1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

IW612 PB

NXP B.V.

IW612 - 1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution - Product brief (public)

IW612: 2.4/5 GHz Dual-Band 1x1 Wi-Fi 6 (802.11ax) Bluetooth 5.2 802.15.4 Tri-Radio Solution | NXP Semiconductors

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Document DEVICE REPORTIW612 PB

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

Rev. 1 -- 16 May 2023

Product brief

1 Product overview
The IW612 is a highly integrated 2.4/5 GHz dual-band 1x1 Wi-Fi 6, Bluetooth/Bluetooth Low Energy 5.2 and 802.15.4 tri-radio single-chip solution optimized for a broad array of IoT and industrial applications in smart home, smart devices and accessories, smart appliances, smart energy, industrial automation, gateways and many more. This high degree of integration contributes to very low system costs and a minimum external BOM while achieving efficient co-existence between all internal radios as well as external radios.
IW612 includes a full-feature Wi-Fi subsystem powered by NXP's 802.11ax (Wi-Fi 6) technology bringing higher throughput, better network efficiency, lower latency and improved range over previous generation Wi-Fi standards. The Wi-Fi subsystem integrates a Wi-Fi MAC, baseband, and direct-conversion radio with integrated PA, LNA, and transmit/receive switch removing the need for an RF front end module (FEMs), saving cost, and reducing system complexity.
In addition to a Wi-Fi 6 radio, the IW612 integrates an independent Bluetooth 5.2 and 802.15.4 subsystem that supports Thread mesh network. The device features Bluetooth Profiles such as hands free (HFP), advanced audio distribution profile (A2DP) for audio streaming as well as additional profiles like dual wide band speech (WBS). For Bluetooth Low Energy, the IW612 enables 2 Mbit/s high speed data rate, long range, and extended advertising. Finally, LE Audio feature is supported utilizing isochronous channels for a better overall audio experience.
The Tri-radio capability of the IW612 makes it an ideal device for Matter applications running over Wi-Fi and/or Thread. The IW612 can operate as a Matter Controller as well as Thread Border Router. This capability enables full Matter functionality for both local and cloud-based control, and monitoring of IoT products seamlessly across major ecosystems.
The IW612 supports two front-end antenna configurations: single-antenna (Figure 1) and dual-antenna (Figure 2).
The IW612 integrates dedicated CPUs and memories for both the Wi-Fi and Bluetooth/802.15.4 subsystems which enable real time, independent protocol processing. Interfaces for connecting the IW612 to external host processors include SDIO 3.0 for Wi-Fi, UART for Bluetooth and SPI for 802.15.4.

NXP Semiconductors

IW612_PB
1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

Figure 1 shows the application diagram for the single-antenna configuration.

SDIO interface SPI interface
UART interface
Audio interface (I2S/PCM)

IW612

Wi-Fi 5 GHz Tx/Rx

Antenna

Wi-Fi 2.4 GHz Tx/Rx, Bluetooth/802.15.4 Rx
Bluetooth/ 802.15.4 Tx

SPDT

Diplexer

GPIO/LED interface

3.3V and 1.8V Power-down XTAL_IN

Coexistence

XTAL_OUT

Figure 1.Application diagram - Single antenna configuration Figure 2 shows the application diagram for the dual-antenna configuration.

SDIO interface SPI interface
UART interface
Audio interface (I2S/PCM)

IW612

Wi-Fi 5GHz Tx/Rx Wi-Fi 2.4GHz Tx/Rx

Antenna
Diplexer

GPIO/LED interface

3.3V and 1.8V Power-down XTAL_IN XTAL_OUT
Figure 2.Application diagram - Dual-antenna configuration

