WILCS02IC and WILCS02 Family Data Sheet

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Document DEVICE REPORTWILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557

WILCS02IC and WILCS02 Family Data Sheet
WILCS02IC and WILCS02 Family

Introduction
The WILCS02IC is a single chip 2.4 GHz and IEEE® 802.11b/g/n-compliant solution with integrated High Power Amplifier (HPA), Low-Noise Amplifier (LNA) and Radio Frequency (RF) switches for TX/RX control. It is a Link Controller IC with a hardware-based security accelerator. The WILCS02 module is a fully RF and Wi-Fi AllianceTM-certified wireless module based on the WILCS02IC. The module provides Secure Digital Input Output (SDIO) or Serial Peripheral Interface (SPI) to interface with the host controller.
The WILCS02 module operates at a single supply voltage VDD (3.3V typical). Specific Input/Output (I/O) pins support a voltage range of 1.8-3.6V by supplying the VDDIO pin separately.
The WILCS02 module is available with either an on-board Printed Circuit Board (PCB) antenna or U.FL connector for an external antenna.
Note:The WILCS02IC must be programmed with the appropriate Link Controller firmware version to meet the specification described in the data sheet.
WILCS02IC and WILCS02 Module Features
· Compliant with IEEE 802.11 b/g/n Single Spatial Stream of 20 MHz Channel Bandwidth · Protected Management Frame (PMF) Handled in Hardware, WPA3 Support · Integrated Power Amplifier (PA), TX/RX Switch and Power Management · Internal Flash Memory (up to 2 MB) to Store Firmware · Immutable Secure Boot with Hardware Root of Trust · Supports Host Assisted Firmware Sideloading · Hardware-Based Low-Power Modes with Support for Magic Packet-Based Snooze Mode
Low Power modes Connected Sleep and Extreme Deep Sleep (XDS) Fast host wake-up from Sleep mode by a pin or the host I/O transaction · Hardware-Based IEEE 802.15.2 Compliant Three-Wire Packet Traffic Arbitration (PTA) Interface for Wi-Fi/ Bluetooth® Coexistence · SDIO/SPI Host Interface on a Supported Linux System · Secure Device Firmware Upgrade (DFU)
Security
· Hardware Accelerated Security Modes (CryptoMaster) with Built-in DMA Support Encryption engines (AES and TDES with different NIST modes of operation): · Modes Electronic Code Book (ECB), Cypher Block Chaining (CBC), Counter Mode (CTR), Cypher Feedback Mode (CFB) and Output Feedback Mode (OFB) · AES key sizes: 128b, 192b and 256b Authentication engines: · SHA-1 and SHA-2

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WILCS02IC and WILCS02 Family
· AES GCM (Galois/Counter mode) · HMAC and AES CMAC On-chip oscillator for NDRNG generation · Multi-Purpose Public Key Crypto Engine Supporting the Following Algorithms: ECC/ECDH/ECDSA with standard NIST prime curves up to 521-bit, Curve25519 and Ed25519 RSA up to 2048-bit keys
Operating Conditions
· WILCS02IC Operating Voltage VDD: 3.0-3.6V, VDDIO: 1.8-3.6V (3.3V Typical) Operating Temperature: -40°C to 105°C
· WILCS02 Operating Voltage VDD: 3.0-3.6V, VDDIO: 1.8-3.6V (3.3V Typical) Operating Temperature: -40°C to 85°C
Module Variants
· PCB Antenna: WILCS02PE
· U.FL Connector for External Antenna: WILCS02UE
Package
· WILCS02IC 48-Pin QFN Size: 7 mm x 7 mm x 0.9 mm
· WILCS02 28-Pin SMD Package with Shield Can on Top Size: 21.7 mm x 14.7 mm x 2.1 mm
Applications
· Smart Factories/Control Devices · Security Systems, CCTV · Smart Homes/Lighting, Smart Locks · Computing, Wi-Fi Dongles, Protocol Bridging · Remote Control · Wearable Smart Devices · Industrial Control
Certifications
· WILCS02 Module is Planned to be Certified to FCC, ISED, UKCA and CE Radio Regulations and Wi-Fi Alliance · RoHS and REACH Compliant
Notes: 1. For more details about the latest supported features, refer to the WILCS02 Application Developer's Guide. 2. Refer to the current Linux driver release notes for all available features.

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WILCS02IC and WILCS02 Family
Table of Contents
Introduction........................................................................................................................................................................... 1
WILCS02IC and WILCS02 Module Features........................................................................................................................1
1. Ordering Information....................................................................................................................................................4 1.1. WILCS02IC Ordering Information.....................................................................................................................4 1.2. WILCS02 Module Ordering Information..........................................................................................................5
2. Device Overview............................................................................................................................................................ 6 2.1. Pin Details of WILCS02IC................................................................................................................................... 7 2.2. Pin Details of WILCS02 Module........................................................................................................................ 9 2.3. Basic Connection Requirement......................................................................................................................11 2.4. WILCS02 Module Placement Guidelines....................................................................................................... 13 2.5. WILCS02 Module Routing Guidelines............................................................................................................ 15 2.6. WILCS02 Module RF Considerations..............................................................................................................16 2.7. WILCS02 Module Antenna Considerations................................................................................................... 16 2.8. WILCS02 Module Reflow Profile Information............................................................................................... 23 2.9. WILCS02 Module Assembly Considerations................................................................................................. 24
3. Electrical Specifications.............................................................................................................................................. 25 3.1. WILCS02IC Electrical Specifications................................................................................................................25 3.2. WILCS02 Module Electrical Specifications.....................................................................................................41
4. Packaging Information............................................................................................................................................... 51 4.1. WILCS02IC Packaging Information.................................................................................................................51 4.2. WILCS02 Module Packaging Information......................................................................................................55
5. Appendix A: Acronyms and Abbreviations............................................................................................................... 59
6. Document Revision History........................................................................................................................................61
Microchip Information....................................................................................................................................................... 62 The Microchip Website............................................................................................................................................... 62 Product Change Notification Service........................................................................................................................ 62 Customer Support.......................................................................................................................................................62 Microchip Devices Code Protection Feature............................................................................................................ 62 Legal Notice..................................................................................................................................................................62 Trademarks.................................................................................................................................................................. 63 Quality Management System.....................................................................................................................................64 Worldwide Sales and Service..................................................................................................................................... 65

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WILCS02IC and WILCS02 Family Ordering Information

1. Ordering Information
This chapter provides the ordering information of the WILCS02IC and the WILCS02 module.
1.1 WILCS02IC Ordering Information
This section provides the ordering information of the WILCS02IC.

Table 1-1. WILCS02IC Ordering Details

SoC Name Pin and Package

Description

WILCS02IC 48-pin VQFN

32-bit Link Controller IC with WLAN connectivity and hardware-

(7 mm x 7 mm x 0.9 mm) based security accelerator with embedded Flash of 2 MB

Ordering Code WILCS02IC-I/ZZX

The following figure illustrates the details of the WILCS02IC ordering information. Figure 1-1. WILCS02IC Ordering Information

-I/V

ZZX

Wi-Fi®
Link Controller
Stacked Flash
Flash Memory Size 02 = 2 MB Flash
Chip Temperature Industrial: -40°C to 85°C Various: -40°C to 105°C
Package Code
Note:The WILCS02IC must be programmed with the appropriate Link Controller firmware version to meet the specification described in the data sheet.

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1.2

WILCS02 Module Ordering Information
This chapter provides the ordering information of the WILCS02 module.

WILCS02IC and WILCS02 Family Ordering Information

Table 1-2. WILCS02 Module Ordering Details

Module Name WILCS02PE

Description Wi-Fi® Link Controller Module with PCB Antenna

WILCS02UE

Wi-Fi Link Controller Module with U.FL connector for external Antenna

Ordering Code WILCS02PE-I WILCS02UE-I

The following figure illustrates the details of the WILCS02 module ordering information. Figure 1-2. WILCS02 Module Ordering Information

WI
Wi-Fi®
LC Link Controller
Stacked Flash Flash Memory Size
02 = 2 MB Flash Antenna
P PCB Antenna U U.FL Connector
Encryption E No Encryption
Packing - Tray T - Tape & Reel
Temperature Industrial: -40°C to +85°C
Firmware Version

S 02 P/U E

-/T -I XXX

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WILCS02IC and WILCS02 Family Device Overview

2. Device Overview
The WILCS02IC is a single chip 2.4GHz and IEEE 802.11b/g/n-compliant solution with integrated high-power PA, LNA and RF switches for TX/RX control. The WILCS02 is a fully RF and Wi-Fi Alliancecertified module based on WILCS02IC available with the following antenna variants: · PCB antenna (WILCS02PE)
· U.FL connector (WILCS02UE) for external antenna
The following figure illustrates the WILCS02IC and WILCS02 module block diagram and various peripherals supported by these devices.
Figure 2-1. WILCS02 Module Block Diagram

MCLR SDIO/SPI UART2_TX (Debug Log)
PTA
VDD
VDDIO DFU_RX/STRAP1
DFU_TX/STRAP2

SDIO/SPI, PTA Interfaces

WILCS02 Module
VDD, VDDIO

PMU

WILCS02IC

POSC

PCB Antenna or
U.FL Connector

CRYPTO

FLASH RAM Memory

CPU

WLAN MAC

Baseband Phy

ADC/ DAC

System Bus

INT0 IRQ

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2.1 Pin Details of WILCS02IC

WILCS02IC and WILCS02 Family Device Overview

This section provides details on pin diagrams and the pinout table of WILCS02IC.

