of 2

DSxxxxxxxxA - 39

Notes: 1. All dimensions are in Millimeters.

Microchip Technology Drawing C04-21567 Rev B Sheet 2 of 2

DSxxxxxxxxA - 40

6.01

21.72

1.02 15 16

6.27 3.68

14.73
9.67 Ø2.80
3.70 3.70
1.91

28X 1.90
PCB EDGE
0.22 9 8 7 6
2.03 5
28x 0.80 4 3 2 1
2.67

21 22 23 24 25 26 27 28

6.88

2.67

SILKSCREEN

COPPER KEEPOUT ZONE
RECOMMENDED LAND PATTERN
Notes: 1. All dimensions are in millimeters. 2. Keep these areas free from routes and exposed copper. Ground fill with solder mask may be placed here.
Microchip Technology Drawing C04-23567 Rev B

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WIUBS02 Appendix A: Regulatory Approval

5.
5.1
5.1.1

Appendix A: Regulatory Approval
The WIUBS02PE module has received regulatory approval for the following countries: · United States/FCC ID: 2ADHKWIXCS02
· Canada/ISED: IC: 20266-WIXCS02
HVIN: WIUBS02PE
PMN:Wireless MCU Module with IEEE®802.11 b/g/n
· Europe/CE
The WIUBS02UE module has received regulatory approval for the following countries: · United States/FCC ID: 2ADHKWIXCS02U
· Canada/ISED: IC: 20266-WIXCS02U
HVIN: WIUBS02UE
PMN:Wireless MCU Module with IEEE®802.11 b/g/n
· Europe/CE
United States
The WIUBS02PE/WIUBS02UE modules have received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C "Intentional Radiators" single-modular approval in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a complete RF transmission sub-assembly, designed to be incorporated into another device, that must demonstrate compliance with FCC rules and policies independent of any host. A transmitter with a modular grant can be installed in different end-use products (referred to as a host, host product or host device) by the grantee or other equipment manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter function provided by that specific module or limited module device.
The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance.
A host product itself is required to comply with all other applicable FCC equipment authorization regulations, requirements, and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated: to regulations for other transmitter components within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Suppliers Declaration of Conformity (SDoC) or certification) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic functions).
Labeling and User Information Requirements
The WIUBS02PE/WIUBS02UE modules have been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must display a label referring to the enclosed module. This exterior label must use the following wording:

DSxxxxxxxxA - 42

For the WIUBS02PE module For the WIUBS02UE module

WIUBS02 Appendix A: Regulatory Approval
Contains Transmitter Module FCC ID: 2ADHKWIXCS02 or Contains FCC ID: 2ADHKWIXCS02 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Contains Transmitter Module FCC ID: 2ADHKWIXCS02U or Contains FCC ID: 2ADHKWIXCS02U This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

The user's manual for the finished product must include the following statement:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: · Reorient or relocate the receiving antenna
· Increase the separation between the equipment and receiver
· Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
· Consult the dealer or an experienced radio/TV technician for help

5.1.2

Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748, which is available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) apps.fcc.gov/oetcf/kdb/index.cfm.
RF Exposure
All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC).
From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures.
WIUBS02PE/WIUBS02UE: These modules are approved for installation into mobile or/and host platforms at least 20 cm away from the human body.

5.1.3

Approved Antenna Types
To maintain modular approval in the United States, only the antenna types that have been tested shall be used. It is permissible to use different antenna, provided the same antenna type, antenna gain (equal to or less than), with similar in-band and out-of band characteristics (refer to specification sheet for cutoff frequencies).
For the WIUBS02PE, the approval is received using the integral PCB antenna.
For the WIUBS02UE, approved antennas are listed in the WIUBS02 Module Approved External Antenna.

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5.1.4
5.2
5.2.1

WIUBS02 Appendix A: Regulatory Approval
Helpful Web Sites
· Federal Communications Commission (FCC): www.fcc.gov.
· FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) apps.fcc.gov/oetcf/kdb/index.cfm.
Canada
The WIUBS02PE/WIUBS02UE modules have been certified for use in Canada under Innovation, Science and Economic Development Canada (ISED, formerly Industry Canada) Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device.
Labeling and User Information Requirements
Labeling Requirements (from RSP-100 - Issue 12, Section 5): The host product shall be properly labeled to identify the module within the host device.
The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host device; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the word "Contains" or similar wording expressing the same meaning, as follows:

For the WIUBS02PE module For the WIUBS02UE module

Contains IC: 20266-WIXCS02 Contains IC: 20266-WIXCS02U

User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 5, February 2021): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both:

This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada's license-exempt RSS(s). Operation is subject to the following two conditions:
(1) This device may not cause interference;
(2) This device must accept any interference, including interference that may cause undesired operation of the device.
L'émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d'Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
1. L'appareil ne doit pas produire de brouillage;
2. L'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Transmitter Antenna (From Section 6.8 RSS-GEN, Issue 5, February 2021): User manuals, for transmitters shall display the following notice in a conspicuous location:
This radio transmitter IC: 20266-WIXCS02 and IC: 20266-WIXCS02U have been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device.
Le présent émetteur radio IC: 20266-WIXCS02 and IC: 20266-WIXCS02U a été approuvé par Innovation, Sciences et Développement économique Canada pour fonctionner avec les types d'antenne énumérés cidessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué pour tout type figurant sur la liste, sont strictement interdits pour l'exploitation de l'émetteur.

Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each.

DSxxxxxxxxA - 44

5.2.2

RF Exposure

WIUBS02 Appendix A: Regulatory Approval

All transmitters regulated by Innovation, Science and Economic Development Canada (ISED) must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands).
This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with Canada multi-transmitter product procedures.
WIUBS02PE/WIUBS02UE: The devices operate at an output power level which is within the ISED SAR test exemption limits at any user distance greater than 20 cm.

5.2.3
5.2.4 5.2.5
5.3

Exposition aux RF
Tous les émetteurs réglementés par Innovation, Sciences et Développement économique Canada (ISDE) doivent se conformer à l'exposition aux RF. exigences énumérées dans RSS-102 - Conformité à l'exposition aux radiofréquences (RF) des appareils de radiocommunication (toutes les bandes de fréquences).
Cet émetteur est limité à une utilisation avec une antenne spécifique testée dans cette application pour la certification, et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou émetteur au sein d'un appareil hôte, sauf conformément avec les procédures canadiennes relatives aux produits multi-transmetteurs.
Les appareils fonctionnent à un niveau de puissance de sortie qui se situe dans les limites du DAS ISED. tester les limites d'exemption à toute distance d'utilisateur supérieure à 20 cm.

Approved Antenna Types
For the WIUBS02PE, the approval is received using the integral PCB antenna.
For the WIUBS02UE, approved antennas are listed in the WIUBS02 Module Approved External Antenna.

Helpful Web Sites
Innovation, Science and Economic Development Canada (ISED): www.ic.gc.ca/.
Europe
The WIUBS02PE/WIUBS02UE modules are a Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product.
The WIUBS02PE/WIUBS02UE modules have been tested to RED 2014/53/EU Essential Requirements mentioned in the following European Compliance table.

Table 5-1. European Compliance Information

Certification

Standard

Safety

EN 62368

Health

EN 62311

EMC

EN 301 489-1 EN 301 489-17

Radio

EN 300 328

Article 3.1a
3.1b 3.2

The ETSI provides guidance on modular devices in the "Guide to the application of harmonised standards covering articles 3.1b and 3.2 of the RED 2014/53/EU (RED) to multi-radio and combined radio and non-radio equipment" document available at http://www.etsi.org/deliver/ etsi_eg/203300_203399/20 3367/01.01.01_60/eg_203367v010101p.pdf.

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WIUBS02 Appendix A: Regulatory Approval
Note:To maintain conformance to the standards listed in the preceding European Compliance table, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product, the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements against the RED.

5.3.1

Labeling and User Information Requirements
The label on the final product that contains the WIUBS02PE/WIUBS02UE modules must follow CE marking requirements.

5.3.2

Conformity Assessment
From ETSI Guidance Note EG 203367, section 6.1, when non-radio products are combined with a radio product:

If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the combined equipment against article 3.2 of the RED is required.

5.3.2.1 Simplified EU Declaration of Conformity
Hereby, Microchip Technology Inc. declares that the radio equipment type WIUBS02PE/WIUBS02UE modules are in compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity, for this product, is available at www.microchip.com/ design-centers/wireless-connectivity/.

5.3.3

Approved Antenna Types
For the WIUBS02PE, the approval is received using the integral PCB antenna.
For the WIUBS02UE, approved antennas are listed in the WIUBS02 Module Approved External Antenna.

5.3.4
5.4

Helpful Websites
A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Communications Committee (ECC) at: http:// www.ecodocdb.dk/.
Additional helpful web sites are:
· Radio Equipment Directive (2014/53/EU): https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/red_en
· European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org
· European Telecommunications Standards Institute (ETSI): http://www.etsi.org
· The Radio Equipment Directive Compliance Association (REDCA): http://www.redca.eu/
UKCA (UK Conformity Assessed)
The WIUBS02PE/WIUBS02UE module is a UK conformity assessed radio module that meets all the essential requirements according to CE RED requirements.

5.4.1

Labeling Requirements for Module and User's Requirements
The label on the final product that contains the WIUBS02PE/WIUBS02UE module must follow UKCA marking requirements.

DSxxxxxxxxA - 46

WIUBS02 Appendix A: Regulatory Approval

5.4.2
5.4.3 5.4.4
5.5

The UKCA mark above is printed on the module itself or on the packing label.
Additional details for the label requirement are available at:
https://www.gov.uk/guidance/using-the-ukca-marking#check-whether-you-need-to-use-the-newukca-marking.
UKCA Declaration of Conformity
Hereby, Microchip Technology Inc. declares that the radio equipment type the WIUBS02PE/ WIUBS02UE modules are in compliance with the Radio Equipment Regulations 2017. The full text of the UKCA declaration of conformity for this product is available (under Documents > Certifications) at: www.microchip.com/en-us/product/WIUBS02.
Approved Antennas
The testing of the WIUBS02PE/WIUBS02UE module was performed with the antennas listed in WIUBS02 Module Approved External Antenna.
Helpful Websites
For more information on the UKCA regulatory approvals, refer to the www.gov.uk/guidance/placingmanufactured-goods-on-the-market-in-great-britain.
Other Regulatory Information
· For information about other countries' jurisdictions not covered here, refer to the www.microchip.com/design-centers/wireless-connectivity/certifications.
· Should other regulatory jurisdiction certification be required by the customer, or the customer needs to recertify the module for other reasons, contact Microchip for the required utilities and documentation.

