ESP32S3WROOM1 ESP32S3WROOM1U - Espressif Systems

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ESP32S3WROOM1

ESP32S3WROOM1YU Datasheet AR 2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE) module
Built around ESP32S3 series of SoCs, Xtensa® dualcore 32bit LX7 microprocessor
IN IP Flash up to 16 MB, PSRAM up to 8 MB
36 GPIOs, rich set of peripherals Onboard PCB antenna or external antenna connector

PRELFIMORREVCIHSION 1 ESP32S3WROOM1

ESP32S3WROOM1U

Pre-release v0.6 Espressif Systems Copyright © 2021

www.espressif.com

1 Module Overview
1 Module Overview
Note: Check the link or the QR code to make sure that you use the latest version of this document: https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_ datasheet_en.pdf

1.1 Features

CPU and OnChip Memory

Peripherals

· ESP32-S3 series of SoCs embedded, Xtensa®
Y dual-core 32-bit LX7 microprocessor, up to 240
MHz
R · 384 KB ROM
· 512 KB SRAM
A · 16 KB SRAM in RTC
· Up to 8 MB PSRAM
IN WiFi · 802.11 b/g/n · Bit rate: 802.11n up to 150 Mbps · A-MPDU and A-MSDU aggregation IM · 0.4 µs guard interval support · Center frequency range of operating channel: L 2412 ~ 2484 MHz Bluetooth
E · Bluetooth LE: Bluetooth 5, Bluetooth mesh
· 2 Mbps PHY
R · Long range mode P· Advertising extensions

· GPIO, SPI, LCD interface, Camera interface, UART, I2C, I2S, remote control, pulse counter, LED PWM, USB 1.1 OTG, USB Serial/JTAG controller, MCPWM, SDIO host, GDMA, TWAI® controller (compatible with ISO 11898-1), ADC, touch sensor, temperature sensor, timers and watchdogs
Integrated Components on Module
· 40 MHz crystal oscillator · Up to 16 MB SPI flash
Antenna Options · On-board PCB antenna (ESP32-S3-WROOM-1) · External antenna via a connector (ESP32-S3-WROOM-1U)
Operating Conditions
· Operating voltage/Power supply: 3.0 ~ 3.6 V · Operating ambient temperature:
­ 65 °C version: ­40 ~ 65 °C ­ 85 °C version: ­40 ~ 85 °C

· Multiple advertisement sets

­ 105 °C version: ­40 ~ 105 °C

· Channel selection algorithm #2

· Dimensions: See Table 1

1.2 Description
ESP32-S3-WROOM-1 and ESP32-S3-WROOM-1U are two powerful, generic Wi-Fi + Bluetooth LE MCU modules that are built around the ESP32-S3 series of SoCs. On top of a rich set of peripherals, the acceleration

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1 Module Overview

for neural network computing and signal processing workloads provided by the SoC make the modules an ideal choice for a wide variety of application scenarios related to AI and Artificial Intelligence of Things (AIoT), such as wake word detection, speech commands recognition, face detection and recognition, smart home, smart appliances, smart control panel, smart speaker, etc.

ESP32-S3-WROOM-1 comes with a PCB antenna. ESP32-S3-WROOM-1U comes with an external antenna

connector. A wide selection of module variants are available for customers as shown in Table 1. Among the

module variants, those embed ESP32-S3R8 operate at ­40 ~ 65 °C ambient temperature,

ESP32-S3-WROOM-1-H4 and ESP32-S3-WROOM-1U-H4 operate at ­40 ~ 105 °C ambient temperature, and

other module variants operate at ­40 ~ 85 °C ambient temperature.

Table 1: Ordering Information

Ordering Code
Y ESP32-S3-WROOM-1-N4
ESP32-S3-WROOM-1-N8 ESP32-S3-WROOM-1-N16
R ESP32-S3-WROOM-1-H4 (105 °C)
ESP32-S3-WROOM-1-N4R2 ESP32-S3-WROOM-1-N8R2
A ESP32-S3-WROOM-1-N16R2
ESP32-S3-WROOM-1-N4R8 (65 °C) ESP32-S3-WROOM-1-N8R8 (65 °C)
IN ESP32-S3-WROOM-1-N16R8 (65 °C)
ESP32-S3-WROOM-1U-N4 ESP32-S3-WROOM-1U-N8 ESP32-S3-WROOM-1U-N16 ESP32-S3-WROOM-1U-H4 (105 °C)
IM ESP32-S3-WROOM-1U-N4R2
ESP32-S3-WROOM-1U-N8R2 ESP32-S3-WROOM-1U-N16R2 ESP32-S3-WROOM-1U-N4R8 (65 °C)
L ESP32-S3-WROOM-1U-N8R8 (65 °C)
ESP32-S3-WROOM-1U-N16R8 (65 °C)

Chip Embedded ESP32-S3 ESP32-S3 ESP32-S3 ESP32-S3 ESP32-S3R2 ESP32-S3R2 ESP32-S3R2 ESP32-S3R8 ESP32-S3R8 ESP32-S3R8 ESP32-S3 ESP32-S3 ESP32-S3 ESP32-S3 ESP32-S3R2 ESP32-S3R2 ESP32-S3R2 ESP32-S3R8 ESP32-S3R8 ESP32-S3R8

Flash (MB) 4 8 16 4 4 8 16 4 8 16 4 8 16 4 4 8 16 4 8 16

PSRAM (MB) 0 0 0 0
2 (Quad SPI) 2 (Quad SPI) 2 (Quad SPI) 8 (Octal SPI) 8 (Octal SPI) 8 (Octal SPI)
0 0 0 0 2 (Quad SPI) 2 (Quad SPI) 2 (Quad SPI) 8 (Octal SPI) 8 (Octal SPI) 8 (Octal SPI)

Dimensions (mm) 18 × 25.5 × 3.1
18 × 19.2 × 3.2

E At the core of the modules is an ESP32-S3 series of SoC *, an Xtensa® 32-bit LX7 CPU that operates at up to
240 MHz. You can power off the CPU and make use of the low-power co-processor to constantly monitor the
R peripherals for changes or crossing of thresholds. PESP32-S3 integrates a rich set of peripherals including SPI, LCD, Camera interface, UART, I2C, I2S, remote

control, pulse counter, LED PWM, USB Serial/JTAG controller, MCPWM, SDIO host, GDMA, TWAI® controller

(compatible with ISO 11898-1), ADC, touch sensor, temperature sensor, timers and watchdogs, as well as up to

45 GPIOs. It also includes a full-speed USB 1.1 On-The-Go (OTG) interface to enable USB

communication.

Note: * For more information on ESP32-S3 series of SoCs, please refer to ESP32-S3 Series Datasheet.