Figure 2-2. WILCS02IC Pin Diagram (Bottom View)

PA9 VDD33 SPI_VDD15 AFE_VDD15 XTL_VDD15 XTL_IN XTL_OUT SYN_SD_VDD15 SYN_PLL_VDD15 SYN_VCO_VDD15 SPI_FE_VDD15 RXR_RIQ_VDD15

13 14 15 16 17 18 19 20 21 22 23 24

PA8 12 PA7 11 PA6 10 SD_DATA3/PA5 9 SD_DATA2/SDI1/PA4 8 VDDIO 7 SD_DATA1/CS1/PA3 6 SD_DATA0/SDO1/PA2 5 SD_CLK/PA1 4 SD_CMD/SCK1/PA0 3 VDD15 2 PMU_VDDIO/PMU_VDDC 1

WILCS02IC
54
49 Thermal GND
PAD

25 RXR_LNA2_VDD15 26 RXR_LNA1_VDD15 27 TRS_RF 28 TXR_HPA_VDD33 29 TXR_HPA_VDD33 30 TXR_PPA_VDD33 31 TXR_UMX_VDD15 32 BB_VDD15 33 MSB_EXTRA_48K 34 PB0 35 PB1 36 MCLR

48 47 46 45 44 43 42 41 40 39 38 37

PMU_BK_LX PMU_VDDP PMU_MLDO_OUT
VDD33 PB7 PB6 PB5
VDD33 PB4 PB3
INT0/PB2 AVDD

Table 2-1. WILCS02IC Pinout Table

Pin Number Pin Name

PMU_VDDIO/ PMU_VDDC

VDD15

SD_CMD/SCK1/PA0(1)

SD_CLK/PA1(1)

SD_DATA0/SDO1/PA2(1)

SD_DATA1/CS1/PA3(1)

VDDIO

SD_DATA2/SDI1/PA4(1)

SD_DATA3/PA5(1)

PA6(1)

PA7(1)

PA8

PA9

VDD33

Pin Type P P I/O O O I/O O I/O I P I/O I I/O O I/O I/O I/O P

Description 3.3V input supply voltage to PMU Input supply voltage (1.5V) from PMU SDIO command SPI1 serial clock SDIO clock SDIO data 0 SPI1 serial data out SDIO DATA 1 SPI1 chip select Input supply voltage for I/O Port A (PA0-PA7) SDIO data 2 SPI1 serial data in SDIO data 3 Reserved Reserved Reserved Reserved Input supply voltage

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WILCS02IC and WILCS02 Family Device Overview

...........continued

Pin Number Pin Name

Pin Type Description

SPI_VDD15

RF supply voltage from PMU

AFE_VDD15

XTL_VDD15

XTL_IN

40 MHz primary oscillator crystal input

XTL_OUT

40 MHz primary oscillator crystal output

SYN_SD_VDD15

RF supply voltage from PMU 1.5V

SYN_PLL_VDD15

SYN_VCO_VDD15

SPI_FE_VDD15

RXR_RIQ_VDD15

RXR_LNA2_VDD15

RXR_LNA1_VDD15

TRS_RF

I/O

RF transmit/receive

TXR_HPA_VDD33

RF supply voltage 3.3V

TXR_HPA_VDD33

TXR_PPA_VDD33

TXR_UMX_VDD15

RF supply voltage from PMU 1.5V

BB_VDD15

MSB_EXTRA_48K

RF PIN, Pull down with 48.7K resistor

PB0

I/O

DFU_RX/Strap1

PB1

I/O

DFU_TX/Strap2

MCLR

Master clear input active low

AVDD

Analog input supply voltage 3.3V

INT0/PB2

External interrupt to wake up from deep sleep

PB3

I/O

Reserved

PTA_BT_ACTIVE/PB4

PTA Interface, PTA_BT_ACTIVE

VDD33

Input supply voltage

PTA_BT_PRIO/PB5

I/O

PTA Interface, PTA_BT_PRIO

PTA_WLAN_ACTIVE/PB6

PTA Interface, PTA_WLAN_ACTIVE

PB7

Reserved

VDD33

3.3V input supply voltage

PMU_MLDO_OUT(4)

PMU MLDO output voltage (1.5V).

PMU_VDDP

Input supply to PMU

PMU_BK_LX

PMU BUCK output. Connection to external LC filter

GND

Thermal ground PAD

Notes:

1. These pins support lower voltage by supplying the VDDIO pin separately (1.8V 3.6V). 2. Refer to the reference design package for exact pin mapping and signal connection.

3. The WILCS02 module firmware does not support the GPIO functionality. All the pins are reserved.

4. This is for internal use only. Do not connect any external circuits.

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WILCS02IC and WILCS02 Family Device Overview
2.2 Pin Details of WILCS02 Module
This section provides details on pin diagrams and the pinout table of WILCS02 module.
Figure 2-3. WILCS02 Module Pin Diagram (Bottom View)

DFU_RX/Strap1 10 INT0/Wake 11 GND 12 IRQn 13 SD_DATA3 14
SD_DATA2/SPI_SDI 15 SD_DATA1/SPI_CSn 16 SD_DATA0/SPI_SDO 17
SD_CMD/SPI_SCK 18 SD_CLK 19
20

29 Thermal GND
PAD

9 GND 8 NC 7 Reserved 6 PTA_BT_PRIO 5 PTA_WLAN_ACTIVE

4 NMCLR 3 Reserved 2 Reserved 1 NC
21 22 23 24 25 26 27 28

VDD PTA_BT_ACTIVE
Reserved VDDIO TP NC
DFU_TX/Starp2 UART2_TX GND

Table 2-2. WILCS02 Module Pinout Table

Pin Number Pin Name

Pin Type Pin Description

No connection

I/O

Reserved

I/O

Reserved

MCLR

Master clear reset, active-low

PTA_WLAN_ACTIVE O

PTA interface, WLAN Active

PTA_BT_PRIO

I/O

PTA interface, BT Priority

I/O

Reserved

No connection

GND

Ground

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WILCS02IC and WILCS02 Family Device Overview

...........continued
Pin Number Pin Name

Pin Type Pin Description

DFU_RX/Strap1

For device firmware update receive pin. The SDIO/SPI Interface must be pulled

high.

INT0/Wake

To wake up the Wi-Fi® module from its Extreme Deep Sleep (XDS) mode by the

host

GND

Ground

IRQ(1)

Interrupt request (active-low) from the Wi-Fi module to wake up the host from

its Sleep state

SD_DATA3(1)

SDIO interface, SD DATA 3

SD_DATA2/SPI_SDI(1) O

SDIO interface, SD DATA 2/Serial interface, Serial Data In

SD_DATA1/SPI_CS(1) I/O

SDIO interface, SD DATA 1/Serial interface Chip Select (Active low)

SD_DATA0/SPI_SDO(1) I/O

SDIO interface, SD Data 0/SPI interface, Serial Data Out

SD_CMD/SPI_SCK(1) I/O

SDIO interface, SD Command signal SPI Interface, Serial Clock

SD_CLK(1)

I/O

SDIO interface, SD Clock Signal

VDD

VDD power supply (3.0-3.6V)

PTA_BT_ACTIVE

PTA Interface BT_ACTIVE

VDDIO

I/O power supply (1.8-3.6V)

Test point: 1.5V(2)

No connection

DFU_TX/Strap2

For device firmware update transmit pin.

UART2_TX(1)

I/O

UART2 transmit signal for the debug log

GND

Ground

GND Paddle

Thermal ground pad

Notes:

1. These pins support lower voltage by supplying the VDDIO pin separately (1.8V 3.6V).

2. This is for factory test purposes. Do not connect to any external circuit to source the voltage.

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WILCS02IC and WILCS02 Family Device Overview
2.3 Basic Connection Requirement
The WILCS02 module requires attention to a minimal set of device pin connections before proceeding with development.
Figure 2-4. WILCS02 Module Basic Connection and Interface Diagram

VDD VDDIO

C1 4.7uF

C2 0.1uF

GND U1

GND

C3 0.1uF
GND

VDD 20 VDDIO 23

RESET

SD_DATA3

14 SD_DATA3

PA8/I2C_SCL 2

SD_DATA2/SPI_SDI SD_DATA2/SPI_SDI 15 SD_DATA2/SPI_SDI

PA9/I2C_SDA 3

SD_DATA1/SPI_CSn SD_DATA1/SPI_CSn 16 SD_DATA1/SPI_CSn

PB6/USB_D+/PTA_WLAN_ACTIVE 5

VDD

SD_DATA0/SPI_SDO SD_DATA0/SPI_SDO 17 SD_DATA0/SPI_SDO/PTA_WLAN_ACTIVE SD_CMD/SPI_CLK SD_CMD/SPI_CLK 18 SD_CMD/SPI_SCK/PTA_BT_ACTIVE

PB5/USB_D-/PTA_BT_PRIO 6 PB7 7

R7 SD_CLK

SD_CLK

19 SD_CLK/PTA_BT_PRIO

10k

R13

4 MCLR

C4 0.1uF

WAKE IRQn

11 PB2/INT0/WAKE 13 PA6/IRQ

TP 24 PA7/UART2_TX 27

GND

PTA_BT_ACTIVE

21 PB4/SOSCI/PTA_BT_ACTIVE

NC 1

22 PB3/SOSCO

NC 8

10 PB0/DFU_RX/STRAP1

NC 25

26 PB1/DFU_TX/STRAP2

9 GND 12 GND 28 GND 29 GND PADDLE

VDD

10K

WILCS02_MODULE

PB0/Strap1 PB1/Strap2

GND

100K

DNP

GND

TP1 1V5
UART2_TX

PTA_WLAN_ACTIVE PTA_WLAN_ACTIVE

Table 2-3. Configuration Details

Configuration Details

Module Pin10/Strap1

Module Pin26/Strap2

Host Interface Selection

Description

SDIO (Default)

WILCS02 module with SDIO

SPI

WILCS02 module with SPI over SDIO

pins

Note:The mentioned resistance values are only guidelines. For details on the application schematics, refer to the WILCS02 Wi-Fi Link Controller SD Board User Guide (DS50003655).

