PIDEU

PAN9019 / PAN9019A

May 22, 2024 — To comply with the regulatory requirements, all instructions of this section must be followed. 5.2.1.1 RF Path. Please follow the design described in ⇨ 5.1 RF ...

User Guide for Panasonic models including: PAN9019, PAN9019A, PAN9019 Wi-Fi and Bluetooth Module, PAN9019, Wi-Fi and Bluetooth Module, Bluetooth Module, Module

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Document DEVICE REPORTpanasonic-pan9019-pan9019a-data
PAN9019 / PAN9019A
Wi-Fi 6 Dual Band 2.4 GHz/5 GHz, Bluetooth® and 802.15.4 (PAN9019A only) Module
Module Integration Guide
Rev. 1.0
Wireless Connectivity


PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

1 About This Document

Overview
The PAN9019 and PAN9019A are 2.4GHz and 5GHz ISM band Wi-Fi, Bluetooth, and 802.15.41 radio modules, which allow easy integration of Wi-Fi, Bluetooth, and 802.15.41 based technologies into various electronic devices.
Features
· Dual band 2.4GHz and 5GHz 802.11 a/b/g/n/ac/ax Wi-Fi, Bluetooth, and 802.15.41 combo module
· Supports WPA3 security · Secured boot and firmware · 802.11e Quality of Service is supported for
multimedia application · IEEE 802.11ax, 1×1 spatial stream with data
rates up to 600Mbps (MCS11, 80MHz channel bandwidth) · OFDMA (UL/DL) and MU-MIMO (UL/DL) · Bluetooth 5.4 (including LE and long range) · WCI-2- and 5-wire PTA coexistence interfaces · Generic interfaces include SDIO 3.0, high-speed UART and SPI2 for host processor connection · OS driver support for RTOS, Linux®, and AndroidTM

Characteristics
· Surface Mount Type (SMT): 15.3mm × 12mm × 2.5mm
· PAN9019: NXP® IW611 WLAN 2.4GHz and 5GHz, Bluetooth single-chip solution inside
· PAN9019A: NXP IW612 WLAN 2.4GHz and 5GHz, Bluetooth and 802.15.4 single-chip solution inside
· Rx sensitivity: -98dBm at IEEE 802.11b 1Mbps · IEEE 802.11ax 20MHz, 40MHz, 80MHz
channel bandwidth
· Power supply: 1.8V and 3.3V · SDIO 1bit or 4bit · Wide temperature range: -40°C to 85°C

Block Diagram
SDIO (Wi-Fi) UART (BT)
COEX GPIO I²S/PCM PDn VIO/VIOSD V1V8 V3V3

PAN9019 Wi-Fi and Bluetooth® Radio Module
IEEE 802.11 a/b/g/n/ac/ax Bluetooth 5.4 (BR, EDR, Low Energy)

NXP® IW611 Radio SoC

Crystal
40 MHz
SPDT

RF SW

LB

HB

Diplexer

C

RF Pad

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

1 About This Document

SDIO (Wi-Fi) UART (BT) SPI (802.15.4)
COEX GPIO I²S/PCM PDn VIO/VIOSD V1V8 V3V3

PAN9019A Wi-Fi, Bluetooth® and 802.15.4 Radio Module
IEEE 802.11 a/b/g/n/ac/ax Bluetooth 5.4 (BR, EDR, Low Energy)
IEEE 802.15.4-2015 2.4 GHz

NXP® IW612 Radio SoC

Crystal
40 MHz
SPDT

RF SW

LB

HB

Diplexer

C

RF Pad

1 802.15.4 is only supported by the PAN9019A. 2 SPI is available as 802.15.4 host interface (only on PAN9019A).
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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

1 About This Document

By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time without notification. Please consult the most recently issued Module Integration Guide before initiating or completing a design.
© Panasonic Industrial Devices Europe GmbH 2024.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party.
All rights reserved.
This Module Integration Guide does not lodge the claim to be complete and free of mistakes.
If this document is marked as preliminary, please be aware that its final content is not yet concluded and the use of it is at your own risk.

Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status "Engineering Samples". This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series production.

Disclaimer The customer acknowledges that samples may deviate from the Module Integration Guide and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by:
· The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer,
· Deviation or lapse in function of the Engineering Sample,
· Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager.

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by Panasonic for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
Description of hardware, software, and other information in this document is only intended to illustrate the functionality of the referred Panasonic product. It should not be construed as guaranteeing specific functionality of the product as described or suitable for a particular application.
Any provided (source) code shall not be used or incorporated into any products or systems whose manufacture, use or sale is prohibited under any applicable laws or regulations.

Any outlined or referenced (source) code within this document is provided on an "as is" basis without any right to technical support or updates and without warranty of any kind on a free of charge basis according to § 516 German Civil Law (BGB) including without limitation, any warranties or conditions of title, non infringement, merchantability, or fitness for a particular purpose. Customer acknowledges that (source) code may bear defects and errors.

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

1 About This Document

The third-party tools mentioned in this document are offered by independent third-party providers who are solely responsible for these products. Panasonic has no responsibility whatsoever for the performance, product descriptions, specifications, referenced content, or any and all claims or representations of these third-party providers. Panasonic makes no warranty whatsoever, neither express nor implied, with respect to the goods, the referenced contents, or any and all claims or representations of the third-party providers.
To the maximum extent allowable by Law Panasonic assumes no liability whatsoever including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation loss of profits, loss of opportunities, business interruption, and loss of data.

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

1 About This Document

Table of Contents
1 About This Document.........................................................................................................................7 1.1 Purpose and Audience ..............................................................................................................7 1.2 Revision History.........................................................................................................................7 1.3 Use of Symbols .........................................................................................................................7 1.4 Related Documents ...................................................................................................................8
2 Overview..............................................................................................................................................9
3 PAN9019 / PAN9019A Module..........................................................................................................10 3.1 Block Diagram .........................................................................................................................10 3.2 Land Pattern ............................................................................................................................11 3.3 Footprint ..................................................................................................................................12 3.4 Solder Resist Mask and Solder Paste Stencil..........................................................................13
4 Power Supply ....................................................................................................................................14 4.1 General Guidance ...................................................................................................................14 4.2 Power Supply Terminals..........................................................................................................14
5 RF Interface .......................................................................................................................................16 5.1 RF Trace..................................................................................................................................16 5.2 Antennas .................................................................................................................................17
6 Host Interfaces ..................................................................................................................................25 6.1 SDIO Interface.........................................................................................................................25 6.2 UART Interface........................................................................................................................25 6.3 SPI Interface............................................................................................................................27
7 M.2 Reference Design.......................................................................................................................28 7.1 Reference Schematics.............................................................................................................28 7.2 Reference Layout ....................................................................................................................30
8 Software Integration .........................................................................................................................33 8.1 Wi-Fi ­ Regulatory Compliant Bring Up ...................................................................................33 8.2 Bluetooth ­ Regulatory Compliant Bring Up ............................................................................40 8.3 802.15.4 ­ Regulatory Compliant Bring Up .............................................................................48
9 Contact Details..................................................................................................................................50 9.1 Contact Us...............................................................................................................................50 9.2 Product Information .................................................................................................................50

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1 About This Document

1 About This Document
1.1 Purpose and Audience
This Module Integration Guide is intended to support the easy integration of the PAN9019 and PAN9019A into a product and to ensure the compliance with regulatory requirements. This guide gives an overview about the hardware design requirements by providing a reference design, which is the evaluation board of the PAN9019 and PAN9019A. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as "PAN9019 / PAN9019A" and "module" within this document.

1.2 Revision History

Revision 0.1 0.2

Date 2023-08-04 2023-11-22

1.0

2024-05-22

Modifications/Remarks
First preliminary version
· Added antenna lists  5.2 Antennas · Added subsections  5.2.2 External Antennas · Added section  5.2.1.3 Design Verification · Changed reference matching and tuning components  5.2.1.2 Antenna Layout · Updated pictures  5.2.1.2 Antenna Layout · Added  8 Software Integration · Corrected direction of SPI_FRM  6.3 SPI Interface · Updated Block diagrams: Bluetooth 5.2  Bluetooth 5.4 · Added IND_RST_15.4 to SPI diagram  6.3 SPI Interface · Corrected cross references · Updated formatting and structure

1.3 Use of Symbols

Symbol
 [chapter number] [chapter title]

Description Note Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product's functionality at risk. Tip Indicates useful information designed to facilitate working with the software.
Cross reference Indicates cross references within the document. Example: Description of the symbols used in this document  1.3 Use of Symbols.

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

1 About This Document

Symbol  
This font
Menu > Menu item
This font
This font

Description Requirement Indicates a requirement that must be met before the corresponding tasks can be completed. Result Indicates the result of a task or the result of a series of tasks. GUI text Indicates fixed terms and text of the graphical user interface. Example: Click Save. Path Indicates a path, e.g. to access a dialog. Example: In the menu, select File > Setup page. File names Indicates file names displayed on the screen or to be selected by the user. Examples: pan1760.c contains the actual module initialization. Messages, user input, code Indicates messages, information, and code displayed on the screen or to be entered by the user. Examples: The message Failed to save your data is displayed. Enter the value Product 123. Copy firmware binaries to firmware library: $> cd ${TOP}/... $> ...

Key

Key

Indicates a key on the keyboard.

Example:

Press F10 .

1.4 Related Documents
For related documents please refer to the Panasonic website  9.2 Product Information.

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

2 Overview

2 Overview
The PAN9019 / PAN9019A is a dual band 2.4GHz and 5GHz 802.11 a/b/g/n/ac/ax Wi-Fi radio module with integrated Bluetooth BR/EDR/Low Energy (LE) and 802.15.43 radio, specifically designed for highly integrated and cost-effective applications. The independent operation of the three standards enables 802.11ax data rates with high efficiency (HE) and low-power operation (Bluetooth LE and 802.15.43).
Latest technologies like multiuser MIMO and OFDMA improve the efficiency in large networks, while the 1024-QAM modulation allows high data rates. Integrated power management, a fast dual-core CPU, 802.11i/w security standard support, and high-speed data interfaces deliver the performance for the speed, reliability, and quality requirements of next generation products.
Tx power calibration data and Wi-Fi/Bluetooth/802.15.43 system parameters are pre-stored on the one-time-programmable memory of the PAN9019 / PAN9019A during production at Panasonic. Thus, the module reduces design, test, and calibration effort resulting in reduced time-to-market compared to discrete solutions.
Integrating Wi-Fi, Bluetooth, and 802.15.43 wireless connectivity allows high throughput applications for industrial devices and appliances. The combination of Wi-Fi, Bluetooth, and 802.15.43 provides the highest flexibility for connectivity. This Module Integration Guide applies to the PAN9019 / PAN9019A WLAN and Bluetooth combo module and the PAN9019 / PAN9019A M.2 evaluation platforms.

For related documents please refer to  9.2 Product Information.

3 802.15.4 is only supported by the PAN9019A.
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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

3 PAN9019 / PAN9019A Module

3 PAN9019 / PAN9019A Module
3.1 Block Diagram PAN9019 (ENWF9501C1KF)

SDIO (Wi-Fi) UART (BT)
COEX GPIO I²S/PCM PDn VIO/VIOSD V1V8 V3V3

PAN9019 Wi-Fi and Bluetooth® Radio Module
IEEE 802.11 a/b/g/n/ac/ax Bluetooth 5.4 (BR, EDR, Low Energy)

NXP® IW611 Radio SoC

Crystal
40 MHz
SPDT

RF SW

LB

HB

Diplexer

C

RF Pad

PAN9019A (ENWF9511C1KF)

SDIO (Wi-Fi) UART (BT) SPI (802.15.4)
COEX GPIO I²S/PCM PDn VIO/VIOSD V1V8 V3V3

PAN9019A Wi-Fi, Bluetooth® and 802.15.4 Radio Module
IEEE 802.11 a/b/g/n/ac/ax Bluetooth 5.4 (BR, EDR, Low Energy)
IEEE 802.15.4-2015 2.4 GHz

NXP® IW612 Radio SoC

Crystal
40 MHz
SPDT

RF SW

LB

HB

Diplexer

C

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

3.2 Land Pattern

Top View

3 PAN9019 / PAN9019A Module

H1

H2

H3

GND

V_SD

V_IO

G1

G2

SD_ DA T3

GND

G3
GP IO30

F1

F2

F3

SD_DAT2 SD_DAT1

NC

E1

E2

SD_ DA T0

GND

E3
GP IO20

D1
SD_CLK

D2
SD_ CM D

D3
GP IO24

C1

C2

C3

GND

GP IO21

GP IO0

B1

B2

B3

GP IO8

GP IO9

GND

A1

A2

A3

GND

GP IO10

GP IO11

H4

H5

H6

H7

H8

GND

1V 8

1V 8

GND

PDn

G4

G5

G6

G7

G8

GP IO31

GND

GP IO28

GP IO29

GP IO16

Th1 (Thermal GND)

Th2 (Thermal GND)

B4
GP IO3
A4
GP IO6

B5
GP IO5
A5
GND

B6
GP IO7
A6
GP IO4

B7
GP IO19
A7
GP IO18

B8
GP IO2
A8
GP IO1

H9
GND
G9
GND
F9
GP IO17
E9
GP IO12
D9
GP IO15
C9
GP IO14
B9
GND
A9
GND

H10
NC
G10
GND
F10
GP IO25
E10
GP IO22
D10
GND
C10
GP IO13
B10
GND
A10
RF 1

H11
GND
G11
GND
F11
GP IO26
E11
GND
D11
3V 3
C11
3V 3
B11
GND
A11
GND

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module
3.3 Footprint

3 PAN9019 / PAN9019A Module

All dimensions are in millimeters. The outer dimensions have a tolerance of ±0.35 mm.

12 1.4

Top View
p

H1

H2

H3

H4

H5

H6

H7

H8

H9

H10

H11

G1

G2

G3

G4

G5

G6

G7

G8

G9

G10

G11

2.8

F1

F2

F3

F9

F10

F11

E1

E2

E3

D1

D2

D3

Th1
(Thermal GND)

Th2
(Thermal GND)

4.2

E9

E10

E11

D9

D10

D11

C1

C2

C3

C9

C10

C11

B1

B2

B3

B4

B5

B6

B7

B8

B9

B10

B11

A1

A2

A3

A4

A5

A6

A7

A8

A9

A10

A11

0.65

1.4

5.95

9.35

15.3

Ø0.8

6 1.1

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

3 PAN9019 / PAN9019A Module

3.4 Solder Resist Mask and Solder Paste Stencil
It is recommended to use the following layout for the solder resist mask and the solder paste stencil to reduce voids on the pads.
The following dimensions are recommended:  The solder resist mask should be 50µm bigger (circumferential) than the pad size (non-sol-
der-mask-defined design).  The solder paste stencil apertures should have the same size as the copper pads; they are
separated in two semi circles with 300µm distance and are shifted about 150µm towards the outside.