Bluetooth/802.15.4 Tx/Rx Coexistence

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

1.1 Applications
· Smart entertainment -- Smart speaker, smart display, streaming/OTT device, smart television · Gateways/hubs/bridges -- Voice assistant front-end, Matter controller and Thread border router, and other
radios to Wi-Fi/IP network · Smart home -- Control panel, security system, thermostat, sprinkler controller, security camera, garage door
controller, smart outlet, light switch, smart doorbell, smoke alarm/CO detector · Industrial -- Building automation, smart lighting, Wi-Fi to other radio bridge, point of sale (POS) terminal · Smart appliances -- Refrigerator, washer, dryer, oven range, microwave, dishwasher, water heater, air
conditioner, coffee pot, rice cooker, vacuum cleaner, air purifier
1.2 Product family devices
· AW611: Automotive AECQ-100 grade 2 and grade 3, Wi-Fi 6 and Bluetooth/Bluetooth Low Energy (LE) · IW611: Wi-Fi 6 and Bluetooth/Bluetooth Low Energy (LE) · IW612: Wi-Fi 6, Bluetooth/Bluetooth Low Energy (LE), and 802.15.4 Tri-radio

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NXP Semiconductors

IW612_PB
1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

2 Wi-Fi subsystem
2.1 IEEE 802.11 standards
· 802.11ax 1x1 SU and MU-MIMO/OFDMA · 802.11ac Wave 1/2 backward compatible · 802.11n/a/g/b backward compatible · 802.11d operation in additional regulatory domains · 802.11az accurate ranging · 802.11e quality of service · 802.11h transmit power control · 802.11h DFS radar pulse detection · 802.11k radio resource measurement · 802.11mc precise indoor location positioning · 802.11r fast hand-off for AP roaming · 802.11v BTM frame transmission/reception · 802.11w protected management frames · 802.11y ECSA · 802.11z tunneled direct link setup · Fully supports clients (stations) implementing IEEE Power Save mode

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

2.2 Wi-Fi MAC
· 802.11ax 1x1 MU-MIMO MAC · Trigger Frame Formats
Basic trigger frame MU-BAR, MU-RTS, Beamforming Report Poll (BFRP), BSR Poll (BSRP) trigger variant Trigger frame MAC padding · HE Variants of HT Control Basic format UL Power Headroom Receive Operation Mode control subfield · HE MU Frame Exchange Sequences · MU Acknowledgment (ACK) · M-BA and C-BA Variants in BA Frames · MU-RTS/CTS Procedures · Target Wait Time Scheduling · HE Dual-NAV · UL Carrier Sensing · Buffer Status Reports in response to BSRP trigger frames · Operating Mode Indication (OMI) · A-MPDU Rx (de-aggregation) and Tx (aggregation) (supports single-MPDU A-MPDU)
· Reduced Inter-Frame Spacing (RIFS) receive · Management information base counters · Radio resource measurement counters · Quality of service queues · Block acknowledgment extension · Dynamic frequency selection · Multiple-BSS/Station · Long and short preamble generation on a frame-by-frame basis for 802.11b frames · Transmit rate adaptation · Transmit power control · Mobile hotspot

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

2.3 Wi-Fi baseband
· 802.11ax 1x1 MU-MIMO baseband, backward compatible with 802.11ac/n/a/g/b technology · Bandwidth support
20 MHz 40 MHz 80 MHz · Modulation and Coding Schemes (MCS) 802.11ax--MCS0~11 802.11ac--MCS0~9 802.11n--MCS0~7 Dual Sub-Carrier Modulation (DCM)
MCS0 BCC and LDPC coding · Frame Formats 802.11ax HE_SU (Tx/Rx) 802.11ax HE_MU (Rx) 802.11ax HE_ER_SU (Tx/Rx) 802.11ax HE_TB (Tx) 802.11ac VHT 802.11n HT 802.11a (including dup/quad modes) 802.11g (including dup mode) 802.11b
· Uplink MU-MIMO Tx as STA · Downlink MU-MIMO Rx as STA · Aggressive Packet Extension · Range Extension · Receiver Beam Change · Guard Interval Modes
1x HE-LTF with 0.8 us GI 1x HE-LTF with 1.6 us GI (for UL TB PPDU) 2x HE-LTF with 0.8 us GI 2x HE-LTF with 1.6 us GI 4x HE-LTF with 3.2 us GI 4x HE-LTF with 0.8 us GI · Dynamic Frequency Selection (DFS) (radar detection) · Optional 802.11ac and 802.11n MIMO features: 20/40/80 MHz coexistence with middle-packet detection (GI detection) for enhanced CCA LDPC transmission and reception for both 802.11ac and 802.11n Short guard interval (0.4 us) RIFS on receive path for 802.11n packets VHT MU-PPDU (receive) · Spectral intelligence Spectrum monitoring DFS assist to reduce false detections Interference identification/classification