2.3.1

Power Supply Pin
It is recommended to add a bulk and a decoupling capacitor at the input supply Pin 20 (VDD), Pin 23 (VDDIO) and GND of the WILCS02 module.
VDD and VDDIO can be connected to the same supply for the typical 3.3V operation. For I/Os to operate at a lower voltage, typically 1.8V, VDDIO can be connected separately along with a decoupling capacitor.

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Figure 2-5. Recommended Module Power Supply Connections

C1 4.7 µF
GND

C2 0.1 µF
GND

VDDIO
VDD
WILCS02

WILCS02IC and WILCS02 Family Device Overview

2.3.2

The value of the C1 and C2 capacitors may vary based on the application requirements and source of supply voltage. The C1 and C2 capacitors must be placed close to the pin.
Master Clear (MCLR) Pin
The MCLR pin works as a device Reset.
Pulling the MCLR pin low generates a device Reset. The basic connection and interface diagram of the module illustrates a typical MCLR circuit. See the Module Basic Connection and Interface Diagram in the Basic Connection Requirement from Related Links.
Figure 2-6. Example of MCLR Pin Connections

VDD

R 10k R1(1)

0.1 µF(2)

C 1 k

WILCS02
MCLR

2.3.3

Notes: 1. 470 R1 1 k limits any current flowing into MCLR from the external capacitor C in the
event of MCLR pin breakdown due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). Ensure that the MCLR pin VIH and VIL specifications are met without interfering with the Debug/ Programmer tools.
2. The capacitor can be sized to prevent unintentional Resets from brief glitches or to extend the device Reset period during POR.
Related Links 2.3. Basic Connection Requirement
Device Firmware Update
The WILCS02 module is available for purchase with pre-programmed firmware. Microchip periodically releases the firmware to fix reported issues or to implement the latest feature support. There are two ways to perform a regular firmware update:
1. Serial DFU command-based update over UART
2. Firmware Sideloader
Note:For the serial DFU and Firmware Sideloader programming guidance, refer to the WILCS02 Module Application Developer's Guide.

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Figure 2-7. Basic Connection Diagram of DFU

R12

0R DFU_TX/STRAP2/PB1 MCLR

R11

0R DFU_RX/STRAP1/PB0

26 4
WILCS02 10

WILCS02IC and WILCS02 Family Device Overview

12345678

GND

2.3.4

Interface with Host Microcontroller
The WILCS02 module can be interfaced with the host microcontroller through the SDIO/SPI Interface signals along with additional signals.
Figure 2-8. WILCS02 Module Host Interface Diagram

WILCS02

SDIO/SPI_SDO SDIO/SPI_SDI SDIO/SPI_CS SDIO/SPI_CLK INT0/Wake
MCLR IRQ

HOST MCU

2.4 WILCS02 Module Placement Guidelines
· For any Wi-Fi product, the antenna placement affects the performance of the whole system. The antenna requires free space to radiate RF signals, and it must not be surrounded by the ground plane. Thus, for the best PCB antenna performance, it is recommended that the WILCS02PE module is placed at the edge of the host board.
· The WILCS02PE module ground outline edge must be aligned with the edge of the host board ground plane as shown in the following figure.
· A low-impedance ground plane for the WILCS02 module ensures the best radio performance (best range and lowest noise). The ground plane can be extended beyond the minimum recommendation as required for the host board EMC and noise reduction.
· For the best performance, keep metal structures and components (such as mechanical spacers, bump-on and so on) at least 31.75 mm away from the PCB trace antenna as illustrated in the following figure.
· The antenna on the WILCS02 module must not be placed in direct contact with or in close proximity to plastic casing or objects. Keep a minimum clearance of 10 mm in all directions around the PCB antenna as shown in the following figure. Keeping metallic and plastic objects close to the antenna can detune the antenna and reduce the performance of the device.
· Exposed GND pads on the bottom of the WILCS02 module must be soldered to the host board (see the Example of Host Board on Top Layer figure in the WILCS02 Module Routing Guidelines from Related Links).

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WILCS02IC and WILCS02 Family Device Overview
· A PCB cutout or a copper keepout is required under the RF test point (see WILCS02 Module Packaging Information from Related Links).
· Copper keepout areas are required on the top layer under voltage test points (see WILCS02 Module Packaging Information from Related Links).
· Alternatively, the entire region, except the exposed ground paddle, can be solder-masked.
The following figure illustrates the examples of WILCS02 module placement on a host board with a ground plane. Refer to the following figure for placement-specific guidance.
Figure 2-9. Module Placement Guidelines

No Copper Region

5.3 mm

Module PCB Edge 15.73 mm

31.75 mm (keepout clearance region) for all metallic and plastic structures around the antenna. Refer to antennaspecific details of the respective antenna.
Edge of Host PCB Ground Plane

Host PCB Ground Plane

The following figure illustrates the examples of the WILCS02 module placement on a host board with a ground plane. Refer to Figure 2-9 for placement-specific guidance.

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Figure 2-10. WILCS02 Module Placement

WILCS02IC and WILCS02 Family Device Overview

Related Links 2.5. WILCS02 Module Routing Guidelines 4.2. WILCS02 Module Packaging Information
2.5 WILCS02 Module Routing Guidelines
· Use the multi-layer host board for routing signals on the inner layer and the bottom layer.
· The top layer (underneath the module) of the host board must be ground with as many GND vias as possible, shown in the following figure.
· Avoid fan-out of the signals under the module or antenna area. Use a via to fan-out signals to the edge of the WILCS02 module.
· For a better GND connection to the WILCS02 module, solder the exposed GND pads of the WILCS02 module on the host board.
· For the module GND pad, use a GND via of a minimum 10 mil (hole diameter) for good ground to all the layers and thermal conduction path.
· Having a series resistor on the host board for all GPIOs is recommended. These resistors must be placed close to the WILCS02 module. The following figure illustrates the placement of the series resistor.
· The SOSC crystal (32.768 kHz) on the host board must be placed close to the WILCS02 module and follow the shortest trace routing length with no vias (see the following figure).

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Figure 2-11. Example of Host Board on Top Layer
Host Board Outline
Copper Keepout

WILCS02IC and WILCS02 Family Device Overview
Module Outline Copper Keepout GND Plane on Host Board
Exposed GND Pad Underneath Module Module Footprint

2.6
2.7
2.7.1

RTCC Crystal Placement
WILCS02 Module RF Considerations
The overall performance of the system is significantly affected by the product design, environment and application. The product designer must ensure system-level shielding (if required) and verify the performance of the product features and applications.
Consider the following guidelines for optimal RF performance:
· The WILCS02 module must be positioned in a noise-free RF environment and must be kept far away from high-frequency clock signals and any other sources of RF energy.
· The antenna must not be shielded by any metal objects.
· The power supply must be clean and noise-free.
· Make sure that the width of the traces routed to GND, VDD rails are sufficiently large for handling peak TX current consumption. Note:The WILCS02 module includes RF shielding on top of the board as a standard feature.
WILCS02 Module Antenna Considerations
PCB Antenna
For the WILCS02PE module, the PCB antenna is fabricated on the top copper layer and covered with a solder mask. The layers below the antenna do not have a copper trace. It is recommended that the module be mounted on the edge of the host board and to have no PCB material below the antenna structure of the module and no copper traces or planes on the host board in that area.
The following table lists the technical specification of the PCB antenna when tested with the WILCS02 module mounted on the WILCS02 Wi-Fi Link Controller SD Board.

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WILCS02IC and WILCS02 Family Device Overview

Table 2-4. PCB Antenna Specification for WILCS02 Module

Parameter

Specification

Operating frequency

2400-2485 MHz

Peak gain Efficiency (average)

1.18 dBi at 2445 MHz 68.83%1

Note: 1. The size of the WILCS02 Wi-Fi® Link Controller SD Board is 85 mm x 40 mm. The antenna efficiency will improve with
larger ground plane baseboards. If the best case routing guidelines are followed on a larger ground plane application board, the efficiency will be better.

PCB Antenna Radiation Pattern The following figure illustrates the module orientation in the measurement system for the PCB antenna radiation pattern.
Figure 2-12. Module Orientation for Radiation Pattern Measurement

Vertical Cut at Phi = +90°

Z+ Y+

Vertical Cut at Phi = 0°

X+

Horizontal Cut at Theta = 90°

3D Antenna Radiation Pattern The following figures illustrate the 3D cross section of the antenna radiation pattern.