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1 Module Overview

1.3 Applications

· Generic Low-power IoT Sensor Hub

· Smart Building

· Generic Low-power IoT Data Loggers

· Industrial Automation

· Cameras for Video Streaming

· Smart Agriculture

· Over-the-top (OTT) Devices

· Audio Applications

· USB Devices

· Speech Recognition · Image Recognition · Mesh Network
PRELIMINARY · HomeAutomation

· Health Care Applications · Wi-Fi-enabled Toys · Wearable Electronics · Retail & Catering Applications

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Contents

Contents

1 Module Overview

2

1.1 Features

2

1.2 Description

2

1.3 Applications

4

2 3
3.1 3.2 3.3
4
4.1 4.2 4.3 4.4 4.5
4.6
5 6 7
7.1 7.2 7.3
8
8.1

Block Diagram

8

Pin Definitions

9

Pin Layout

9

Pin Description

10

Y Strapping Pins

11

Electrical Characteristics

14

R Absolute Maximum Ratings

14

Recommended Operating Conditions

14

DC Characteristics (3.3 V, 25 °C)

14

A Current Consumption Characteristics

15

Wi-Fi RF Characteristics

15

4.5.1 Wi-Fi RF Standards

15

IN 4.5.2 Wi-Fi RF Transmitter (TX) Specifications

16

4.5.3 Wi-Fi RF Receiver (RX) Specifications

17

Bluetooth LE Radio

18

4.6.1 Bluetooth LE RF Transmitter (TX) Specifications

18

IM 4.6.2 Bluetooth LE RF Receiver (RX) Specifications

20

Module Schematics

23

L Peripheral Schematics

25

Physical Dimensions and PCB Land Pattern

26

E Physical Dimensions

26

Recommended PCB Land Pattern

27

Dimensions of External Antenna Connector

29

R Product Handling

30

PStorage Conditions

30

8.2 Electrostatic Discharge (ESD)

30

8.3 Reflow Profile

30

9 Related Documentation and Resources

31

Revision History

32

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List of Tables

List of Tables

1 Ordering Information

3

2 Pin Definitions

10

3 JTAG Signal Source Selection

12

4 Strapping Pins

12

5 Parameter Descriptions of Setup and Hold Times for the Strapping Pin

13

6 Absolute Maximum Ratings

14

7 Recommended Operating Conditions

14

8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

DC Characteristics (3.3 V, 25 °C)

14

Current Consumption Depending on RF Modes

15

Current Consumption Depending on Work Modes

15

Wi-Fi RF Standards

16

Y TX Power with Spectral Mask and EVM Meeting 802.11 Standards

16

TX EVM Test

16

RX Sensitivity

17

R Maximum RX Level

17

RX Adjacent Channel Rejection

18

Bluetooth LE Frequency

18

A Transmitter Characteristics - Bluetooth LE 1 Mbps

18

Transmitter Characteristics - Bluetooth LE 2 Mbps

19

Transmitter Characteristics - Bluetooth LE 125 Kbps

19

IN Transmitter Characteristics - Bluetooth LE 500 Kbps

19

Receiver Characteristics - Bluetooth LE 1 Mbps

20

Receiver Characteristics - Bluetooth LE 2 Mbps

20

Receiver Characteristics - Bluetooth LE 125 Kbps

21

PRELIM Receiver Characteristics - Bluetooth LE 500 Kbps

21

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List of Figures

List of Figures

1 ESP32-S3-WROOM-1 Block Diagram

8

2 ESP32-S3-WROOM-1U Block Diagram

8

3 Pin Layout (Top View)

9

4 Setup and Hold Times for the Strapping Pin

13

5 ESP32-S3-WROOM-1 Schematics

23

6 ESP32-S3-WROOM-1U Schematics

24

7 Peripheral Schematics

25

8 ESP32-S3-WROOM-1 Physical Dimensions

26

9 ESP32-S3-WROOM-1U Physical Dimensions

26

10 ESP32-S3-WROOM-1 Recommended PCB Land Pattern

27

11 ESP32-S3-WROOM-1U Recommended PCB Land Pattern

28

Y 12 Dimensions of External Antenna Connector

29

PRELIMINAR 13 ReflowProfile

30

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2 Block Diagram
2 Block Diagram

40 MHz

ESP32-S3-WROOM-1

3V3

Crystal

Antenna

ESP32-S3

RF Matching

ESP32-S3R2

EN

ESP32-S3R8

PSRAM(opt.) (QSPI/OSPI)

GPIOs

SPICS0 SPICLK SPID SPIQ SPIHD SPIWP VDD_SPI

Y QSPI Flash R Figure 1: ESP32S3WROOM1 Block Diagram

A 40 MHz

ESP32-S3-WROOM-1U

3V3

Crystal

Antenna

IN ESP32-S3

RF Matching

ESP32-S3R2

EN

ESP32-S3R8

GPIOs

IMPSRAM(opt.)
(QSPI/OSPI)

SPICS0 SPICLK SPID SPIQ SPIHD SPIWP VDD_SPI

LQSPI Flash PREFigure 2: ESP32S3WROOM1U Block Diagram

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3 Pin Definitions

3 Pin Definitions

3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 7.1 Physical Dimensions.

The pin diagram is applicable for ESP32-S3-WROOM-1 and ESP32-S3-WROOM-1U, but the latter has no

keepout zone.

ARY GND

1

3V3

2

IN EN

3

IO4

4

IO5

5

IO6

6

IM IO7

7

IO15

8

L IO16

9

IO17 10

E IO18

11

IO8 12

IO19 13

PRIO20 14

26

25

24

IO21 23

22

21

IO12 20

IO11 19

IO10 18

IO9 17

IO46 16

IO3 15

IO45

IO48

IO47

IO14

IO13

Keepout Zone

GND

GND

GND

GND

41 GND

GND

GND

GND

GND

40 GND

39 IO1

38 IO2

37

TXD0

36 RXD0

35 IO42

34 IO41

33 IO40

32 IO39

31 IO38

30 IO37

29 IO36

28 IO35

27 IO0

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Figure 3: Pin Layout (Top View)

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3 Pin Definitions

3.2 Pin Description
The module has 41 pins. See pin definitions in Table 2. For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to ESP32-S3 Series Datasheet.

Table 2: Pin Definitions

Name No. Type a Function

GND 3V3
EN
Y IO4
IO5
R IO6
IO7 IO15
A IO16
IO17 IO18
IN IO8
IO19 IO20 IO3 IO46
IM IO9
IO10
L IO11 E IO12
IO13
R IO14 PIO21

1

P GND

2

P Power supply

High: on, enables the chip.

3

I Low: off, the chip powers off.

Note: Do not leave the EN pin floating.

