Antenna Specification

Dongguan Yong fang Electronic Technology Co., LTD. T29 True Wireless Earphone 2ACYR-T29 2ACYRT29 t29

PDF Viewing Options

Not Your Device? Search For Manuals or Datasheets below:


File Info : application/pdf, 9 Pages, 1.21MB

Document DEVICE REPORTGetApplicationAttachment.html?id=7390173
P/N: SURL160808 SRF08
Features
1.Surface Mounted Devices with a small dimension of 1.6 x 0.8 x 0.8 mm meet future miniaturization trend. 2,Embedded and LTCC (low temperature co-fired ceramic) technology is able to integrate with system design as well as beatifying the housing of final product. 3.High stability and low tolerance.
Applications 1. Bluetooth 2. Wireless LAN 3. ISM band 2.4GHz wireless applications

DimensionsUnitmm
L

w



( Top View )
A

Number Terminal Name



INPUT



NC

( Bottom View )

Symbols Dimensions

L 1.60±0.20

T
( Side View )

W 0.80±0.20

T 0.80±0.20

A 0.30±0.10

www.surbaner.com.cn
SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology.
. Page 1

P/N: SURL160808 SRF08
Evaluation Board and Matching Circuits
www.surbaner.com.cn
SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology.
. Page 2

P/N: SURL160808 SRF08

Electrical Characteristics
1 2 3 4 5 6 7

Feature Central frequency
Bandwidth Peak gain
VSWR Polarization Azimuth beamwidth Impedance

Specification 2445MHz >100MHz >3dBi <2 Linear
Omnidirectional 50 

Characteristic curve

www.surbaner.com.cn
SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology.
. Page 3

Radiation Pattern
coordinates

P/N: SURL160808 SRF08

Y-Z Plane

X-Z Plane
www.surbaner.com.cn
SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology.
. Page 4

X-Y Plane

P/N: SURL160808 SRF08

3D Radiation Pattern

Frequency 2400MHz 2450MHz

Avg. gain -1.14

-0.85

Peak gain

2

2.8

Efficiency 77%

82%

2500MHz -1.30 2.5 78%

www.surbaner.com.cn
SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology.
. Page 5

Dependability Test
Test Temperature: Operating Temperature Temperature Relative Humidity
Moisture Proof

P/N: SURL160808 SRF08
25±3 -25~+85
5~40 20~70%

Temperature40±2 Humidity90~95%RH Duration500h Recovery conditionsRoom temperature Recovery Time24h (Class1) or 48h (Class2) Sol derabi li ty
At least 95% of the terminal electrode is covered by new solder.Preheating conditions:80 to 120; 10~30s. SolderTemperature:235± 5 Duration:2±0.5s,SolderTemperature:245±5 Duration:2±0.5s

Optimum Solder Amount for Reflow Soldering

Too much solder

Cracks tend to occur due to large stress.

Not enough solder

Weak holding force may cause bad connection between the
. capacitor and PCB

Recommended Soldering amounts
The optimal solder fillet amounts for re-flow soldering

The optimal solder fillet amounts for wave soldering

www.surbaner.com.cn

 

SBR Communication has possession of proprietary information provided in this report and this

proprietary information shall be kept in strict confidence and not disclosed to any person or firm

without the prior written consent of SBR Communication Technology.

. Page 6

Temperature Cycle Test

P/N: SURL160808 SRF08

10±1S Applied Force: 5N

Duration: 10±1S

Preheating conditions: up-category temperature, 1h Recovery time: 24±1h
Initial Measurement

Cycling Times: 5 times, 1 cycle, 4 steps:

Resistanceto SolderingHeat
Preheating80 to 120; 10~30s.SolderTemperature:235±5 Duration:2±0.5sSolderTemperature:245±5 Duration:2±0.5sPreheating100to200;10±2min. Solder Temperature: 265±5 Duration: 10±1s Clean the capacitor with solvent and examine it with a 10X(min.) microscope. Recovery Time: 24±2h Recovery condition: Room temperature
Resistance to Flexure of Substrate

Test Board: Al2O3 or PCB Warp: 1mm Speed: 0.5mm/sec. Unit: mm
The measurement should be made with the board in
the bending position.
www.surbaner.com.cn
SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology.
. Page 7

P/N: SURL160808 SRF08
While in preheating,please keep the temperature difference between soldering temperature and surface temperature of chips as: T150.
www.surbaner.com.cn
SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology.
. Page 8

P/N: SURL160808 SRF08
Dimensions of paper taping for 0603types

Reel4000 pcs/Reel

Unitmm

Storage Period

The guaranteed period for solderability is 6 months (Under deliver package

condition).Temperature

5~40 /Relative Humidity20~70%

www.surbaner.com.cn
SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology.
. Page 9



Related FCC IDs:

Search Any Device: