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Antenna specification
Dongguan Ruige Electronics Co., LTD M96 TWS Wireless earphone 2BC8W-M96 2BC8WM96 m96
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Document DEVICE REPORTGetApplicationAttachment.html?id=81997022.4GHz 1608 Chip Antenna: RANT1608F245C01 _ Application: WLAN, 802.11b/g, Bluetooth, WLAN, etc... Features SMD, high reliability, ultra Impact, Omni-directional... Part number Information RANT 1608 F 245 C 01 (A) (B) (C) (D) (E) (F) (A)Product Type Chip Antenna (B) Size Code 1.6x0.8mm(±0.1mm) (C) Material High K material (D) Frequency 2.4 ~ 2.5GHz (E) Feeding mode PIFA & Single Feeding (F) Antenna type Type=01 Electrical Specification Working Frequency Range Bandwidth Peak Gain Impedance Return loss Polarization Azimuth Beamwidth Operation Temperature() Resistance to Soldering Heats Termination 2400 ~2500 MHz 120 MHz (Min.) 2.7 dBi (Typ.) 50 Ohm 10 dB ( Min) Linear Omni-directional -40 ~85 10sec. ( @ 280) Ni / Au (Leadless) Dimension and Terminal Configuration Dimension (mm) L 1.60 ± 0.10 W 0.80 ± 0.10 T 0.80 ± 0.10 No. Terminal Name 1 Feeding/GNG 2 GND/Feeding Add:Room 707, Building F, Tongan Zhichuangyuan, xixiang street, Baoan District, Shenzhen. 2.4GHz 1608 Chip Antenna: RANT1608F245C01 _ Evaluation Board Reference PCB Dimension Antenna Layout Reference Electrical Characteristics Return Loss & Radiation ELECTRICAL CHARACTERISTICSS11 Unit :mm 1 Radiation Electrical Characteristics Freque ncy 2400 2450 2500 Effic -1.64 -1.33 -1.59 Percen 72.27% 75.34% 72.98% Gain 2.38 2.7 2.59 Add:Room 707, Building F, Tongan Zhichuangyuan, xixiang street, Baoan District, Shenzhen. 2.4GHz 1608 Chip Antenna: RANT1608F245C01 _ Taping Specifications Reel Specification Reel and Taping Specification TYPE 1608 SIZE 7" 4K/Reel A 4.0±0.5 Tapping Specification B 4.0±2 C 13.5±0.5 D 178±2 Packaging Type A B W E F G H T D P Paper Type 1608 1.90±0.20 3.50±0.20 8.0±0.20 1.75±0.10 3.5±0.05 4.0±0.10 2.0±0.05 0.75±0.10 1.50±0.10 4.0±0.1 Add:Room 707, Building F, Tongan Zhichuangyuan, xixiang street, Baoan District, Shenzhen. 2.4GHz 1608 Chip Antenna: RANT1608F245C01 _ Reliability Table Test Item Electrical Characterization Thermal Shock Temperature Cycling High Temperature Exposure Low Temperature Storage Solderability (SMD Bottom Side) Soldering Heat Resistance (RSH) Vibration Mechanical Shock Procedure 1. Preconditioning: 50 ± 10 / 1 hr , then keep for 24 ± 1 hrs at room temp. 2. Initial measure: Spec: refer Initial spec. 3. Rapid change of temperature test: -30 to +85; 100 cycles; 15 minutes at Lower category temperature; 15 minutes at Upper category temperature. 1. Initial measure: Spec: refer Initial spec. 2. 100 Cycles (-30 to +85), Soak Mode=1 (2 Cycle/hours). 3. Measurement at 24 ± 2Hours after test condition. 1. Initial measure: Spec: refer Initial spec. 2. Unpowered; 500hours @ T=+85. 3. Measurement at 24 ± 2 hours after test. 1. Initial measure: Spec: refer Initial spec. 2. Unpowered: 500hours @ T= -30. 3. Measurement at 24 ± 2 hours after test. Dipping method: a. Temperature: 235 ± 5°C b. Dipping time: 3 ± 0.5s Preheating temperature: 150 ± 10°C. Preheating time: 1~2 min. Solder temperature: 260 ± 5°C. Dipping time: 5 ± 0.5s 5g's for 20 min., 12 cycles each of 3 orientations Note: Use 8"X5" PCB .031" thick 7 secure points on, one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz. Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks) Peak value: 1,500g's Duration: 0.5ms Velocity change: 15.4 ft/s Waveform: Half-sine Requirements Ceramic Type Fulfill the electrical specification No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. The solder should cover over 95% of the critical area of bottom side. No Visible Damage. No Visible Damage. No Visible Damage. Remark (Reference) User Spec. MIL-STD-202 107 JESD22 JA104 MIL-STD-202 108 MIL-STD-202 108 IEC 60384-21/22 4.10 IEC 60384-21/22 4.10 MIL-STD-202 Method 204 MIL-STD-202 Method 213 Humidity Bias 1. Humidity: 85% R.H., Temperature: 85 ± 2 °C. 2. Time: 500 ± 24 hours. 3. Measurement at 24 ± 2hrs after test condition. No Visible Damage. Fulfill the electrical specification. MIL-STD-202 Method 106 Add:Room 707, Building F, Tongan Zhichuangyuan, xixiang street, Baoan District, Shenzhen. 2.4GHz 3216 Chip Antenna: RANT1608F245C01 Board Flex (SMD) 1. Mounting method: IR-Reflow. PCB Size (L:100 × W:40 × T:1.6mm) 2. Apply the load in direction of the arrow until bending reaches 2 mm. No Visible Damage. _ AEC-Q200 005 Adhesion Force of 1.8Kg for 60 seconds. No Visible Damage Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body terminals and body/terminal junction. AEC-Q200 006 Physical Dimension Any applicable method using x10 magnification, micrometers, calipers, gauges, contour projectors, or other measuring equipment, capable of determining the actual specimen dimensions. In accordance with specification. JESD22 JB100 Revision History Revision 1 2 Date 2019/03/01 2020/02/22 Content New Datasheet Add 2D radiation characteristic Add:Room 707, Building F, Tongan Zhichuangyuan, xixiang street, Baoan District, Shenzhen.
Related FCC IDs:
- 2BC8W-M96 - Dongguan Ruige Electronics Co., LTD TWS Wireless earphone [-M96] WPS 文字