4 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3

5 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4

6 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5

7 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6

8 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P

9 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N

10 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6

11 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3

12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1

13 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-

14 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+

15 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2

16 I/O/T GPIO46

17 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD

RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4, 18 I/O/T
SUBSPICS0

RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5, 19 I/O/T
SUBSPID

RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6, 20 I/O/T
SUBSPICLK

RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7, 21 I/O/T
SUBSPIQ

RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS, 22 I/O/T
SUBSPIWP

23 I/O/T RTC_GPIO21, GPIO21

IO47 24 I/O/T SPICLK_P_DIFF,GPIO47, SUBSPICLK_P_DIFF

IO48 25 I/O/T SPICLK_N_DIFF,GPIO48, SUBSPICLK_N_DIFF

IO45 26 I/O/T GPIO45

IO0

27 I/O/T RTC_GPIO0, GPIO0

IO35 b 28 I/O/T SPIIO6, GPIO35, FSPID, SUBSPID

IO36 b 29 I/O/T SPIIO7, GPIO36, FSPICLK, SUBSPICLK

Cont'd on next page

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3 Pin Definitions

Table 2 ­ cont'd from previous page

Name No. Type a Function

IO37 b 30 I/O/T SPIDQS, GPIO37, FSPIQ, SUBSPIQ

IO38 31 I/O/T GPIO38, FSPIWP, SUBSPIWP

IO39 32 I/O/T MTCK, GPIO39, CLK_OUT3, SUBSPICS1

IO40 33 I/O/T MTDO, GPIO40, CLK_OUT2

IO41 34 I/O/T MTDI, GPIO41, CLK_OUT1

IO42 35 I/O/T MTMS, GPIO42

RXD0 36 I/O/T U0RXD, GPIO44, CLK_OUT2

TXD0 37 I/O/T U0TXD, GPIO43, CLK_OUT1

IO2

38 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1

IO1

39 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0

GND 40 P GND

Y EPAD 41 P GND

a P: power supply; I: input; O: output; T: high impedance. Pin functions in bold font are the default
R pin functions.
b In module variants that have embedded OSPI PSRAM, i.e., that embed ESP32-S3R8, pins IO35, IO36, and IO37 connect to the OSPI PSRAM and are not available for other uses.

A 3.3 Strapping Pins IN Note:
The content below is excerpted from Section Strapping Pins in ESP32-S3 Series Datasheet. For the strapping pin mapping between the chip and modules, please refer to Chapter 5 Module Schematics.

ESP32-S3 has four strapping pins:
IM · GPIO0
· GPIO45
L · GPIO46
· GPIO3
E Software can read the values of corresponding bits from register "GPIO_STRAPPING".
During the chip's system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog
R reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as
strapping bits of "0" or "1", and hold these bits until the chip is powered down or shut down.
PGPIO0, GPIO45 and GPIO46 are connected to the chip's internal weak pull-up/pull-down during the chip reset.

Consequently, if they are unconnected or the connected external circuit is high-impedance, the internal weak

pull-up/pull-down will determine the default input level of these strapping pins.

GPIO3 is floating by default. Its strapping value can be configured to determine the source of the JTAG signal inside the CPU, as shown in Table 4. In this case, the strapping value is controlled by the external circuit that cannot be in a high impedance state. Table 3 shows more configuration combinations of EFUSE_DIS_USB_JTAG, EFUSE_DIS_PAD_JTAG, and EFUSE_STRAP_JTAG_SEL that determine the JTAG signal source.

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3 Pin Definitions

Table 3: JTAG Signal Source Selection

EFUSE_STRAP_JTAG_SEL 1 0 don't care don't care don't care

EFUSE_DIS_USB_JTAG 0 0 0 1 1

EFUSE_DIS_PAD_JTAG 0 0 1 0 1

JTAG Signal Source Refer to Table 4 USB Serial/JTAG controller USB Serial/JTAG controller On-chip JTAG pins N/A

To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCU's GPIOs to control the voltage level of these pins when powering on ESP32-S3.
After reset, the strapping pins work as normal-function pins.
Y Refer to Table 4 for a detailed configuration of the strapping pins.

Table 4: Strapping Pins

R Pin
GPIO45
A Pin
GPIO0
IN GPIO46
Pin GPIO46
IM Pin L GPIO3

VDD_SPI Voltage 1

Default

3.3 V

1.8 V

Pull-down

0

1

Booting Mode 2

Default

SPI Boot

Download Boot

Pull-up

1

0

Pull-down

Don't care

0

Enabling/Disabling ROM Messages Print During Booting 3 4

Default

Enabled

Disabled

Pull-down

See the fourth note

See the fourth note

JTAG Signal Selection

Default

EFUSE_DIS_USB_JTAG = 0, EFUSE_DIS_PAD_JTAG = 0, EFUSE_STRAP_JTAG_SEL=1

0: JTAG signal from on-chip JTAG pins N/A
1: JTAG signal from USB Serial/JTAG controller

E Note:
1. VDD_SPI voltage is determined either by the strapping value of GPIO45 or by VDD_SPI_TIEH. When
R EFUSE_VDD_SPI_FORCE is 0, VDD_SPI voltage is determined by the strapping value of GPIO45; when
EFUSE_VDD_SPI_FORCE is 1, VDD_SPI voltage is determined by VDD_SPI_TIEH.
P2. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior.

3. ROM boot messages can be printed over U0TXD (by default) or GPIO17 (U1TXD), depending on the eFuse bit

EFUSE_UART_PRINT_CHANNEL.

4. When both EFUSE_DIS_USB_SERIAL_JTAG and EFUSE_DIS_USB_OTG are 0, ROM boot messages will be printed to the USB Serial/JTAG controller. Otherwise, the messages will be printed to UART, controlled by GPIO46 and EFUSE_UART_PRINT_CONTROL. Specifically, when EFUSE_UART_PRINT_CONTROL value is: 0, print is normal during boot and not controlled by GPIO46. 1 and GPIO46 is 0, print is normal during boot; but if GPIO46 is 1, print is disabled.

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3 Pin Definitions

2 and GPIO46 is 0, print is disabled; but if GPIO46 is 1, print is normal. 3, print is disabled and not controlled by GPIO46.
Figure 4 shows the setup and hold times for the strapping pin before and after the CHIP_PU signal goes high. Details about the parameters are listed in Table 5.

tSU

tHD

CHIP_PU

VIL_nRST

Y VIH R Strapping pin A Figure 4: Setup and Hold Times for the Strapping Pin

Table 5: Parameter Descriptions of Setup and Hold Times for the Strapping Pin

IN Parameter
tSU
PRELIM tHD

Description Setup time before CHIP_PU goes from low to high Hold time after CHIP_PU goes high

Min (ms) 0 3

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4 Electrical Characteristics

4 Electrical Characteristics
The values presented in this section are preliminary and may change with the final release of this datasheet.

4.1 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These

are stress ratings only and functional operation of the device at these or any other conditions beyond those

indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 6: Absolute Maximum Ratings

Y Symbol
VDD33 TST ORE

Parameter Power supply voltage Storage temperature

Min Max Unit ­0.3 3.6 V ­40 105 °C

AR 4.2 Recommended Operating Conditions

Table 7: Recommended Operating Conditions

IN Symbol Parameter

Min Typ Max Unit

VDD33 Power supply voltage

3.0 3.3 3.6 V

IV DD

Current delivered by external power supply

0.5 -- -- A

65 °C version

65

TA

Operating ambient temperature 85 °C version ­40 -- 85 °C

IM105 °C version

105

4.3 DC Characteristics (3.3 V, 25 °C)

EL Symbol
CIN VIH
R VIL
IIH
PIIL

Table 8: DC Characteristics (3.3 V, 25 °C)

Parameter Pin capacitance High-level input voltage Low-level input voltage High-level input current Low-level input current