For details on the dimensions of the copper pads please refer to  3.3 Footprint.

Solder Paste Stencil Layout

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4 Power Supply

4 Power Supply
4.1 General Guidance
The following requirements must be met:  The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47µF directly at the module).
 The supply voltage must not be exceedingly high or reversed. It must not carry noise and spikes.

4.2 Power Supply Terminals
The PAN9019 / PAN9019A requires 1.8V and 3.3V supply voltages for operation. All supply pins are marked and enumerated in the figure below. All power signals are described in the subsequent table.

Top View

3

4

H1

H2

H3

GND

V_SD

V_IO

G1
SD_ DA T3

G2
GND

G3
GP IO30

F1

F2

F3

SD_DAT2 SD_DAT1

NC

E1
SD_ DA T0

E2
GND

E3
GP IO20

D1
SD_CLK

D2
SD_CMD

D3
GP IO24

C1
GND

C2
GP IO21

C3
GP IO0

B1

B2

B3

GP IO8

GP IO9

GND

A1
GND

A2
GP IO10

A3
GP IO11

H4
GND
G4
GP IO31

1

H5

H6

1V 8

1V 8

G5
GND

G6
GP IO28

H7
GND
G7
GP IO29

H8
PDn
G8
GP IO16

Th1
(Thermal GND)

Th2
(Thermal GND)

B4
GP IO3
A4
GP IO6

B5
GP IO5
A5
GND

B6
GP IO7
A6
GP IO4

B7
GP IO19
A7
GP IO18

B8
GP IO2
A8
GP IO1

H9
GND
G9
GND
F9
GP IO17
E9
GP IO12
D9
GP IO15
C9
GP IO14
B9
GND
A9
GND

H10
NC
G10
GND
F10
GP IO25
E10
GP IO22
D10
GND
C10
GP IO13
B10
GND
A10
RF 1

H11
GND
G11
GND
F11
GP IO26
E11
GND
D11
3V 3
2
C11
3V 3
B11
GND
A11
GND

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

4 Power Supply

Enumeration Name 1 1V8
2 3V3
3 V_SD 4 V_IO

Nominal Voltage 1.8 V
3.3 V
1.8 V or 3.3 V 1.8 V or 3.3 V

Description
Main power supply The supply source should be capable to drive at least 1 A. Supply for Wi-Fi PA and internal RF control pins The supply source sould be capable to drive at least 500 mA. Reference voltage for the digital SDIO interface
Reference voltage for all other digital IO interfaces

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

5 RF Interface

5 RF Interface
The PAN9019 / PAN9019A can be used in combination with various antennas that are listed in this document. The design rules given in this document must be followed to meet the regulatory requirements.

5.1 RF Trace
A 50 trace shall be used for connecting the module either to the documented chip antenna or to a MHF4(L) connector for external antenna usage. This section describes the required design of the trace.
50 Coplanar Waveguide Design
The following requirements must be met:  Trace impedance of 50  Via fence around the trace  Coplanar waveguide design  Substrate Material: FR4  Height (H) of dielectric: typ. 250µm ± 10µm  Trace Width (W): typ. 450µm ± 10µm  Copper Gap (G): typ. 500µm, min. 450µm  All inner layers have the same copper-obstruct pattern as the GND on the top layer.  The minimum trace length in  5.2.1 Chip Antenna is met.

G
Top GND

W
Signal

G
Top GND

H

Inner Layer(s) GND

FR4

GND of Reference Plane

Inner Layer(s) GND

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5 RF Interface

5.2 Antennas
The PAN9019 / PAN9019A are certified in combination with the following antenna types:
· Chip antenna · External flex PCB antenna · External terminal antenna
All approved antennas are listed in the corresponding subsection.

5.2.1 Chip Antenna

One option of the RF interface is to use the chip antenna ANT162442DT-2001A2 directly on the carrier PCB.

Part Number

Vendor Type

Max. Gain Max. Gain Cable Variants

(2.4 GHz (5 GHz

band)

band)

ANT162442DT-2001A2 TDK

Chip

2.1 dBi

Antenna

2.3 dBi

50 Ohm trace
· Min. length: 15 mm · Design follows  5.2.1.1 RF
Path

To comply with the regulatory requirements, all instructions of this section must be followed.

5.2.1.1

RF Path
Please follow the design described in  5.1 RF Trace for connecting the antenna. The trace length should be at minimum 15 mm. The following figure illustrates the connection on the reference design.

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module
5.2.1.2 Antenna Layout

5 RF Interface

Please note that the stackup must follow the design instructions described in  5.1 RF Trace!

This section describes the layout on the module's carrier PCB that must be followed. A reference DXF file can be obtained from Panasonic.
The following requirements must be met:  The top copper layer complies with the following dimensions:

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5 RF Interface

 On the lower layer, the shown metal structure is placed. The shape is connected to the top layer with vias at the marked positions.

 Besides the metal structures, no other metal objects are placed within the antenna area of 8mm × 5mm (shown in the pictures above).
 To obtain an optimum performance of the antenna, the GND areas next to the antenna on the top and bottom of the PCB are at least 12 mm long:

 The GND areas has a minimum depth of 20mm towards the inside of the PCB (shown in the pictures above).

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5 RF Interface

Three components are used for impedance matching and tuning of the antenna. The following table shows the reference design's component specifications.

Component Size (inch)

Type

Value Characteristics

Part No.

Ft 2.4GHz 0201 Capacitor

3.9pF ± 0.1pF, C0G

GJM0335C1E3R9BB01D

Ft 5GHz 0201 Capacitor

0.6pF ± 0.1pF, C0G

GJM0335C1ER60BB01D

Mt

0402 Inductor

1nH

± 0.1nH, fr  10GHz

LQG15HS1N0B02D

5.2.1.3 Design Verification
It must be verified that the antenna is tuned and matched correctly. This can be done by measuring the return loss at the RF entry point on the mother PCB.
Verify the Design Connect a 50 Ohm probe to the RF1 landing pad and GND (e.g. a semi-rigid cable can be soldered onto the footprint's pads).
Probe Connection on the Reference Design

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module  The measured return loss should look similar as shown:

5 RF Interface

It ensures that the antenna is correctly tuned and thus the antenna radiates in the correct bands. Moreover, the effective impedance is close to 50 Ohm and the reflection towards the module is low, which is a precondition for the Tx power amplifier and Rx low noise amplifier to work as specified.
5.2.2 External Antennas
Antenna Warning
The PAN9019 / PAN9019A is tested with a standard MHF4(L) connector and with the antennas listed in the "PAN9019 / PAN9019A Product Specification". When integrated into the OEM's product, these fixed antennas require installation preventing end users from replacing them with non-approved antennas.
Any antenna not listed in the "PAN9019 / PAN9019A Product Specification" must be tested to comply with FCC section 15.203 for unique antenna connectors and with section 15.247 for emissions.