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Figure 2-13. 3D Antenna Radiation Pattern (Slant View)

WILCS02IC and WILCS02 Family Device Overview

Z X
Y

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Figure 2-14. 3D Antenna Radiation Pattern (XY View)

WILCS02IC and WILCS02 Family Device Overview

Y X

Figure 2-15. 3D Antenna Radiation Pattern (XZ View)
Z X

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Figure 2-16. 3D Antenna Radiation Pattern (YZ View)

WILCS02IC and WILCS02 Family Device Overview

Z Y

2D Antenna Radiation Pattern The following figures illustrate the 2D cross section of the antenna radiation pattern. Figure 2-17. Antenna Radiation Azimuth Plane Pattern @ Theta = 90°
90° 2400.00 MHz Polar H 90° 2400.00 MHz Polar V

Azimuth (°)
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Figure 2-18. Antenna Radiation Elevated Plane Pattern @ Phi = 0°
0° 2400.00 MHz Polar H 0° 2400.00 MHz Polar V

WILCS02IC and WILCS02 Family Device Overview

Elevation (°)
Figure 2-19. Antenna Radiation Elevated Plane Pattern @ Phi = 90°
90° 2400.00 MHz Polar H 90° 2400.00 MHz Polar V

Elevation (°)
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2.7.2

WILCS02IC and WILCS02 Family Device Overview
External Antenna Placement Recommendations
The user must ensure the following for the placement of the antenna and its cable:
· Do not route the antenna cable over circuits generating electrical noise on the host board or alongside or underneath the module. The recommendation is to route the cable straight out of the module.
· Do not place the antenna in direct contact or in close proximity of the plastic casing/objects.
· Do not enclose the antenna within a metal shield.
· The user must keep any components capable of radiating noise, signals or harmonics in the 2.4-2.5 GHz frequency range away from the antenna and, if feasible, provide shielding for such components. Any noise radiated from the host board in this frequency band degrades the sensitivity of the module.
· Place the antenna at a distance greater than 5 cm away from the module. The following figure illustrates the antenna keepout area (do not place the antenna in this area). This recommendation is based on an open-air measurement and does not take into account any metal shielding of the customer end product. When a metal enclosure is used, the antenna can be located closer to the WILCS02 module.
These recommendations are based on an open-air measurement and do not take into account any metal shielding of the customer end product. When a metal enclosure is used, the antenna can be located closer to the WILCS02 module.
The following figure illustrates how the antenna cable must be routed depending on the location of the antenna with respect to the WILCS02 PCB. There are two possible options for the optimum routing of the cable.
Figure 2-20. WILCS02 Module Antenna Placement Guidelines

5 cm from Board Edge

Preferred Antenna Cable Routing Direction

5 cm from Board Edge

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WILCS02IC and WILCS02 Family Device Overview

Note:These are generic guidelines and the recommendation is that customers can check and fine-tune the antenna positioning in the final host product based on RF performance.
2.7.2.1 External Antennas
The WILCS02UE module has an ultra-small surface mount U.FL connector for an external antenna connection. The choice of antenna is limited to the antenna types that the module is tested and approved for.
The WILCS02UE module is approved to use with the antennas listed in the following table. It is permissible to use a different antenna provided it is the same antenna type, has the same antenna gain (equal or less than) and similar in-band and out-of-band characteristics are present (refer to the antenna specification sheet for cutoff frequencies).
If other antenna types are used, the OEM installer must conduct the necessary assessments and authorize the antenna with the respective regulatory agencies and ensure compliance.

Table 2-5. WILCS02 Module Approved External Antenna List with Antenna Gain

Antenna Part Number Number

Manufacturer

Antenna Antenna Gain (dBi) Type

Regulatory Certification
FCC/ISED(2) CE
(3)

Cable Length

WXE2400-SM

TE Connectivity/Laird 3

Dipole x

External Antennas

SMA TO U.FL cable

length of 100 mm

ANT-2.4-CW-RCL-SMA TE Connectivity/Linx 2.3

Dipole x

Technologies

SMA to U.FL cable

length of 100 mm

RFA-02-C2M2-SMA- Alead/Aristotle

Dipole x

D034

SMA to U.FL cable

length of 100 mm

Notes:

1. `x' denotes the antennas covered under the certification.

2. If the end product using the module is designed to have an antenna port that is accessible to the end user, a unique (non-standard) antenna connector (as permissible by FCC) must be used (for example, RP (Reverse Polarity)-SMA socket).

3. If an RF coaxial cable is used between the module RF output and the enclosure, a unique (non-standard) antenna connector must be used in the enclosure wall to interface with the antenna.

4. Contact the antenna vendor for detailed antenna specifications to review the suitability to the end product operating environment and to identify alternatives.

5. If any external antenna is used other than the recommended antennas in the list, it may need an extra step of post-calibration on the customer's application board.

2.8 WILCS02 Module Reflow Profile Information
The WILCS02 module was assembled using the IPC/JEDEC J-STD-020 standard lead-free reflow profile. The WILCS02 module can be soldered to the host board using standard leaded or lead-free solder reflow profiles. To avoid damaging the module, adhere to the following recommendations:
· For solder reflow recommendations, refer to the AN233 Solder Reflow Recommendation Application Note (DS00233).
· Do not exceed a peak temperature (TP) of 250°C.
· For specific reflow profile recommendations from the vendor, refer to the Solder Paste Data Sheet.
· Use no-clean flux solder paste.
· Do not wash as moisture can be trapped under the shield.
· Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.

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2.8.1
2.9
2.9.1

WILCS02IC and WILCS02 Family Device Overview
Cleaning
The exposed GND pad helps to self-align the module, avoiding pad misalignment. The recommendation is to use the no clean solder pastes. Ensure full drying of no-clean paste fluxes as a result of the reflow process. As per the recommendation by the solder paste vendor, this requires longer reflow profiles and/or peak temperatures toward the high end of the process window. The uncured flux residues can lead to corrosion and/or shorting in accelerated testing and possibly the field.
WILCS02 Module Assembly Considerations
The WILCS02 module is assembled with an EMI shield to ensure compliance with EMI emission and immunity rules. The EMI shield is made of a tin-plated steel (SPTE) and is not hermetically sealed. Solutions like IPA and similar solvents can be used to clean the WILCS02 module. However, do not use the cleaning solutions that contain acid on the module.
Conformal Coating
The modules are not intended for use with a conformal coating, and the customer assumes all risks (such as the module reliability, performance degradation and so on) if a conformal coating is applied to the modules.

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WILCS02IC and WILCS02 Family Electrical Specifications

3.
3.1
3.1.1
3.1.2

Electrical Specifications
This chapter provides the electrical specifications and the characteristics of the WILCS02IC and the WILCS02 Module across the operating temperature range of the product.
WILCS02IC Electrical Specifications
This chapter provides the electrical specifications and the characteristics of the WILCS02IC.

WILCS02IC Absolute Maximum Ratings
The following table provides details about the list of absolute maximum ratings for the WILCS02IC device. Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied.

Table 3-1. Absolute Maximum Ratings

Parameter Ambient temperature under bias(1,2)

Value -40°C to +105°C

Storage temperature

-65°C to +150°C

Voltage on VDD with respect to GND Voltage on any pin(s), with respect to GND(3) Voltage on any pin, with respect to GND (PA0-PA7) Maximum current out of GND pins Maximum current into VDD pins(2) Maximum output current sourced/sunk by any Low-Current Mode I/O pin (4x I/O Pin)

-0.3V to +4.0V -0.3V to (VDD+0.3V) -0.3V to (VDDIO+0.3V) 300 mA 300 mA 15 mA

Maximum output current sourced/sunk by any High-Current Mode I/O pin (8x I/O Pin) 25 mA

Maximum current sunk by all ports Maximum current sourced by all ports(2)

150 mA 150 mA

ESD Qualification

Human Body Model (HBM) per JESD22-A114

2000V

Charged Device Model (CDM) (ANSI/ESD STM 5.3.1) (All pins / Corner pins)

±500V

Notes: 1. The preceding table provides the list of stresses that can cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. 2. Maximum allowable current is a function of the device's maximum power dissipation.
Thermal Specifications

Table 3-2. Thermal Operating Conditions
Rating Industrial Temperature Devices: Operating ambient temperature range Operating junction temperature range Various Temperature Devices: Operating ambient temperature range Operating junction temperature range(1) Power Dissipation:

Symbol
TA TJ
TA TJ

Min.

Typ

-40

Max.
+85 +125
+105 +125

Unit
°C °C
°C °C

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3.1.3 3.1.4

WILCS02IC and WILCS02 Family Electrical Specifications

...........continued

Rating

Symbol

Min.

Typ

Internal chip power dissipation:

PINT = (VDDIOx x (IDD IOH)) + (VDDCORE x IDDCORE) + (VUSB3V3 x IDDUSB) + (VDDANA * VDDANA_IDD) +

(VDDREG x IDDREG)

PINT + PI/O

Maximum allowed power dissipation Note:

PDMAX

(TJ TA)/JA

1. Junction temperature can exceed 125°C under these ambient conditions.

Max.

Unit W

Table 3-3. Thermal Packaging Characteristics

Characteristics

Symbol

Typ

Max.

Unit

Thermal resistance, 48-pin VQFN (7 mm x 7 mm x 0.9 mm) package JA

°C/W

Note:Junction-to-ambient thermal resistance, JA numbers are based on JEDEC 2S2P achieved by package simulations.

Table 3-4. Recommended Operating Voltages

Param. Symbol No.

Characteristics

DC_1 DC_4

VDD VDDIO

VDD voltage range VDDIO voltage range

DC_7

GNDDB

Common EDP ground reference

Min.
3 1.8

Typ.
3.3 3.3

Max.
3.6 3.6

VSS

Unit Conditions

PA[7:0] I/O

pins only, All

other I/Os are

at VDD

Maximum Clock Frequencies AC Electrical Specifications

Table 3-5. Maximum Clock Frequencies AC Electrical Specifications
AC Characteristics

Param. No. FCLK_1

Symbol FCY

Characteristics Frequency of system clock

Power Management Unit DC Electrical Specifications

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Max. 80

Units MHz

Table 3-6. Power Management Unit DC Electrical Specifications

DC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. Symbol

REG_45

VBUK

REG_53

FBUK

Characteristics

Min. Typ.

Buck convertor output voltage 1.425 1.5 range

Buck switching frequency

External LC Filter Components

Max. Units Conditions

1.575 V

With external L-C filter

MHz Buck convertor switching

frequency

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WILCS02IC and WILCS02 Family Electrical Specifications

...........continued
DC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. Symbol

Characteristics

Min. Typ. Max. Units Conditions

REG_58

Inductor value

4.7

REG_59

LDCR

Inductor DCR

Lower is better for high load

efficiency

REG_60

Capacitor value

REG_61 REG_62

CESR CESL

Capacitor ESR Capacitor ESL(1)

0.01

Lower is better for low ripple
Lower is better for high frequency ripple

PMU MLDO Mode

REG_64

VMLDO

MLDO output voltage range 1.425 1.5

1.575 V

Note:

1. Measurement depends on the quality of the evaluation board with respect to coupled noise, input bypass capacitor and output capacitor's Effective Series Resistance (ESR).

2. This parameter is characterized but not tested in manufacturing.

3.1.5 WILCS02IC DC Characteristics 3.1.5.1 I/O Pin AC/DC Electrical Specifications

Table 3-7. I/O Pin AC/DC Electrical Specifications

AC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. Symbol Characteristics

Min.

Typ. Max.
(1)

Units Conditions

DI_1

VIL

Input low voltage I/O GND

pins

DI_3

VIH

Input high voltage

0.8*VDDIO

non-5V tolerant I/O

pins

DI_5

VOL

Output low voltage --

DI_9

VOH

Output high voltage 2.4

DI_13

IIL

Input pin leakage

-1

current

Note:

1. This parameter is characterized but not tested in manufacturing.

0.2*VDDIO V

VDDIO

0.4

µA

-- --
VDDIO = 3.3V at IOL 10 mA VDDIO = 3.3V at IOH 10 mA --

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3.1.5.2 WILCS02IC Wi-Fi Current

WILCS02IC and WILCS02 Family Electrical Specifications

Table 3-8. WILCS02IC Wi-Fi Current
DC Characteristics(1)(2)

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp Temp

Param. Symbol Device States No.

Code Rate

Output Power (Typ.) (dBm)

Current (Typ.) (mA)(3)

IWF_TX IDD

On_Transmit(5)

802.11b 1 Mbps 19

273

802.11b 1 Mbps 14

236

802.11b 11 Mbps 20

279

802.11g 6 Mbps 19

275

802.11g 54 Mbps 16

234

802.11n MCS0

254

802.11n MCS7

238

802.11n MCS7

15.5

229

802.11n MCS7

10.5

216

IWF_RX IDD

On_Receive

802.11b 1 Mbps --

802.11n MCS7

Notes:

1. Measured along with RF matching network (assume 50 impedance).

Max. Units Conditions

mA VDD = VDDIO =

3.3V

2. The test conditions for IDD current measurements are as follows: CPU, Flash panel and SRAM data memory are operational
CPU is operating at 50 MHz CPU is in Wi-Fi® RF Test mode All peripheral modules are disabled (ON bit = 0) but the associated PMD bit is cleared

WDT and FSCM are disabled All I/O pins are configured as inputs and pulled to VDD MCLR = VDD 3. Data in the "Typ." column is at 3.3V, 25°C unless otherwise stated.

4. This parameter is characterized but not tested in manufacturing. 5. Tested at channel 7 in Fixed mode gain.

3.1.5.3 Extreme Deep Sleep (XDS) Current Consumption

Table 3-9. Extreme Deep Sleep (XDS) Current Consumption

DC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. XDSPWR_1

Symbol IDD_XDS(2)

Characteristics IDD in XDS mode

Typ(1) 0.7

Max. --

Units µA

Conditions VDD = VDDIO = 3.3V

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WILCS02IC and WILCS02 Family Electrical Specifications

...........continued
DC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

-40°C TA +105°C for V-temp

Param. No. Symbol

Characteristics

Typ(1) Max. Units Conditions

Notes: 1. Typical values at 25°C only

2. Conditions: All peripherals inactive

All IO configured as input and pulled down internally

3.1.6 WILCS02IC AC Characteristics 3.1.6.1 External XTAL POSC 40 MHz AC Electrical Specifications

Table 3-10. External XTAL POSC 40 MHz AC Electrical Specifications

AC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. Symbol(2)

Characteristics

Min. Typ Max. Units Conditions(1)

XOSC_1

FOSC_XOSC XOSC crystal frequency

-- 40 --

MHz XIN, XOUT primary oscillator

XOSC_1A TOSC

TOSC = 1/FOSC_XOSC

-- ----

See parameter XOSC_1 for

FOSC_XOSC value

XOSC_11 XOSC_34

CLOAD gm

XOSC crystal FOSC = 40 MHz

XOSC transconductance GAIN = 0 --

-- 12 16 --

mA/V XOSC auto gain control disabled

XOSC_39 XCLK_FST

Primary XIN clock fail safe time-out -- 2

ms --

period

Notes: 1. Crystal oscillator requirements:
Crystal load capacitance = 12 pF

ESR = 50

Maximum drive level = 200 µW

2. This parameter is characterized but not tested in manufacturing.

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3.1.6.2 SPI Electrical Specifications
Figure 3-1. SPI Client CPHA=0 Timing Diagram

SCK CPOL=0
SCK CPOL=1
MISO (Mstr Data In)
MOSI (Mstr Data Out)
SSP_19
__ SS

SSP_1

SSP_15
MSB

SSP_17

MSB
SSP_11

WILCS02IC and WILCS02 Family Electrical Specifications

SSP_5

SSP_9

SSP_7 SSP_13

SSP_3

LSB
LSB
SSP_21

Figure 3-2. SPI Client CPHA=1 Timing Diagram

SCK CPOL=0
SCK CPOL=1
MISO (Mstr Data In)
MOSI (Mstr Data Out)
SSP_11
__ SS

SSP_1

SSP_15
MSB

SSP_17

MSB
SSP_19

SSP_5
SSP_3

SSP_9

SSP_7 SSP_13

LSB
LSB
SSP_21

Table 3-11. SPI Client Mode Electrical Specifications

AC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. SSP_1 SSP_3

Symbol FSCK TSCL

SSP_5

TSCH

SSP_7

TSCF

SSP_9

TSCR

Characteristics
SCK frequency
SCK output low time
SCK output high time
SCK and MOSI output fall time
SCK and MOSI output rise time

Min. -- --
--
--
--

Typ
--
1/ (2*FSCK)
1/ (2*FSCK)
--

Max. 40 --
--
10

Units MHz ns
ns
ns

Conditions SPI1 CLOCK on PA0 --
--
--

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WILCS02IC and WILCS02 Family Electrical Specifications

...........continued
AC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. Symbol

Characteristics

Min.

Typ

Max. Units

SSP_11

TSOV

MOSI data output -- valid after SCK

SSP_15

TSIS

MISO setup time of 6 data input to SCK

SSP_17

TSIH

MISO hold time of 1 data input to SCK

Notes:

1. Assumes VDDIOx (min) and 15 pF external load on all SPIx pins unless otherwise noted.

Conditions --

2. CPHA=0 3. CPHA=1

4. These parameters are characterized but not tested in manufacturing.

3.1.6.3 SDIO Controller AC Timing Specifications
Figure 3-3. SDIO Controller AC Timing Diagram

Table 3-12. SDIO Controller AC Timing Specifications

AC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp

Param. No. Symbol

Characteristics

Min.

Typ

Max. Units Conditions(1)

SD/SDIO Default Speed Mode

SD_5 SD_7 SD_9 SD_11 SD_13

tSDCK tDUTY tHIGH tLOW tRISE

Clock frequency

MHz

Duty cycle

Clock high time

8.5

ns --

Clock low time

8.5

ns --

Clock rise time

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WILCS02IC and WILCS02 Family Electrical Specifications

...........continued
AC Characteristics

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

-40°C TA +105°C for V-temp

Param. No. Symbol

Characteristics

Min.

Typ

Max. Units Conditions(1)

SD_15

tFALL

Clock fall time

SD_17

tIN_SETUP

Input setup time

SD_19

tIN_HOLD

Input hold time

SD_21

tOUT_DLY

Output delay time --

SD_23

tOUT_HOLD

Output hold time

Notes:

1. All output pins with 15 pF load.

ns --

VDDIO = 3.3V, CLOAD = 15 pF (Max)

2. Maximum clock frequency specified is limited by the SDIO Host interface internal design; actual maximum clock frequency can be lower and depends on the specific PCB layout.

3.1.6.4 Power on Reset AC Electrical Specifications
Table 3-13. Power on Reset AC Electrical Specifications
AC Characteristics

3.1.7

Param. No. Symbol

DC_11

VPOR

DC_12

SVDD

DC_13

TRST

Characteristics VDD start voltage to ensure internal POR signal VDD rise rate to ensure internal POR signal External Reset valid active pulse width

WILCS02IC Radio Specifications

Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Min. Typ. Max. 1.45 -- 1.65

Units Conditions

0.03 -- 0.115 V/ms 0-3.0V in 0.1s

----

Table 3-14. WILCS02IC Radio Specifications
Feature WLAN standards Frequency range Number of channels

Description IEEE® 802.11b, IEEE 802.11g and IEEE 802.11n 2.412 GHz ~ 2.472 GHz (2400 ~ 2483.5 MHz ISM band) 11 for North America and 13 for Europe and Japan

3.1.7.1 WILCS02IC Receiver Performance

Table 3-15. WILCS02IC Receiver Performance Characteristics(1)
RF Characteristics

Param. No. Characteristics

WF_RX_1

Frequency

Description(5) --

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)
Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp Temp

Min.

Typ

Max. Units

2412 --

2472 MHz

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...........continued
RF Characteristics

Param. No. WF_RX_2 WF_RX_3
WF_RX_4
WF_RX_5 WF_RX_6
WF_RX_7

Characteristics Sensitivity 802.11b Sensitivity 802.11g
Sensitivity 802.11n (Bandwidth at 20 MHz) (Both long GI and short GI)
Maximum receive signal level
Adjacent channel rejection
RSSI accuracy

Description(5) 1 Mbps DSSS 2 Mbps DSSS 5.5 Mbps CCK 11 Mbps CCK(6) 6 Mbps OFDM 9 Mbps OFDM 12 Mbps OFDM 18 Mbps OFDM 24 Mbps OFDM 36 Mbps OFDM 48 Mbps OFDM 54 Mbps OFDM(6) MCS 0 MCS 1 MCS 2 MCS 3 MCS 4 MCS 5 MCS 6 MCS 7(6) 1, 2 Mbps DSSS 5.5, 11 Mbps CCK 6 Mbps OFDM 54 Mbps OFDM MCS 0 MCS 7 1 Mbps DSSS (30 MHz offset) 11 Mbps CCK (25 MHz offset) 6 Mbps OFDM (25 MHz offset) 54 Mbps OFDM (25 MHz offset) MCS 0 20 MHz Bandwidth (25 MHz offset) MCS 7 20 MHz Bandwidth (25 MHz offset) --

WILCS02IC and WILCS02 Family Electrical Specifications

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)
Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp Temp

Min.

Typ

Max. Units

-97

dBm

-94

-93

-89

-92

dBm

-91

-89

-87

-84

-81

-76

-75

-90

dBm

-87

-85

-82

-79

-74

-73

-71

-3

dBm

-3

-7.2

-3

-7

43.5

39.5

21.5

38.5

19.5

-5

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WILCS02IC and WILCS02 Family Electrical Specifications

...........continued
RF Characteristics

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)
Operating Temperature: -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp Temp

Param. No. Characteristics

Description(5)

Min.

Typ

Max. Units

Notes:

1. Measured after RF matching network (assume 50 impedance).

2. RF performance is ensured at 3.3V, 25°C, with a 2-3 dB change at boundary conditions.

3. The availability of some specific channels and/or operational frequency bands are country-dependent and must be programmed in the host product at the factory to match the intended destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via host implementation.

4. The host product manufacturer must ensure that the RF behavior adheres to the certification (for example, FCC, ISED) requirements when the module is installed in the final host product.

5. This parameter is characterized but not tested in manufacturing.

6. This parameter is characterized and tested in manufacturing.

7. Preproduction samples must undergo RF testing using either conducted methods or antennas that exhibit a return loss better than -20 dB. Production samples designed to supports VSWR<2.

3.1.7.2 WILCS02 Module Transmitter Performance

Table 3-16. WILCS02 Module Transmitter Performance Characteristics

RF Characteristics

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. Characteristics No.

Description(8)

Min. Typ(3)

Max.

Units

WF_TX_1 Frequency WF_TX_2 Output power(1)(2) 802.11b

-- 1 Mbps DSSS(9)

2412 --

2472 --

MHz dBm

2 Mbps DSSS

5.5 Mbps CCK

WF_TX_3 Output power(1)(2) 802.11g

11 Mbps CCK 6 Mbps OFDM

dBm

9 Mbps OFDM

12 Mbps OFDM

18 Mbps OFDM

24 Mbps OFDM

36 Mbps OFDM

48 Mbps OFDM

17.5

54 Mbps OFDM(9)

Advance Information Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DS70005557A - 34

WILCS02IC and WILCS02 Family Electrical Specifications

...........continued
RF Characteristics

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. No.
WF_TX_4

Characteristics
Output power(1)(2) 802.11n (Bandwidth at 20 MHz)

Description(8)
MCS 0 MCS 1

Min. Typ(3)

Max.
-- --

Units dBm

MCS 2

MCS 3

17.5

MCS 4

17.5

MCS 5

WF_TX_5 WF_TX_6

Transmit Power Control (TPC) accuracy
Harmonic output power (Radiated, Regulatory mode)

MCS 6 MCS 7(9) --
2nd 3rd

±2(2)

74(7)

Below noise floor

74(7)

dB dBuV/m

Notes: 1. Measured at IEEE® 802.11 specification compliant EVM/Spectral mask

2. Measured after RF matching network (assume 50 impedance)

3. RF performance is ensured at 3.3V, 25°C, with a 2-3 dB change at boundary conditions.

4. With respect to TX power, different (higher/lower) RF output power settings can be used for specific antennas and/or enclosures, in which case, re-certification can be required. Program the custom gain table to control the transmit power using the MCHPRT3 tool.

5. The availability of some specific channels and/or operational frequency bands are country-dependent and must be programmed in the host product at the factory to match the intended destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via host implementation.

6. The host product manufacturer must ensure that the RF behavior adheres to the certification (for example, FCC, ISED) requirements when the module is installed in the final host product.

7. FCC Radiated Emission limits (Restricted Band)

8. This parameter is characterized but not tested in manufacturing.

9. This parameter is characterized and tested in manufacturing.

Advance Information Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DS70005557A - 35

3.1.7.3 WILCS02IC Receiver and Transmitter Characteristics Graphs

Figure 3-4. Receive Current vs Temperature, MCS7, Channel 7, 3.3V

Current (mA)

110

100

-40

-20

Temperature (°C)

WILCS02IC and WILCS02 Family Electrical Specifications

105

Figure 3-5. Receive Current vs Receive Signal Power, MCS7, Channel 7, 3.3V, 25

Current (mA)

110

100

-73

-68

-63

-58

-53

-50

-48

-43

-40

Receive Signal Power (dBm)

Advance Information Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DS70005557A - 36

Figure 3-6. Transmit Current vs Temperature, MCS7, Channel 7, 3.3V

WILCS02IC and WILCS02 Family Electrical Specifications

Current (mA)

400

350

300

250

200

150

100

-40

-20

105

Temperature (°C)

Figure 3-7. Transmit Current vs Transmit Output Power, MCS7, Channel 7, 3.3V, 25
300.0

250.0

200.0

Current (mA)

150.0

100.0

50.0

0.0 7.874

8.855

9.821

10.977

11.932

12.883

13.822

TX Output Power (dBm)

14.86

15.837

16.763

17.627

18.537

Advance Information Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DS70005557A - 37

Figure 3-8. Transmit Power vs Voltage, 11b, 1Mbps, Channel 7, 25
25

WILCS02IC and WILCS02 Family Electrical Specifications

Transmit Power (dBm)

3.1

3.2

3.3

3.4

3.5

3.6

Voltage (V)

Figure 3-9. Transmit Power vs Temperature, 11b, 1Mbps, Channel 7, 3.3V, 25
25

Transmit Power (dBm)

-40

-20

105

Temperature (°C)

Advance Information Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DS70005557A - 38

Figure 3-10. Transmit Power vs Channel, 1Mbps, 3.3V, 25
25

WILCS02IC and WILCS02 Family Electrical Specifications

Transmit Power (dBm)

Channel

Figure 3-11. RSSI vs Received Signal Power, MCS7, Channel7, 3.3V, 25

RSSI

-5

-10

-15

-20

-25

-30

-35

-40

-45

-50

-55

-60

-65

-70

-75

-72

-67.5

-62

-57

-52.5

-46.5

-41.5

-36.5

-31

-27

-22

-17

-12

-7

Received Signal Power

Advance Information Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DS70005557A - 39

Figure 3-12. RX Sensitivity vs Channel, MCS7, 3.3V, 25

-10

-20

-30

RX Sensitity (dBm)

-40

-50

-60

-70

-80

Channel

Figure 3-13. Receive Sensitivity vs Voltage, MCS7, Channel 7, 3.3V, 25 (TBD) Figure 3-14. RX Sensitivity vs Temperature, MCS7, Channel 7, 3.3V
0

-10

-20

RX Sensitity (dBm)

-30

-40

-50

-60

-70

-80 -40

Temperature (°C)

WILCS02IC and WILCS02 Family Electrical Specifications

105

Advance Information Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DS70005557A - 40

3.2
3.2.1

WILCS02IC and WILCS02 Family Electrical Specifications
WILCS02 Module Electrical Specifications
This chapter provides the electrical specifications and the characteristics of the WILCS02 Module across the operating temperature range of the product.

WILCS02 Module Absolute Maximum Ratings
The following table provides details about the list of absolute maximum ratings for the WILCS02 module. Exposure to these maximum rating conditions for extended periods can affect the device's reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied.

Table 3-17. Absolute Maximum Ratings

Parameter Ambient temperature under bias(1)

Value -40°C to +85°C

Storage temperature

-65°C to +150°C

Voltage on VDD with respect to GND Voltage on any pin(s) with respect to GND Voltage on (Pin 13-19 and 27) with respect to GND Maximum current out of GND pins(2) Maximum current into VDD pins(2) ESD Qualification

-0.3V to +4.0V -0.3V to (VDD+0.3V) -0.3V to (VDDIO+0.3V) 500 mA 500 mA

Human Body Model (HBM) per JESD22-A114

2000V

Charged Device Model (CDM) (ANSI/ESD STM 5.3.1)

±500V

Notes:
1. The preceding table provides the list of stresses that can cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied.

2. Maximum allowable current is a function of the device's maximum power dissipation.

3.2.2 3.2.3

Thermal Specifications

Table 3-18. Thermal Operating Conditions
Rating Industrial Temperature Devices: Operating ambient temperature range Operating junction temperature range

Symbol
TA TJ

Min.

Typ

-40

Max.
+85 +125

Unit
°C °C

Table 3-19. Recommended Operating Voltages

Param. No.

Symbol

Characteristics

Min.

Typ.

Max. Unit Conditions

DC_1 DC_4

VDD VDDIO

VDD voltage range VDDIO voltage range

3.3

3.6

1.8

3.3

3.6

Module pins (13-19 and 27)

only. All other I/Os are at

VDD.

DC_7

GNDDB Common EDP ground reference VSS

VSS

WILCS02 Module AC and DC Characteristics
For WILCS02 Module AC and DC Electrical Characteristics, refer to 3.1. WILCS02IC Electrical Specifications.

Advance Information Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DS70005557A - 41

3.2.3.1 Wi-Fi Current Consumption

WILCS02IC and WILCS02 Family Electrical Specifications

Table 3-20. Wi-Fi Current Consumption DC Electrical Specifications

DC Characteristics(1)(2)

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. Symbol Device States No.

