user
Antenna Report
Shenzhen XinNengDa Technology Co.,Ltd BL014 Anti-Lost Mini Flashlight 2A6W7-BL014 2A6W7BL014 bl014
Not Your Device? Search For Manuals or Datasheets below:
File Info : application/pdf, 5 Pages, 808.37KB
Document DEVICE REPORTGetApplicationAttachment.html?id=7314721Application: WLAN, 802.11b/g, Bluetooth, WLAN, etc... Features SMD, high reliability, ultra Impact, Omni-directional... Part number Information RANT 2012 F 245 C 07 (A) (B) (C) (D) (E) (F) (A)Product Type Chip Antenna (B) Size Code 2.0x1.2mm(+-0.2mm) (C) Material High K material (D) Frequency 2.4 ~ 2.5GHz (E) Feeding mode PIFA & Single Feeding (F) Antenna type Type=07 Electrical Specification Working Frequency Range 2400 ~2484 MHz Bandwidth 84 (Min.) Peak Gain 1.7 dBi (Typ.) Impedance 50 Ohm Return loss 10 dB ( Min) Polarization Linear Azimuth Beamwidth Omni-directional Operation Temperature() -40 ~85 Resistance to Soldering Heats 10sec. ( @ 280) Termination Ni / Au (Leadless) The specification is defined on EVB. Dimension and Terminal Configuration Dimension (mm) L 2.05+-0.10 W 1.20+-0.10 T 0.65+-0.10 No. Terminal Name 1 Feeding/GNG 2 GND TEL: 13530576606 Manufacturer: RAIN International Technology Co., Ltd. Address: 709, Building F, Yuxing Science and Technology Industrial Park, Nanchang Third Industrial Zone, Nanchang Community, Xixiang Street, Bao'an District, Shenzhen 2.4GHz 2012 Chip Antenna: RANT2012F245C07 Evaluation Board Reference PCB Dimension Antenna Layout Reference Unit :mm Electrical Characteristics Return Loss Return Loss & Radiation 1 Radiation Frequency(MHz) 2400 2450 2484 S11 (dB) -10.77 -24.81 -10.243 Z Y X Efficiency Efficiency 2400MHz 70.56% 2400MHz 0.67dBi 2450MHz 75.25% 2450MHz 1.7dBi 2500MHz 71.01% 2500MHz 0.87dBi 2.4GHz 2012 Chip Antenna: RANT2012F245C07 Taping Specifications Reel Specification Reel and Taping Specification TYPE 2012 SIZE 7" 5K/Reel A 9.0±0.5 B 60±2 C 13.5±0.5 D 178±2 Tapping Specification Packaging Type Paper Type 2012 A B W E F G H T D P 1.50±0.20 2.30±0.20 8.0±0.20 1.75±0.10 3.5±0.05 4.0±0.10 2.0±0.05 0.75±0.10 1.57±0.10 4.0±0.1 2.4GHz 2012 Chip Antenna: RANT2012F245C07 Reliability Table Test Item Electrical Characterization Thermal Shock Temperature Cycling High Temperature Exposure Low Temperature Storage Solderability (SMD Bottom Side) Soldering Heat Resistance (RSH) Vibration Mechanical Shock Procedure 1. Preconditioning: 50 ± 10 / 1 hr , then keep for 24 ± 1 hrs at room temp. 2. Initial measure: Spec: refer Initial spec. 3. Rapid change of temperature test: -30 to +85; 100 cycles; 15 minutes at Lower category temperature; 15 minutes at Upper category temperature. 1. Initial measure: Spec: refer Initial spec. 2. 100 Cycles (-30 to +85), Soak Mode=1(2 Cycle/hours). 3. Measurement at 24 ± 2Hours after test condition. 1. Initial measure: Spec: refer Initial spec. 2. Unpowered; 500hours @ T=+85. 3. Measurement at 24 ± 2 hours after test. 1. Initial measure: Spec: refer Initial spec. 2. Unpowered: 500hours @ T= -30. 3. Measurement at 24 ± 2 hours after test. Dipping method: a. Temperature: 235 ± 5°C b. Dipping time: 3 ± 0.5s Preheating temperature: 150 ± 10°C. Preheating time: 1~2 min. Solder temperature: 260 ± 5°C. Dipping time: 5 ± 0.5s 5g's for 20 min., 12 cycles each of 3 orientations Note: Use 8"X5" PCB .031" thick 7 secure points on, one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz. Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks) Peak value: 1,500g's Duration: 0.5ms Velocity change: 15.4 ft/s Waveform: Half-sine Requirements Ceramic Type Fulfill the electrical specification No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. The solder should cover over 95% of the critical area of bottom side. No Visible Damage. No Visible Damage. No Visible Damage. Remark (Reference) User Spec. MIL-STD-202 107 JESD22 JA104 MIL-STD-202 108 MIL-STD-202 108 IEC 60384-21/22 4.10 IEC 60384-21/22 4.10 MIL-STD-202 Method 204 MIL-STD-202 Method 213 Humidity Bias 1. Humidity: 85% R.H., Temperature: 85 ± 2°C. 2. Time: 500 ± 24 hours. 3. Measurement at 24 ± 2hrs after testcondition. No Visible Damage. Fulfill the electrical specification. MIL-STD-202 Method 106 2.4GHz 2012 Chip Antenna: RANT2012F245C07 2.4GHz 2012 Chip Antenna: RANT2012F245C07 Board Flex (SMD) 1. Mounting method: IR-Reflow. PCB Size (L:100 × W:40 × T:1.6mm) 2. Apply the load in direction of the arrow until bending reaches 2 mm. No Visible Damage. _ AEC-Q200 005 Adhesion Force of 1.8Kg for 60 seconds. No Visible Damage Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body terminals and body/terminal junction. AEC-Q200 006 Physical Dimension Any applicable method using x10 magnification, micrometers, calipers, gauges, contour projectors, or other measuring equipment, capable of determining the actual specimen dimensions. In accordance with specification. JESD22 JB100 Revision History Revision 1 Date 2020/10/15 Content New Datasheet 2.4GHz 2012 Chip Antenna: RANT2012F245C07
Related FCC IDs:
- 2A6W7-BL014 - Shenzhen XinNengDa Technology Co.,Ltd Anti-Lost Mini Flashlight [-BL014]