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IW612_PB
1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

· Power save features
2.4 Wi-Fi radio
· 5 GHz and 2.4 GHz Wi-Fi band operation · 802.11ax 1x1 MU-MIMO on-chip RF radio · Integrated PA, LNA

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

2.5 RF channels

Table 1 shows the list of supported channels for 2.4GHz and 5GHz.

Table 1.List of supported Wi-Fi channels

Channel number

Frequency

Channel number

Frequency

2.4GHz channel

2412 MHz

2417 MHz

2427 MHz

2432 MHz

2442 MHz

2447 MHz

2457 MHz

2462 MHz

2472 MHz

5GHz channel

5180 MHz

5200 MHz

5240 MHz

5260 MHz

5300 MHz

5320 MHz

104

5520 MHz

108

5540 MHz

116

5580 MHz

120

5600 MHz

128

5640 MHz

132

5660 MHz

140

5700 MHz

144

5720 MHz

153

5765 MHz

157

5785 MHz

165

5825 MHz

169

5845 MHz

177

5885 MHz

184

4920

187

4935

192

4960

196

4980

5040

5055

5080

Channel number

Frequency

2422 MHz

2437 MHz

2452 MHz

2467 MHz

5220 MHz

5280 MHz

100

5500 MHz

112

5560 MHz

124

5620 MHz

136

5680 MHz

149

5745 MHz

161

5805 MHz

173

5865MHz

188

4940

5060

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

2.6 Wi-Fi encryption
· Supports WPA2 and WPA3 personal and enterprise · Data Frame Encryption/Decryption
Advanced Encryption Standard (AES) / Counter-Mode/CBC-MAC Protocol (CCMP) Advanced Encryption Standard (AES) / Galois/Counter Mode Protocol (GCMP) WLAN Authentication and Privacy Infrastructure (WAPI) · Management Frame Encryption/Decryption for broadcast/multicast packets Advanced Encryption Standard (AES) / Cipher-based Message Authentication Code (CMAC) BIP-GMAC · Management Frame Encryption/Decryption for unicast packets AES/CCMP AES/GCMP
2.7 Beamforming
· 802.11ax/ac/n Explicit Beamformee Supports sounding feedback for up to 4x4 Beamformer
2.8 Wi-Fi host interface
· SDIO 3.0 (4-bit SDIO and 1-bit SDIO) with transfer rates up to SDR104 (208MHz)

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

3 Bluetooth subsystem

3.1 Bluetooth features
· Bluetooth 5.2 features · Bluetooth Class 2 · Bluetooth Class 1 · Single-ended, shared Tx/Rx path for Bluetooth · I2S/PCM interface for voice applications · Baseband/radio BDR/EDR packet types--1Mbps (GFSK), 2Mbps ( /4-DQPSK), 3Mbps (8DPSK) · Fully functional Bluetooth baseband--AFH, forward error correction, header error control, access code
correlation, CRC, encryption bit stream generation, and whitening · Interlaced scan for faster connection setup · Simultaneous active ACL connection support · Automatic ACL packet type selection · Full central1 and peripheral1 piconet support · Scatternet support · Standard UART HCI transport layer · HCI layer to integrate with profile stack · SCO/eSCO links with hardware accelerated audio signal processing and hardware supported PPEC algorithm
for speech quality improvement · All standard SCO/eSCO voice coding · A2DP support · All standard pairing, authentication, link key, and encryption operations · Standard Bluetooth power-saving mechanisms (hold, sniff modes, and sniff subrating) · Enhanced Power Control (EPC) · Channel Quality Driven Data Rate (CQDDR) · Wideband Speech (WBS) support (2 WBS links) · Encryption (AES) support