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5 RF Interface

5.2.2.1 RF Path
All external antennas listed in this Module Integration Guide require an MHF4(L) connector on the mother PCB. Follow the design described in  5.1 RF Trace for routing the module's RF signal to the MHF4(L) receptable connector.

M.2 reference design

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5 RF Interface

5.2.2.2 PCB Antennas
Part Number 2JF1002P
2JF0102P
FXP830 W3P35X8W04 W3F35X8W01 1001932PT

Vendor Type

Max. Gain Max. Gain Cable Options4

(2.4GHz (5GHz

band)

band)

2J

Flex PCB 4.2dBi

2J

Flex PCB 2.2dBi

Taoglas Flex PCB 2.5dBi

Kyocera PCB AVX

2.3dBi

Kyocera Flex PCB 2.3dBi AVX

Kyocera Flex PCB 2.0dBi AVX

8.0dBi
3.8dBi
4.7dBi 5dBi 5dBi 4.5dBi

-005MC137-MHF4L (50 mm) -010MC137-MHF4L (100 mm) -015MC137-MHF4L (150 mm) -020MC137-MHF4L (200 mm) -025MC137-MHF4L (250 mm) -030MC137-MHF4L (300 mm) -005MC137-MHF4L (50 mm) -010MC137-MHF4L (100 mm) -015MC137-MHF4L (150 mm) -020MC137-MHF4L (200 mm) -025MC137-MHF4L (250 mm) -030MC137-MHF4L (300 mm) .54.0055C (55 mm) .54.0100C (100 mm) .54.0150C (150 mm) .54.0200C (200 mm) -H050D3B0A (50 mm) -H100D3B0A (100 mm) -H150D3B0A (150 mm) -H050D3B0C (50 mm) -H100D3B0C (100 mm) -H150D3B0C (150 mm) -AC10L0050 (50 mm) -AC10L0100 (100 mm)

4 Cable option with MHF4L connector; Product number: [Part Number][Cable Option]

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module

5 RF Interface

5.2.2.3 Terminal Mount Antennas

Part Number

Vendor Type

Max. Gain Max. Gain Cables5

(2.4GHz (5GHz

band)

band)

GW.51.5153

Taoglas Terminal 5.2dBi Mount

2JW1102-C943B 2J

Terminal 4.1dBi Mount

X9000294W3DRMB

Kyocera Terminal 3.2dBi

AVX

Mount

X9001748W3DRMB

Kyocera Terminal 3.2dBi

AVX

Mount

X9003019-

Kyocera Terminal 2.8dBi

W3DRMB (Black) AVX

Mount

X9003019W3DRMW (White)

5.5dBi 3.9dBi
4.5dBi 3.6dBi 4.9dBi

CAB.S140 (50 mm) CAB.S119 (100 mm) CAB.S141 (150 mm) CAB.S142 (200 mm) CAB.S143 (300 mm) C213GST-005MC137-MHF4L (50 mm) C213GST-010MC137-MHF4L (100 mm) C213GST-015MC137-MHF4L (150 mm) C213GST-020MC137-MHF4L (200 mm) C213GST-025MC137-MHF4L (250 mm) C213GST-030MC137-MHF4L (300 mm) ACM13-04LB030SAR00 (30 mm) ACM13-04LB050SAR00 (50 mm) ACM13-04LB100SAR00 (100 mm) ACM13-04LB150SAR00 (150 mm) ACM13-04LB200SAR00 (200 mm) ACM13-04LB300SAR00 (300 mm) ACM13-04LB030SAR00 (30 mm) ACM13-04LB050SAR00 (50 mm) ACM13-04LB100SAR00 (100 mm) ACM13-04LB150SAR00 (150 mm) ACM13-04LB200SAR00 (200 mm) ACM13-04LB300SAR00 (300 mm) ACM13-04LB030SAR00 (30 mm) ACM13-04LB050SAR00 (50 mm) ACM13-04LB100SAR00 (100 mm) ACM13-04LB150SAR00 (150 mm) ACM13-04LB200SAR00 (200 mm) ACM13-04LB300SAR00 (300 mm)

5 MHF4L to RP-SMA (female) cable Module Integration Guide Rev. 1.0

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module
6 Host Interfaces
This section describes the interfaces to the host processor:
· SDIO for Wi-Fi · UART for Bluetooth · SPI for 802.15.4

6 Host Interfaces

6.1 SDIO Interface
The SDIO interface of the PAN9019 / PAN9019A is shown in the following block diagram:

Host Processor
VIO_SD

VIO_SD

PAN9019(A)
V_SD(H2)

R11 R12 R13 R14 R15 R16

SDIO_CLK SDIO_DAT[0] SDIO_DAT[1] SDIO_DAT[2] SDIO_DAT[3]
SDIO_CMD

R1

SD_CLK (D1)

R2

SD_DAT0 (E1)

R3

SD_DAT1 (F2)

R4

SD_DAT2 (F1)

R5

SD_DAT3 (G1)

R6

SD_CMD (D2)

The block diagram includes pull-up resistors (R11 to R16) and series damping resistors (R1 to R6). If the host processor includes internal pull-up resistors, resistors R11 to R16 are not required to be designed-in. In the case the host does not provide pull-resistors, please add pull-up resistors with a resistance of 10k to 100k. If long ribbon cables are used for connecting the PAN9019 / PAN9019A, the damping resistors R1 to R6 can help to reduce the under-/overshoot. If required, 33 resistors should be used. If the signal integrity shows good performance, it is not required to design-in these resistors.
6.2 UART Interface
The PAN9019 / PAN9019A includes a standard UART interface with flow control for operating the Bluetooth radio. In the following, two connection scenarios to host processors are described.
Serial Data Communication Equipment (DCE) If a host is operated as serial Data Communication Equipment (DCE), the CTS and RTS hardware flow control lines have a different direction than the standard UART interface.

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6 Host Interfaces

Host Pin Assignment in DCE Mode
Please be aware that hosts that operate the serial interface as DCE (Data Communication Equipment) or DTE (Data Terminal Equipment) usually switch the pins for Tx and Rx based on the mode. Ensure that the pins are used as assigned in DCE mode.

Data Communication Equipment (DCE)

Host Processor

In legacy op eration mo de

DCE (Data Communication

Equipm ent )

VIO_UART

PAN9019(A)
VIO
V_IO(H3)

DCE - TX DCE - RX DCE - CTS DCE - RTS

GPIO[10] /UART_RX (A2) GPIO[11] /UART_TX (A3) GPIO[8] /UART_CTS (B1) GPIO[9] /UART_RTS (B2)

Standard UART Interface If the host processor provides a standard UART interface, the pins have a static pin assignment, and the interface's lines are "crossed" by the hardware connection.
Standard UART Connection

Host Processor

With standard UART interface

VIO_UART

PAN9019(A)
VIO
V_IO(H3)

UART - TX UART - RX UART - RTS UART - CTS

GPIO[10] /UART_RX (A2) GPIO[11] /UART_TX (A3) GPIO[8] /UART_CTS (B1) GPIO[9] /UART_RTS (B2)

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6 Host Interfaces

6.3 SPI Interface
In addition to the SDIO and UART interfaces, there is a Serial Peripheral Interface (SPI) on the PAN9019A. This is used for operating the 802.15.4 radio. Besides the usual four SPI lines, there are the SPI_INT and IND_RST_15.4 lines.
The PAN9019A uses SPI_INT to indicate that there is data to transmit. The host needs to start the communication in this case. Asserting IND_RST_15.4 will reset the 802.15.4 radio6. The 802.15.4 is usually operated via the spinel protocol, which requires the SPI_INT and IND_RST_15.4 functionalities.