Min

Typ

--

2

0.75 × VDD1 --

­0.3

--

--

--

--

--

Max

Unit

--

pF

VDD1+ 0.3 V

0.25 × VDD1 V

50

nA

50

nA

VOH 2

High-level output voltage

0.8 × VDD1 --

--

V

VOL2

Low-level output voltage

--

-- 0.1 × VDD1 V

IOH

High-level source current (VDD1= 3.3 V, VOH >=

--

40

--

mA

2.64 V, PAD_DRIVER = 3)

IOL

Low-level sink current (VDD1= 3.3 V, VOL =

--

28

--

mA

0.495 V, PAD_DRIVER = 3)

Cont'd on next page

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4 Electrical Characteristics

Symbol RP U RP D VI H _nRS T
VI L_nRS T

Table 8 ­ cont'd from previous page

Parameter

Min

Typ

Internal weak pull-up resistor

--

45

Internal weak pull-down resistor

--

45

Chip reset release voltage (EN voltage is within 0.75 × VDD1 -- the specified range)

Chip reset voltage (EN voltage is within the

­0.3

--

specified range)

Max

Unit

--

k

--

k

VDD1+ 0.3 V

0.25 × VDD1 V

1 VDD is the I/O voltage for pins of a particular power domain. 2 VOH and VOL are measured using high-impedance load.

4.4 Current Consumption Characteristics
Y With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section Low Power Management
R in ESP32-S3 Series Datasheet.

Table 9: Current Consumption Depending on RF Modes

A Work mode IN Active (RF working)

Description 802.11b, 1 Mbps, @20.5 dBm 802.11g, 54 Mbps, @18 dBm
TX 802.11n, HT20, MCS 7, @17.5 dBm 802.11n, HT40, MCS 7, @17 dBm 802.11b/g/n, HT20
RX 802.11n, HT40

Peak (mA) 355 297 286 285 95 97

IM 1 The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF port. All transmitters' measurements are based on a 100% duty cycle. 2 The current consumption figures for in RX mode are for cases when the peripherals are dis-
abled and the CPU idle.

L Note that the data in Table 10 only applies to the module variants that embed the chip variant ESP32-S3.

ETable 10: Current Consumption Depending on Work Modes

Work mode
R Light-sleep
Deep-sleep
PHibernation

Description -- RTC memory and RTC peripherals are powered on. RTC memory is powered on. RTC peripherals are powered off.

Typ Unit 240 µA
8 µA 7 µA

Power off CHIP_PU is set to low level. The chip is powered off.

1 µA

4.5 WiFi RF Characteristics
4.5.1 WiFi RF Standards

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4 Electrical Characteristics

Table 11: WiFi RF Standards

Name

Description

Center frequency range of operating channel 1

2412 ~ 2484 MHz

Wi-Fi wireless standard

IEEE 802.11b/g/n

11b: 1, 2, 5.5 and 11 Mbps

Data rate

20 MHz

11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 11n: MCS0-7, 72.2 Mbps (Max)

40 MHz

11n: MCS0-7, 150 Mbps (Max)

Antenna type

PCB antenna, external antenna via the connector

1 Device should operate in the center frequency range allocated by regional regulatory authorities. Target center frequency range is configurable by software.
2 For the modules that use external antennas, the output impedance is 50 . For other modules without
Y external antennas, the output impedance is irrelevant.

R 4.5.2 WiFi RF Transmitter (TX) Specifications
Target TX power is configurable based on device or certification requirements. The default characteristics are provided in Table 12.

A Table 12: TX Power with Spectral Mask and EVM Meeting 802.11 Standards

IN Rate
802.11b, 1 Mbps 802.11b, 11 Mbps 802.11g, 6 Mbps
IM 802.11g, 54 Mbps
802.11n, HT20, MCS 0 802.11n, HT20, MCS 7 802.11n, HT40, MCS 0
L 802.11n, HT40, MCS 7

Min (dBm)
-- -- -- -- -- -- -- --

Typ (dBm)
20.5 20.5 20.0 18.0 19.0 17.5 18.5 17.0

Max (dBm)
-- -- -- -- -- -- -- --

E Table 13: TX EVM Test

Rate
R802.11b, 1 Mbps, @20.5 dBm P 802.11b, 11 Mbps, @20.5 dBm

Min (dB)
-- --

Typ (dB) ­24.5 ­24.5

SL1 (dB)
­10 ­10

802.11g, 6 Mbps, @20 dBm

-- ­23.0

­5

802.11g, 54 Mbps, @18 dBm

-- ­29.5 ­25

802.11n, HT20, MCS 0, @19 dBm

-- ­24.0

­5

802.11n, HT20, MCS 7, @17.5 dBm

-- ­30.5 ­27

802.11n, HT40, MCS 0, @18.5 dBm

-- ­25.0

­5

802.11n, HT40, MCS 7, @17 dBm

-- ­30.0 ­27

1 SL stands for standard limit value.

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4 Electrical Characteristics

4.5.3 WiFi RF Receiver (RX) Specifications

Table 14: RX Sensitivity

Rate

Min Typ Max (dBm) (dBm) (dBm)

802.11b, 1 Mbps

-- ­98.2

--

802.11b, 2 Mbps

-- ­95.6

--

802.11b, 5.5 Mbps

-- ­92.8

--

802.11b, 11 Mbps 802.11g, 6 Mbps 802.11g, 9 Mbps 802.11g, 12 Mbps
Y 802.11g, 18 Mbps
802.11g, 24 Mbps 802.11g, 36 Mbps
R 802.11g, 48 Mbps
802.11g, 54 Mbps 802.11n, HT20, MCS 0
A 802.11n, HT20, MCS 1
802.11n, HT20, MCS 2 802.11n, HT20, MCS 3
IN 802.11n, HT20, MCS 4
802.11n, HT20, MCS 5 802.11n, HT20, MCS 6 802.11n, HT20, MCS 7 802.11n, HT40, MCS 0
IM 802.11n, HT40, MCS 1
802.11n, HT40, MCS 2 802.11n, HT40, MCS 3
L 802.11n, HT40, MCS 4
802.11n, HT40, MCS 5 802.11n, HT40, MCS 6
E802.11n, HT40, MCS 7

-- ­88.5

--

-- ­93.0

--

-- ­92.0

--

-- ­90.8

--

-- ­88.5

--

-- ­85.5

--

-- ­82.2

--

-- ­78.0

--

-- ­76.2

--

-- ­93.0

--

-- ­90.6

--

-- ­88.4

--

-- ­84.8

--

-- ­81.6

--

-- ­77.4

--

-- ­75.6

--

-- ­74.2

--

-- ­90.0

--

-- ­87.5

--

-- ­85.0

--

-- ­82.0

--

-- ­78.5

--

-- ­74.4

--

-- ­72.5

--

-- ­71.2

--

PRRate

Table 15: Maximum RX Level Min Typ

Max

(dBm) (dBm) (dBm)

802.11b, 1 Mbps

--

5

--

802.11b, 11 Mbps

--

5

--

802.11g, 6 Mbps

--

5

--

802.11g, 54 Mbps

--

0

--

802.11n, HT20, MCS 0

--

5

--

802.11n, HT20, MCS 7

--

0

--

Cont'd on next page

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4 Electrical Characteristics

Table 15 ­ cont'd from previous page

Rate

Min Typ (dBm) (dBm)

802.11n, HT40, MCS 0

--

5

802.11n, HT40, MCS 7

--

0

Max (dBm)
-- --

Table 16: RX Adjacent Channel Rejection

Min Typ Max

Rate
802.11b, 1 Mbps 802.11b, 11 Mbps 802.11g, 6 Mbps
Y 802.11g, 54 Mbps
802.11n, HT20, MCS 0 802.11n, HT20, MCS 7
R 802.11n, HT40, MCS 0
802.11n, HT40, MCS 7

(dB) -- -- -- -- -- -- -- --

(dB) 35 35 31 14 31 13 19 8

(dB) -- -- -- -- -- -- -- --

A 4.6 Bluetooth LE Radio

IN Table 17: Bluetooth LE Frequency

Parameter Center frequency of operating channel

Min (MHz)
2402

Typ (MHz)
--

Max (MHz)
2480

IM 4.6.1 Bluetooth LE RF Transmitter (TX) Specifications

L Table 18: Transmitter Characteristics  Bluetooth LE 1 Mbps

Parameter
E RF transmit power PR Carrier frequency offset and drift

Description RF power control range Gain control step Max |fn|n=0, 1, 2, ..k Max |f0 - fn| Max |fn - fn-5|

Min ­25.00
-- -- -- --

Typ 0
3.00 2.50 2.00 1.40

Max 20.00
-- -- -- --

Unit dBm dB kHz kHz kHz

|f1 - f0|

--

1.00

-- kHz

 f 1avg

-- 249.00

-- kHz

Modulation characteristics

Min  f 2max (for at least 99.9% of all  f 2max)

-- 198.00

-- kHz

 f 2avg/ f 1avg

--

0.86

----

±2 MHz offset

-- ­37.00

-- dBm

In-band spurious emissions

±3 MHz offset

-- ­42.00

-- dBm

Cont'd on next page

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4 Electrical Characteristics

Parameter

Table 18 ­ cont'd from previous page

Description

Min

>±3 MHz offset

--

Typ ­44.00

Max

Unit

-- dBm

Table 19: Transmitter Characteristics  Bluetooth LE 2 Mbps

Parameter

Description

Min

Typ

Max

Unit

RF power control range

­25.00

0 20.00 dBm

RF transmit power

Gain control step

--

3.00

-- dB

Carrier frequency offset and drift
Y Modulation characteristics AR In-band spurious emissions

Max |fn|n=0, 1, 2, ..k Max |f0 - fn| Max |fn - fn-5| |f1 - f0|  f 1avg Min  f 2max (for at least 99.9% of all  f 2max)  f 2avg/ f 1avg ±4 MHz offset ±5 MHz offset >±5 MHz offset

--

2.50

--

2.00

--

1.40

--

1.00

-- 499.00

-- 416.00

--

0.89

-- ­42.00

-- ­44.00

-- ­47.00

-- kHz -- kHz -- kHz -- kHz -- kHz
-- kHz
---- -- dBm -- dBm -- dBm

IN Table 20: Transmitter Characteristics  Bluetooth LE 125 Kbps

Parameter RF transmit power
IM Carrier frequency offset and drift L Modulation characteristics PRE In-band spurious emissions

Description RF power control range Gain control step Max |fn|n=0, 1, 2, ..k Max |f0 - fn| |fn - fn-3| |f0 - f3|  f 1avg Min  f 1max (for at least 99.9% of all f 1max) ±2 MHz offset ±3 MHz offset >±3 MHz offset

Min ­25.00
-- -- -- -- -- --
--
-- -- --

Typ 0
3.00 0.80 1.00 0.30 1.00 248.00
222.00
­37.00 ­42.00 ­44.00

Max 20.00
-- -- -- -- -- --

Unit dBm dB kHz kHz kHz kHz kHz

-- kHz

-- dBm -- dBm -- dBm

Table 21: Transmitter Characteristics  Bluetooth LE 500 Kbps

Parameter RF transmit power
Carrier frequency offset and drift

Description RF power control range Gain control step Max |fn|n=0, 1, 2, ..k Max |f0 - fn|

Min ­25.00
-- -- --

Typ

Max

Unit

0 20.00 dBm

3.00

-- dB

0.80

-- kHz

1.00

-- kHz

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4 Electrical Characteristics

Table 21 ­ cont'd from previous page

Parameter

Description

Min

Typ

Max

Unit

Modulation characteristics

|fn - fn-3| |f0 - f3|  f 2avg Min  f 2max (for at least 99.9% of all  f 2max)

--

0.85

--

0.34

-- 213.00

-- 196.00

-- kHz -- kHz -- kHz
-- kHz

±2 MHz offset

-- ­37.00

-- dBm

In-band spurious emissions

±3 MHz offset

-- ­42.00

-- dBm

>±3 MHz offset

-- ­44.00

-- dBm

4.6.2 Bluetooth LE RF Receiver (RX) Specifications

Y Table 22: Receiver Characteristics  Bluetooth LE 1 Mbps

Parameter
R Sensitivity @30.8% PER
Maximum received signal @30.8% PER Co-channel C/I
INA Adjacent channel selectivity C/I IM Image frequency
Adjacent channel to image frequency
L Out-of-band blocking performance E Intermodulation

Description -- -- F = F0 MHz F = F0 + 1 MHz F = F0 ­ 1 MHz F = F0 + 2 MHz F = F0 ­ 2 MHz F = F0 + 3 MHz F = F0 ­ 3 MHz F > F0 + 3 MHz F > F0 ­ 3 MHz -- F = Fimage + 1 MHz F = Fimage ­ 1 MHz 30 MHz ~ 2000 MHz 2003 MHz ~ 2399 MHz 2484 MHz ~ 2997 MHz 3000 MHz ~ 12.75 GHz --

Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --

Typ ­96.5
8 9 ­3 ­3 ­28 ­30 ­31 ­33 ­32 ­36 ­32 ­39 ­31 ­9 ­18 ­15 ­5 ­29

Max -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --

Unit dBm dBm dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm dBm dBm

PRTable 23: Receiver Characteristics  Bluetooth LE 2 Mbps

Parameter

Description

Min Typ Max Unit

Sensitivity @30.8% PER

--

-- ­92.5

-- dBm

Maximum received signal @30.8% PER --

--

3

-- dBm

Co-channel C/I

F = F0 MHz

--

10

-- dB

F = F0 + 2 MHz

--

­8

-- dB

F = F0 ­ 2 MHz

--

­5

-- dB

Cont'd on next page

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4 Electrical Characteristics

Table 23 ­ cont'd from previous page

Parameter

Description

Min Typ Max Unit

F = F0 + 4 MHz

-- ­31

-- dB

F = F0 ­ 4 MHz

-- ­33

-- dB

F = F0 + 6 MHz

-- ­37

-- dB

F = F0 ­ 6 MHz

-- ­37

-- dB

F > F0 + 6 MHz

-- ­40

-- dB

F > F0 ­ 6 MHz

-- ­40

-- dB

Image frequency

--

-- ­31

-- dB

Adjacent channel to image frequency
Y Out-of-band blocking performance
Intermodulation

F = Fimage + 2 MHz F = Fimage ­ 2 MHz 30 MHz ~ 2000 MHz 2003 MHz ~ 2399 MHz 2484 MHz ~ 2997 MHz 3000 MHz ~ 12.75 GHz --

-- ­37

--

­8

-- ­15

-- ­19

-- ­15

--

­6

-- ­29

-- dB -- dB -- dBm -- dBm -- dBm -- dBm -- dBm

R Table 24: Receiver Characteristics  Bluetooth LE 125 Kbps

A Parameter
Sensitivity @30.8% PER
Maximum received signal @30.8% PER
IN Co-channel C/I IM Adjacent channel selectivity C/I L Image frequency E Adjacent channel to image frequency

Description -- -- F = F0 MHz F = F0 + 1 MHz F = F0 ­ 1 MHz F = F0 + 2 MHz F = F0 ­ 2 MHz F = F0 + 3 MHz F = F0 ­ 3 MHz F > F0 + 3 MHz F > F0 ­ 3 MHz -- F = Fimage + 1 MHz F = Fimage ­ 1 MHz

Min -- -- -- -- -- -- -- -- -- -- -- -- -- --

Typ ­103.5
8 6 ­6 ­5 ­32 ­39 ­35 ­45 ­35 ­48 ­35 ­49 ­32

Max -- -- -- -- -- -- -- -- -- -- -- -- -- --

Unit dBm dBm dB dB dB dB dB dB dB dB dB dB dB dB

PR Parameter

Table 25: Receiver Characteristics  Bluetooth LE 500 Kbps

Description

Min Typ Max Unit

Sensitivity @30.8% PER

--

-- ­100

-- dBm

Maximum received signal @30.8% PER --

--

8

-- dBm

Co-channel C/I

F = F0 MHz

--

4

-- dB

F = F0 + 1 MHz

-- ­5

-- dB

F = F0 ­ 1 MHz

-- ­5

-- dB

F = F0 + 2 MHz

-- ­28

-- dB

Adjacent channel selectivity C/I

Cont'd on next page

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4 Electrical Characteristics

Table 25 ­ cont'd from previous page

Parameter

Description

Min Typ Max Unit

F = F0 ­ 2 MHz

-- ­36

-- dB

F = F0 + 3 MHz

-- ­36

-- dB

F = F0 ­ 3 MHz

-- ­38

-- dB

F > F0 + 3 MHz

-- ­37

-- dB

F > F0 ­ 3 MHz

-- ­41

-- dB

Image frequency

--

-- ­37

-- dB

PRELIMINARY Adjacent channel to image frequency

F = Fimage + 1 MHz F = Fimage ­ 1 MHz

-- ­44 -- ­28

-- dB -- dB

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5 Module Schematics

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5This isMtheoredferuenlcee dSescPignhoef tmhe amotdicules. 5

4

3

GND

R GND Y1

4

GND

C1

C4

D

TBD

TBD

VDD33

2 GND XOUT 3

XIN GND

E VDD33

The values of C1 and C4 vary with the selection of the crystal.
The value of R4 varies with the actual PCB board.

L VDD33 I C M C6
10uF

C3 1uF

GND L1

C7

C8

1uF

0.1uF

C2 10nF
GND 2.0nH(0.1nH)
C9 0.1uF

57 GND

56 55

R4

0

1

47 46

GND

GND

GND

GND

GND

ANT1

1 RF_ANT 2

L2

TBD

LNA_IN

1 2 LNA_IN

I PCB_ANT

L3 C11 TBD TBD

VDDA

VDDA 54 XTAL_P 53

XTAL_N 52

GPIO46 51

GPIO45 50

U0RXD 49

U0TXD 48

MTMS MTDI

VDD3P3_CPU 45

MTDO 44

MTCK 43

GPIO38

C12 TBD

CHIP_PU
GPIO0 GPIO1

3 VDD3P3 4 VDD3P3 5 CHIP_PU 6 GPIO0

GPIO2

7 GPIO1

N GND

GND

GND GPIO3

8 GPIO2

C5

GPIO4 GPIO5

9 GPIO3 10 GPIO4

TBD

GPIO6 GPIO7

11 GPIO5 12 GPIO6

B
GND

GPIO8 GPIO9

13 GPIO7 14 GPIO8
GPIO9

A The values of L3, C5, C11, L2 and C12
vary with the actual PCB board.

SPICS1

GPIO17 GPIO18

GPIO10

28 GPIO21

27 GPIO20

26 GPIO19

23 XTAL_32K_N

22 XTAL_32K_P

21 VDD3P3_RTC

20 GPIO14

19 GPIO13

18 GPIO12

17 GPIO11

NC: No component.

24 25

15 16

U1 VDD33

GND 40MHz(±10ppm)

R1 10K(NC)

GPIO46

GPIO45

U0RXD

R3

499 U0TXD

GPIO42

GPIO41

GPIO40

GPIO39

GPIO38

C10 0.1uF

VDD33

GND

42

GPIO37 41

GPIO36 40

GPIO35 39

GPIO34 38

GPIO33 37

SPICLK_P SPICLK_N

36 35

SPID 34

SPIQ 33

SPICLK 32

R16 R15 R10

SPICS0 31 R14

SPIWP SPIHD

30 29

R13

VDD_SPI

GPIO37 GPIO36 GPIO35
GPIO47 GPIO48 0 SPID 0 SPIQ 0 SPICLK SPICS0 0 SPIWP 0 SPIHD

ESP32-S3 ESP32-S3R2 ESP32-S3R8

C13 0.1uF

C14 VDD_SPI 1uF

GND GND

15

R C15
0.1uF

GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21

Y GND

2

1

VDD33 GND U3

1

2 GND

CHIP_PU 3 3V3

GPIO4 GPIO5

4 5

EN IO4

D1 GPIO6

6 IO5

ESD GPIO7 GPIO15
GPIO16

7 IO6 8 IO7 9 IO15

GPIO17 10 IO16

GND

GPIO18 GPIO8 GPIO19 GPIO20

11 IO17

12 IO18

13 14

IO8 IO19

IO20

ESP32-S3-WROOM-1

41

EPAD 40

GND 39

IO1 38

IO2 TXD0

37 36

RXD0 35

IO42 34

IO41 33

IO40 32

IO39 31

IO38 30

IO37 29

IO36 IO35

28 27

IO0

GND
GPIO1 GPIO2 U0TXD U0RXD GPIO42 GPIO41 GPIO40 GPIO39 GPIO38 GPIO37 GPIO36 GPIO35 GPIO0

IO45

26 IO48

25 IO47

24 IO21

23 IO14

22 IO13

21 IO12

20 IO11

IO9 IO10

17 IO46

16 IO3

18 19

GPIO3 GPIO46 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO21 GPIO47 GPIO48 GPIO45

ESP32-S3-WROOM-1(pin-out)
VDD_SPI

8 VDD

SPICS0 SPICLK SPIHD

1 /CS
6 CLK
7 /HOLD

U2

5 DI
2 DO /WP 3
FLASH-3V3

SPID SPIQ SPIWP

4 GND

GND

D C B

ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.6

A

A

Figure 5: ESP32S3WROOM1 Schematics Title <ESP32-S3-WROOM-1>

Size Page Name A4 <02_ESP32-S3-WROOM-1>

Rev V1.3 Confidential and Proprietary

Date:

Thursday, October 28, 2021

Sheet 2

of 2

5

4

3

2

1

5 Module Schematics

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D C B A

2 3

5

4

3

GND

4

GND Y1

3

GND

P C1 TBD

XIN GND

GND XOUT

C4 TBD

VDD33

IO3

15 16

R VDD33

The values of C1 and C4 vary with the selection of the crystal.
The value of R4 varies with the actual PCB board.

2

1

E VDD33
C6
L 10uF

C3 1uF

GND L1

C7

C8

1uF

0.1uF

GND 57

56

VDDA 55

R4

0

C2 10nF
GND 2.0nH(0.1nH)
C9 0.1uF

GND

GND GND GND
I 1 RF_ANT L2

GND

TBD

LNA_IN

VDDA 54 XTAL_P 53

XTAL_N 52

GPIO46 51

GPIO45 U0RXD

ANT1
M CONN

C11 TBD

50 49

U0TXD 48

MTMS 47

MTDI 46

VDD3P3_CPU 45

MTDO 44

MTCK 43

GPIO38

C12 TBD

GND

GND

GND

The values of C11, L2 and C12 vary with the actual PCB board.
I NC: No component.

CHIP_PU
GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9

1

2 LNA_IN

3 VDD3P3

4 VDD3P3

5 CHIP_PU

6 GPIO0

7 8

GPIO1 GPIO2

9 GPIO3

10 GPIO4

11 GPIO5

12 GPIO6

13 GPIO7

14 GPIO8

GPIO9

N U1
VDD33

SPICS1

28 GPIO21

27 GPIO20

26 GPIO19

25 GPIO18

24 GPIO17

23 XTAL_32K_N

VDD3P3_RTC XTAL_32K_P

20 GPIO14

19 GPIO13

18 GPIO12

17 GPIO11

16 GPIO10

21 22

15

GND 40MHz(±10ppm)

R1 10K(NC)

GPIO46

GPIO45

U0RXD

R3

499 U0TXD

GPIO42

GPIO41

GPIO40

GPIO39

GPIO38

C10 0.1uF

VDD33

GND

42

GPIO37 41

GPIO36 40

GPIO35 39

GPIO34 38

GPIO33 37

SPICLK_P SPICLK_N
SPID SPIQ SPICLK

36 35 34 33 32

R16 R15 R10

SPICS0 31 R14

SPIWP SPIHD

30 29

R13

VDD_SPI

GPIO37 GPIO36 GPIO35
GPIO47 GPIO48 0 SPID 0 SPIQ 0 SPICLK SPICS0 0 SPIWP 0 SPIHD

ESP32-S3 ESP32-S3R2 ESP32-S3R8

C13 0.1uF

C14 VDD_SPI 1uF

GND GND

A C15
0.1uF

GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21

Figure 6: ESP32S3WROOM1U SchematicsRY GND

2

1

D

VDD33 GND

GND

U3

ESP32-S3-WROOM-1U

1

2 GND

CHIP_PU 3 3V3

GPIO4 GPIO5

4 5

EN IO4

D1 GPIO6

6 IO5

ESD GPIO7 GPIO15
GPIO16

7 IO6 8 IO7 9 IO15

GPIO17 10 IO16

GND

GPIO18 GPIO8 GPIO19 GPIO20

11 IO17

12 IO18

13 14

IO8 IO19

IO20

41

EPAD 40

GND 39

IO1 38

IO2 TXD0

37 36

RXD0 35

IO42 34

IO41 33

IO40 32

IO39 31

IO38 30

IO37 29

IO36 IO35

28 27

IO0

GPIO1 GPIO2 U0TXD U0RXD GPIO42 GPIO41 GPIO40 GPIO39 GPIO38 GPIO37 GPIO36 GPIO35 GPIO0

C

IO45

26 IO48

IO21 IO47

23 IO14

22 IO13

21 IO12

20 IO11

19 IO10

18 IO9

17 IO46

24 25

GPIO3 GPIO46 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO21 GPIO47 GPIO48 GPIO45

ESP32-S3-WROOM-1U(pin-out)
VDD_SPI

8 VDD

SPICS0 1

5 SPID

/CS

DI

B

SPICLK 6

2 SPIQ

CLK

DO

SPIHD 7 /HOLD

/WP 3 SPIWP

U2

FLASH-3V3

4 GND

GND

Title <ESP32-S3-WROOM-1U>
Size Page Name A4 <02_ESP32-S3-WROOM-1U>

A
Rev V1.3 Confidential and Proprietary

Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash in the module works at 3.3 VDbatye: defaThuurlstda(yo, Oucttopbeur 2t8,b20y21VDD_SShPeeIt). P2 leaosfe m2 ake sure IO45 is

ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.6

5

4

3

2

1

not pulled high when the module is powered up by external circuit.

6 Peripheral Schematics

6 Peripheral Schematics

This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface).

VDD33

GND

GND

VDD33

JP1

ESP32-S3-WROOM-1/ESP32-S3-WROOM-1U 41

1 21

C1

C3

R1

TBD

1 2 GND

EPAD 40

GND 39

IO1

32 43

5

22uF 0.1uF GND

C2

TBD

EN

IO4

GND GND

IO5

GND

C4 12pF(NC)

IO6

X1: ESR = Max. 70 K IO7

X1 32.768KHz(NC)

R3

0(NC) IO15

R5

0(NC) IO16

IO17

2

1

NC

R2

Y GND C7 12pF(NC)

IO18 IO8

IO19

IO20

IO45

IO11 IO12

JP3 1
12 2

USB_DUSB_D+

R6

0

R4

0

R USB OTG

C6

C5 NC: No component.

15

16 IO3

17 IO46

18 IO9

19 IO10

20 21

22 IO13

23 IO14

24 IO21

25 IO47

26 IO48

TBD

TBD

3 3V3

4 5

EN IO4

6 IO5

7 IO6

8 IO7

9 IO15

10 IO16

11 IO17

12 IO18

13 14

IO8 IO19

IO20

A GNDGND

IO3 IO46 IO9 IO10 IO11 IO12 IO13 IO14 IO21 IO47 IO48 IO45

IO1 38

IO2 TXD0

37 36

RXD0 35

IO42 34

IO41 33

IO40 32

IO39 31

IO38 30

IO37 29

IO36 IO35

28 27

IO0

U1

IO2 RXD0 TXD0 IO42 IO41 IO40 IO39 IO38 IO37 IO36 IO35 IO0
SW1

4

GND TMS TDI TDO TCK
GND

UART JP2 1 21 32 43
4

JTAG

JP4

2 1

2

1

Boot Option

R7

0 EN

C8 0.1uF

GND

Figure 7: Peripheral Schematics

IN · Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste.
· To ensure that the power supply to the ESP32-S3 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 k and
IM C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-S3's power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32-S3 Series Datasheet.