1 The master/slave replacement in this document follows the recommendation of Bluetooth SIG.

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

3.2 Bluetooth Low Energy (LE) features
· Bluetooth LE 5.3 · Supports up to 16 simultaneous central2/peripheral2 connections · Wi-Fi/Bluetooth coexistence protocol support · Shared RF with BDR/EDR · Encryption (AES) support · Intelligent Adaptive Frequency Hopping (AFH) · Bluetooth LE Privacy 1.3 · Bluetooth LE Secure Connection · Bluetooth LE Data Length Extension · Bluetooth LE Advertising Extension · Bluetooth LE Long Range · Bluetooth LE 2Mbps · Bluetooth LE power control · Bluetooth LE isochronous channels3
3.3 Bluetooth host interface
· High-Speed UART with support up to 3Mbps baud rate

2 The master/slave replacement in this document follows the recommendation of Bluetooth SIG. 3 Bluetooth LE audio supported with external host running Low Complexity Communication codec (LC3) through HCI interface

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

3.4 Digital audio interfaces
3.4.1 I2S interface
· Central4 or peripheral4 mode · I2S (Inter-IC Sound) interface for audio data connection to Analog-to-Digital Converters (ADC) and Digital-to-
Analog Converters (DAC) · 3-state I2S interface capability · I2S pins shared with PCM pins · Supports clock speeds of 4.096MHz, 2.048MHz, and 2MHz
3.4.1.1 I2S interface protocol
Figure 3 shows I2S interface protocol.

BCLK LRCLK DATA

Left Channel

MSB

. .. ........

LSB

DMA Data (Right0, Left0, Right1, Left1, ...)
Figure 3.I2S interface protocol

Right Channel

MSB Rn

. .. ........

LSB R1 R0

4 The master/slave replacement in this document follows the recommendation of Bluetooth SIG.

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NXP Semiconductors

IW612_PB
1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

IW612 supports mono and dual channel modes. In mono-channel mode, by default the left channel is used for data.

I2S_BCLK I2S_LRCLK I2S_DOUT I2S_DIN

... .. .
LEFT LEFT

... .. .
RIGHT RIGHT

Figure 4.I2S timing specification diagram--Mono channel mode In dual-channel mode, the two channels are supported on two time slots.

I2S_BCLK I2S_LRCLK I2S_DOUT I2S_DIN

... .. .
CH0 CH0

... .. .
CH1 CH1

Figure 5.I2S timing specification diagram--Dual channel mode - Single Bluetooth
With dual Bluetooth, the channel pair CH0 + CH2 is for one Bluetooth, and the channel pair CH1 + CH3 is for the second Bluetooth.

I2S_BCLK I2S_LRCLK I2S_DOUT I2S_DIN

... .. .

CH0 CH0

CH1 CH1

... .. .

CH2 CH2

CH3 CH3

Figure 6.I2S timing specification diagram--Dual channel mode - Dual Bluetooth

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

3.4.1.2 Clock frequency and audio data resolutions
Audio data may arrive with different input data formats with different sampling rates.
In central5 mode, the I2S interface uses an audio input clock of 4.096 MHz or 2.048 MHz to provide the appropriate M clock (MCLK) and bit clock (I2S_BCLK) frequency to match the sampling rates of each audio data format. The sampling rates can be 8 kHz to 16 kHz.
In peripheral5 mode, the I2S interface does not provide the bit clock (I2S_BCLK) but it can provide the M clock (MCLK).