Code Rate

Output Power (Typ.) (dBm)

Current

Max.

(Typ.) (mA)(3)

IWF_TX IDD

On_Transmit(5)

802.11b 1 Mbps

266

802.11b 1 Mbps

243

802.11b 11 Mbps 20

268

802.11g 6 Mbps

269

802.11g 54 Mbps 16

236

802.11n MCS0

239

802.11n MCS7

238

802.11n MCS7

15.5

233

802.11n MCS7

10.5

224

IWF_RX IDD

On_Receive

802.11b 1 Mbps

802.11n MCS7

Notes:

1. Measured along with the RF matching network (assume 50 impedance)

2. The test conditions for IDD current measurements are as follows: CPU, Flash panel and SRAM data memory are operational

Units Conditions mA VDD = VDDIO = 3.3V

CPU is operating at 50 MHz CPU is in Wi-Fi® RF Test mode All peripheral modules are disabled (ON bit = 0) but the associated PMD bit is cleared

WDT and FSCM are disabled All I/O pins are configured as inputs and pulled to VDD MCLR = VDD 3. Data in the "Typ." column is at 3.3V, 25°C unless otherwise stated.

4. This parameter is characterized but not tested in manufacturing. 5. Tested at channel 7 in Fixed mode gain.

3.2.4

WILCS02 Module Radio Specifications
Table 3-21. WILCS02 Module Radio Specifications
Feature WLAN standards Frequency range Number of channels

Description IEEE® 802.11b, IEEE 802.11g, and IEEE 802.11n 2.412 GHz ~ 2.472 GHz (2400 ~ 2483.5 MHz ISM band) 11 for North America and 13 for Europe and Japan

Advance Information Data Sheet
© 2024 Microchip Technology Inc. and its subsidiaries

DS70005557A - 42

3.2.4.1 WILCS02 Module Receiver Performance

WILCS02IC and WILCS02 Family Electrical Specifications

Table 3-22. WILCS02 Module Receiver Performance Characteristics(1)

RF Characteristics

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. No.

Characteristics

Description(5)

Min.

Typ

Max.

Units

WF_RX_1

Frequency

2412

2472

MHz

WF_RX_2

Sensitivity 802.11b

1 Mbps DSSS

-97

dBm

2 Mbps DSSS

-93

5.5 Mbps CCK 11 Mbps CCK(6)

-92

-88

WF_RX_3

Sensitivity 802.11g

6 Mbps OFDM

-91

dBm

9 Mbps OFDM

-90

12 Mbps OFDM

-88

18 Mbps OFDM

-86

24 Mbps OFDM

-83

36 Mbps OFDM

-80

48 Mbps OFDM

54 Mbps OFDM(6)

-75

-74

WF_RX_4

Sensitivity 802.11n

MCS 0

(Bandwidth at 20 MHz) (Both long GI and

MCS 1

short GI)

MCS 2

MCS 3

-89

dBm

-86

-84

-81

MCS 4

-78

MCS 5

-74

MCS 6 MCS 7(6)

-72

-70

WF_RX_5

Maximum receive

1, 2 Mbps DSSS

-3

signal level

5.5, 11 Mbps CCK

-3

dBm

6 Mbps OFDM

-3

54 Mbps OFDM

-8.5

MCS 0

-3

MCS 7

-8.5

WF_RX_6

Adjacent channel rejection

1 Mbps DSSS (30 MHz offset)

43.5

11 Mbps CCK

38.5

(25 MHz offset)

6 Mbps OFDM

46.5

(25 MHz offset)

54 Mbps OFDM

28.5

(25 MHz offset)

MCS 0 20 MHz Bandwidth 45.5

(25 MHz offset)

MCS 7 20 MHz Bandwidth 25.5

(25 MHz offset)

WF_RX_7

RSSI accuracy

-5

DS70005557A - 43

WILCS02IC and WILCS02 Family Electrical Specifications

...........continued
RF Characteristics

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. No.

Characteristics

Description(5)

Min.

Typ

Max.

Units

Notes: 1. Measured after RF matching network (assume 50 impedance)

2. RF performance is ensured at 3.3V, 25°C, with a 2-3 dB change at boundary conditions.

4. The host product manufacturer must ensure that the RF behavior adheres to the certification (for example, FCC, ISED) requirements when the module is installed in the final host product.

5. This parameter is characterized but not tested in manufacturing.

6. This parameter is characterized and tested in manufacturing.

3.2.4.2 WILCS02 Module Transmitter Performance

Table 3-23. WILCS02 Module Transmitter Performance Characteristics

RF Characteristics

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. Characteristics No.

Description(8)

Min. Typ(3)

Max.

Units

WF_TX_1 Frequency WF_TX_2 Output power(1)(2) 802.11b

-- 1 Mbps DSSS(9)

2412 --

2472 --

MHz dBm

2 Mbps DSSS

5.5 Mbps CCK

WF_TX_3 Output power(1)(2) 802.11g

11 Mbps CCK 6 Mbps OFDM

dBm

9 Mbps OFDM

12 Mbps OFDM

18 Mbps OFDM

24 Mbps OFDM

36 Mbps OFDM

WF_TX_4 Output power(1)(2) 802.11n (Bandwidth at 20 MHz)

48 Mbps OFDM 54 Mbps OFDM(9) MCS 0 MCS 1

17.5

dBm

MCS 2

MCS 3

17.5

MCS 4

17.5

MCS 5

WF_TX_5 Transmit Power Control (TPC) accuracy

MCS 6 MCS 7(9) --

±2(2)

DS70005557A - 44

WILCS02IC and WILCS02 Family Electrical Specifications

...........continued
RF Characteristics

Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated)

Operating Temperature: -40°C TA +85°C for Industrial

Param. No.
WF_TX_6

Characteristics
Harmonic output power (Radiated, Regulatory mode)

Description(8)
2nd 3rd

Min. Typ(3)

Below noise floor

Max.
74(7) 74(7)

Units dBuV/m

Notes: 1. Measured at IEEE® 802.11 specification compliant EVM/Spectral mask

2. Measured after RF matching network (assume 50 impedance)

3. RF performance is ensured at 3.3V, 25°C, with a 2-3 dB change at boundary conditions.

6. The host product manufacturer must ensure that the RF behavior adheres to the certification (for example, FCC, ISED) requirements when the module is installed in the final host product.

7. FCC Radiated Emission limits (Restricted Band)

8. This parameter is characterized but not tested in manufacturing.

9. This parameter is characterized and tested in manufacturing.

3.2.4.3 WILCS02 Module Receiver and Transmitter Characteristics Graphs
Figure 3-15. Receive Current vs Temperature, MCS7, Channel 7, 3.3V

Receive Current (mA)

120

100

-40

-20

Temperature (°C)

DS70005557A - 45

Figure 3-16. Receive Current vs Receive Signal Power, MCS7, Channel 7, 3.3V, 25
100

Current (mA)

-70

-65

-60

-55

-50

Receive Signal Power (dBm)

Figure 3-17. Transmit Current vs Temperature, MCS7, Channel 7, 3.3V
350

WILCS02IC and WILCS02 Family Electrical Specifications

-40

-30

300

250

Current (mA)

200

150

100

-40

-20

Temperature(°C)

DS70005557A - 46

WILCS02IC and WILCS02 Family Electrical Specifications
Figure 3-18. Transmit Current vs Transmit Output Power, MCS7, Channel 7, 3.3V, 25
300

250

200

Current (mA)

150

100

9.5

10.5

11.5

12.5

13.5

14.5

15.5

TX Output Power (dBm)

Figure 3-19. Transmit Power vs Voltage, 1M, Channel 7, 3.3V, 25
25.00

20.00

Transmit Power (dBm)

15.00

10.00

5.00

0.00 3

3.1

3.2

3.3

3.4

3.5

3.6

Voltage (V)

DS70005557A - 47

Figure 3-20. Transmit Power vs Temperature, 1M, Channel 7, 3.3V
25.00

20.00

Transmit Power (dBm)

15.00

10.00

5.00

0.00

-40

-20

Temperature(°C)

Figure 3-21. Transmit Power vs Channel, 1M, Channel 7, 3.3V, 25
25.00

20.00

Transmit Power (dBm)

15.00

10.00

5.00

0.00

Channel

WILCS02IC and WILCS02 Family Electrical Specifications

DS70005557A - 48

Figure 3-22. RX RSSI vs RX Input Power, MCS7, 3.3V, 25

WILCS02IC and WILCS02 Family Electrical Specifications

RSSI

-18.00

-23.00

-28.00

-33.00

-38.00

-43.00

-48.00

-53.00

-58.00

-63.00

-68.00

-73.00

-73

-68

-63

-58

-53

-48

-43

-38

-33

-28

-23

-18

RX Input Power

Figure 3-23. RX Sensitivity vs Channel, MCS7, 3.3V, 25
-20.00

-30.00

-40.00

-50.00

Sensitivity (dBm)

-60.00

-70.00

-80.00

-90.00

-100.00

Channel

DS70005557A - 49

Figure 3-24. Receive Sensitivity vs Voltage, MCS7, Channel 7, 3.3V, 25
-20

-30

-40

Receive Sensitivity (dBm)

-50

-60

-70

-80

-90

-100 3

3.1

3.2

3.3

3.4

Voltage (V)

Figure 3-25. Receive Sensitivity vs Temperature, MCS7, Channel 7, 3.3V
-20.00

-30.00

-40.00

Receive Sensitivity (dBm)

-50.00

-60.00

-70.00

-80.00

-90.00

-100.00 -40

25
Temperature(°C)

WILCS02IC and WILCS02 Family Electrical Specifications

3.5

3.6

DS70005557A - 50

WILCS02IC and WILCS02 Family Packaging Information

4.
4.1
4.1.1

Packaging Information
This chapter provides information on package markings, dimension, and footprint of the WILCS02IC and the WILCS02 Module.
WILCS02IC Packaging Information
For the most current package drawings, see the Microchip Packaging Specification available at www.microchip.com/en-us/support/package-drawings.
WILCS02IC Package Marking
Figure 4-1. WILCS02IC Package Marking

48L VQFN 7x7x0.9 mm

Example

Legend: XX...X Customer-specific informaon Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week '01') NNN Alphanumeric traceability code Pb-free JEDEC designator for Mae Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus liming the number of available characters for customer-specific informaon.
4.1.2 WILCS02IC Packaging Dimension
This section provides the package dimension details of WILCS02IC.

