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Antenna Specification

Qingdao Machenike Technology Co., Ltd. GX60-2 2.4G USB Type-C Dongle 2BBT5-GX60-2 2BBT5GX602 gx60 2

Qingdao Machenike Technology Co., Ltd. GX60 MACHENIKE HEADPHONE 2BBT5-GX60 2BBT5GX60 gx60

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Document DEVICE REPORTGetApplicationAttachment.html?id=7861341 
2.4GHz 1608 Chip Antenna: RANT1608F245C01/1608F245C04/1608F245C05
Application:
WLAN, 802.11b/g, Bluetooth, WLAN, etc...

Features
SMD, high reliability, ultra Impact, Omni-directional...

Part number Information
RANT 1608 F 245 (A) (B) (C) (D)

C 01/04 (E) (F)

(A)Product Type

Chip Antenna

(B) Size Code (C) Material

1.6x0.8mm(±0.1mm)
High K material

(D) Frequency

2.4 ~ 2.5GHz

(E) Feeding mode

PIFA & Single Feeding

(F) Antenna type

Type=01/04/05

Electrical Specification

Working Frequency Range Bandwidth Peak Gain Impedance Return loss Polarization Azimuth Beamwidth Operation Temperature() Resistance to Soldering Heats Termination

2400 ~2500 MHz 120 MHz (Min.) 2.7 dBi (Typ.) 50 Ohm 10 dB ( Min) Linear Omni-directional -40 ~85
10sec. ( @ 280) Ni / Au (Leadless)

Dimension and Terminal Configuration

Dimension (mm)

L

1.60 ± 0.10

W

0.80 ± 0.10

T

0.80 ± 0.10

No. Terminal Name

1

Feeding/GNG

2

GND/Feeding


RAIN International Technology Co., Ltd.

: 13530576606 TEL: 13530576606

Address:



611, Building 601F, Yuxing Science and Technology Industrial Park, Nanchang Third Industrial Zone, Nanchang

Community, Xixiang Street, Baoan District, Shenzhen, Guangdong Province

2.4GHz 1608 Chip Antenna: RANT1608F245C01/1608F245C04/1608F245C05
Evaluation Board Reference

Top layer:

Layout

1
Bottom layer:



2.4GHz 1608 Chip Antenna: RANT1608F245C01/1608F245C04/1608F245C05

Top layer:

Layout

Top layer:



2.4GHz 1608 Chip Antenna: RANT1608F245C01/1608F245C04/1608F245C05
Electrical Characteristics
Return Loss & Radiation
ELECTRICAL CHARACTERISTICSS11
Radiation Pattern


2.4GHz 1608 Chip Antenna: RANT1608F245C01/1608F245C04/1608F245C05
Electrical Characteristics


2.4GHz 1608 Chip Antenna: RANT1608F245C01/1608F245C04/1608F245C05

Taping Specifications
Reel Specification

Reel and Taping Specification

TYPE 1608

SIZE 7" 4K/Reel

A 4.0±0.5

Tapping Specification

B 4.0±2

C 13.5±0.5

D 178±2

Packaging Type

A

B

W

E

F

G

H

T

D

P

Paper Type 1608 1.90±0.20 3.50±0.20 8.0±0.20 1.75±0.10 3.5±0.05 4.0±0.10 2.0±0.05 0.75±0.10 1.50±0.10 4.0±0.1



2.4GHz 1608 Chip Antenna: RANT1608F245C01/1608F245C04/1608F245C05
Reliability Table

Test Item Electrical Characterization Thermal Shock
Temperature Cycling
High Temperature Exposure
Low Temperature Storage
Solderability (SMD Bottom Side)
Soldering Heat Resistance (RSH)
Vibration
Mechanical Shock

Procedure
1. Preconditioning: 50 ± 10 / 1 hr , then keep for 24 ± 1 hrs at room temp.
2. Initial measure: Spec: refer Initial spec. 3. Rapid change of temperature test:
-30 to +85; 100 cycles; 15 minutes at Lower category temperature; 15 minutes at Upper category temperature.
1. Initial measure: Spec: refer Initial spec. 2. 100 Cycles (-30 to +85), Soak Mode=1 (2 Cycle/hours). 3. Measurement at 24 ± 2Hours after test condition.
1. Initial measure: Spec: refer Initial spec. 2. Unpowered; 500hours @ T=+85. 3. Measurement at 24 ± 2 hours after test.
1. Initial measure: Spec: refer Initial spec. 2. Unpowered: 500hours @ T= -30. 3. Measurement at 24 ± 2 hours after test.
Dipping method: a. Temperature: 235 ± 5°C b. Dipping time: 3 ± 0.5s
Preheating temperature: 150 ± 10°C. Preheating time: 1~2 min. Solder temperature: 260 ± 5°C. Dipping time: 5 ± 0.5s
5g's for 20 min., 12 cycles each of 3 orientations Note: Use 8"X5" PCB .031" thick 7 secure points on, one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz.
Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks) Peak value: 1,500g's Duration: 0.5ms Velocity change: 15.4 ft/s Waveform: Half-sine

Requirements Ceramic Type Fulfill the electrical specification No Visible Damage. Fulfill the electrical specification.
No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. The solder should cover over 95% of the critical area of bottom side. No Visible Damage.
No Visible Damage.
No Visible Damage.

Remark (Reference) User Spec. MIL-STD-202 107
JESD22 JA104
MIL-STD-202 108
MIL-STD-202 108
IEC 60384-21/22 4.10
IEC 60384-21/22 4.10
MIL-STD-202 Method 204
MIL-STD-202 Method 213

Humidity Bias

1. Humidity: 85% R.H., Temperature: 85 ± 2 °C. 2. Time: 500 ± 24 hours. 3. Measurement at 24 ± 2hrs after test condition.

No Visible Damage. Fulfill the electrical specification.

MIL-STD-202 Method 106



2.4GHz 3216 Chip Antenna:

RANT1608F245C01/RANT1608F245C04/1608F245C05

Board

1. Mounting method:

No Visible Damage.

Flex

IR-Reflow. PCB Size (L:100 × W:40 × T:1.6mm)

(SMD)

2. Apply the load in direction of the arrow until bending reaches

2 mm.

_
AEC-Q200
005

Adhesion

Force of 1.8Kg for 60 seconds.

No Visible Damage Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body terminals and body/terminal junction.

AEC-Q200 006

Physical Dimension

Any applicable method using x10 magnification, micrometers, calipers, gauges, contour projectors, or other measuring equipment, capable of determining the actual specimen dimensions.

In accordance with specification.

JESD22 JB100

Revision History

Revision 1 2

Date 2019/03/01 2020/02/22

Content New Datasheet Add 2D radiation characteristic

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