DSxxxxxxxxA - 47

WIUBS02 Appendix B: Acronyms and Abbreviations

6. Appendix B: Acronyms and Abbreviations

Table 6-1. Acronyms and Abbreviations
Acronyms ADC AES ASCII CBC CDM CFB
CLK CMD CPU CTR CTS DAC DC DES DFU DNP ECB ECC EMC EMI ESD ESR EVM FCC GND GPIO HBM HPA HTTP I2C IP I/O IPWR IRQn ISED ISM LNA LPRC MCLR MSB NC NDRNG

Abbreviations Analog-to-Digital Converter Advanced Encryption Standard American Standard Code for Information Interchange Cypher Block Chaining Charged Device Model Cypher Feedback Mode
Clock Command Central Processing Unit Counter Mode Clear-to-Send Digital-to-Analog Converter Direct Current Data Encryption Standard Device Firmware Update Do Not Populate Electronic Code Book Elliptic-Curve Cryptography Electro-Magnetic Compatibility Electro-Magnetic Interference Electrostatic Discharge Effective Series Resistance Error Vector Magnitude Federal Communications Commission Ground General Purpose I/O Human Body Model High Power Amplifiers Hypertext Transfer Protocol Inter-Integrated Circuit Internet Protocol Input Output Idle Current Interrupt Request (active-low) Innovation, Science and Economic Development International Safety Management Certification Low Noise Amplifier Low Power RC Oscillator Master Clear Input Active Low Most Significant Bit No Connection Non Deterministic Random Number Generator

DSxxxxxxxxA - 48

...........continued
Acronyms NIST OEM OFB OFDM OTA OTP PA PCB PMF PMU POR POSC PRIO PSM PTA PWM RF ROM RP RSSI RTC RTCC RTS RX SMA SMD SOSC SOSCO SRAM SSL STM TCP TLS TP TPC TX UART UDP VQFN WCM WLAN WPA XDS XLP XOSC

WIUBS02 Appendix B: Acronyms and Abbreviations
Abbreviations National Institute of Standards and Technology Original Equipment Manufacturer Output Feedback Mode Orthogonal Frequency Division Multiplexing Over-the-Air One Time Programmable Power Amplifier Printed Circuit Board Protected Management Frame Power Management Unit Power-on Reset Primary Oscillator Priority Pulse Skipping Mode Packet Traffic Arbitration Pulse Width Modulation Radio Frequency Read Only Memory Reverse Polarity Receive Signal Strength Indication Real Time Counter Real Time Clock Calendar Request-to-Send Receive SubMiniature Connector Surface Mount Device Secondary Oscillator Secondary Oscillator Output Static Random Access Memory Secure Sockets Layer Standard Test Method Transmission Control Protocol Transport Layer Security Test Point Transmit Power Control Transmit Universal Asynchronous Receiver/Transmitter Unified Data Packet Very Thin Quad Flat No-lead Wi-Fi® Context Memory Wireless Local Area Network Wi-Fi Protected Access Extended Deep Sleep Extreme Low-Power Crystal Oscillator

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WIUBS02 Document Revision History

7. Document Revision History
The revision history describes the changes that were implemented in the document. The changes are listed by revision, starting with the most current publication.

Table 7-1. Document Revision History

Revision

Date

06/2024

Section Document

Description Initial Revision

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WIUBS02

Microchip Information
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Customers should contact their distributor, representative or ESE for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in this document.
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Note the following details of the code protection feature on Microchip products:
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DSxxxxxxxxA - 51

WIUBS02
that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at www.microchip.com/en-us/support/design-help/ client-support-services.
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DSxxxxxxxxA - 52

All other trademarks mentioned herein are property of their respective companies. © 2024, Microchip Technology Incorporated and its subsidiaries. All Rights Reserved.
ISBN:
Quality Management System
For information regarding Microchip's Quality Management Systems, please visit www.microchip.com/quality.

WIUBS02

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Worldwide Sales and Service

AMERICAS
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India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-4121-0141 Japan - Osaka Tel: 81-6-6152-7160 Japan - Tokyo Tel: 81-3-6880- 3770 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-577-8366 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Thailand - Bangkok Tel: 66-2-694-1351 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100

EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4485-5910 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra'anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-72884388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820

DSxxxxxxxxA - 54

References

Related FCC IDs:

2ADHKWIXCS02U - Microchip Technology Inc. Wireless MCU Module with IEEE 802.11 b/g/n [WIXCS02U]

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