Host Processor
VIO_SPI

PAN9019A
VIO
V_IO(H3)

SPI CLK SPI SS
SPI TXD SPI RXD GPIO INT 802.15.4 Reset

MOSI MISO

GPIO[12] /SPI_CLK (E9) GPIO[13] /SPI_FRM (C10) GPIO[14] /SPI_RXD (C9) GPIO[15] /SPI_TXD (D9) GPIO[20] /SPI_INT (E3) GPIO[24] /IND_RST_15.4 (D3)

6 The request to reset either Bluetooth or 15.4 radio leads to reinitialization of both radios.
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7 M.2 Reference Design

7 M.2 Reference Design

No SDIO Pull-Ups on the M.2 Designs
Please note that the M.2 reference designs do not contains pull-up resistors on the SDIO lines, because the host processor platforms usually provide these. For details please refer to  6.1 SDIO Interface.

7.1 Reference Schematics
7.1.1 M.2 Reference Design with MHF4 Connector
PAN9019

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module
PAN9019A

7 M.2 Reference Design

7.1.2 M.2 Reference Design with Chip Antenna
PAN9019

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PAN9019A

7 M.2 Reference Design

7.2 Reference Layout
This section shows the reference layout for a design with the described chip antenna. A layout for conducted RF interfaces can also use the information from the documented reference design.
Layer 1 (Top)

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Layer 2

7 M.2 Reference Design

Layer 3

Layer 4

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Layer 5

7 M.2 Reference Design

Layer 6 (Bottom)

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8 Software Integration

8 Software Integration
The following chapters describe how the radio interfaces can be brought up in such way that the regulatory requirements are met. The instructions must be followed for the modular approval to be valid.

8.1 Wi-Fi ­ Regulatory Compliant Bring Up
8.1.1 Concept
Self-Managed Interface Must be Used
Please be aware that the regulatory grant is only valid if the driver is installed with the parameter cntry_txpwr=2. This ensures that the self-managed interface is used. A security key inside the PAN9019 / PAN9019A ensures that the system is only operable, if valid regulatory files are used.

For keeping the modular approval of the PAN9019 / PAN9019A valid, it is only allowed to use the self-managed interface. This interface requires the so-called rgpower files that contain regulatory settings, like e.g. Dynamic Frequency Selection (DFS) parameters and power settings for all modulations and channels.
The self-managed interface is used, if the driver (moal.ko) was installed with the parameter cntry_txpwr set to 2. Moreover, valid rgpower files must be present on the host system. After the start-up, the world-wide rgpower file (rgpower_WW.bin) is loaded. If the file cannot be loaded because it is not available or invalid, the start-up fails and it is not possible to operate the module.
In the intended case that the valid file is available, the device is ready for operation with the world-wide settings initially applied. For extending the capabilities, the country code shall be changed to the country of operation by using the command iw reg set (US is used as an example). After the change was initiated, the related rgpower file is looked up. If this is available and valid, the settings are loaded and applied. In contrast, the world-wide file is loaded as a fallback, if the US file is not available or not valid. This behavior is illustrated in the figure below.

The drivers and firmware files are provided by NXP Semiconductors. Please ensure that the driver and firmware with a version greater than or equal to 6.1.55-2.2.0 are used.

The regulatory files (rgpower_XX.bin) are provided by Panasonic.

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lib firmware nxp rgpower_WW.bin - securtiy key rgpower_US.bin - securtiy key
Device OTP security key

Start
Drivers are loaded (cntry_txpwr=2), device is detected and the firmware is dowloaded
Initial regulatory setting mechanism

rgpower_WW.bin available?

No

Fail

Yes

Do the security keys match?

No

Fail

Yes Device is ready with world-wide settings

Change to different country code Example: iw reg set US

8 Software Integration
Legend
Data Flow Process Flow
State Process Decision
Data

No rgpower_US.bin available?

Yes

Do the security keys match?

No

Yes Device is ready with US settings

No rgpower_WW.bin available?

Fail

Yes

No Do the security keys match?

Fail

Yes
Device is ready with world-wide settings

The required rgpower files are provided by Panasonic and contain a security key. The same key is stored in the PAN9019 / PAN9019A One Time Programable (OTP) memory. This ensures that only files can be used, which comply with the respective regulations and standards. To obtain access to the files please contact your local sales representative  9.1 Contact Us.
The world-wide file must be always present on the host system to act as fallback with minimum settings (2.4 GHz Ch 1-11 only).
If required, additional restrictions can be applied via the WPA supplicant. For instance, indooronly channels can be disabled, if the end-product shall be operated outdoor.

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8 Software Integration

8.1.2 File Overview

The file structure on the linux host system is illustrated below. Following parts are present inside the lib/firmware/nxp folder:

/

 lib

 firmware

  nxp



 sduart_nw61x_v1.bin.se



 sd_w61x_v1.bin.se



 uartspi_n61x_v1.bin.se



 rgpower_WW.bin



 rgpower_US.bin



 wifi_mod_para.conf

 modules

 <kernel_version>

 extra

 mlan.ko

 moal.ko

· The firmware files
­ sduart_nw61x_v1.bin.se: Wi-Fi, Bluetooth + 802.15.4 combo firmware
­ sd_w61x_v1.bin.se: Wi-Fi only firmware
­ uartspi_n61x_v1.bin.se: Bluetooth + 802.15.4 only firmware
· The rgpower files
­ rgpower_WW.bin: World-wide file
­ rgpower_US.bin: File for the country of operation (US in this case)
· The driver parameter configuration file
­ wifi_mod_para.conf: Configuration file that contains parameters for the driver installation (see  8.1.3 Driver Parameters and  8.1.4 Installing Drivers)
· The drivers are located in the folder extra.

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8 Software Integration

8.1.3 Driver Parameters
Three important parameters must be handed over during the installation of the driver. They are specified in the SDIW612 section of the wifi_mod_para.conf configuration file: ... SDIW612 = {
cal_data_cfg=none cntry_txpwr=2 fw_name=nxp/sduart_nw61x_v1.bin.se } ...

Further parameters can be added, if required.
Important parameters:
· cal_data_cfg must be always none to use the calibration data from the module's
OTP memory
· cntry_txpwr must be always set to 2 to use the self-managed interface · fw_name contains the firmware file name that shall be downloaded onto the module

8.1.4 Installing Drivers
Two driver parts need to be installed: mlan.ko and moal.ko.
If the drivers are installed manually, mlan.ko must be installed first. Use modprobe for installation to check the file location and dependencies automatically, which simplifies the installation process. The example below uses modprobe to install moal with a parameter configuration file as introduced in  8.1.3 Driver Parameters. All contained parameters are applied, when loading the drivers.

