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Document DEVICE REPORTsx-sdmax 230224 englishDual-band Wi-Fi 6 plus Bluetooth® Combo SDIO Module
SX-SDMAX-2530S
Low Power Wireless LAN Module Powered by NXP's IW611
Overview
The SX-SDMAX is a Wi-Fi 6 (IEEE 802.11a/b/g/n/ac/ax) plus Bluetooth® v5.3 that supports SDIO as its host interface. Powered by NXP's highly integrated IW611 chipset, the Wi-Fi 6 module delivers higher throughput, better network efficiency, lower latency, and improved range over previous-generation Wi-Fi standards. The module supports SDIO as its host interface, which is a popular choice for many battery-operated device applications, as it provides the perfect balance between performance and power consumption. In addition, by supporting a wide temperature range, it is a wireless LAN module that is ideal for wireless compatibility with a wide range of products, from industrial equipment to small devices.
Efficient, Faster, & Lower Latency with Wi-Fi 6
The latest Wi-Fi 6 technology introduces features such as OFDMA, 1024QAM, and Target Wake Time (TWT) bringing higher throughput, better network efficiency, lower latency, and improved range over previous-generation Wi-Fi standards. The SX-SDMAX with its SDIO host interface combines all the benefits of Wi-Fi 6 while optimizing power consumption to deliver unmatched WiFi performance with improved battery life, making it an ideal solution for many battery-operated embedded devices.
Wi-Fi 6 Features
Frequency
Channel width
Subcarriers
{ Efficiency
MU-MIMO OFDMA
(f )
Improved
efficiency
and
stability
in
dense
Resource {
Unit
networks. Wi-Fi 6 delivers data reliably with
low latency even in congested radio wave
environments.
Power Saving TWT
Multiple BSS
Wi-Fi 6 has introduced new features like
Target Wake Time which allows devices to
negotiate when and how frequently they will
wake up to send or receive data. This Wi-Fi
6/6E feature increases device sleep time and
greatly improves battery life. It also
incorporates a mechanism for avoiding
collisions between packets and for efficiently
avoiding radio wave interference for efficient
communication.
Time(t)
SX-SDMAX Features
PHY data rate up to 600Mbps (at 5GHz/80MHz/MSC11) Single stream, 1x1 Powered by NXP's IW611 chipset Host interface: Wireless LAN SDIO3.0 compatible, Bluetooth® UART 80MHz band mode (5GHz) High density modulation mode (1024 QAM) Bluetooth® v5.3 Class1 compatible RoHS compliant Modular certifications(Planned) Japan, USA, Canada, Europe, UK
Applications
Ideal for many battery operated medical devices, mobile printers, Hand held POS and terminals, barcode scanners, IoT Applications etc.
Specifications
Product Name Chipset Host Interface Wi-Fi Standard Bluetooth® Antenna Connector Operating Voltage
Current Consumption (Peak Value)
Operating Environment Storage Environment Size Weight Package Type
SX-SDMAX-2530S
NXP IW611
WLAN SDIO3.0 Bluetooth®UART
IEEE 802.11a/b/g/n/ac/ax (1x1)
Bluetooth® v5.3BR/EDR/LE Compliant)
MHF Connector1
Main Power Supply 3.3V + 1.8V IO Power Supply1.8V or 3.3V
Voltage
VDD18
VDD33
Tx
Rx
Tx
Rx
Wi-Fi:2.4GHz 190mA 130mA 200mA 10mA
Wi-Fi:5GHz 260mA 150mA 240mA 10mA
Bluetooth® 150mA 80mA 20mA 10mA
Temperature -40 85 Humidity 95% RH or less (Without Condensation) Temperature-40 85 Humidity : 95% RH or less (Without Condensation)
17.0 18.0 2.65mm
1.7g
44-pins Land Grid Array (Direct Solder
Block Diagram
VDD33 VDD18
VIO VIO_SD
SDIO UART
I2S PDn
SX-SDMAX-2530S SYSTEM BLOCK DIAGRAM
NXP IW611
WLAN 5G Tx/Rx
WLAN 2.4G Tx/Rx Bluetooth Tx/Rx
LC Network
Diplexer
LC Network
SPDT Swotch LC Network
MHF-1 Connector
40MHz
Dual-band Wi-Fi 6 plus Bluetooth® Combo SDIO Module
SX-SDMAX-2530S
Product Lineup
SX-SDMAX-2530S (44pins Direct Solder Pads)
SX-SDCAX-2530 (Micro SD Card Type)
Model SX-SDMAX-2530S SX-SDMAX-2530S-SP SX-SDCAX-2530
Form Factor Surface Mount Surface Mount Micro SD Card
MoQ 500
1 1
Packaging Reel
Reel Individual Box
Antenna Included
Mechanical Drawing SX-SDMAX-2530S
17.0
18.0
SX-SDCAX-2530
7.5
9.7
26.0
7.5
18.0 60.0
Wireless Driver 1
WLAN Linux
- Station, Access Point Mode - WPATM/WPA2TM/WPA3TM Authentication - IEEE 802.1XTLS, TTLS, PEAP, LEAP, FAST - WPS2.0 Support2 - Wi-Fi Direct® Support2
Bluetooth® In order to support the Bluetooth® v5.3 standard, it is necessary
to combine a stack and profile that support the Bluetooth® v5.3 standard. Please contact our sales representative for compatible Bluetooth® stacks and profiles.
1 : Please contact our sales representative for details of compatible drivers. 2When using, it is necessary to obtain Wi-Fi Alliance certification separately.
Evaluation
Although the NXP i.MX BSP will already include Wi-Fi drivers for SX-SDMAX to enable plug-n-play evaluation, Silex also provides a separate evaluation Linux OS image which not only includes Silex's optimized driver but also board data files, and other Linux test tools ideal for evaluation.
What you will need? SX-SDCAX-2530 NXP i.MX8M Evaluation Kit
(MCIMX8M-EVKB)
Other useful tools inluded in Silex image Wireless LAN management command - iw Throughput test - iperf Station/AP function - hostapd, wpa_supplicant DHCP - udhcpdudhcpc
To get started:
Purchase SX-SDCAX-2530-SP
Includes antenna
ExecuteEvaluationLicenseAgreementonwebsite.
Download evaluation image via link provided in an email.
Procure other equipment necessary for evaluation. It includes
NXPi.MX8MEvaluationKit
Begin evaluation.
Steps included in Startup Guide.
SX-SDMAX Product Page
https://www.silextechnology.com/connectivity-solutions/embedded-wireless/sx-sdmax
NXP is a registered trademark or trademark of NXP Semiconductors. Other company names and product names are registered trademarks or trademarks of their respective companies.
Bluetooth is a trademark or registered trademark of Bluetooth SIG, Inc., USA. Specifications are subject to change without notice for improvement. The listed specifications are as of March 2023.
silex global sales & support locations
US O ce silex technology america, Inc. +1-657-218-5199 www.silextechnology.com [email protected]
Europe O ce silex technology europe, GmbH +49-2154-88967-0 Germany toll free 0800-7453938 www.silextechnology.com [email protected]
China silex technology beijing, Inc. +86-10-8497-1430 www.silex.com.cn [email protected]
Corporate Headquarters silex technology, Inc. +81-774-98-3781 www.silex.jp [email protected]
03.01.2023
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