PREL4

3

2

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7 Physical Dimensions and PCB Land Pattern
ESP32-S3-WROOM-1 Dimensions
7 Physical Dimensions and PCB Land Pattern

7.1 Physical Dimensions ESP32-S3-WROOM-1 Dimensions

18±0.15

3.1±0.15 0.8

Unit: mm Unit: mm

6

40 x 0.9

16.51 6

1.27

25.5±0.15 25.5±0.15

40 x 01.95

16.51

1.27

1.5

18±0.15

3.1±0.15 0.8

15.8

0.9

0.5

40 x Ø0.55

Ø

0

.5

17.6

1.05

15.8
Y 40 x Ø0.55

40 x 0.9

0.9 10.29

0.9 3.7
0.5 7.5

3.7

13.97

Ø

0

.5

17.6

1.05

R 40 x 0.45

1

40 x 0.9

0.9 10.29

3.7

Top View

Side View

1.27 32..7015 40 x 0.85
7.5
Bottom View

13.97

A 40 x 0.45

1

1.27 2.015 40 x 0.85

Top View

ESP32-S3-WSidRe VOieOw M-1U Dimensions Bottom View

IN Figure 8: ESP32S3WROOM1 Physical Dimensions

ESP32-S3-WROOM-1U Dimensions

Unit: mm

Ø 0 .5 17.5

Ø 0 .5 17.5

13.1

13.1

IM 18±0.15 3
10.75 18±0.15
L3
40 x Ø0.55 15.65 10.75
E40 x Ø0.55
15.65
R13.97
40 x 0.45 1.08
P Top View

1.1

2.14.61

2.46

3.2±0.15 0.8
3.2±0.15 0.8
Side View

40 x 0.9

40 x 0.9

0.9 10.29

0.9 10.29

Unit: mm 0.9 0.5
0.9 3.7 0.5
7.5
1.27 32..7015 40 x 0.85
7.5 Bottom View

3.7

3.7

13.97
40 x 0.45 Fig1u.0re8 9: ESP32S3WROOM1U Physical Dimensions

1.27 2.015 40 x 0.85

40 x 0.9

1.27

16.51

40 x1.0.59

19.2±0.15 19.2±0.15

1.27

16.51

1.5

Note:

Top View

Side View

Bottom View

For information about tape, reel, and product marking, please refer to Espressif Module Package Information.

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7 Physical Dimensions and PCB Land Pattern

7.2 Recommended PCB Land Pattern

Unit: mm Via for thermal pad Copper

18

RY 40 x1.5

Antenna Area

1

40

0.9

0.5

6

7.49

40 x0.9

16.51

25.5

3.7

A 3.7 IN 7.50

1.27

0.9 10.29

15

26

IM0.5 1.27
2.015 2.015 17.5

0.5

1.5

PREL Figure 10: ESP32S3WROOM1 Recommended PCB Land Pattern

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7 Physical Dimensions and PCB Land Pattern

40 x1.5

Unit: mm Via for thermal pad Copper 18

1

40

0.9

0.5

40 x0.9

16.51

0.5

1.5

0.90 10.29
1.27 1.19 19.2

3.7

RY 3.7
7.5

A 15

26

0.5

1.27

IN 2.015 2.015

17.5

PRELIM Figure 11: ESP32S3WROOM1U Recommended PCB Land Pattern

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7 Physical Dimensions and PCB Land Pattern
7.3 Dimensions of External Antenna Connector
ESP32-S3-WROOM-1U uses the first generation external antenna connector as shown in Figure 12. This connector is compatible with the following connectors:
· U.FL Series connector from Hirose · MHF I connector from I-PEX · AMC connector from Amphenol
PRELIMINAUnit:mRm Y
Figure 12: Dimensions of External Antenna Connector

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8 Product Handling

8 Product Handling

8.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.

After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and

/60%RH. If the above conditions are not met, the module needs to be baked.

8.2 Electrostatic Discharge (ESD)
· Human body model (HBM): ±2000 V · Charged-device model (CDM): ±500 V
Y 8.3 Reflow Profile R Solder the module in a single reflow.

Temperature ()

INA 250
Preheating zone 150 ~ 200  60 ~ 120 s 217 200
IM Ramp-up zone
1 ~ 3 /s
L 100

Peak Temp. 235 ~ 250 
Reflow zone !217  60 ~ 90 s
Soldering time > 30 s

Cooling zone ­1 ~ ­5 /s

E 50

25

0

R0

50

100

150

200

Ramp-up zone -- Temp.: 25 ~ 150  Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 /s
PPreheating zone -- Temp.: 150 ~ 200  Time: 60 ~ 120 s

Time (sec.) 250

Reflow zone -- Temp.: >217  7LPH60 ~ 90 s; Peak Temp.: 235 ~ 250  Time: 30 ~ 70 s

Cooling zone -- Peak Temp. ~ 180  Ramp-down rate: ­1 ~ ­5 /s

Solder -- Sn-Ag-Cu (SAC305) lead-free solder alloy

Figure 13: Reflow Profile

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9 Related Documentation and Resources
9 Related Documentation and Resources
Related Documentation
· ESP32-S3 Series Datasheet ­ Specifications of the ESP32-S3 hardware. · ESP32-S3 Technical Reference Manual ­ Detailed information on how to use the ESP32-S3 memory and peripherals. · ESP32-S3 Hardware Design Guidelines ­ Guidelines on how to integrate the ESP32-S3 into your hardware product. · Certificates
http://espressif.com/en/support/documents/certificates · Documentation Updates and Update Notification Subscription
http://espressif.com/en/support/download/documents
Developer Zone
Y · ESP-IDF and other development frameworks on GitHub. http://github.com/espressif · ESP32 BBS Forum ­ Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
R share knowledge, explore ideas, and help solve problems with fellow engineers.
http://esp32.com/ · The ESP Journal ­ Best Practices, Articles, and Notes from Espressif folks.
A http://blog.espressif.com/
· See the tabs SDKs and Demos, Apps, Tools, AT Firmware. http://espressif.com/en/support/download/sdks-demos
IN Products · ESP32-S3 Series SoCs ­ Browse through all ESP32-S3 SoCs. http://espressif.com/en/products/socs?id=ESP32-S3 · ESP32-S3 Series Modules ­ Browse through all ESP32-S3-based modules. IM http://espressif.com/en/products/modules?id=ESP32-S3 · ESP32-S3 Series DevKits ­ Browse through all ESP32-S3-based devkits. http://espressif.com/en/products/devkits?id=ESP32-S3 L · ESP Product Selector ­ Find an Espressif hardware product suitable for your needs by comparing or applying filters. http://products.espressif.com/#/product-selector?language=en
E Contact Us · See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. PR http://espressif.com/en/contact-us/sales-questions

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Revision History

Revision History

Date 2021-10-29 2021-07-19

Version v0.6 v0.5.1

Release notes Overall update for chip revision 1 Preliminary release, for chip revision 0

PRELIMINARY

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ELIMINARY Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
R ALL THIRD PARTY'S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
P INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.

All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein.

The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG.

www.espressif.com

All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged.

Copyright © 2021 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.


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