$ modprobe moal mod_para=nxp/wifi_mod_para.conf mlan: loading out-of-tree module taints kernel. wlan: Loading MWLAN driver wlan: Register to Bus Driver... wlan: Register to Bus Driver Done wlan: Driver loaded successfully

After the installation, the driver modules can be listed with the command lsmod. Moreover, the size and dependency of the modules is displayed.

$ lsmod module moal mlan

Size 831488 577536

Used by 0 1 moal

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8 Software Integration

 If the PAN9019 / PAN9019A was detected, the driver modules are loaded with the defined parameters, the firmware is loaded into the module, and the system is set up for world-wide operation (rgpower_WW.bin is loaded).

A log file of these steps:
wlan: Loading MWLAN driver wlan: Register to Bus Driver... wlan: Register to Bus Driver Done wlan: Driver loaded successfully mmc0: new ultra high speed SDR104 SDIO card at address 0001 vendor=0x0471 device=0x0205 class=0 function=1 Attach moal handle ops, card interface type: 0x109 rps set to 0 from module param SDIW612: init module param from usr cfg card_type: SDIW612, config block: 0 cal_data_cfg=none cntry_txpwr = 2 fw_name=nxp/sduart_nw61x_v1.bin.se SDIO: max_segs=128 max_seg_size=65535 rx_work=1 cpu_num=4 Attach mlan adapter operations.card_type is 0x109. wlan: Enable TX SG mode wlan: Enable RX SG mode Request firmware: nxp/sduart_nw61x_v1.bin.se Wlan: FW download over, firmwarelen=918016 downloaded 841816 WLAN FW is active on_time is 1653984027625 VDLL image: len=76200 fw_cap_info=0x487cff03, dev_cap_mask=0xffffffff uuid: 707e337f287b5c19ac00ddf0c9b83a9f max_p2p_conn = 8, max_sta_conn = 16 Trying download country_power_tble: nxp/rgpower_WW.bin Request firmware: nxp/rgpower_WW.bin call regulatory_set_wiphy_regd WW call regulatory_set_wiphy_regd WW Register NXP 802.11 Adapter mlan0 wlan: uap%d set max_mtu 2000 Register NXP 802.11 Adapter uap0 call regulatory_set_wiphy_regd WW

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8 Software Integration

Register NXP 802.11 Adapter wfd0 wlan: version = SDIW612---18.99.2.p19.17-MM6X18408.p2-GPL-(FP92)

The detection and identification of the module is handled by the MMC-controller. Related detection modes are configured by the following properties in the device tree.

CD Property Items

Description

non-removable None (recommended)

broken-cd

None

cd-gpio

CD GPIO

The MMC-controller looks for a connected device at the start-up of the system. If detected, the device is identified. This mode is intended for statically fixed devices as the PAN9019 / PAN9019A. Please note that the module cannot be found if it is not present at start-up, or if it is restarted (e.g. by power cycling or asserting the PDn line) without rebooting the host system.
The MMC-controller regularly polls for a device. If detected, the device is identified. Please note that timing or stability issues can occur if this mode is used.
The MMC-controller checks the interface for a device after the card detect signal was asserted. The card detect signal is conneted to the GPIO, which is defined as item of the property. The mode is usually used for removable SD cards and it is not recommended for non-removable devices as the PAN9019 / PAN9019A.

8.1.5 Loading rgpower Files
After a module was detected and the drivers were loaded, the system utilizes the world-wide settings.

1. Use the command iw reg get to read out the current configuration.  The settings of the global interface are displayed first and the more important configuration of the self-managed interface at the end.
$ iw reg get global country 00: DFS-UNSET
(755 - 928 @ 2), (N/A, 20), (N/A), PASSIVE-SCAN (2402 - 2472 @ 40), (N/A, 20), (N/A) (2457 - 2482 @ 20), (N/A, 20), (N/A), AUTO-BW, PASSIVE-SCAN (2474 - 2494 @ 20), (N/A, 20), (N/A), NO-OFDM, PASSIVE-SCAN (5170 - 5250 @ 80), (N/A, 20), (N/A), AUTO-BW, PASSIVE-SCAN (5250 - 5330 @ 80), (N/A, 20), (0 ms), DFS, AUTO-BW, PASSIVE-SCAN (5490 - 5730 @ 160), (N/A, 20), (0 ms), DFS, PASSIVE-SCAN (5735 - 5835 @ 80), (N/A, 20), (N/A), PASSIVE-SCAN (57240 - 63720 @ 2160), (N/A, 0), (N/A)

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phy#2 (self-managed) country 00: DFS-UNSET
(2402 - 2427 @ 20), (N/A, 19), (N/A) (2412 - 2462 @ 40), (N/A, 19), (N/A) (2447 - 2472 @ 20), (N/A, 19), (N/A)

8 Software Integration

2. Use the command iw reg set to change to the configuration of the country, in which the device is operated. The following example initiates a change to the US configuration:
$ iw reg set US
Trying download country_power_tble: nxp/rgpower_US.bin Request firmware: nxp/rgpower_US.bin
 Now the self-managed interface has changed by calling iw reg get. $ iw reg get global country US: DFS-FCC
(902 - 904 @ 2), (N/A, 30), (N/A) (904 - 920 @ 16), (N/A, 30), (N/A) (920 - 928 @ 8), (N/A, 30), (N/A) (2400 - 2472 @ 40), (N/A, 30), (N/A) (5150 - 5250 @ 80), (N/A, 23), (N/A), AUTO-BW (5250 - 5350 @ 80), (N/A, 24), (0 ms), DFS, AUTO-BW (5470 - 5730 @ 160), (N/A, 24), (0 ms), DFS (5730 - 5850 @ 80), (N/A, 30), (N/A), AUTO-BW (5850 - 5895 @ 40), (N/A, 27), (N/A), NO-OUTDOOR, AUTO-BW, PASSIVE-SCAN (5925 - 7125 @ 320), (N/A, 12), (N/A), NO-OUTDOOR, PASSIVE-SCAN (57240 - 71000 @ 2160), (N/A, 40), (N/A)

phy#2 (self-managed) country US: DFS-FCC
(2402 - 2427 @ 20), (N/A, 19), (N/A) (2412 - 2462 @ 40), (N/A, 19), (N/A) (2447 - 2472 @ 20), (N/A, 19), (N/A) (5170 - 5250 @ 80), (N/A, 19), (N/A) (5250 - 5330 @ 80), (N/A, 19), (0 ms), DFS, PASSIVE-SCAN (5490 - 5730 @ 80), (N/A, 19), (0 ms), DFS, PASSIVE-SCAN (5735 - 5815 @ 80), (N/A, 19), (N/A) (5815 - 5835 @ 20), (N/A, 19), (N/A)

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8 Software Integration

8.2 Bluetooth ­ Regulatory Compliant Bring Up
This chapter describes the Bluetooth bring up using the standard Linux Host Controller Interface (HCI) driver.

Please note that the NXP Bluetooth UART driver (btnxpuart) is not covered.

The following requirement must be met:
 The Wi-Fi/Bluetooth combo firmware is loaded successfully through the module driver ( 8.1 Wi-Fi ­ Regulatory Compliant Bring Up) or the Bluetooth (802.15.4) only firmware is loaded successfully with NXP's firmware loader (not covered in this document).

1. Attach the Host Controller Interface to the corresponding UART interface with the
following parameters for the HCI.
(The initial UART baud rate is 115200. For a description on how the baud rate can be changed afterwards please refer to  8.2.2 Changing the UART Baud Rate.)