5 The master/slave replacement in this document follows the recommendation of Bluetooth SIG.

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NXP Semiconductors

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

3.4.2 PCM interface
· Central6 or peripheral6 mode · PCM bit width size of 8 bits or 16 bits · Up to four slots with configurable bit width and start positions · 3-state PCM interface capability · PCM short frame and long frame7 synchronization · PCM pins shared with I2S pins · Supports clock speeds of 4.096MHz, 2.048MHz, and 2MHz
3.4.2.1 PCM protocol
The PCM interface supports long and short frame sync. Figure 7 and Figure 8 show an example of a PCM interface with four signals.

PCM_SYNC PCM_CLK

PCM_DOUT

MSb MSb-1 MSb-2 MSb-3

PCM_DIN

Don't Care

MSb MSb-1 MSb-2 MSb-3

Figure 7.PCM long frame sync

Don't Care

PCM_SYNC PCM_CLK

PCM_DOUT

MSb MSb-1 MSb-2 MSb-3

PCM_DIN

Don't Care

MSb MSb-1 MSb-2 MSb-3

Figure 8.PCM short frame sync

Don't Care

6 The master/slave replacement in this document follows the recommendation of Bluetooth SIG. 7 In PCM central mode, PCM long frame synchronization is 1 clock wide. In PCM peripheral mode, PCM central long frame
synchronization pattern is supported.

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

IW612 supports mono and dual channel modes.
Note: Figure 9 and Figure 10 illustrate PCM mono and dual channel modes in short frame sync. The same applies to long frame sync.
In mono-channel mode, by default the left channel is used for data.

PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN

....
LEFT LEFT

... .. .

....
RIGHT RIGHT

Figure 9.PCM mono channel mode (short frame sync) In dual-channel mode, the two channels are supported on two time slots.

PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN

....
CH0 CH0

... .. .

....
CH1 CH1

Figure 10.PCM dual channel mode (short frame sync)

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

3.4.2.2 PCM modes of operation
The PCM interface supports two modes of operation: · PCM central8 · PCM peripheral8
When in PCM central8 mode, the interface generates a 2 MHz or a 2.048 MHz PCM_CLK and 8 kHz PCM_SYNC signal. An alternative PCM central8 mode is available that uses an externally generated PCM_CLK, but still generates the 8 kHz PCM_SYNC. The external PCM_CLK must have a frequency that is an integer multiple of 8 kHz. Supported frequencies are in the 512 kHz to 4 MHz range.
When in PCM peripheral8 mode, the interface has both PCM_CLK and PCM_SYNC as inputs, thereby letting another unit on the PCM bus generate the signals.
The PCM interface consists of up to four PCM slots (time divided) preceded by a PCM sync signal. Each PCM slot can be either 8 or 16 bits wide. The slots can be separated in time, but are not required to follow immediately after one other. The timing is relative to PCM_CLK. Figure 12 shows an example of a PCM burst with two slots.
The burst starts with a PCM_SYNC and then follows the PCM burst. In this example, the PCM burst consists of two PCM slots (the first slot is 8 bits wide, the second slot is 16 bits wide) separated with two PCM_CLK clock cycles. The PCM slots can be configured to start at an arbitrary point in time, and the start value is given relative to the start of the PCM_SYNC. The timing of the four PCM slots must be such that slot 0 is always located before slot 1, slot 1 before slot 2, etc. It is possible to only use for example slot 1 and not slot 0.

PCM_CLK

PCM_SYNC PCM_DIN, PCM_DOUT

PCM Slot 0 pcmSlotStart0 = 1

pcmSlotStart1 = 11

Figure 11.PCM burst with two PCM slots - PCM long frame sync

PCM Slot 1

PCM_CLK

PCM_SYNC PCM_DIN, PCM_DOUT

PCM Slot 0 pcmSlotStart0 = 1

pcmSlotStart1 = 11

Figure 12.PCM burst with two PCM slots - PCM short frame sync

PCM Slot 1

8 The central/peripheral replacement in this document follows the recommendation of Bluetooth SIG.

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

4 802.15.4 radio subsystem
4.1 802.15.4 radio features
· IEEE 802.15.4-2020 compliant supporting Thread in 2.4GHz band · Support for Matter over Thread · MAC accelerator with packet formatting, CRCs, address check, auto-acknowledgements and timers · Programmable packet filtering for lower power consumption · Timestamp for transmit and receive packets · Received Signal Strength Indication (RSSI) of received packets · Integrated high power PA up to +21dBm transmit power · 128-bit AES security
4.2 802.15.4 host interface
· SPI with maximum clock speed of 10MHz