DS70005557A - 51

WILCS02IC and WILCS02 Family Packaging Information

48-Lead Very Thin Plastic Quad Flat, No Lead Package (ZZX) - 7x7 mm Body [VQFN] With 5.3 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

NOTE1

A B

48X 0.08 C
0.10 C

E1
4
2

(DATUM B) (DATUM A) 2X
0.10 C 2X
0.10 C
L

TOP VIEW
D2

(A3) 0.10 C A B

(K)

0.45

SEATING PLANE

SIDE VIEW

e 2
NOTE 1

2 1
N
e
BOTTOM VIEW

0.10 C A B

48X b 0.10 0.05

CAB C

Microchip Technology Drawing C04-535 Rev A Sheet 1 of 2

DS70005557A - 52

WILCS02IC and WILCS02 Family Packaging Information
48-Lead Very Thin Plastic Quad Flat, No Lead Package (ZZX) - 7x7 mm Body [VQFN] With 5.3 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Notes:

Units

Dimension Limits

Number of Terminals

Pitch

Overall Height

Standoff

Terminal Thickness

Overall Length

Exposed Pad Length

Overall Width

Exposed Pad Width

Terminal Width

Terminal Length

Terminal-to-Exposed-Pad

MILLIMETERS

MIN

NOM

MAX

0.50 BSC

0.80

0.85

0.90

0.00

0.035

0.05

0.203 REF

7.00 BSC

5.20

5.30

5.40

7.00 BSC

5.20

5.30

5.40

0.20

0.25

0.30

0.40

0.50

0.45 REF

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-535 Rev A Sheet 2 of 2

DS70005557A - 53

ØV

C2 Y2

SILK SCREEN

RECOMMENDED LAND PATTERN

Notes:

Units

Dimension Limits

Contact Pitch

Center Pad Width

Center Pad Length

Contact Pad Spacing

Contact Pad Width (X48)

Contact Pad Length (X48)

Contact Pad to Center Pad (X48) G1

Contact Pad to Contact Pad (X44) G2

Thermal Via Diameter

Thermal Via Pitch

MILLIMETERS

MIN

NOM

MAX

0.50 BSC

5.40

6.90

0.30

0.85

0.33

0.20

0.33

1.20

1. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process

Microchip Technology Drawing C04-2535 Rev A

DS70005557A - 54

4.2
4.2.1

WILCS02 Module Packaging Information
WILCS02 Module Packaging Marking
Figure 4-2. WILCS02 Module Packaging Marking

WILCS02IC and WILCS02 Family Packaging Information

XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN
XX XX

WILCS02PE FCC ID: xxxxxx IC: xxxxxx CMIIT ID: xxxxxx YYWWNNN

WILCS02UE FCC ID: xxxxxx IC: xxxxxx CMIIT ID: xxxxxx YYWWNNN

Legend: XX....X YY: WW NNN

Module part number and version and regulatory designator Year code (last 2 digits of calendar year) Week code (week of January 1 is week "01") Alphanumeric traceability code

4.2.2 WILCS02 Module Packaging Dimension
This section provides the package dimension details of the WILCS02 module.

DS70005557A - 55

WILCS02IC and WILCS02 Family Packaging Information
28-Lead PCB Module (TEC) - 14.73x21.72x2.1 mm Body [MODULE] With Metal Shield and Coaxial Connector
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

1.64

THERMAL RELIEF
HOLES 10X

15.46

14 15

Ø 0.80 10X

5.95

8 7 6

COAXIAL CONNECTOR

21.72

12.40
4
3
2
1

6.27 0.80 9X 0.90
5.82 0.80

21 22 23 24 25 26 27 28

13.63 14.73

6.88 0.65

21 22 23 24 25 26 27 28

0.20

1.20

0.90

Ø2.7

O.D.

Ø1.7 I.D.

METAL SHIELD
28X 0.80
28X 0.60
1 2 3 4
1.02
5
6 7 8 9
8.86 6.00

0.80
1.30 2.10
SIDE VIEW

1.91 5.06
Microchip Technology Drawing C04-21567 Rev B Sheet 1 of 2

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Microchip Technology Drawing C04-21567 Rev B Sheet 2 of 2

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6.01

21.72

1.02 15 16

6.27 3.68

14.73
9.67 Ø2.80
3.70 3.70
1.91

28X 1.90
PCB EDGE
0.22 9 8 7 6
2.03 5
28x 0.80 4 3 2 1
2.67

21 22 23 24 25 26 27 28

6.88

2.67

SILKSCREEN

COPPER KEEPOUT ZONE
RECOMMENDED LAND PATTERN
Notes: 1. All dimensions are in millimeters. 2. Keep these areas free from routes and exposed copper. Ground fill with solder mask may be placed here.

Microchip Technology Drawing C04-23567 Rev B

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WILCS02IC and WILCS02 Family Appendix A: Acronyms and Abbreviations

5. Appendix A: Acronyms and Abbreviations

Table 5-1. Acronyms and Abbreviations
Acronyms and Abbreviations ADC AES CBC CDM CFB
CLK CMD CPU CTR DAC DC DFU ECB ECC EMC EMI ESD ESR EVM FCC GND GPIO HBM HPA I/O IP IRQ ISED ISM LNA MCLR MSB NC NDRNG NIST OEM OFB OFDM PA PCB PMF PMU

Description Analog-to-Digital Converter Advanced Encryption Standard Cypher Block Chaining Charged Device Model Cypher Feedback Mode
Clock Command Central Processing Unit Counter Mode Digital-to-Analog Converter Direct Current Device Firmware Update Electronic Code Book Elliptic-Curve Cryptography Electro-Magnetic Compatibility Electro-Magnetic Interference Electrostatic Discharge Effective Series Resistance Error Vector Magnitude Federal Communications Commission Ground General Purpose I/O Human Body Model High Power Amplifiers Input Output Internet Protocol Interrupt Request (active-low) Innovation, Science and Economic Development International Safety Management Certification Low Noise Amplifier Master Clear Input Active Low Most Significant Bit No Connection Non Deterministic Random Number Generator National Institute of Standards and Technology Original Equipment Manufacturer Output Feedback Mode Orthogonal Frequency Division Multiplexing Power Amplifier Printed Circuit Board Protected Management Frame Power Management Unit

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...........continued
Acronyms and Abbreviations POR POSC PRIO PTA RF RP RSSI RTC RTCC RX SDIO SMA SMD SOSC SOSCO SPI SRAM STM TP TPC TX UART VQFN WLAN WPA XDS XLP XOSC

WILCS02IC and WILCS02 Family Appendix A: Acronyms and Abbreviations
Description Power-on Reset Primary Oscillator Priority Packet Traffic Arbitration Radio Frequency Reverse Polarity Receive Signal Strength Indication Real Time Counter Real Time Clock Calendar Receive Secure Digital Input Output SubMiniature version A Connector Surface Mount Device Secondary Oscillator Secondary Oscillator Output Serial Peripheral Interface Static Random Access Memory Standard Test Method Test Point Transmit Power Control Transmit Universal Asynchronous Receiver/Transmitter Very Thin Quad Flat No-lead Wireless Local Area Network Wi-Fi Protected Access Extended Deep Sleep Extreme Low-Power Crystal Oscillator

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WILCS02IC and WILCS02 Family Document Revision History

6. Document Revision History
The revision history describes the changes that were implemented in the document. The changes are listed by revision, starting with the most current publication.

Table 6-1. Document Revision History

Revision

Date

03/2024

Section Document

Description Initial Revision

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WILCS02IC and WILCS02 Family
Microchip Information
The Microchip Website
Microchip provides online support via our website at www.microchip.com/. This website is used to make files and information easily available to customers. Some of the content available includes:
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To register, go to www.microchip.com/pcn and follow the registration instructions.
Customer Support
Users of Microchip products can receive assistance through several channels:
· Distributor or Representative
· Local Sales Office
· Embedded Solutions Engineer (ESE)
· Technical Support
Customers should contact their distributor, representative or ESE for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in this document.
Technical support is available through the website at: www.microchip.com/support
Microchip Devices Code Protection Feature
Note the following details of the code protection feature on Microchip products:
· Microchip products meet the specifications contained in their particular Microchip Data Sheet.
· Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions.
· Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
· Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is "unbreakable". Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products.
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This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure

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WILCS02IC and WILCS02 Family
that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at www.microchip.com/en-us/support/design-help/ client-support-services.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE.
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The Microchip name and logo, the Microchip logo, Adaptec, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, TimeCesium, TimeHub, TimePictra, TimeProvider, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, Clockstudio, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, EyeOpen, GridTime, IdealBridge, IGaT, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, IntelliMOS, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, MarginLink, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mSiC, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, Power MOS IV, Power MOS 7, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, Trusted Time, TSHARC, Turing, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

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WILCS02IC and WILCS02 Family
All other trademarks mentioned herein are property of their respective companies. © 2024, Microchip Technology Incorporated and its subsidiaries. All Rights Reserved. ISBN: 978-1-6683-4058-5
Quality Management System
For information regarding Microchip's Quality Management Systems, please visit www.microchip.com/quality.

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Worldwide Sales and Service

AMERICAS
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