No. Parameter 1 Serial Hardware Device 2 Type 3 Baudrate 4 Flow Control

Description Specifies the serial device that shall be attached (e.g. ttymxc0) Should be any for hardware independent attachment Select the baudrate of the module (initially 115 200) Use the keyword flow for hardware flow control (required)

# Example HCI attach $ hciattach /dev/ttymxc0 any 115200 flow Setting TTY to N_HCI line discipline Device setup complete

2. Use the command hciconfig to display the HCI configuration.  The following reply is received after successful hciattach but with the HCI still down.
$ hciconfig hci0: Type: Primary Bus: UART
BD Address: 34:32:E6:34:40:E7 ACL MTU: 1021:7 SCO MTU: 120:6 DOWN RX bytes: 740 acl:0 sco: 0 events:43 errors:0 TX bytes: 469 acl:0 sco: 0 commands:43 errors:0

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8 Software Integration

3. Use the following command to start-up the HCI: $ hciconfig hci0 up
 Reading out the HCI configuration shows the interface up and running.
$ hciconfig hci0: Type: Primary Bus: UART
BD Address: 34:32:E6:34:40:E7 ACL MTU: 1021:7 SCO MTU: 120:6 UP RUNNING RX bytes: 1544 acl:0 sco: 0 events:95 errors:0 TX bytes: 1285 acl:0 sco: 0 commands:95 errors:0

Now the module's Bluetooth system can be operated (e.g. via the hcitool or a Bluetooth stack like e.g. BlueZ).

8.2.1 Setting the Bluetooth Power Limit
The configurations described in this chapter are volatile and need to be applied after each boot-up.

The PAN9019 / PAN9019A is prequalified and listed at the Bluetooth Special Interest Group (SIG). The output power must be limited to meet the listed power class and the regulatory requirements of the respective country/region. The following configuration are mandatory for compliance:

Country/Region Bluetooth mode

Power Class Configured Maximum Power (dBm)

US

Basic Rate / Enhanced Data Rate 1

8

Low Energy

1

8

Low Energy

1.5

4

CA

Basic Rate / Enhanced Data Rate 1

8

Low Energy

1

8

Low Energy

1.5

4

EU

Basic Rate / Enhanced Data Rate 1

3

Low Energy

1.5

3

UK

Basic Rate / Enhanced Data Rate 1

3

Low Energy

1.5

3

NZ

Basic Rate / Enhanced Data Rate 1

3

Low Energy

1.5

3

AU

Basic Rate / Enhanced Data Rate 1

3

Low Energy

1.5

3

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8 Software Integration

Country/Region Bluetooth mode

Power Class Configured Maximum Power (dBm)

JP

Basic Rate / Enhanced Data Rate 1

3

Low Energy

1.5

3

If the product shall be operated in the range of Bluetooth power classes 2 or 3: the regulatory requirements are met, if the power is set according to the Bluetooth Core Specification's requirements.
There are already Bluetooth settings that are stored in the one-time-programable (OTP) memory of the module at delivery. This includes the initial power, which is set to 3dBm, and the NXP power class, which is set to class 1.5.
To check, if the configurations are correct, they can be read out by the custom host controller interface (HCI) command 3F 62 37 as shown below.
The initial power is the green marked byte; the power class is encoded in the red byte.

$ hcitool -i hci0 cmd 3f 62 37

HCI Event: 0x0e plen 33 01 62 FC 00 01 37 [CRC] 1C 00 00 00 00 00 01 [crystal] 03 03 08 00 00 00 00 C2 01 00 [BD0] [BD1] [BD2] [BD3] [BD4] [BD5] F0 00

Two bits of the red byte determine the NXP power class:

Bit Name

Description

0 Force Class 2 Operation

If enabled, NXP class 2 is used.

If disabled, NXP class 1.5 or 1 is used depending on bit 9.

9 Class 1 Operation Support If bit 0 is zero: · Disabled: NXP class 1.5 is used · Enabled: NXP class 1 is used

NXP Power Classes
(Not identical to the Bluetooth power classes.)

NXP Power Class Minimum Configurable Maximum Configurable Notes

Power (dBm)

Power (dBm)

1

-13

1.5

-20

2

-20

+19

Bluetooth Enhanced Data

Rate Power is reduced by

appr. 9dB

+13

Bluetooth Enhanced Data

Rate Power is reduced by

appr. 3dB

+3

Bluetooth Enhanced Data

Rate Power is equal to the

Basic Rate Power

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8 Software Integration

Bluetooth Power Classes
The given maximum equivalent isotropically radiated power (E.I.R.P.) is not a measurement limit, but the theoretical value resulting from the configured maximum power and the antenna gain.

Technology

Bluetooth Power Class

Basic Rate &

1

Enhanced Data Rate 2

Maximum E.I.R.P. (dBm) (shall be greater than) 4
0

Maximum E.I.R.P. (dBm) (shall be smaller than) 20
4

3

-

0

Low Energy

1

10

20

1.5

4

10

2

0

4

3

-

0

From the tables above and an antenna gain range of 2.0dBi to 5.2dBi, it can be derived that the NXP power class 1.5 covers all Bluetooth power classes. Therefore, it is recommended to use NXP power class 1.5. It is not recommended to use the NXP power class 1, because this shows a higher power difference between the Enhanced Data Rate and Basic Rate PHYs.
The preconfigured settings of the NXP class 1.5 and an initial power of 3dBm can be kept to meet the regulatory requirements after startup and being still able to adjust the power limit depending on the country. In case that the Bluetooth settings shall be changed anyway, this can be done by using the HCI command 3F 61. Please note that the settings do also include device related settings like e.g. the BD (Bluetooth device) address and XTAL calibration value. Therefore, the OTP data shall be read out and the device related settings shall be adopted when writing the new data. It is not required to calculate the CRC as this field is ignored when writing new data.

##### Optional Change of the Bluetooth Configuration Data ##### # Read out the OTP data $ hcitool -i hci0 cmd 3f 62 37 < HCI Command: ogf 0x3f, ocf 0x0062, plen 1
37 > HCI Event: 0x0e plen 33
01 62 FC 00 01 37 [CRC] 1C 00 00 00 00 00 01 [crystal] 03 03 08 00 00 00 00 C2 01 00 [BD0] [BD1] [BD2] [BD3] [BD4] [BD5] F0 00

# Write the new Bluetooth data $ hcitool -i hci0 cmd 3F 61 00 00 01 1C 37 [CRC] 1C 00 00 00 00 00
01 [crystal] [Init. Power in dB] 03 [Configuration Byte] 00 00 00

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8 Software Integration

00 C2 01 00 [BD0] [BD1] [BD2] [BD3] [BD4] [BD5] F0 00 < HCI Command: ogf 0x3f, ocf 0x0061, plen 32
00 00 01 1C 37 00 1C 00 00 00 00 00 01 [crystal] [Init. Power in dB] 03 [Configuration Byte]00 00 00 00 C2 01 00 [BD0] [BD1] [BD2] [BD3] [BD4] [BD5] F0 00 > HCI Event: 0x0e plen 4 01 61 FC 00

# Reset the HCI Inteface $ hcitool -i hci0 cmd 03 03 < HCI Command: ogf 0x03, ocf 0x0003, plen 0 > HCI Event: 0x0e plen 4
01 03 0C 00

8.2.1.1 Configuring the Bluetooth Basic Rate and Enhanced Data Rate Power Limit
The power limit can be changed by the HCI command 3F EE. If not applied, the initial power is used as limit. Please note that the power for Bluetooth Enhanced Data Rate is reduced depending on the NXP power class (about 3dBm with class 1.5).

The command has following parameters:

Parameter Name

1

Maximum Power

Selction

Description
· 0x00: Default behavior. Maximum power is set to physical maximum power level
· 0x01: Updates Maximum power based on parameter 2 · Other values: Invalid. HCI_ERR_INVALID_PARAMETERS
error is returned

2

User-defined Maximum The parameter is ignored when the first parameter (maximum

Power Value

power selection) is 0.

· 127: Maximum power is updated by the power value calculated from the Initial power and FE loss parameters stored in Cal-
data.

· Signed value of TX power (dBm) in the range -20 to 19

· Other values: Error is returned

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The following example shows the configuration of a 3dB power limit: # Configure 3 dBm as power limit $ hcitool -i hci0 cmd 3f ee 01 03 < HCI Command: ogf 0x3f, ocf 0x00ee, plen 2
01 03 > HCI Event: 0x0e plen 4
01 EE FC 00

8 Software Integration

# Reset the HCI Inteface $ hcitool -i hci0 cmd 03 03 < HCI Command: ogf 0x03, ocf 0x0003, plen 0 > HCI Event: 0x0e plen 4
01 03 0C 00

For regions like the US, the power limit can be enlarged to 8 dBm: # Configure 8 dBm as power limit $ hcitool -i hci0 cmd 3f ee 01 08 < HCI Command: ogf 0x3f, ocf 0x00ee, plen 2
01 08 > HCI Event: 0x0e plen 4
01 EE FC 00

# Reset the HCI Inteface $ hcitool -i hci0 cmd 03 03 < HCI Command: ogf 0x03, ocf 0x0003, plen 0 > HCI Event: 0x0e plen 4
01 03 0C 00

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8 Software Integration

8.2.1.2 Configuring the Bluetooth Low Energy Power Limit
The power limit for Bluetooth low energy can be changed by the HCI command 3F 87. If not applied, the initial power setting is used as limit. There is only one parameter, which is the power limit in dBm.

Following this, the power can be limited to 3dBm by using following command sequence: # Configure 3 dBm as power limit $ hcitool -i hci0 cmd 3f 87 03 < HCI Command: ogf 0x3f, ocf 0x0087, plen 1
03 > HCI Event: 0x0e plen 4
01 87 FC 00

# Reset the HCI Inteface $ hcitool -i hci0 cmd 03 03 < HCI Command: ogf 0x03, ocf 0x0003, plen 0 > HCI Event: 0x0e plen 4
01 03 0C 00

For regions like the US, the power limit can be enlarged to 8dBm: # Configure 8 dBm as power limit $ hcitool -i hci0 cmd 3f 87 08 < HCI Command: ogf 0x3f, ocf 0x0087, plen 1
08 > HCI Event: 0x0e plen 4
01 87 FC 00

# Reset the HCI Inteface $ hcitool -i hci0 cmd 03 03 < HCI Command: ogf 0x03, ocf 0x0003, plen 0 > HCI Event: 0x0e plen 4
01 03 0C 00

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8.2.2 Changing the UART Baud Rate

8 Software Integration

This section describes the baud rate change on the HCI layer to provide an example procedure. Please note that there are also other ways like a raw UART communication or using the NXP Bluetooth UART driver (btnxpuart).

At delivery, the device operates the UART interface with the baud rate 115200. This ensures that host devices with limited UART interface capabilities can operate the PAN9019 / PAN9019A. While granting a wide compatibility, the low baud rate limits the data throughput and thus excludes some features like audio profiles. Therefore, the baud rate must be enlarged if a high data throughput is required. To enlarge the baud rate use the HCI command 3F 09. The command expects the baud rate in hexadecimal format with the least significant byte at the first position. A command complete event is returned at the old baud rate before the module is operable at the new baud rate after 5ms. After the change took place, the HCI must be detached from the UART interface and attached again with the new baud rate.
Please note that the command killall must be used with option -9 to force the process to end.

An example that changes the baud rate to 3M: # The HCI was attached with the initial baud rate of 115200. # => Change the baud rate to 3M # hcitool -i hci0 cmd 3f 09 [Baud0] [Baud1] [Baud2] [Baud3] $ hcitool -i hci0 cmd 3f 09 C0 C6 2D 00 < HCI Command: ogf 0x3f, ocf 0x0009, plen 4
C0 C6 2D 00 # The command returns an Command Complete Event with the old # baud rate > HCI Event: 0x0e plen 4
01 09 FC 00
# It takes up to 5 ms until the module operates at the new baud rate
# Shut down the HCI attachment immediately (option -9) # Please note that HCI frame errors can be reported due to the # kill process

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PAN9019 / PAN9019A Wi-Fi and Bluetooth Module killall -9 hciattach

8 Software Integration

# Attach the HCI to the UART interface with the new baud rate (3M) hciattach /dev/ttymxc0 any 3000000 flow Setting TTY to N_HCI line discipline Device setup complete

# Start the HCI interface hciconfig hci0 up

For further information please refer to the Panasonic Wireless Connectivity Development Hub: https://pideu.panasonic.de/development-hub/.

8.3 802.15.4 ­ Regulatory Compliant Bring Up

When using 802.15.4, the maximum output power must be configured to meet the regulatory requirements of the respective country/region.
The following configuration are mandatory for compliance:

Country / Region Configured Maximum Power (dBm)

US

8

CA

8

EU

4

UK

4

NZ

4

AU

4

JP

4

Setting the 802.15.4 Power
This section describes how the maximum power levels can be configured. At delivery of the module, the power is not limited by software. OEMs must limit the power in there software according to the limits stated in this document and depending on the country/region of operation. A configuration using the open thread stack is documented in the following. The open thread command txpwrlimit expects the power limit in steps of 0.5dB.
Use the following command to limit the power to 8dBm: $ ot-ctl txpwrlimit 16

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Use the following command to limit the power to 4dBm: $ ot-ctl txpwrlimit 8

8 Software Integration

The power limit must be configured directly after start-up and before performing any 802.15.4 operation. Moreover, the limit must be kept through the entire operation. To configure and vary the Tx power during operation, the command txpower can be used. This expects a power value in dB. It is not possible to configure a Tx power that is higher than the power limit.
As an example, the configuration of a Tx power of 6dBm is shown: $ ot-ctl txpower 6

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9 Contact Details
9.1 Contact Us

9 Contact Details

Please contact your local Panasonic Sales office for details on additional product options and services:
For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: [email protected]
For Panasonic Sales assistance in North America, visit the Panasonic website "Sales & Support" to find assistance near you at https://na.industrial.panasonic.com/distributors

For information about evaluation tools, schematics, software development, and more, please visit the "Panasonic Wireless Connectivity Development Hub" https://pideu.panasonic.de/development-hub/.
9.2 Product Information
For further information on our products and related documents please refer to the Panasonic Wireless Connectivity website:
For complete Panasonic product details in the EU, visit https://industry.panasonic.eu/
For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules

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References

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