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1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

5 Revision history

Table 2.Revision history Document ID
IW612 v.1.0

Release date 20230516

Data sheet status Product brief

Change notice -

Supersedes -

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6 Legal information

6.1 Definitions
Draft -- A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information.
6.2 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.
Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect.

Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.
Suitability for use in non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications.
Translations -- A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
Security -- Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer's applications and products. Customer's responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer's applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at [email protected]) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products.

IW612_PB
Product brief

All information provided in this document is subject to legal disclaimers.
Rev. 1 -- 16 May 2023

NXP Semiconductors

IW612_PB
1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

NXP B.V. - NXP B.V. is not an operating company and it does not distribute or sell products.

6.3 Trademarks
Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners. NXP -- wordmark and logo are trademarks of NXP B.V.

IW612_PB
Product brief

All information provided in this document is subject to legal disclaimers.
Rev. 1 -- 16 May 2023

NXP Semiconductors

IW612_PB
1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

Tables

Tab. 1. List of supported Wi-Fi channels .......................8 Tab. 2. Revision history ...............................................19

Figures

Fig. 1. Fig. 2. Fig. 3. Fig. 4. Fig. 5. Fig. 6.

Application diagram - Single antenna configuration ...................................................... 2 Application diagram - Dual-antenna configuration ...................................................... 2 I2S interface protocol ...................................... 12 I2S timing specification diagram--Mono channel mode ..................................................13 I2S timing specification diagram--Dual channel mode - Single Bluetooth .................... 13 I2S timing specification diagram--Dual channel mode - Dual Bluetooth .......................13

Fig. 7. Fig. 8. Fig. 9.
Fig. 10. Fig. 11.
Fig. 12.

PCM long frame sync ..................................... 15 PCM short frame sync .................................... 15 PCM mono channel mode (short frame sync) ................................................................ 16 PCM dual channel mode (short frame sync) ... 16 PCM burst with two PCM slots - PCM long frame sync .......................................................17 PCM burst with two PCM slots - PCM short frame sync .......................................................17

IW612_PB
Product brief

All information provided in this document is subject to legal disclaimers.
Rev. 1 -- 16 May 2023

NXP Semiconductors

IW612_PB
1x1 Dual-band Wi-Fi 6, Bluetooth 5.2 and 802.15.4 Tri-radio Solution

Contents

Product overview ................................................ 1

1.1

Applications ........................................................3

1.2

Product family devices .......................................3

Wi-Fi subsystem ..................................................4

2.1

IEEE 802.11 standards ......................................4

2.2

Wi-Fi MAC ......................................................... 5

2.3

Wi-Fi baseband ................................................. 6

2.4

Wi-Fi radio ......................................................... 7

2.5

RF channels ...................................................... 8

2.6

Wi-Fi encryption .................................................9

2.7

Beamforming ......................................................9

2.8

Wi-Fi host interface ........................................... 9

Bluetooth subsystem ........................................10

3.1

Bluetooth features ............................................10

3.2

Bluetooth Low Energy (LE) features ................11

3.3

Bluetooth host interface ...................................11

3.4

Digital audio interfaces .................................... 12

3.4.1 I2S interface .................................................... 12

3.4.1.1 I2S interface protocol .......................................12

3.4.1.2 Clock frequency and audio data resolutions .... 14

3.4.2 PCM interface ..................................................15

3.4.2.1 PCM protocol ...................................................15

3.4.2.2 PCM modes of operation .................................17

802.15.4 radio subsystem ................................ 18

4.1

802.15.4 radio features ....................................18

4.2

802.15.4 host interface .................................... 18

Revision history ................................................ 19

Legal information .............................................. 20

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'.

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